US3845341A

US3845341A - Actively cooled anode for current-carrying component

Info

Publication number: US3845341A
Application number: US00384647A
Authority: US
Inventors: J Addoms; D Culver
Original assignee: Aerojet General Corp
Current assignee: Aerojet Rocketdyne Inc
Priority date: 1973-08-01
Filing date: 1973-08-01
Publication date: 1974-10-29
Anticipated expiration: 1991-10-29

Abstract

An improved anode for an electronic component, such as used in circuitry having high power requirements wherein the anode requires some external coolant to pass therethrough to keep it from deteriorating due to heat energy absorbed thereby due to electrons bombarding the same. The anode includes platelet structure defining a working face which receives electrons from an emitter, such as a cathode. The platelet structure is formed with a coolant passage of relatively small dimensions to permit a coolant to pass continuously therewithin and in proximity to the working face to absorb and dissipate heat energy developed at the same in an efficient, rapid manner to minimize the build-up of heat energy in the structure itself due to induction therethrough. A number of platelet units can be provided with each platelet being secured to a base defining a manifold adapted to be coupled to a source of coolant under pressure. Each platelet structure can comprise at least a pair of plates of relatively thin wall thickness bonded together and having grooves or openings etched or otherwise formed therein to present the coolant passage therethrough with adjacent outer faces of the plates defining portions of the working face of the anode.

Description

United States Patent Addoms et al.

[4 1 Oct. 29, 1974 ACTIVELY COOLED ANODE FOR CURRENT-CARRYING COMPONENT [75] Inventors: John F. Addorns, Rocklin, Calif;

Donald W. Culver, Richland, Wash.

[73] Assignee: Aerojet General Corporation, El Monte, Calif.

[22] Filed: Aug. 1, 1973 [21] Appl. No; 384,647

[52) U.S. Cl. 313/32, 315/538 [5 1] Int. Cl. HOlj 7/24 [58] Field of Search 313/32; 315/538 [56] References Cited UNITED STATES PATENTS 3,098,165 7/1963 Zitelli 3l3/32 Primary Examiner-Herman Karl Saalbach Assistant ExaminerDarwin R. Hostetter Attorney. Agent, or Firm-John L. McGannon; John S. Bell [57] ABSTRACT An improved anode for an electronic component,

such as used in circuitry having high power requirements wherein the anode requires some external coolant to pass therethrough to keep it from deteriorating due to heat energy absorbed thereby due to electrons bombarding the same. The anode includes platelet structure defining a working face which receives electrons from an emitter, such as a cathode. The platelet structure is formed with a coolant passage of relatively small dimensions to permit a coolant to pass continuously therewithin and in proximity to the working face to absorb and dissipate heat energy developed at the same in an efficient, rapid manner to minimize the build-up of heat energy in the structure itself due to induction therethrough. A number of platelet units can be provided with each platelet being secured to a base defining a manifold adapted to be coupled to a source of coolant under pressure. Each platelet structure can comprise at least a pair of plates of relatively thin wall thickness bonded together and having grooves or openings etched or otherwise formed therein to present the coolant passage therethrough with adjacent outer faces of the plates defining portions of the working face of the anode.

26 Claims, 14 Drawing Figures W S Ci ll i- .i' 5 60 h x f I 46 2s 266 R l 3' y 26b PT 2X66 D i ACTIVELY COOLED ANODE FOR CURRENT-CARRYING COMPONENT This invention relates to improvements in electronic circuitry components and, more particularly, to an anode for a circuit component, such as a vacuum tube, having improved means for cooling the same when it is in use.

BACKGROUND OF THE INVENTION Radar devices require vacuum tubes called, at least in some cases. crossed field amplifiers. These devices operate in a pulsed mode. During a pulse, electron energy incidence upon the anode is very large as the range of the entire device depends upon the strength of the pulse. A great amount of thermal energy is absorbed by the anode during a pulse; however, the pulses are of such short duration that the anode is not melted by the thermal energy released from a single pulse. For devices having a low duty cycle, e.g., 0.1% on" time, the working surface of the anode can be adequately cooled by the use of high melting point surface materials and high conductivity backup materials. The more useful tubes, however, have a much more stringent duty cycle, on the order of l.0% on time which means that the anode receives pulse energy input l% of the time. Under these conditions, the anode working surface requires active cooling.

Low frequency tubes have been successfully cooled with water or other fluids of high velocity so that the required peak power and larger percentage duty cycle, i.e., high average power level, is obtained. The anode design affects the frequency of the tube. Low frequency tubes make use of an assembly of rather large individual vanes, separated by a rather large uniform spacing. Such large components can be cooled internally with normal methods, e.g., water cooled tubing and the like. Tubes which operate at higher frequencies (X band and higher) are characterized by much smaller anodc components. No method of internally cooling them presently exists. Thus, high average power, high frequency, crossed field amplifier tubes are not now available or not now being built. To accommodate such tubes, coolant passages must be provided near the heated anode working surface to carry off the heat energy developed at such location by the bombardment ofelectrons on the same, It is also desired that the relatively small size of the anode be sufficient for the Ku band radar. yet still be cooled sufficiently to prevent structural deterioration or other damage due to thermal stresses imposed by the energy developed by the electron stream striking the working surface of the anode during a duty cycle. A need has, therefore, arisen for an improved anode having cooling means which allows relatively small dimensions to be utilized in those radar devices for high frequency, high power requirements.

SUMMARY OF THE lNVENTlON The present invention is directed to an improved anode which satisfies the aforesaid need in that it prescnts Ll working surface of relatively small dimensions and fluid passage means of relatively small dimensions for directing a coolant into proximity with the working surface. In this way, the coolant can be actively passed in extremely close proximity to the working surface to absorb and carry off excess thermal energy due to the bombardment of electrons on the working surface during the duty cycle of the anode, thereby preventing build-up of thermal stresses which would otherwise damage and cause deterioration of the anode structure itself.

The invention utilizes a series of thin-walled plates bonded together to form a unit which is relatively thin in construction yet the unit has a coolant passage of relatively small cross-sectional area which extends very close to the working surface of the anode. This can be accomplished because the passages are etched or machined into the plates before the same are bonded to gether so that, upon being assembled, the passages are at the precise locations desired to absorb the thermal energy yet the platelet assembly itself is of sufficient strength to sustain itselfover many hours of actual use.

For purposes of illustration, the anode is comprised of three side-byside platelet units, each unit being formed of a central plate having a fluid passage etched therethrough and a pair of end plates which are bonded to opposed faces of the central plate to close the sides of the passage and to form with the central plate three end face portions defining the working surface against which electrons impinge when the anode is in use. The base sections of the three platelet units form parts of a coolant manifold and the platelet units are separated from each other by suitable spacers also forming parts of the manifold. When coupled to a source of coolant, the coolant flows into the manifold, through the passages in the three platelet units, then out of the manifold, back to the coolant source. The coolant volume rate of flow can be selected to achieve the desired cooling capacity yet the structural integrity of the platelet units remains intact notwithstanding the relatively high frequency, high power electron stream bombarding the working surface of the anode during a duty cycle.

Several different embodiments of the working surface can be utilized. In one embodiment, the anode working surface is formed by the working surface portions of the platelet units when the same are parallel with each other. In another embodiment, the platelet units are arranged in an angular array so that the effec tive anode working surface is circular or is at least curved. Other configurations can be utilized where usage dictates particular requirements.

The primary object of this invention is to provide an improved anode for a current-carrying electronic component wherein the anode has a working surface for receiving electron current in an internal fluid passage of relatively small dimensions and in extremely close proximity to such working surface to absorb and carry off the thermal energy developed at the same by the electron bombardment thereon so that the anode can be used where high power, high frequency parameters are required, such as in radar devices Another object of this invention is to provide an improved anode of the type described wherein the anode working surface is defined by end face segments of a group of platelet units arranged side-byside and coupled at their bases to a manifold wherein each platelet unit has a fluid passage formed therein in proximity to its end face segment to permit delivery of coolant as closely as possible to the same to dissipate the heat energy developed at such end face segment.

Still another object of this invention is to provide an anode of the aforesaid character wherein each platelet unit thereof is comprised of a group of stacked plates with at least one of the plates being etched to form a finely dimensioned fluid passage therethrough with the passage extending along and in extremely close proximity to the end face segment thereof so that a high velocity coolant can be directed through the passage and dissipate the energy developed directly adjacent thereto at the working surface portion thereof.

Other objects of this invention will become apparent as the following specification progresses, reference being had to the accompanying drawings for illustrations of several embodiments of the invention In the drawings:

FIG. I is a perspective view of one embodiment of the anode of this invention;

FIG. 2 is an elevational view, partly in section, of the anode of FIG. 1, showing the three platelet units thereof in end elevation;

FIG. 3 is an elevational view of the anode showing a platelet unit in side elevation;

FIG. 4 is an enlarged, side elevational view of one of the three plates forming a platelet unit of the anode;

FIG. 4a is an enlarged, end elevational view of a platelet unit, showing the three plates forming the same;

FIG. 5 is a view similar to FIG. 4 but showing another plate of the platelet unit;

FIG. 6 is an exploded view of the parts used to form the anode of FIG. 1',

FIG. 7 is a view similar to FIG. I but showing another embodiment of the anode with the platelet units thereof arranged in a circular array; and

FIGS. Sci-8f are enlarged, fragmentary crosssectional views of other platelet units. showing variations in the way in which the fluid passages thereof can be formed.

The first embodiment of the anode of this invention is denoted by the numeral 10 and is shown in FIG. I. Anode 10 utilizes a base 12 and a number of platelet units 14 which are in electrically-coupled relationship to base 12 and extend laterally from one face 16 thereof. Each unit 14 has an outer, rectilinear. rela tively narrow surface 18 which defines a portion of the working face of the anode. i.e., the face against which an electron current impinges during operation of the component of which the anode forms a part.

Anode I0 is adapted to be mounted in an envelope or housing and forms one portion of an electrical circuit which includes an electron emitter in the housing and spaced from surfaces 18 of units 14. Thus, when a potential difference is established between the emitter and anode I0. electron current will flow to the anode and will strike surfaces 18 and llow through units 14, base 12, and in the external circuit.

Anode I0 is adapted to be used in components which operate at relatively high frequencies (X band and higher) and. as such, the anode is relatively small in dimensions. Because of the current which flows there through. anode I0 is heated to an appreciable degree when used at high frequencies. and the heat energy absorbed by the anode is sufficient to require cooling of it to prevent damage due to thermal stresses. To this end, a coolant. such as water is caused to flow under pressure into base 12 through a first port 20 in one side face 21, then into and through a fluid passage in each platelet unit 14, and then out of the base through another port 22 (FIG. 3] in the opposite side face 23.

Ports

20 and 22 are adapted to be coupled in some suitable manner to a suitable coolant source. Thus. the water or other coolant can be forced through the anode at a predetermined volume rate of flow. thereby maintaining the anode sufficiently cool during its duty cycle which, in the case of high frequency, high power radar tubes. can be of the order of 1%.

The platelet units 14 are substantially identical in construction. Each unit 14 includes a pair of flat end plates 24, one of which is shown in FIG. 5, and a flat central plate 26 shown in FIG. 4. Each plate 24 has a base section 28 provided with two

circular holes

30 and 32 therethrough, and a second or vane section 34 integral with and projecting laterally from a marginal edge 36 of base section 28. Each second section 34 has a pair of recesses 38 therein which, for purposes of illustration, are for accommodating adjacent structure of the component of which anode 10 forms a part. Each section 38 has an outer, substantially flat end face 40 which defines a part of the current-receiving surface portion 18 of the platelet unit 14 of which end plate 24 forms a part.

Central plate 26 has a base section 42 substantially identical in size to base section 28 of each end plate 24.

Section 42 has a pair of

holes

44 and 46 aligned with

holes

30 and 32 of both end plates 24, respectively, when the corresponding unit 14 is assembled. When so aligned, holes 30 and 44 are adapted to receive a coolant from the coolant source through port 20. and holes 32 and 46 communicate with port 22 for return of the coolant to the source.

Central plate 26 has a second section 48 integral with and projecting from base section 42 and of the same size and shape as second section 34 of each end plate 24. Section 48 has an outer end face 50 which mates with end faces 40 of end plates 24 to form the currentreceiving working surface 18 of the corresponding platelet unit 14.

Central plate 26 has etched therethrough a fluid passage broadly denoted by the numeral 52 which interconnects holes 44 and 46 in the manner shown in FIG. 4. Passage 52 has two

segments

53 and 55 which extend away from

holes

44 and 46 and converge as they approach end face 50. Then, near an imaginary line 61 perpendicular to a center line 54 of plate 26, segments 53 and S5 diverge, become smaller in cross section, and terminate at respective ends of an end segment 58 which is in extremely close proximity to end face 50. Thus. the coolant entering hole 44 flows successively into and through segments 53. 58 and 5S and out of plate 26 through hole 46.

To assemble each platelet unit 14, the two end plates 24 and central plate 26 thereof are bonded together to form a sandwich construction as shown in FIG. 4a. The bond can be made in any suitable manner. such as by diffusion bonding.

In assembling anodc 10, three units 14 are stacked with other parts in a manner shown, for purposes of illustration. in the exploded view of FIG. 6. Such other parts include a number of spacers 62 and a pair of

end base plates

66 and 68. There is a spacer 62 between each pair of adjacent platelet units 14, and a spacer 62 near the outer face of each end platelet unit 14. Each spacer 62 has the same size and shape as section 28 of each end plate 24 and has two holes 64 and 65 (FIG. 6) therethrough for alignment with

ports

20 and 22, respectively. End base plate 66 with inlet port 20 is at one end of the assembly and end base plate 68 having exit port 22 is at the opposite end of the assembly.

All of the parts shown in FIG. 6 will be bonded together to form anode so that it will have the configuration shown in FIG. 1. When so assembled, the anode will be ready for use.

In use. the anode will be placed in a housing along with an emitter. such as a cathode. the housing being evacuated if the component to be formed is a vacuum tube. When a potential difference is applied across the anode and cathode, with the cathode negative with respect to the anode. current will flow to the anode. specifically to the working surfaces 18 thereof. However. during this time. a coolant. such as water. will flow through the platelet units and cool the same and dissipate the heat generated in the anode due to the bombardment of electrons on working surfaces 18. The coolant will enter anode 10 through port 20, will flow through each platelet unit [4 by flowing through passage 52 thereof. and will exit from the anode through port 22. The heat generated in the anode will then be carried off to the coolant source.

Segment S8 of central plate 26 can be etched therethrough so that it is spaced by a distance of approximately 0030 inch from end face 50 thereof. This distance is denoted by the letter din FIG. 4. This distance is relatively small with respect to the length and width ofeach vane section 34. Thus. plate 26 must be etched to obtain the relatively small cross-sectional area of the fluid passage through the corresponding unit 14.

Certain dimensions ofanode 10 are critical as to certain frequency bands ofoperation. The relatively small sin: of the anode is dictated by resonant frequency response requirements in these bands. The design dimensions in inches for a three platelet unit anode and the corresponding tolerances are given for the following two bands:

X Band K Band Tolerance Pitch is defined as the center lineto-center line distance between each pair of adjacent platelet units 14.

The anode. while being described above as comprised ofthree platelet units 14, is practical for use with approximately ll0 such platelet units 14. in using such a relatively large number, care must be taken to assure that the tolerances do not exceed prescribed limits for particular bands.

Other typical dimensions include the following: segment 58 of each platelet unit 14 is approximately .006 inch (denoted by the letter S"); the width ofsegments 53 and 55 is approximately .018 inch (denoted by the letter .X");

segments

53 and 55 tapering progressively smaller as they approach the corresponding ends of segment 58. and at such ends. the width of the segments is approximately 0.009 inch (denoted by the numeral 7.). the radius of each

hole

44 and 46 is 0.080 inch l denoted by the letter R); the central axes of the

holes

44 and 46 being spaced inwardly from

adjacent end margins

26a and 26b of base section 42 by a distance of approximately 0.175 inch (denoted by the let tcr D); the distance of the central axes of

holes

44 and 46 with respect to side margin 26c being also approximately 0.175 inch (denoted by the letter H); and the height of base section 42 is approximately 0.350 inch (denoted by the letter J).

In designing the anode, freedom of design is restricted by various operating and fabrication considerations. If the anode is to form a component ofa vacuum tube. this requirement limits the material and the brazing alloy selections in the case of brazing the platelets together. The resonant frequency response requirements results in extremely tight tolerance limits. Available coolant quantity and pressure restricts the thermal design. Anode assembly procedures require that the anode be capable of several future braze cycles. The materials used in making the anode must conform to the following: they must be non-magnetic; the material must have a high surface conductivity; and the material must have a high melting point.

Typical process requirements are as follows: the maximum coolant volume rate of flow should be approximately 0.0l9 gpm for each platelet unit 14; the maximum coolant inlet pressure should be approximately 500 psia; the average power dissipation is approximately 60 watts for each platelet unit 14; and the life of the anode should be thousands of hours. typically of the order of IO thermal cycles.

ln the selection of materials, silver. copper or aluminum can be used. The requirement for a material that can withstand 1.000C. during fabrication steps elimi nates aluminum and silver. and copper is most preferred over any other material. OFHC copper was selected over the higher strength zirconium copper because the latter material breaks down when heated over l.750F.

For thermal design limits. such limits were based on of burnout heat flux. assuming 400 psia minimum pressure in the coolant passage, water being the coolant. and a maximum water temperature of lOOF. and one-dimensional cooling. The required coolant velocity was calculated as a function of the thickness of each platelet unit l4. approximately 0.0l6 inch. Essentially. the thicker the wall. the less area is available for removal of heat. The average heat flux over the area of the working face of each platelet unit. ie. 60 watts/unit. is approximately [4.2 BTU/sec-in". The required coolant velocity for this is typically 42.5 feet per sec ond. The velocity increase required for various wall thicknesses is proportional to reduction in area. Thus. ifthe main wall thickness is 0.004 inch, the area available for removal of heat is reduced from 0.0l6 inch to 0.008 inch and the required velocity doubles or increases to feet per second.

In the mechanical design of the coolant passages through the platelet units. such design is established by the thermal design and the etch factor requirements for platelet fabrication. In general. for good. reproducible parts. the passage etch width must be at least three times the depth of the passage. This etch factor influences the passage area. depending upon the number of platelets and the type of etch. whether through etch or depth etch. t

FlGS. 8a through Sfshow passage cross sections of several proposed designs. In FlG, 8a, two mirror image. depth etch platelets 80 are joined to form the coolant passage segment 58. (FlG. 8b shows a through-etched platelet 82 backed by two unetched cover plates 84 to form segment 58.). The design of FIG. 8b is the one above with respect to anode 10. In FIG. 8c, the segment is formed from a combination of the designs of FIGS. 8a and 8b. FIGS. 8d. 8e and 8f are variations possible for the formation of two parallel segments 58. FIG. 8d shows a central plate 86 partially etched on both sides and disposed between a pair of flat cover plates 84; FIG. 80 shows a central plate 86 disposed between a pair of partially etched cover plates 80'. and FIG. 8f shows a flat central plate 88 between a pair of etched cover plates 80. segment 58 of each of the designs of FIGS. 80 through 8f has a minimum cross-sectional area a function of wall thickness and etch ratio.

Anode IO has been described as having the three platelet units 14 substantially parallel with each other. In another embodiment. anode 110 shown in FIG. 7 has the three platelet units [I4 thereof which are inclined with respect to each other. They are made in essentially the same way as that described above with respect to anode except that the three platelet units 114 are separated from each other by a tapered spacer plate 162. Coolant flows through the platelet units H4 in the same way as that described above with respect to platelet units I4. Also. there could be a plurality of angularly disposed platelet units 114 forming an array which surrounds a central area in which the electron emitter is placed.

We claim:

I. An anode for a current-carrying electronic component comprising: an assembly comprised of a plurality of plates bonded together in a stack to form an external. current-receiving working surface and an internal fluid passage having a segment in proximity to said working surface. the thickness of the assembly being a number oftimes less than the length ofthe working surface. and means defining a fluid manifold coupled to the assembly in fluid communication with said fluid passage. said manifold adapted to be coupled to a source of a coolant under pressure so that the coolant can be directed into the passage and through said segment and thereby into substantial heat exchange relationship to said working surface.

2. An anode as set forth in claim I, wherein said segment extends longitudinally of said working surface with the distance therebetween being a number of times less than the length of said working surface.

3. An anode as set forth in claim 2, wherein the ratio ofsaid length to said distance is approximately 8.33311 for the X frequency band.

4. An anode as set forth in claim 2, wherein the cross- .sectional area of said segment is approximately Z4Xlll inches.

5. An anode as set forth in claim I. wherein the ratio of said length to said thickness is approximately lfititilzl for the X frequency band.

6. An anode as set forth in claim I. wherein the ratio of said length to said thickness is approximately :1 for the Kpt frequency bandv 7. An anode as set forth in claim I, wherein said assembly includes a central plate having said passage through-etched therein and a pair of end plates bonded to rcspcctnc sides otihe central plate to close the sides of the passage 8. An anode as set forth in claim I, wherein the as- SCml l) includes a pair of plates. each plate having an inner surface provided with a groove therein. the grooves being in mating relationship with each other to form said passage.

(iii

9. An anode as set forth in claim 1, wherein the assembly includes a pair of end plates and a central plate between the end plates, the central plate having a groove in each face thereof, respectively, the grooves defining a pair of side-by-side fluid passages in fluid communication with said manifold.

It). An anode assembly as set forth in claim I. wherein the assembly includes a pair of end plates and a central plate between the end plates. each end plate having a groove on its inner surface. the grooves defining a pair of side-byside fluid passages in fluid communication with said manifold.

II. An anode as set forth in claim 1. wherein the passage decreases in width as it approaches the segment.

I2. An anode as set forth in claim I, wherein the seg' ment is substantially parallel to said working surface.

I3. An anode as set forth in claim I. wherein each plate has a base section and a vane section integral with the base section. the latter having a pair of spaced holes therethrough. said passage communicating with the holes and extending into the vane section. said base section defining a part of said manifold means.

14. An anode as set forth in claim I, wherein the length of each vane section is a number of times greater than said thickness.

15. An anode as set forth in claim 14, wherein the ratio of said vane section length to said thickness is approximately 2l.25:l for the X frequency band.

16. An anode as set forth in claim 14, wherein the ratio of said vane section length to said thickness is approximately l9:l for the Kp. frequency band.

I7. An anode for a current-carrying electronic component comprising: an array of spaced. elongated. elec trically conductive vanes. each vane being comprised of an assembly of plates coupled together in a stack to form an external. curent-receiving working surface extending across its width at one end thereof. the plates of each vane having means defining an internal fluid passage provided with a segment in proximity to the adjacent working surface. the thickness of each assembly being a number of times less than said width. the working surfaces of said vanes being in aligned, side-by-side relationship to each other; and means defining a fluid manifold for delivering fluid to said passages. said vanes being coupled to the manifold means with said passages in fluid communication therewith. said manifold means adapted to be coupled to a source of a fluid under pressure so that the fluid can be directed into the passages and through respective segments in heat exchange relationship to adjacent working surfaces.

18. An anode as set forth in claim I7. wherein each segment extends longitudinally ofthe adjacent working surface with the distance therebetween being a number of times less than said width.

19. An anode as set forth in claim I7. wherein the pitch of the vanes is a number of times less than the length of each vane.

20. An anode as set forth in claim 17. wherein said width is of the order of magnitude of the length of the corresponding vane.

21. An anode as set forth in claim [7, wherein the vanes are angularly disposed relative to each other and converge toward each other as the working surfaces thereof are approached.

22. An anode as set forth in claim [7. wherein the vanes are parallel with each other.

23. An anode as set forth in claim 17, wherein the vanes are substantially identical to each other in length, width and thickness and are uniformly spaced apart.

24. An anode for a current-carrying electronic component comprising: an array of elongated, electrically conductive vanes, the vanes being uniformly spaced apart to provide a predetermined pitch for said array, each vane having a length and width and being comprised of an assembly of plates coupled together in a stack to form an external, currenbreceiving working surface extending across its width at one end thereof, the plates of each vane having means defining an internal fluid passage provided with a segment in proximity to the adjacent working surface, the thickness of each assembly and said pitch being a number of times less than said width, said length being of the order of magnitude of said width, said pitch being greater than said thickness, the working surfaces of said vanes being in aligned, side-by-side relationship to each other; and means defining a fluid manifold for delivering fluid to said passages, said vanes being coupled to the manifold means with said passages in fluid communication therewith, said manifold means adapted to be coupled to a source of a fluid under pressure so that the fluid can be directed into the passages and through respective segments in heat exchange relationship to adjacent working surfaces.

25. An anode as set forth in claim 24, wherein said thickness, said length, said width and said pitch, when said array is adapted for use with the X frequency band, are as follows:

Thickness ,tllb inch Length .340 inch Width .250 inch Pitch ,(lJZ inch 26. An anode as set forth in claim 24, wherein said thickness, said length, said width and said pitch. when said array is adapted for use with the Ku frequency band, are as follows:

Thickness .UlU inch Length ,l inch Width ,200 inch Pitch ,Ol8 inch

Claims

1. An anode for a current-carrying electronic component comprising: an assembly comprised of a plurality of plates bonded together in a stack to form an external, current-receiving working surface and an internAl fluid passage having a segment in proximity to said working surface, the thickness of the assembly being a number of times less than the length of the working surface; and means defining a fluid manifold coupled to the assembly in fluid communication with said fluid passage, said manifold adapted to be coupled to a source of a coolant under pressure so that the coolant can be directed into the passage and through said segment and thereby into substantial heat exchange relationship to said working surface.

2. An anode as set forth in claim 1, wherein said segment extends longitudinally of said working surface with the distance therebetween being a number of times less than the length of said working surface.

3. An anode as set forth in claim 2, wherein the ratio of said length to said distance is approximately 8.333:1 for the X frequency band.

4. An anode as set forth in claim 2, wherein the cross-sectional area of said segment is approximately 24 X 10 6 inches.

5. An anode as set forth in claim 1, wherein the ratio of said length to said thickness is approximately 15.667:1 for the X frequency band.

6. An anode as set forth in claim 1, wherein the ratio of said length to said thickness is approximately 20:1 for the K Mu frequency band.

7. An anode as set forth in claim 1, wherein said assembly includes a central plate having said passage through-etched therein and a pair of end plates bonded to respective sides of the central plate to close the sides of the passage.

8. An anode as set forth in claim 1, wherein the assembly includes a pair of plates, each plate having an inner surface provided with a groove therein, the grooves being in mating relationship with each other to form said passage.

10. An anode assembly as set forth in claim 1, wherein the assembly includes a pair of end plates and a central plate between the end plates, each end plate having a groove on its inner surface, the grooves defining a pair of side-by-side fluid passages in fluid communication with said manifold.

11. An anode as set forth in claim 1, wherein the passage decreases in width as it approaches the segment.

12. An anode as set forth in claim 1, wherein the segment is substantially parallel to said working surface.

13. An anode as set forth in claim 1, wherein each plate has a base section and a vane section integral with the base section, the latter having a pair of spaced holes therethrough, said passage communicating with the holes and extending into the vane section, said base section defining a part of said manifold means.

14. An anode as set forth in claim 1, wherein the length of each vane section is a number of times greater than said thickness.

15. An anode as set forth in claim 14, wherein the ratio of said vane section length to said thickness is approximately 21.25:1 for the X frequency band.

16. An anode as set forth in claim 14, wherein the ratio of said vane section length to said thickness is approximately 19:1 for the K Mu frequency band.

17. An anode for a current-carrying electronic component comprising: an array of spaced, elongated, electrically conductive vanes, each vane being comprised of an assembly of plates coupled together in a stack to form an external, curent-receiving working surface extending across its width at one end thereof, the plates of each vane having means defining an internal fluid passage provided with a segment in proximity to the adjacent working surface, the thickness of each assembly being a number of times less than said width, the working surfaces of said vanes being in aligned, side-by-side relationship to each other; and meAns defining a fluid manifold for delivering fluid to said passages, said vanes being coupled to the manifold means with said passages in fluid communication therewith, said manifold means adapted to be coupled to a source of a fluid under pressure so that the fluid can be directed into the passages and through respective segments in heat exchange relationship to adjacent working surfaces.

18. An anode as set forth in claim 17, wherein each segment extends longitudinally of the adjacent working surface with the distance therebetween being a number of times less than said width.

19. An anode as set forth in claim 17, wherein the pitch of the vanes is a number of times less than the length of each vane.

20. An anode as set forth in claim 17, wherein said width is of the order of magnitude of the length of the corresponding vane.

21. An anode as set forth in claim 17, wherein the vanes are angularly disposed relative to each other and converge toward each other as the working surfaces thereof are approached.

22. An anode as set forth in claim 17, wherein the vanes are parallel with each other.

24. An anode for a current-carrying electronic component comprising: an array of elongated, electrically conductive vanes, the vanes being uniformly spaced apart to provide a predetermined pitch for said array, each vane having a length and width and being comprised of an assembly of plates coupled together in a stack to form an external, current-receiving working surface extending across its width at one end thereof, the plates of each vane having means defining an internal fluid passage provided with a segment in proximity to the adjacent working surface, the thickness of each assembly and said pitch being a number of times less than said width, said length being of the order of magnitude of said width, said pitch being greater than said thickness, the working surfaces of said vanes being in aligned, side-by-side relationship to each other; and means defining a fluid manifold for delivering fluid to said passages, said vanes being coupled to the manifold means with said passages in fluid communication therewith, said manifold means adapted to be coupled to a source of a fluid under pressure so that the fluid can be directed into the passages and through respective segments in heat exchange relationship to adjacent working surfaces.

26. An anode as set forth in claim 24, wherein said thickness, said length, said width and said pitch, when said array is adapted for use with the K Mu frequency band, are as follows: