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WO2008102592A1 - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component Download PDF

Info

Publication number
WO2008102592A1
WO2008102592A1 PCT/JP2008/050787 JP2008050787W WO2008102592A1 WO 2008102592 A1 WO2008102592 A1 WO 2008102592A1 JP 2008050787 W JP2008050787 W JP 2008050787W WO 2008102592 A1 WO2008102592 A1 WO 2008102592A1
Authority
WO
WIPO (PCT)
Prior art keywords
tcps
receiving
holding
mounting
punching
Prior art date
Application number
PCT/JP2008/050787
Other languages
French (fr)
Japanese (ja)
Inventor
Keigou Hirose
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN200880001513.7A priority Critical patent/CN101578933B/en
Priority to JP2009500110A priority patent/JP5046253B2/en
Priority to KR1020097013869A priority patent/KR101166058B1/en
Publication of WO2008102592A1 publication Critical patent/WO2008102592A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by the punching apparatus and transferring them to a prescribed position; index means (5A, 5B) which have a plurality of first holding heads (6) for receiving and holding the TCPs transferred by the receiving/transferring means; buffer means (31A, 31B) having a second holding head (34) for receiving and holding the TCPs held by a first holding head of the index means; and mounting heads (36A, 36B) for receiving the TCPs stored in the buffer means and mounts them on the side portion of the substrate.
PCT/JP2008/050787 2007-02-22 2008-01-22 Apparatus and method for mounting electronic component WO2008102592A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880001513.7A CN101578933B (en) 2007-02-22 2008-01-22 Mounting device and mounting method of electronic parts
JP2009500110A JP5046253B2 (en) 2007-02-22 2008-01-22 Electronic component mounting apparatus and mounting method
KR1020097013869A KR101166058B1 (en) 2007-02-22 2008-01-22 Apparatus and method for mounting electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007042332 2007-02-22
JP2007-042332 2007-02-22

Publications (1)

Publication Number Publication Date
WO2008102592A1 true WO2008102592A1 (en) 2008-08-28

Family

ID=39709871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050787 WO2008102592A1 (en) 2007-02-22 2008-01-22 Apparatus and method for mounting electronic component

Country Status (4)

Country Link
JP (1) JP5046253B2 (en)
CN (1) CN101578933B (en)
TW (1) TWI451819B (en)
WO (1) WO2008102592A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035583A1 (en) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
WO2010035582A1 (en) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
JP2010080875A (en) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp Punching device, and apparatus and method for mounting electronic component
JP2010272754A (en) * 2009-05-22 2010-12-02 Panasonic Corp Component mounting apparatus and method
WO2011016307A1 (en) * 2009-08-07 2011-02-10 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
JP2018074090A (en) * 2016-11-04 2018-05-10 パナソニックＩｐマネジメント株式会社 Component mounting device
EP3715886A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715887A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
JP7543061B2 (en) 2020-09-30 2024-09-02 芝浦メカトロニクス株式会社 Electronic component mounting equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4652487B2 (en) * 2009-07-09 2011-03-16 パナソニック株式会社 Component mounting apparatus and method
KR20230138423A (en) * 2022-03-23 2023-10-05 시바우라 메카트로닉스 가부시끼가이샤 Electronic component mounting device and mounting method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (en) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2002093859A (en) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp Component mounting apparatus and component delivery method used in the apparatus
JP2002305398A (en) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp Component mounting device and component mounting method
JP2002314294A (en) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp Component mounting apparatus and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929937B2 (en) * 1994-04-20 1999-08-03 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
JP3176580B2 (en) * 1998-04-09 2001-06-18 太陽誘電株式会社 Electronic component mounting method and mounting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106796A (en) * 1993-09-30 1995-04-21 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2002093859A (en) * 2000-09-18 2002-03-29 Shibaura Mechatronics Corp Component mounting apparatus and component delivery method used in the apparatus
JP2002305398A (en) * 2001-04-06 2002-10-18 Shibaura Mechatronics Corp Component mounting device and component mounting method
JP2002314294A (en) * 2001-04-11 2002-10-25 Shibaura Mechatronics Corp Component mounting apparatus and method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223896B1 (en) * 2008-09-29 2013-01-17 시바우라 메카트로닉스 가부시끼가이샤 Apparatus and method for mounting electronic component
WO2010035582A1 (en) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
JP2010080875A (en) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp Punching device, and apparatus and method for mounting electronic component
JP2010080874A (en) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component
JP2010080876A (en) * 2008-09-29 2010-04-08 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component
TWI462664B (en) * 2008-09-29 2014-11-21 Shibaura Mechatronics Corp Installation and installation method of electronic parts (1)
CN102165858A (en) * 2008-09-29 2011-08-24 芝浦机械电子株式会社 Apparatus and method for mounting electronic component
WO2010035583A1 (en) * 2008-09-29 2010-04-01 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
JP2010272754A (en) * 2009-05-22 2010-12-02 Panasonic Corp Component mounting apparatus and method
CN102473652A (en) * 2009-08-07 2012-05-23 芝浦机械电子株式会社 Apparatus and method for mounting electronic component
WO2011016307A1 (en) * 2009-08-07 2011-02-10 芝浦メカトロニクス株式会社 Apparatus and method for mounting electronic component
JP2018074090A (en) * 2016-11-04 2018-05-10 パナソニックＩｐマネジメント株式会社 Component mounting device
EP3715886A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
EP3715887A1 (en) * 2019-03-29 2020-09-30 Sintokogio, Ltd. Inspecting device
CN111830385A (en) * 2019-03-29 2020-10-27 新东工业株式会社 Inspection device
JP7543061B2 (en) 2020-09-30 2024-09-02 芝浦メカトロニクス株式会社 Electronic component mounting equipment

Also Published As

Publication number Publication date
JPWO2008102592A1 (en) 2010-05-27
CN101578933A (en) 2009-11-11
JP5046253B2 (en) 2012-10-10
TWI451819B (en) 2014-09-01
CN101578933B (en) 2012-02-22
TW200845840A (en) 2008-11-16

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