WO2019210628A1

WO2019210628A1 - Chip pick-up and mounting device and chip mounting machine using same

Info

Publication number: WO2019210628A1
Application number: PCT/CN2018/102416
Authority: WO
Inventors: 王敕
Original assignee: 苏州艾科瑞思智能装备股份有限公司
Priority date: 2018-05-03
Filing date: 2018-08-27
Publication date: 2019-11-07
Also published as: CN110444499A; JP3231027U; CN110444499B

Abstract

Provided in the present invention are a chip pick-up and mounting device and a chip mounting machine using same. A rotation driving device is provided at a middle position between a wafer table and a chip carrier. The driving device is provided with a swing arm body connected thereto, and is used for driving the swing arm body to rotate 180 degrees clockwise and 180 degrees counterclockwise in a horizontal direction. Each of two ends of the swing arm body of the present invention is provided with a suction nozzle, and the swing arm body can simultaneously complete chip pick-up and chip mounting, improving the chip mounting efficiency. Moreover, the swing arm body of the present invention alternately rotates 180 degrees clockwise and 180 degrees counterclockwise, and the swing arm body is connected to the rotation driving device thereof by means of a U-shaped connecting piece, thereby effectively preventing air pipes from winding. Meanwhile, the structural arrangement of the present invention is reasonable, the entire device has a high response speed, improving the chip mounting efficiency and the chip mounting yield.

Description

Picking and loading device and loading machine using same

Technical field

The invention relates to the field of semiconductor component packaging, and in particular to a chip taking device, a film loading device and a film loading machine using the same.

Background technique

In the field of electronic technology, we often use packaged semiconductor components or chips. In the packaging process, the semiconductor chips on the wafer need to be removed and placed on the carrier substrate. Specifically, the first point is needed. The glue machine dispenses on the loading station on the carrier substrate, and then the semiconductor chip is taken out from the wafer by the loading arm of the loading mechanism, and then transferred to the loaded loading station; In the process of taking the film, a thimble is arranged under the blue film of the wafer, and a visual positioning device is arranged on the blue film of the wafer: first, by judging the position of the chip on the wafer, and making the thimble under the chip and the chip face the visual device; Move the piece of welding head so that the welding head is facing the visual device, so that the center of the piece welding head, the center of the thimble, and the center of the visual positioning can be achieved at three points. This process is also called three-point one. Line calibration work.

Under the same loading quality conditions (the chip is precisely packaged in the dispensing position), the loading efficiency of the loading machine is an important indicator to evaluate the performance of the loading machine. In order to quickly remove the chip from the wafer and quickly move the chip to the loading station: Chinese patent No. 201310262893.2, discloses a double swing arm type mounting machine welding head mechanism and loading machine, including a rotary motion driving device, a first swing arm, a second swing arm, a first linear motion driving device, a second linear motion driving device, a first suction nozzle, and a second suction nozzle, wherein the linear motion driving device is used for driving the suction The nozzle moves up and down to suck the chip on the wafer and place the chip on the fixed station on the carrier substrate; at the same time, the swing arm body can be rotated to further switch between the taking and loading stations; in theory, it can Improve efficiency, but there are two problems in the actual implementation process: 1) In the technical field, the visual positioning device is usually placed at the wafer position, and the swing arm body is moved in the x, y direction, so that the swing arm body is mounted The center of the welding head, the center of the thimble, and the center of the visual positioning are three points and one line, but there is no such moving device in the x, y direction; 2) in order to move the nozzle up and down, the linear motion driving device is fixed at Head arm body, increasing the rotational inertia of the system, reducing the rotational speed and accuracy, it is difficult to play a role in the speed.

The Chinese patent No. 201220257299.5 discloses a double swing arm type direct drive loading machine, which comprises a rotating electric machine, a swing arm connecting plate connected to the output end of the rotating electric machine, and two sets of opposite arrangement mounted on the swing arm connecting plate. The swing arm mechanism includes a swing arm seat, a voice coil motor stator fixed in the swing arm seat, a slider connected to the swing arm seat through a vertically disposed third rail, and is fixed on the slider and a voice coil motor stator adapted to the voice coil motor mover, a swing arm fixed on the slider; the voice coil motor stator and the voice coil motor mover cooperate to drive the slider to move along the third guide rail relative to the swing arm seat; The swing arm seat is rotated by the swing arm connecting plate to rotate the entire swing arm mechanism. It can realize the simultaneous driving of the swing arm movement and the up and down movement, and can also take the film taking and loading process at the same time, but the voice coil motor mover and the slider are still the rotating load of the rotating motor, which increases the moment of inertia of the system. , reducing the rotation speed and accuracy, it is difficult to speed up. In the actual implementation process, there are also two problems existing in the above patent No. 201310262893.2, which is urgently needed to be improved.

Summary of the invention

In order to solve the above problems, the present invention provides a film taking device, a film loading device, and a film loading machine using the same. The suction arm body of the invention is provided with nozzles at both ends, which can complete the taking and loading operations at the same time, greatly improving the loading efficiency; secondly, the swing arm body of the invention rotates 180° clockwise and 180° counterclockwise, and the swing arm The body is connected to its rotary drive through a special jaw-shaped connector, which effectively prevents the air tube from being entangled. At the same time, the structure of the invention is reasonable, the response of the whole device is fast, and the loading efficiency and the yield of the film are greatly improved.

In order to achieve the technical object, the technical solution of the present invention is: a film taking and loading device, comprising a wafer table and a film table, wherein the wafer table is used for placing a wafer, and the film carrier is used for placing the wafer. The substrate is described; it should be noted that the taking and loading operations refer to taking out the chip on the wafer and placing the chip onto the substrate.

Rotating driving device is arranged at a midpoint position of the wafer table and the film table for driving the following swing arm body to realize 180° clockwise rotation and 180° counterclockwise rotation in the horizontal direction;

A vertical motion driving device is provided for driving the first nozzle and the second nozzle to move up and down in the vertical direction. In the initial position, firstly, assuming that the first nozzle is located above the wafer table, when the first nozzle and the second nozzle are moved down, the first nozzle completes the taking operation, and the second nozzle simultaneously completes the loading operation. After that, the first nozzle and the second nozzle are moved up and rotated by 180°, and finally the first nozzle and the second nozzle are moved downward, and the second nozzle completes the taking operation, and the first nozzle completes loading. Action; repeat the above steps, the following swing arm body rotates 180° clockwise and 180° counterclockwise to realize simultaneous take-up and loading operations, which greatly improves the efficiency of filming and loading of the loading machine.

The swing arm body comprises: a first swing arm and a second swing arm, wherein the first swing arm and the second swing arm are oppositely disposed at opposite ends of the swing arm connecting plate, and the swing arm connecting plate forms a one-shaped swing arm body ;

The first swing arm and the second swing arm end are respectively provided with a first nozzle and a second nozzle for taking out and placing the chip on the wafer.

Further, the first nozzle and the second nozzle are facing downward, and a vacuum generator is connected by setting a gas pipe for taking out or placing the chip.

As a preferred embodiment of the present invention, based on the above, the rotary drive is driven by a motor or a corner cylinder;

The motor output shaft is connected to the midpoint of the swing arm connecting plate through a 连接-shaped connecting member;

An upper hole and a lower hole are respectively disposed on upper and lower portions of the 匚-shaped connecting member, and the motor output shaft is fixed to the upper hole of the 匚-shaped connecting member, and the midpoint of the swing arm connecting plate is fixed to the lower hole;

The gas pipe is connected to the vacuum generator through a lower hole.

Further, the air pipe is connected to the vacuum generator after passing through the first swing arm, the second swing arm, the swing arm connecting plate and the lower hole.

As a preferred embodiment of the present invention, based on the above, the first swing arm, the second swing arm and the swing arm connecting plate are integrally formed; the vertical motion driving device uses a linear motor to act on the The rotary driving device is configured to drive the rotating arm body to move up and down. As another embodiment of the present invention, the vertical motion driving device adopts a rotating electric machine, and the rotating electric machine output shaft is connected with a setting cam, and the cam top touches the rotating driving device or the rotating arm for driving the rotating arm body to move up and down.

As a preferred embodiment of the present invention, based on the above, the first swing arm and the second swing arm are respectively slidably connected up and down at two ends of the swing arm connecting plate; the vertical motion driving devices respectively function The first swing arm and the second swing arm are configured to simultaneously drive the first swing arm and the second swing arm to move up and down; the vertical motion driving device is decoupled from the rotary driving device, and the vertical motion driving device passes the motor The fixing frame is independently fixed, and the vertical motion driving device of the decoupling connection greatly reduces the motor load and the moment of inertia of the rotary driving device, improves the rotation speed and precision, and effectively accelerates the speed.

As a preferred embodiment of the present invention, based on the above, the difference is that a horizontal driving device is provided, and the horizontal moving device comprises a first horizontal driving device, a second horizontal driving device, and a third horizontal driving device;

a first horizontal driving device is disposed under the wafer table, and a first visual positioning device is disposed directly above the wafer table for calculating a first nozzle or a second nozzle relative to a center of the chip on the wafer a positional deviation, moving the wafer table such that the chip on the wafer faces the first visual positioning device;

The rotating arm body is connected to the second horizontal driving device for driving the rotating arm body in the X and Y directions, so that the first nozzle or the second nozzle, the on-wafer chip, and the first visual positioning device Three points and one line.

further,

a third horizontal driving device is disposed under the film stage for driving the film stage to move in the X and Y directions, and the film stage and the rotating arm body move synchronously;

And a second visual positioning device is disposed directly above the wafer table for calculating a position deviation of the center of the loading position on the chip substrate and the second visual positioning device, and moving the carrier table to position the chip on the chip substrate The center is facing the second visual positioning device. That is to say, in order to achieve the purpose of precision loading, the loading machine of the present invention firstly needs to ensure the correspondence between the second visual positioning device and the center position of the carrier substrate, and secondly, the carrier substrate needs to be moved synchronously with the rotating arm body to maintain The center of the chip on the first nozzle or the second nozzle corresponds to the center of the loading position.

Further, the horizontal driving device comprises: a vertical driving board, a horizontal driving board, and an intermediate body;

The rotary driving device is fixed on the left side of the vertical driving board, the Y-direction rail is disposed on the left side of the intermediate body, and the right side surface of the vertical driving board is fastened to the Y-direction rail for driving the rotary driving device to move in the Y direction ;

The upper side of the intermediate body is provided with an X-direction track, and the lower side of the horizontal driving plate is fastened to the X-direction track for driving the intermediate body to move in the X direction, further driving the rotary driving device to move in the X direction.

The loading machine comprises a substrate feeding device and a dispensing device, and further comprises the above-mentioned taking and loading device.

The beneficial effects of the invention are:

Firstly, the nozzle body of the present invention is provided with suction nozzles at both ends, which can simultaneously complete the taking and loading operations, and greatly improve the loading efficiency; secondly, the swing arm body of the present invention rotates 180° clockwise and 180° counterclockwise, and The swing arm body is connected to the rotary driving device through a special 连接-shaped connecting member, thereby effectively preventing the air tube from being entangled; and the decoupled vertical motion driving device greatly reduces the motor load and the moment of inertia of the rotary driving device, and improves the rotation. Speed and precision have actually played a role in speeding up. At the same time, the structure of the invention is reasonable, the response of the whole device is fast, and the loading efficiency and the yield of the film are greatly improved.

DRAWINGS

1 is a schematic plan view showing a take-up and loading device of the present invention;

Figure 2 is a schematic structural view of a 匚 type connector of the present invention;

3 is a schematic structural view of the integrated swing arm body of the present invention;

4 is a schematic structural view of a sliding swing arm body of the present invention;

Figure 5 is a schematic view showing the installation structure of the nozzle driving motor of the present invention;

Figure 6 is a schematic structural view of a horizontal driving device of the present invention;

Fig. 7 is a schematic structural view of a direct drive rotating device.

detailed description

The technical solutions of the present invention will be clearly and completely described below.

It should be noted that, in the present invention, "horizontal", "vertical", "front", "back", "left", "right", "upper" and "lower" refer to the direction in the drawing, which is also The take-up and loading device of the invention uses the positional direction. The "X direction" and the "Y direction" are relative to the coordinate systems in FIGS. 1 and 4, and the coordinate systems in FIGS. 1 and 4 are the two representation results in the same coordinate system.

As shown in FIG. 1 , a take-up and loading device includes a wafer stage for placing a wafer 1 and a wafer stage 6 for placing a carrier substrate 7; The following take-up and loading operations are described, that is, taking out the chip 3 on the wafer and placing the chip 3 onto the carrier substrate 7.

Rotating driving device 16 is disposed at a midpoint of the wafer table and the carrier table 6 for driving the following swing arm body to realize a clockwise 180° and a counterclockwise 180° rotation in the horizontal direction;

A vertical motion driving device is provided for driving the first nozzle 11 and the second nozzle 12 described below to move up and down in the vertical direction. In the initial position, firstly, it is assumed that the first nozzle 11 is located above the wafer table, and when the first nozzle 11 and the second nozzle 12 are moved downward, the first nozzle completes the taking operation, and the second nozzle 12 is simultaneously completed. After the loading operation, the first suction nozzle 11 and the second suction nozzle 12 are moved up and rotated by 180°, and finally the first suction nozzle 11 and the second suction nozzle 12 are moved downward, and the second suction nozzle completes the taking operation, The first nozzle completes the loading operation; repeating the above steps, the following swing arm body rotates 180° clockwise and 180° counterclockwise to realize the simultaneous taking and loading operations, thereby greatly improving the loading of the loading machine. Film and loading efficiency. At the same time, the swing arm body that rotates 180° clockwise and 180° counterclockwise can prevent the air tube from being entangled by the swing arm body rotated 360°.

The swing arm body includes a first swing arm 5 and a second swing arm 10, and the first swing arm 5 and the second swing arm 10 are disposed opposite to each other at the two ends of the swing arm connecting plate 4, and the swing arm connecting plate 4 forms a The swing arm body of the font shape; that is, the two ends of the swing arm body of the present invention are the first suction nozzle 11 and the second suction nozzle 12, respectively.

The first swing arm 5 and the second swing arm 10 are respectively provided with a first suction nozzle 11 and a second suction nozzle 12 for taking out the chip and placing the chip.

Further, the first suction nozzle 11 and the second suction nozzle 12 face downward, and are respectively connected to the vacuum generator by providing a gas pipe for taking out or placing the chip. That is to say, the taking operation of the present invention is performed by sucking the chip on the wafer by the vacuum nozzle, and the loading operation is performed by releasing the pressure on the vacuum suction nozzle and placing the chip on the substrate.

As a preferred embodiment of the present invention, based on the above, the rotation drive unit 16 is driven by a motor or a corner cylinder;

The motor output shaft 17 is connected to the midpoint of the swing arm connecting plate through the 连接-shaped connecting member 13;

As shown in FIG. 2, an upper hole 14 and a lower hole 15 are respectively disposed at upper and lower portions of the U-shaped connecting member 13, and the motor output shaft 17 is fixed in the upper hole 14 of the 连接-shaped connecting member 13, and the swing arm connecting plate is fixed at a midpoint. In the lower hole 15, as a preferred embodiment of the present invention, the swing arm connecting plate 4 is provided with a hole in the center, and a sleeve is sleeved in the hole, and the sleeve is fixed in the lower hole 15. The advantage of adopting the embodiment is that when the swing arm body maintains an action of rotating 180° clockwise and 180° counterclockwise, the air pipe passes through the lower hole 15 so that the air pipe is in a relatively static state to prevent the air pipe from being entangled. Of course, if the connection mode of the U-shaped connecting member 13 is not adopted, the rotary driving device 16 directly adopts a hollow type DDR motor, such as the direct drive rotating device disclosed by CN 102290951 A, and the direct drive rotating device includes the bearing housing 32. The outer casing 26, and the stator 27, the lower cover 30, the rotor 28 composed of the yoke 33 and the permanent magnet block 34, the bearing 29, the scale 31 and the code reader; the inner ring of the bearing 29 and the bearing block 32 are fixed, and the outer ring of the bearing 29 The yoke 33 and the rotor 28 are fixed, and the output shaft 35 is fixed to the shaft sleeve in the yoke cavity of the yoke 33 by a flat key, and the output shaft 35 is connected to the hole 9 of the swing arm connecting plate 4.

Further, after the air pipe passes through the first swing arm 5, the second swing arm 10, the swing arm connecting plate 4, and the lower hole 15, it is connected to a vacuum generator. The advantage of adopting the technical solution is that the air pipe is placed inside the swing arm body to prevent the air pipe from being exposed and entangled, thereby increasing the stability of the device.

As a preferred embodiment of the present invention, based on the above, the difference is that, as shown in FIG. 3, the first swing arm 5, the second swing arm 10 and the swing arm connecting plate 4 are integrally formed; The motion drive device acts on the rotary drive unit 16 using a linear motor. As another embodiment of the present invention, the vertical motion driving device adopts a rotating electrical machine, and the rotating motor output shaft is connected with a setting cam, and the cam top touches the rotating driving device or the rotating arm for driving the rotating arm body to move up and down, further making two The nozzles move up and down to realize the movement in the Z direction to complete the simultaneous taking and loading operations.

As a preferred embodiment of the present invention, based on the above, the first swing arm 5 and the second swing arm 10 are respectively slidably connected up and down at the two ends of the swing arm connecting plate 4; The first swing arm 5 and the second swing arm 10 are respectively provided with sliding connecting members 18 connected to both ends of the swing arm connecting plate 4; the vertical motion driving device adopts two linear motors 24, or a voice coil motor or a cam mechanism One is respectively applied to the first swing arm 5 and the second swing arm 10, respectively for respectively driving the first swing arm 5 and the second swing arm to move up and down 10, further driving the two nozzles to move up and down to realize the Z direction. Moving to complete simultaneous taking and loading operations; the vertical motion driving device is decoupled from the rotary driving device, and a turntable is disposed on the top of the device, and the vertical motion driving device is independently fixed and suspended on the top by the motor fixing frame 25 The rotary drive unit 16 of the present invention or the rotary drive unit 16 of the present invention is fixed to the horizontal drive unit described below, and the vertical motion drive unit of the present invention is independently suspended from the top of the apparatus, and the vertical movement in the vertical direction is relatively independent. The advantage of using this embodiment is that the linear motion motor or the cam that moves up and down is directly disposed on the rotary driving device 16. The two decoupled vertical motion driving devices of the present embodiment greatly reduce the motor load and rotation of the rotary driving device. Inertia, flexible movement, improved rotation speed and accuracy, and actually played a role in speeding up.

a first horizontal driving device is disposed under the wafer table, and a first visual positioning device 2 is disposed directly above the wafer table for calculating the first nozzle 11 or the second nozzle 12 relative to the wafer on the wafer 3, the first position deviation of the center, moving the wafer table, so that the chip on the wafer faces the first visual positioning device;

The rotating arm body is connected to the second horizontal driving device for driving the rotating arm body in the X and Y directions, so that the first nozzle 11 or the second nozzle 12, the on-wafer chip 3, the first The visual positioning device 2 is three points and one line, so as to achieve the purpose of accurate film taking.

Further, the film stage 6 is provided with a third horizontal driving device for driving the film stage to move in the X and Y directions, and the film stage and the rotating arm body move synchronously;

And a second visual positioning device is disposed directly above the wafer table for calculating a position deviation of the center of the loading position on the chip substrate and the second visual positioning device, and moving the carrier table to position the chip on the chip substrate The center is facing the second visual positioning device. That is to say, in order to achieve the purpose of precision loading, the loading machine of the present invention firstly needs to ensure the correspondence between the second visual positioning device and the center position of the carrier substrate, and secondly, the carrier substrate needs to be moved synchronously with the rotating arm body to maintain The correspondence of the first nozzle or the second nozzle with respect to the center of the loading position.

It should be noted that the taking and loading of the present invention are performed simultaneously (in parallel), and the first nozzle 11 or the second nozzle 12 is located on the same rotating arm body, so when the xy motion device drives the rotating arm body, The sheet horn (the first nozzle 11 or the second nozzle 12) is offset from the loading position. Each time the rotating arm body is moved a certain distance, the third horizontal driving device of the carrier table actively compensates the distance to ensure that the loading position on the carrier substrate 7 is always positive for the first or second nozzle, thus The chip soldering head can better achieve three points and one line, ensuring the reliability and precision of the film.

In the implementation method of the present invention, the initial position of the first nozzle 11 is manually adjusted above the wafer 1 to ensure that the position of the crystal pulling station is 0; the second nozzle 12 is directed to the center of the loading position on the carrier substrate 7. And manually adjusting the position deviation of the second visual positioning device relative to the second nozzle to be zero.

The implementation steps of the embodiment are as follows:

1) While the first visual device performs the three-point one-line correction work, while recording the movement amount of the second horizontal driving device, the third horizontal driving device moves the rotating table body and the rotating arm body synchronously, and the rotating arm body moves downward. At the same time, the filming and loading operations are completed and moved up;

2) After the rotating arm body rotates 180° clockwise, the correction of the three-point line is completed again, and the movement amount of the second horizontal driving device is recorded, and the third horizontal driving device moves the bearing table and the rotating arm body synchronously. The rotating arm body moves down and simultaneously moves up after the taking and loading operations; wherein before the loading is performed, the third horizontal driving device moves the receiving table so that the loading position on the chip substrate is centered on the second visual positioning device. That is to say, in order to achieve the purpose of precision loading, the loading machine of the present invention firstly needs to ensure the correspondence between the second visual positioning device and the center position of the carrier substrate, and secondly, the carrier substrate needs to be moved synchronously with the rotating arm body to maintain The center of the chip on the first nozzle or the second nozzle corresponds to the center of the loading position.

3) After rotating the rotating arm body counterclockwise by 180°, repeat the calibration of the three points and one line at the picking position, and make the bearing table move synchronously.

Through the above steps, fast and accurate taking and loading operations can be realized, and the position of the receiving table is relatively fixed, so that the entire device has a fast response, which greatly improves the loading efficiency and the yield (quality) of the loading.

Further, the horizontal driving device comprises: a vertical driving board 19, a horizontal driving board 22, an intermediate body 23;

The rotary driving device 16 is fixed to the left side surface of the vertical driving plate 19, the Y-direction rail 20 is disposed on the left side of the intermediate body 23, and the right side surface of the vertical driving plate 19 is fastened to the Y-direction rail 20 for driving the rotation. The driving device 16 moves in the Y direction;

The X-direction rail 21 is disposed on the upper side of the intermediate body 23, and the lower side of the horizontal driving board 22 is fastened to the X-direction rail 21 for driving the intermediate 23 body to move in the X direction, further driving the rotary driving device 16 to move in the X direction. The advantage of using the technical solution is that the chip and the two nozzles are automatically fine-tuned according to the first position deviation recorded by the first visual positioning device 2, so that the nozzle can be further accurately taken above the center position of the chip that needs to take the chip. The purpose of the film.

It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and scope of the invention.

Claims

A film taking and loading device includes a wafer table for placing a wafer, and a wafer table for placing a carrier substrate; wherein:

a rotary driving device is disposed at an intermediate position between the wafer table and the wafer table, and the driving device is connected to the swing arm body for driving the swing arm body to rotate 180° clockwise and 180° counterclockwise in the horizontal direction;

Providing a vertical motion driving device for driving the first nozzle and the second nozzle to move up and down in a vertical direction;

The swing arm body comprises: a first swing arm and a second swing arm, wherein the first swing arm and the second swing arm are oppositely disposed at opposite ends of the swing arm connecting plate, and the swing arm connecting plate forms a one-shaped swing arm body ;

The first swing arm and the second swing arm end are respectively provided with a first nozzle and a second nozzle for taking out and placing the chip on the wafer.
The apparatus for loading and unloading a film according to claim 1, wherein the first nozzle and the second nozzle are facing downward, and a vacuum generator is connected by a gas pipe for taking out or placing the chip.
A picking and loading device according to claim 2, wherein the rotary driving device is driven by a motor or a corner cylinder;

The motor output shaft is connected to the midpoint of the swing arm connecting plate through a 连接-shaped connecting member;

An upper hole and a lower hole are respectively disposed on upper and lower portions of the 匚-shaped connecting member, and the motor output shaft is fixed to the upper hole of the 匚-shaped connecting member, and the midpoint of the swing arm connecting plate is fixed to the lower hole;

The gas pipe is connected to the vacuum generator through a lower hole.
A picking and loading device according to claim 3, wherein the air pipe is connected to the first swing arm, the second swing arm, the swing arm connecting plate and the lower hole, and is connected to Vacuum generator.
A picking and loading device according to claim 3, wherein the first swing arm, the second swing arm and the swing arm connecting plate are integrally formed;

The vertical motion driving device uses a linear motor to act on the rotary driving device for driving the rotating arm body to move up and down;

Alternatively, the vertical motion driving device adopts a rotating electric machine, and the rotating electric machine output shaft is connected to the setting cam for driving the rotating arm body to move up and down.
A picking and loading device according to claim 3, characterized in that

The first swing arm and the second swing arm are respectively slidably connected up and down at two ends of the swing arm connecting plate;

The vertical motion driving device is respectively applied to the first swing arm and the second swing arm for simultaneously driving the first swing arm and the second swing arm to move up and down;

The vertical motion drive is decoupled from the rotary drive, and the vertical motion drive is independently fixed by a motor mount.
A picking and loading device according to claim 1, wherein

Providing a horizontal driving device, the horizontal moving device comprising a first horizontal driving device, a second horizontal driving device, and a third horizontal driving device;

a first horizontal driving device is disposed under the wafer table, and a first visual positioning device is disposed directly above the wafer table for calculating a first nozzle or a second nozzle relative to a center of the chip on the wafer a positional deviation, moving the wafer table such that the chip on the wafer faces the first visual positioning device;

The rotating arm body is connected to the second horizontal driving device for driving the rotating arm body in the X and Y directions, so that the first nozzle or the second nozzle, the on-wafer chip, and the first visual positioning device Three points and one line.
A picking and loading device according to claim 7, wherein

a third horizontal driving device is disposed under the film stage for driving the film stage to move in the X and Y directions, and the film stage and the rotating arm body move synchronously;

And a second visual positioning device is disposed directly above the wafer table for calculating a position deviation of the center of the loading position on the chip substrate and the second visual positioning device, and moving the carrier table to position the chip on the chip substrate The center is facing the second visual positioning device.
A picking and loading device according to claim 8, wherein:

The horizontal driving device comprises: a vertical driving plate, a horizontal driving plate, and an intermediate body;

The rotary driving device is fixed on the left side of the vertical driving board, the Y-direction rail is disposed on the left side of the intermediate body, and the right side surface of the vertical driving board is fastened to the Y-direction rail for driving the rotary driving device to move in the Y direction ;

The upper side of the intermediate body is provided with an X-direction track, and the lower side of the horizontal driving plate is fastened to the X-direction track for driving the intermediate body to move in the X direction, further driving the rotary driving device to move in the X direction.
The loading machine includes a substrate loading device and a dispensing device, and further comprising a picking and loading device according to any one of claims 1-9.