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USD601520S1 - Electric circuit board - Google Patents

Electric circuit board Download PDF

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Publication number
USD601520S1
USD601520S1 US29/232,144 US23214405F USD601520S US D601520 S1 USD601520 S1 US D601520S1 US 23214405 F US23214405 F US 23214405F US D601520 S USD601520 S US D601520S
Authority
US
United States
Prior art keywords
circuit board
electric circuit
ornamental design
electric
drawings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/232,144
Inventor
Yasuo Yokota
Motonari Ogura
Masahiko Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRATA, MASAHIKO, OGURA, MOTONARI, YOKOTA, YASUO
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Application granted granted Critical
Publication of USD601520S1 publication Critical patent/USD601520S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top perspective view of an electric circuit board of the present invention; and,
FIG. 2 is a top view thereof.
The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for an electric circuit board, as shown and described.
US29/232,144 2005-01-14 2005-06-15 Electric circuit board Expired - Lifetime USD601520S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005000814 2005-01-14
JP2005-000814 2005-01-14

Publications (1)

Publication Number Publication Date
USD601520S1 true USD601520S1 (en) 2009-10-06

Family

ID=41128819

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/232,144 Expired - Lifetime USD601520S1 (en) 2005-01-14 2005-06-15 Electric circuit board

Country Status (1)

Country Link
US (1) USD601520S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
USD701182S1 (en) * 2011-04-12 2014-03-18 Plasyl Limited Wave circuit pattern
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
US20160066410A1 (en) * 2014-09-02 2016-03-03 Samsung Display Co. Ltd. Curved display device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD784936S1 (en) * 2014-05-28 2017-04-25 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
USD785575S1 (en) * 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD855577S1 (en) * 2018-04-12 2019-08-06 Telebox Industries Corp. Circuit board for electrical connector

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US168063A (en) * 1875-09-21 Improvement in sheet-iron blanks
US4537001A (en) * 1983-05-23 1985-08-27 Uppstroem Leif R Building elements
US4696706A (en) * 1985-10-31 1987-09-29 Griffin Kevin W Method of using logic design adhesive symbols
US5061822A (en) * 1988-09-12 1991-10-29 Honeywell Inc. Radial solution to chip carrier pitch deviation
US5066999A (en) * 1989-10-23 1991-11-19 Micron Technology, Inc. Resistor under wirebond pad
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
US5484963A (en) * 1993-12-10 1996-01-16 Ngk Spark Plug Co., Ltd. Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like
USD383081S (en) * 1995-02-10 1997-09-02 Ffrench David C Set of reflective safety markers
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
US5951304A (en) * 1997-05-21 1999-09-14 General Electric Company Fanout interconnection pad arrays
US6078505A (en) * 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
US6163042A (en) * 1998-07-02 2000-12-19 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
US6269327B1 (en) * 1999-02-11 2001-07-31 International Business Machines Corporation System and method for generating wire bond fingers
US6348742B1 (en) * 1999-01-25 2002-02-19 Clear Logic, Inc. Sacrificial bond pads for laser configured integrated circuits
US6483038B2 (en) * 2000-05-23 2002-11-19 Samsung Electronics Co., Ltd. Memory card
US6537850B1 (en) * 2001-03-16 2003-03-25 Micron Technology, Inc. Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
US6566168B2 (en) * 2000-08-09 2003-05-20 Kostat Semiconductor Co., Inc. Semiconductor package having implantable conductive lands and method for manufacturing the same
US20030112613A1 (en) * 2002-10-22 2003-06-19 Hitachi, Ltd. IC card
US6597059B1 (en) * 2001-04-04 2003-07-22 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package
US6611055B1 (en) * 2000-11-15 2003-08-26 Skyworks Solutions, Inc. Leadless flip chip carrier design and structure
US6945465B2 (en) * 2000-01-25 2005-09-20 Hitachi, Ltd. Integrated circuit card having staggered sequences of connector terminals
US20060255473A1 (en) * 2005-05-16 2006-11-16 Stats Chippac Ltd. Flip chip interconnect solder mask

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US168063A (en) * 1875-09-21 Improvement in sheet-iron blanks
US4537001A (en) * 1983-05-23 1985-08-27 Uppstroem Leif R Building elements
US4696706A (en) * 1985-10-31 1987-09-29 Griffin Kevin W Method of using logic design adhesive symbols
US5061822A (en) * 1988-09-12 1991-10-29 Honeywell Inc. Radial solution to chip carrier pitch deviation
US5066999A (en) * 1989-10-23 1991-11-19 Micron Technology, Inc. Resistor under wirebond pad
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
US5484963A (en) * 1993-12-10 1996-01-16 Ngk Spark Plug Co., Ltd. Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like
USD383081S (en) * 1995-02-10 1997-09-02 Ffrench David C Set of reflective safety markers
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
US5757082A (en) * 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5951304A (en) * 1997-05-21 1999-09-14 General Electric Company Fanout interconnection pad arrays
US6163042A (en) * 1998-07-02 2000-12-19 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
US6348742B1 (en) * 1999-01-25 2002-02-19 Clear Logic, Inc. Sacrificial bond pads for laser configured integrated circuits
US6269327B1 (en) * 1999-02-11 2001-07-31 International Business Machines Corporation System and method for generating wire bond fingers
US6078505A (en) * 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
US6945465B2 (en) * 2000-01-25 2005-09-20 Hitachi, Ltd. Integrated circuit card having staggered sequences of connector terminals
US6483038B2 (en) * 2000-05-23 2002-11-19 Samsung Electronics Co., Ltd. Memory card
US6566168B2 (en) * 2000-08-09 2003-05-20 Kostat Semiconductor Co., Inc. Semiconductor package having implantable conductive lands and method for manufacturing the same
US6611055B1 (en) * 2000-11-15 2003-08-26 Skyworks Solutions, Inc. Leadless flip chip carrier design and structure
US6537850B1 (en) * 2001-03-16 2003-03-25 Micron Technology, Inc. Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
US6597059B1 (en) * 2001-04-04 2003-07-22 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package
US20030112613A1 (en) * 2002-10-22 2003-06-19 Hitachi, Ltd. IC card
US20060255473A1 (en) * 2005-05-16 2006-11-16 Stats Chippac Ltd. Flip chip interconnect solder mask

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD701182S1 (en) * 2011-04-12 2014-03-18 Plasyl Limited Wave circuit pattern
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
USD692005S1 (en) * 2011-11-07 2013-10-22 Blackberry Limited Device smart card
USD702694S1 (en) 2011-11-07 2014-04-15 Blackberry Limited Device smart card
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD775092S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD798249S1 (en) 2013-10-17 2017-09-26 Vlt, Inc. Electric terminal
USD942406S1 (en) 2013-10-17 2022-02-01 Vicor Corporation Electric terminal
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD877708S1 (en) 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD834548S1 (en) 2013-10-17 2018-11-27 Vlt, Inc. Electric terminal
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD803172S1 (en) 2014-05-28 2017-11-21 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD785575S1 (en) * 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD803803S1 (en) 2014-05-28 2017-11-28 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD805045S1 (en) 2014-05-28 2017-12-12 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD810707S1 (en) 2014-05-28 2018-02-20 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
USD812023S1 (en) 2014-05-28 2018-03-06 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD831594S1 (en) 2014-05-28 2018-10-23 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD784936S1 (en) * 2014-05-28 2017-04-25 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
US9723712B2 (en) * 2014-09-02 2017-08-01 Samsung Display Co., Ltd. Curved display device
US20160066410A1 (en) * 2014-09-02 2016-03-03 Samsung Display Co. Ltd. Curved display device
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD855577S1 (en) * 2018-04-12 2019-08-06 Telebox Industries Corp. Circuit board for electrical connector

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