WO2024021794A1 - Circuit board and electronic device - Google Patents

Abstract

The present application provides a circuit board, which comprises a circuit substrate, a heat conduction block and an electronic component electrically connected to the circuit substrate. A surface of the circuit substrate has an inwardly recessed accommodation groove. The heat conduction block comprises a first heat conduction part and two second heat conduction parts. The first heat conduction part comprises an opposing first surface and second surface, and also a third surface connected to the first surface and second surface. An accommodation space is formed from the first surface facing the second surface. The second heat conduction parts extend from an end of the third surface near the first surface, in a direction away from the accommodation space. The first heat conduction part is embedded in the accommodation groove, and the second heat conduction parts are secured on the surface of the circuit substrate. At least part of the electronic component is located in the accommodation space and is in contact with the heat conduction block. In the circuit board of the present application, heat from the electronic component is quickly conducted to the heat conduction block, thereby achieving a good heat dissipation effect. The present application further provides an electronic device using said circuit board.

Description

Circuit boards and electronic equipment

Cross-references to related applications

This application claims priority to the Chinese patent filed with the China Patent Office on July 27, 2022, with application number 202210895936.

Technical field

The present application relates to a circuit board with good heat dissipation effect and electronic equipment using the circuit board.

Background technique

In order to adapt to higher and higher power demands, power semiconductor devices, especially power supply power semiconductor devices, are increasingly evolving towards thinner, lighter, smaller and high power density. Therefore, the heat dissipation requirements for power semiconductor devices are getting higher and higher. . How to make power semiconductor devices dissipate heat well is a problem currently faced.

Contents of the invention

A first aspect of this application provides a circuit board, including a circuit substrate, a thermal conductive block and electronic components. The surface of the circuit substrate is recessed inward to form a receiving groove. The thermal conductive block includes a first thermal conductive part and two spaced second thermal conductive parts. The first thermal conductive part includes a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface. An accommodation space is opened from the first surface toward the second surface. Each second heat conductive portion extends from an end of the third surface close to the first surface in a direction away from the accommodation space. The first thermal conductive part is embedded in the receiving groove, and the second thermal conductive part is fixed on the surface of the circuit substrate. At least a part of the electronic component is located in the accommodating space and contacts the thermal conductive block, and the electronic component is electrically connected to the circuit substrate.

In the circuit board of the present application, the first thermal conductive part is embedded in the accommodation groove, the second thermal conductive part is fixed on the surface of the circuit substrate, and an accommodation space is formed on the thermal conductive block, And at least a part of the electronic component is located in the accommodation space and contacted with the heat conduction block, so that the heat of the electronic component is quickly conducted to the heat conduction block, thereby achieving a good heat dissipation effect; and at the same time, The thermal conductive block and the electronic component are assembled on the same side of the circuit substrate, which is beneficial to reducing the impact of tolerances on the assembly of the circuit board, thereby ensuring contact between the electronic component and the thermal conductive block for Effective heat conduction can quickly diffuse the heat on the electronic components, reduce the temperature and thermal resistance of the electronic components, and increase the service life of the circuit board. In addition, the first thermal conductive portion of the thermal conductive block is embedded in the receiving groove of the circuit substrate, which is beneficial to reducing the overall thickness of the circuit board. The second thermal conductive part is fixed on the surface of the circuit substrate. When the thermal conductive block and the circuit substrate are fixed, the heat on the electronic component can first be transferred through the first thermal conductive part. Lateral conduction and diffusion, and then conduction and diffusion along the longitudinal direction, that is, the thickness direction of the circuit substrate, to the second thermal conductive portion and then to the outside are beneficial to reducing the temperature and thermal resistance of the electronic components.

In connection with the first aspect, in some embodiments, the side of the second thermal conductive part facing away from the circuit substrate has a concave or convex part, thereby increasing the surface area of the thermal conductive block, which is beneficial to the dissipation of heat, and further improves the efficiency of the thermal conductive block. It is beneficial to quickly reduce the temperature of the electronic components.

In connection with the first aspect, in some embodiments, the first surface has concave or convex parts, thereby increasing the surface area of the thermal conductive block, which is beneficial to the dissipation of heat, and thus is beneficial to quickly lowering the electronic components. temperature.

In connection with the first aspect, in some embodiments, the receiving groove penetrates two opposite surfaces of the circuit substrate, so that the heat on the electronic component can pass through the heat conduction block toward the opposite surface of the circuit substrate. Dissipated on both sides, it is helpful to speed up heat dissipation and improve heat dissipation efficiency.

In conjunction with the first aspect, in some embodiments, the second surface is provided with concave or convex portions, thereby increasing the surface area of the thermal conductive block, which is conducive to the dissipation of heat, and thus is conducive to quickly reducing the electronic components. device temperature.

With reference to the first aspect, in some embodiments, the second surface is flush with the surface of the circuit substrate facing away from the first thermal conductive part or is located on a side of the circuit substrate facing away from the second thermal conductive part. It is beneficial to quickly dissipate the heat on the electronic components toward the opposite sides of the circuit substrate, thereby improving the heat dissipation efficiency.

In conjunction with the first aspect, in some embodiments, the depth of the receiving groove is less than the thickness of the circuit substrate.

In conjunction with the first aspect, in some embodiments, the receiving groove includes a bottom wall facing the second surface, and the second surface is fixed to the bottom wall, which is beneficial to lowering the circuit board when it is acted upon by an external force. The shaking of the first thermal conductive part is beneficial to effective heat conduction between the electronic components and the thermal conductive block, and improves the stability of the overall structure of the circuit board.

In connection with the first aspect, in some embodiments, a glue layer is provided between the second surface and the bottom wall. The glue layer bonds the bottom wall and the second surface, which is beneficial to lifting the circuit board. overall structural stability.

With reference to the first aspect, in some embodiments, the portion of the electronic component located in the accommodation space is fixed to the thermal conductive block, so that the electronic component and the thermal conductive block are closely combined, thereby benefiting all Effective heat conduction occurs between the electronic component and the thermal conductive block, thereby quickly diffusing the heat on the electronic component.

With reference to the first aspect, in some embodiments, the accommodation groove includes a side wall, a conductive layer is provided on the side wall, and the circuit substrate includes lines, and the lines are electrically connected to the conductive layer, so that there is The accommodating groove of the conductive layer not only accommodates the thermal conductive block, but also serves as a via hole in the circuit substrate, which is beneficial to increasing the wiring density of the circuit substrate.

With reference to the first aspect, in some embodiments, the thermally conductive block has electrical conductivity, the electronic components are electrically connected to the thermally conductive block, and the thermally conductive block is in contact with and electrically connected to the conductive layer, thereby avoiding the The electronic component is additionally provided with pins to be electrically connected to the circuit substrate.

With reference to the first aspect, in some embodiments, the number of the electronic components is multiple, and multiple electronic components are provided in the accommodating space, that is, a thermal conductive block is used to realize multiple electronic components at the same time. The heat conduction and heat dissipation of components is beneficial to reducing the total space occupied by the thermal conductive block on the circuit substrate, thereby facilitating the wiring of the circuit substrate.

With reference to the first aspect, in some embodiments, the two second thermal conductive parts are arranged opposite to the first thermal conductive part, which is beneficial to the stable arrangement of the thermal conductive block on the circuit substrate.

With reference to the first aspect, in some embodiments, the circuit board further includes a heat dissipation device, the heat dissipation device is in contact with a side of the second heat conduction part away from the circuit substrate, and is used to heat the second heat conduction part. The heat dissipation is beneficial to the dissipation of heat, which is beneficial to quickly reducing the temperature of the electronic components.

With reference to the first aspect, in some embodiments, the circuit board further includes a heat dissipation device, the heat dissipation device is in contact with the second surface, and is used to dissipate heat of the first heat conductive part, which is beneficial to the dissipation of heat. This will help to quickly Reduce the temperature of the electronic components.

With reference to the first aspect, in some embodiments, the accommodating space forms an opening on the third surface, a part of the electronic component is located in the accommodating space and contacts the thermal conductive block, and the other part is opened from the The opening is extended to facilitate heat dissipation with larger electronic components. At this time, the thermal conductive block and the electronic components are assembled on the same side of the circuit substrate, which is beneficial to reducing the impact of tolerances on the assembly of the circuit board, thereby facilitating the assembly of the electronic components and reducing the probability of the electronic components tilting.

With reference to the first aspect, in some embodiments, the number of the openings is two, and the two openings are arranged oppositely to facilitate the heat source area of the electronic component to be close to the thermal conductive block.

In connection with the first aspect, in some embodiments, the opposite ends of the electronic component respectively extend from the two openings and are located on opposite sides of the first heat conduction part, which facilitates the installation of the electronic component. The heat source area is close to the heat conducting block. For example, when the heat source area of the electronic component is close to or located in the middle area of the electronic component, the two opposite openings facilitate the electronic component to pass through the heat conductive block so that the heat source of the electronic component The area is close to the heat conduction block, which is conducive to quickly conducting the heat of the heat source area outward; at the same time, it is also helpful to avoid the installation of a larger area of the accommodation groove and the heat conduction block to achieve proximity to the heat source area. This is beneficial to improving the wiring density of the circuit substrate. A second aspect of the present application provides an electronic device, including a housing and a circuit board as described above, where the circuit board is disposed in the housing. Electronic equipment using the circuit board is beneficial to reducing the risk of local overheating caused by the electronic components.

Description of drawings

Figure 1 is a schematic cross-sectional view of a circuit board in the prior art.

Figure 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

FIG. 3 is a schematic cross-sectional view of a circuit board in one direction according to an embodiment of the present application.

Figure 4 is a schematic cross-sectional view from another direction of a circuit board according to an embodiment of the present application.

Figure 5 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Figure 6 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 7 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 8 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 9 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 10 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 11 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

FIG. 12 is a schematic cross-sectional view of a circuit board in one direction according to an embodiment of the present application.

Figure 13 is a schematic cross-sectional view from another direction of a circuit board according to an embodiment of the present application.

Figure 14 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 15 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 16 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 17 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 18 is a top view of a circuit board according to an embodiment of the present application.

Figure 19 is a top view of a circuit board according to an embodiment of the present application.

Figure 20 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 21 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 22 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Figure 23 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Description of main component symbols

Detailed ways

The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Wherever there is no conflict, the features in the following embodiments can be combined with each other.

As shown in Figure 1, it is an existing power semiconductor device, in which the back side of component 1 is welded to a circuit substrate 2, and the circuit substrate 2 is provided with a plurality of via holes 2a corresponding to the heat dissipation pad 1a of the component 1. , each via hole 2a is connected to the heat dissipation pad 1a, thereby transferring the heat on the component 1 to the other side of the circuit substrate 2. However, the thermal conductivity of the via hole 2a is limited.

In view of this, as shown in Figure 2, in order to improve the heat dissipation effect, the present application provides a circuit board 100. The circuit board 100 can be used in terminals. The terminal includes a housing and the circuit board 100 accommodated in the housing. The terminal can be, but is not limited to, a power supply, a mobile phone, a computer, a photovoltaic inverter, a site energy source, an industrial motor drive and other electronic equipment. As shown in Figure 23, in some embodiments, the electronic device 200 using the circuit board 100 is an electric vehicle charging pile.

Referring to FIGS. 2 , 3 and 4 , the circuit board 100 includes a circuit substrate 10 , a thermal conductive block 30 and electronic components 50 . The thermal conductive block 30 includes a first thermal conductive part 31 and two spaced second thermal conductive parts 33 . The first thermal conductive part 31 includes a first surface 311, a second surface 312 and a third surface 313. The second surface 312 is arranged opposite to the first surface 311. The third surface 313 is connected to the first surface 311. a surface 311 and the second surface 312 . An accommodating space 310 is opened from the first surface 311 toward the second surface 312 , and the accommodating space 310 forms an opening 314 on the third surface 313 . Each second heat conducting portion 33 extends from an end of the third surface 313 close to the first surface 311 in a direction away from the accommodating space 310 , and the two second heat conducting portions 33 are connected to each other. Spaced out.

The surface 11 of the circuit substrate 10 is recessed inward to form a receiving groove 101 , the first heat conducting part 31 is embedded in the receiving groove 101 , and the second heat conducting part 33 is fixed to the surface 11 of the circuit substrate 10 .

A part of the electronic component 50 is located in the accommodating space 310 and contacts the heat conductive block 30 , and the other part protrudes from the opening 314 . The electronic component 50 is also electrically connected to the circuit substrate 10 .

In the above-mentioned circuit board 100, the first thermal conductive part 31 is embedded in the receiving groove 101, and the second thermal conductive part 33 is fixed on the surface 11 of the circuit substrate 10. In addition, the thermal conductive block 30 An accommodating space 310 is formed on the accommodating space 310 , and a part of the electronic component 50 is placed in the accommodating space 310 in contact with the thermal conductive block 30 , so that the heat of the electronic component 50 is quickly conducted to the thermal conductive block 30 , thereby achieving good heat dissipation effect; at the same time, the heat conduction block 30 and the electronic component 50 are assembled on the same side of the circuit substrate 10 , which is conducive to reducing the impact of tolerances on the assembly of the circuit board. On the one hand, It is beneficial to assemble the electronic component 50 and reduce the probability of the electronic component 50 tilting. On the other hand, it is also beneficial to ensure the contact between the electronic component 50 and the thermal conductive block 30 for effective heat conduction. , thereby quickly diffusing the heat on the electronic component 50 , reducing the temperature and thermal resistance of the electronic component 50 , and extending the service life of the circuit board 100 .

In addition, in the above-mentioned circuit board 100, the first heat conductive part 31 is embedded in the receiving groove 101, which is beneficial to reducing the overall thickness of the circuit board 100. The second thermal conductive part 33 is fixed on the surface 11 of the circuit substrate 10. When the thermal conductive block 30 and the circuit substrate 10 are fixed, the heat on the electronic component 50 can first pass through the circuit substrate 10. The first heat conductive part 31 conducts transverse conduction and diffusion, and then conducts conduction and diffusion along the longitudinal direction, that is, the thickness direction of the circuit substrate 10, to the second heat conduction part 33 and then diffuses to the outside, which is conducive to reducing the risk of the electronic component 50 temperature and thermal resistance.

The circuit substrate 10 may be a flexible circuit board, a rigid circuit board or a combination of soft and hard circuit boards. The circuit substrate 10 may include a single circuit layer or multiple circuit layers. In this application, the circuit substrate 10 is a flexible circuit substrate including multi-layer circuits as an example.

The circuit substrate 10 further includes a surface 12 located opposite to the surface 11 . The receiving groove 101 is recessed from the surface 11 toward the surface 12 . Referring to FIGS. 3 and 4 , the depth of the receiving groove 101 is less than the thickness of the circuit substrate 10 , that is, the receiving groove 101 does not penetrate the surface 12 . In this way, the area of the surface 12 corresponding to the receiving groove 101 can be wired, for example, as shown in FIG. 3 , lines or pads can be provided, which is beneficial to improving the wiring density of the circuit substrate 10 . The receiving groove 101 is surrounded by a bottom wall 102 and side walls 103 , wherein the bottom wall 102 is away from the surface 12 , and the side walls 103 connect the bottom wall 102 and the surface 11 . The depth and shape of the accommodation groove 101 can be selected as needed. For example, as shown in FIG. 2 , the accommodation groove 101 can be but is not limited to a rectangular parallelepiped shape. The receiving groove 101 may be formed by, but is not limited to, laser cutting, mechanical cutting or corrosion.

The thermal conductive block 30 may include, but is not limited to, a metal block or alloy block, and may specifically include, but is not limited to, a copper block, an aluminum block, an aluminum alloy block, an iron block or a steel block, etc. In some embodiments, the first thermal conductive part 31 is made of the same material as the second thermal conductive part 33 . In other embodiments, the material of the first heat conducting part 31 may be different from the material of the second heat conducting part 33 . In some embodiments, the first thermal conductive part 31 and the second thermal conductive part 33 may be an integral structure, that is, the second thermal conductive part 33 is formed by a partial extension of the first thermal conductive part 31, such as The thermal conductive block 30 can be formed by cutting a solid metal block or alloy block. In other embodiments, the first thermal conductive part 31 and the second thermal conductive part 33 may be connected through, but are not limited to, welding, gluing, etc.

Referring to FIGS. 2 and 3 , the accommodation space 310 is surrounded by a bottom surface 315 and a side surface 316 . The bottom surface 315 is opposite to the second surface 312 , and the side surface 316 connects the bottom surface 315 and the first surface 311 . The shape and size of the accommodation space 310 can be selected as needed, and the shape and size of the opening 314 can be set as needed. For example, as shown in FIG. 2 , the accommodating space 310 is generally in the shape of a rectangular parallelepiped, and the accommodating space 310 forms two opposite openings 314 on the third surface 313 . Each of the openings 314 may be rectangular, and is preferably connected to the first surface 311 to facilitate subsequent assembly of electronic components. In other embodiments, the accommodating space 310 and the opening 314 may also have other regular or irregular shapes.

Referring to FIG. 3 , the first heat conducting part 31 is embedded in the receiving groove 101 and can be spaced apart from the receiving groove 101 , that is, the first heat conducting part 31 and the receiving groove 101 are spaced apart. A gap 104 may exist between the bottom wall 102 and the side wall 103 . The second surface 312 faces the bottom wall 102 . In some embodiments, the first heat conducting portion 31 may also be in contact with at least one of the bottom wall 102 and the side wall 103 .

The shape and size of the first heat conducting portion 31 can be selected as needed. In some embodiments, the shape of the first heat conducting portion 31 can be designed to follow the shape of the receiving groove 101 .

The second heat conducting portion 33 includes a connecting surface 330 facing away from the plane of the first surface 311 . The connecting surface 330 faces the circuit substrate 10 and is fixed to the circuit substrate 10 . The connection surface 330 of the second thermal conductive part 33 may be fixed to the surface 11 of the circuit substrate 10 by, but is not limited to, SMT (Surface Mount Technology) welding or bonding. In some embodiments, preferably, the height difference between the bottom surface 315 and the connection surface 330 in the thickness direction X of the circuit substrate 10 is less than or equal to 0.1 mm, so that the thermal conductive block 30 is installed on the circuit After the substrate 10 is mounted, the height difference between the bottom surface 315 and the surface 11 is controlled, which facilitates the subsequent installation of the electronic components 50 and makes the electronic components 50 less likely to be affected by the height difference between the bottom surface 315 and the surface 11 Difference This causes inclination, which is beneficial to the stability of the installation of the electronic component 50 and the stability of the overall structure of the circuit board 100 .

The shape and size of the second heat conduction part 33 can also be selected according to needs. For example, without affecting the wiring of the circuit substrate 10 , the larger the second heat conductive portion 33 is, the more conducive it is to speeding up heat dissipation.

The two second heat conduction parts 33 may be disposed opposite to the first heat conduction part 31 , thereby facilitating the stable placement of the heat conduction block 30 on the circuit substrate 10 . The number of the second heat conduction parts 33 may also be greater, such as three, four, etc. At least two of the plurality of second heat conduction parts 33 are spaced apart.

The electronic component 50 may include one or more active devices, such as active chips, including but not limited to power chips, digital chips, radio frequency chips, etc. In this embodiment, the electronic component 50 may include an insulating Insulated Gate Bipolar Transistor (IGBT), Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), Silicon Carbide (SiC) or Gallium Nitride (GaN) ) equal power chip. It can be understood that the electronic component 50 may also include one or more passive components, including but not limited to resistors, capacitors, inductors, filters, couplers, etc.

Please refer to 4, the electronic component 50 can pass through two oppositely arranged openings 314, so that the opposite ends of the electronic component 50 respectively extend from the openings 314 and are located on the first thermal conductive The opposite sides of the portion 31 facilitate the heat source area of the electronic component 50 to approach the heat conduction block 30 , thereby facilitating rapid conduction of heat from the heat source area outward.

Referring to FIGS. 3 and 4 , the back surface (ie, the non-active surface) of the electronic component 50 is in contact with the bottom surface 315 of the thermal conductive block 30 . Further, a plurality of connection pads 51 may be provided on the back of the electronic component 50 , and the electronic component 50 may contact the bottom surface 315 of the thermal conductive block 30 through the connection pads 51 . Furthermore, the electronic component 50 can also be fixed to the bottom surface 315 . Specifically, the portion of the electronic component 50 located in the accommodating space 310 can be welded or bonded to the bottom surface 315 through the connection pad 51 . As shown in FIG. 3 , the connection pad 51 can be welded to the bottom surface 315 through a tin material 53 . The connection pad 51 can also be welded to the bottom surface 315 using other welding materials, or bonded to the bottom surface 315 using thermally conductive materials such as thermally conductive glue. The portion of the electronic component 50 located in the accommodating space 310 is welded or bonded to the thermal conductive block 30 so that the electronic component 50 and the thermal conductive block 30 are closely combined, which is beneficial to the electronic component. Effective heat conduction occurs between the device 50 and the thermal conductive block 30 , thereby quickly diffusing the heat on the electronic component 50 .

A plurality of the connection pads 51 are arranged as close as possible to the heat source area of the electronic component 50 , thereby facilitating rapid dissipation of heat on the electronic component 50 . The shape and size of each connecting pad 51 is not limited, and may be circular or other shapes, such as rectangle, triangle, strip with a certain aspect ratio, or other regular or irregular shapes. When the number of the connection pads 51 is multiple, the multiple connection pads 51 can be regularly and evenly arranged. As shown in FIG. 3 , multiple connection pads 51 are arranged in a row, and any two of the connection pads 51 are arranged in a row. The connecting pads 51 are uniform in shape and size. In some embodiments, the plurality of connection pads 51 may also be arranged irregularly or unevenly, and any two connection pads 51 may have different shapes and sizes. This application can reasonably lay out the position, size and shape of the connection pads 51 according to the actual number of the connection pads 51 to improve the heat dissipation efficiency of the circuit board 100 .

Referring to FIG. 4 , the electronic component 50 may also be provided with pins 55 , and the electronic component 50 is electrically connected to the circuit substrate 10 through the pins 55 .

In some embodiments, please refer to FIG. 5 and FIG. 6 , the number of the opening 314 may also be one. In this case, one end of the electronic component 50 is located in the accommodating space 310 .

In some embodiments, please refer to FIG. 7 , a conductive layer 13 may also be provided on the side wall 103 , the circuit substrate 10 includes a plurality of lines 15 , and the plurality of lines 15 are electrically connected to the conductive layer 13 . The accommodating groove 101 provided with the conductive layer 13 not only accommodates the thermal conductive block 30 but also serves as a via hole for the circuit substrate 10 , which is beneficial to increasing the wiring density of the circuit substrate 10 . In this embodiment, the number of lines 15 is two, and they are embedded in the dielectric layer of the circuit substrate 10 . In some other embodiments, the number of lines 15 can also be other, such as but not limited to one, three, four, etc.; the distribution position of the lines 15 can also be adjusted as needed, such as being provided on the surface. 11 or said surface 12. The conductive layer 13 may be a conductive metal layer, which may be formed through, but is not limited to, a metallization process.

In some embodiments, please refer to FIG. 8 , the thermal conductive block 30 has electrical conductivity, the first thermal conductive part 31 can be electrically connected to the connection pad 51 of the electronic component 50 , and the second thermal conductive part 33 can be fixed and electrically connected to the circuit 15 provided on the surface 11 , thereby realizing the electrical connection between the electronic component 50 and the circuit substrate 10 through the thermal conductive block 30 . At this time, there is no need to provide additional pins to electrically connect the electronic component 50 and the circuit substrate 10 , that is, the pins 55 can be omitted.

In some embodiments, please refer to FIG. 9 , the thermally conductive block 30 with electrical conductivity can also contact and be electrically connected to the conductive layer 13 , so that the electronic component 50 can pass through the thermally conductive block 30 and the conductive layer 13 . The conductive layer 13 is electrically connected to the circuit substrate 10 . At this time, there is no need to provide additional pins to electrically connect the electronic component 50 and the circuit substrate 10 , that is, the pins 55 can be omitted. Similarly, the second thermal conductive part 33 does not need to be fixed and electrically connected to the circuit 15 provided on the surface 11 .

In some embodiments, please refer to FIG. 10 , the second surface 312 can also be fixed on the bottom wall 102 , thereby helping to reduce the shaking of the first thermal conductive part 31 when the circuit board 100 is subjected to external force. , which is beneficial to effective heat conduction between the electronic component 50 and the thermal conductive block 30 and improves the stability of the overall structure of the circuit board 100 . A glue layer 21 may be provided between the second surface 312 and the bottom wall 102 , but is not limited to a glue layer 21 . The second surface 312 is bonded to the bottom wall 102 through the glue layer 21 , thereby further bonding the second surface 312 to the bottom wall 102 . The heat-conducting block 30 is fixed, which is beneficial to improving the stability of the overall structure of the circuit board. In some embodiments, the glue layer 21 may be, but is not limited to, thermally conductive glue. The thermally conductive glue is helpful for quickly transferring the heat on the thermally conductive block 30 to the circuit substrate 10 and dissipating it through the circuit substrate 10 , thereby improving the heat dissipation efficiency of the circuit board 100 .

In some embodiments, please refer to FIG. 11 , the receiving groove 101 can also penetrate the opposite surfaces 11 and 12 of the circuit substrate 10 . At this time, the heat of the electronic component 50 can be dissipated toward the opposite sides of the circuit substrate 10 through the heat conduction block 30, which is beneficial to speeding up the heat dissipation speed and improving the heat dissipation efficiency. In this embodiment, the second surface 312 of the first thermal conductive part 31 is located between the surface 11 and the surface 12 .

As shown in FIGS. 12 and 13 , the first thermal conductive part 31 can also extend from the surface 12 , that is, the second surface 312 is located on the side of the circuit substrate 10 away from the second thermal conductive part 33 . In some embodiments, the second surface 312 may also be flush with the surface 12 . In this way, the heat on the electronic component 50 can be quickly dissipated to the opposite sides of the circuit substrate 10, thereby improving the heat dissipation efficiency.

In some embodiments, please refer to FIGS. 14 and 15 . When the receiving groove 101 penetrates the opposite surfaces 11 and 12 of the circuit substrate 10 , the second surface 312 may also be provided with concave or convex parts. , so as to increase the surface area of the thermal conductive block 30, thereby facilitating the dissipation of heat, and thereby facilitating the rapid reduction of the temperature of the electronic component 50. The shape and size of the concave portion or the convex portion can be selected as needed. As shown in FIGS. 14 and 15 , the second surface 312 is provided with a plurality of recesses A, so that the side of the first heat conductive part 31 away from the first surface 311 is fin-shaped. It can be understood that the distribution of the plurality of recesses A can be adjusted as needed, and the shape and size of each recess A can also be adjusted as needed.

In some embodiments, please refer to FIG. 16 , the side of the second thermal conductive part 33 facing away from the circuit substrate 10 may have a concave or convex part to increase the surface area of the thermal conductive block 30 , thereby facilitating the dissipation of heat. dissipation, thereby helping to quickly reduce the temperature of the electronic component 50 . The shape and size of the concave portion or the convex portion on the second heat conductive portion 33 can be selected as needed. As shown in FIG. 16 , a recess B is provided on the side of the second heat conducting portion 33 facing away from the circuit substrate 10 , so that the side of the second heat conducting portion 33 facing away from the circuit substrate 10 is fin-shaped. It can be understood that the distribution of the plurality of recesses B can be adjusted as needed, and the shape and size of each recess B can also be adjusted as needed.

In some embodiments, please refer to FIGS. 16 and 17 , the first surface 311 may also have concave or convex parts to increase the surface area of the thermal conductive block 30 , thereby facilitating heat dissipation and thus facilitating rapid thereby reducing the temperature of the electronic component 50 . As shown in FIG. 17 , the first surface 311 has a plurality of concave portions C, so that the side of the first heat conductive portion 31 away from the second surface 312 is fin-shaped. It can be understood that the distribution of the plurality of recesses C can be adjusted as needed, and the shape and size of each recess C can also be adjusted as needed.

The number of the electronic components 50 may be multiple, and multiple electronic components 50 are provided in one accommodation space 310 . As shown in FIG. 18 , there are two electronic components 50 . One end of one electronic component 50 is located in the accommodating space 310 , and the other end extends from one of the two opposite openings 314 . out; one end of the other electronic component 50 is the electronic component 50, and the other end extends from the other of the two oppositely arranged openings 314. That is, the two electronic components 50 are arranged opposite each other and protrude from opposite sides of the thermal conductive block 30 respectively. It can be understood that the above two openings 314 may also be staggered, or may not be located on opposite sides of the heat conduction block 30 respectively. Multiple electronic components 50 can also protrude from the same opening 314. As shown in Figures 19 and 20, two electronic components 50 are arranged side by side and pass through two opposite openings at the same time. 314. In this way, one thermal block 30 can simultaneously conduct and dissipate heat to multiple electronic components 50 , which is beneficial to reducing the total space occupied by the thermal block 30 on the circuit substrate 10 , thereby benefiting the circuit substrate 10 of wiring.

Referring to FIG. 21 , the circuit board 100 may further include a first heat dissipation device 61 , the first heat dissipation device 61 is located on a side of the surface 11 of the circuit substrate 10 away from the surface 12 , and the first heat dissipation device 61 It is in contact with the side of the second thermal conductive part 33 away from the circuit substrate 10 to dissipate heat of the second thermal conductive part 33, which is beneficial to the dissipation of heat, and thus is conducive to quickly lowering the electronic component 50 temperature. The first heat dissipation device 61 may be an air-cooled radiator or a water-cooled radiator, but is not limited thereto. The first heat dissipation device 61 can be connected to the side of the second heat conduction portion 33 away from the circuit substrate 10 through a thermal conductive glue layer (such as thermal conductive silica gel) or a welding layer.

Referring to FIG. 22 , when the second surface 312 is flush with the surface 12 or is located on a side of the surface 12 away from the second heat conductive portion 33 , the circuit board 100 may further include a second heat dissipation device. 63. The second heat dissipation device 63 is located on the side of the surface 12 of the circuit substrate 10 away from the surface 11, and the second heat dissipation device 63 is in contact with the second surface 312 of the first heat conductive part 31 for The heat dissipation of the first heat conduction part 31 is beneficial to the dissipation of heat, which is beneficial to quickly reducing the temperature of the electronic component 50 . The second heat dissipation device 63 may be an air-cooled radiator or a water-cooled radiator, but is not limited thereto. The second heat dissipation device 63 may be connected to the second surface 312 of the first heat conduction part 31 through a thermally conductive glue layer (such as thermally conductive silica gel) or a welding layer.

In some embodiments, the opening 314 may also be omitted. At this time, the entire electronic component 50 is located at the inside the accommodation space 310. The electronic component 50 may be electrically connected to the circuit substrate 10 through conductive wires, or may be electrically connected to the circuit substrate 10 through the heat conductive block 30 .

It should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present application. , are all covered by the protection scope of this application; without conflict, the implementation modes and features in the implementation modes of this application can be combined with each other. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (20)

A circuit board, characterized by including: A circuit substrate, the surface of which is recessed inward to form a receiving groove; Thermal conductive block includes a first thermal conductive part and two spaced second thermal conductive parts; the first thermal conductive part includes a first surface, a second surface opposite to the first surface, and a second surface connected to the first surface and the second thermal conductive part. The third surface of the second surface opens an accommodation space from the first surface toward the second surface, and each of the second heat conductive portions faces from an end of the third surface close to the first surface. Extending in a direction away from the accommodating space, the first thermal conductive part is embedded in the accommodating groove, and the second thermal conductive part is fixed on the surface of the circuit substrate; Electronic components, at least a part of the electronic components is located in the accommodation space and in contact with the thermal conductive block, and the electronic components are electrically connected to the circuit substrate. The circuit board of claim 1, wherein the second thermal conductive portion has a concave portion or a convex portion on a side facing away from the circuit substrate. The circuit board of claim 1, wherein the first surface has concave or convex portions. The circuit board of claim 1, wherein the receiving groove penetrates two opposite surfaces of the circuit substrate. The circuit board of claim 4, wherein the second surface is provided with concave portions or convex portions. The circuit board of claim 4, wherein the second surface is flush with a surface of the circuit substrate facing away from the second heat conducting portion or is located on a side of the circuit substrate facing away from the second heat conducting portion. side. The circuit board of claim 1, wherein the depth of the receiving groove is less than the thickness of the circuit substrate. The circuit board of claim 7, wherein the receiving groove includes a bottom wall facing the second surface, and the second surface is fixed to the bottom wall. The circuit board of claim 8, wherein an adhesive layer is provided between the second surface and the bottom wall, and the adhesive layer bonds the bottom wall and the second surface. The circuit board of claim 1, wherein the portion of the electronic component located in the accommodating space is fixed to the heat conductive block. The circuit board of claim 1, wherein the receiving groove includes a side wall, a conductive layer is provided on the side wall, the circuit substrate includes a circuit, and the circuit is electrically connected to the conductive layer. The circuit board of claim 11, wherein the thermally conductive block is electrically conductive, the electronic component is electrically connected to the thermally conductive block, and the thermally conductive block is in contact with and electrically connected to the conductive layer. The circuit board according to claim 1, characterized in that the number of the electronic components is multiple, and a plurality of the electronic components are arranged in the accommodation space. The circuit board according to claim 1, wherein the two second thermal conductive parts are arranged opposite to the first thermal conductive part. The circuit board of claim 1, wherein the circuit board further includes a heat dissipation device, and the heat dissipation device is in contact with a side of the second heat conductive portion away from the circuit substrate. The circuit board of claim 6, wherein the circuit board further includes a heat dissipation device, and the heat dissipation device is in contact with the second surface. The circuit board according to any one of claims 1 to 16, wherein the accommodating space forms an opening on the third surface, and a part of the electronic component is located in the accommodating space and connected with the The thermal block contacts and the other part protrudes from the opening. The circuit board of claim 1, wherein the number of the openings is two, and the two openings are arranged opposite to each other. The circuit board of claim 18, wherein opposite ends of the electronic component respectively protrude from the two openings and are located on opposite sides of the first thermal conductive part. An electronic device includes a casing, characterized in that the electronic device further includes the circuit board according to any one of claims 1 to 19, and the circuit board is disposed in the casing.