US2744063A - Electrodeposition of tin-antimonycopper alloys - Google Patents
Electrodeposition of tin-antimonycopper alloys Download PDFInfo
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- US2744063A US2744063A US261153A US26115351A US2744063A US 2744063 A US2744063 A US 2744063A US 261153 A US261153 A US 261153A US 26115351 A US26115351 A US 26115351A US 2744063 A US2744063 A US 2744063A
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- tin
- antimony
- copper
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- anode
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- 238000004070 electrodeposition Methods 0.000 title claims description 7
- 229910045601 alloy Inorganic materials 0.000 title description 23
- 239000000956 alloy Substances 0.000 title description 23
- 239000010949 copper Substances 0.000 claims description 38
- 229910052787 antimony Inorganic materials 0.000 claims description 36
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 11
- 239000004327 boric acid Substances 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 6
- ODNBVEIAQAZNNM-UHFFFAOYSA-N 1-(6-chloroimidazo[1,2-b]pyridazin-3-yl)ethanone Chemical compound C1=CC(Cl)=NN2C(C(=O)C)=CN=C21 ODNBVEIAQAZNNM-UHFFFAOYSA-N 0.000 claims description 3
- GUNJVIDCYZYFGV-UHFFFAOYSA-K Antimony trifluoride Inorganic materials F[Sb](F)F GUNJVIDCYZYFGV-UHFFFAOYSA-K 0.000 claims description 3
- IIQJBVZYLIIMND-UHFFFAOYSA-J potassium;antimony(3+);2,3-dihydroxybutanedioate Chemical compound [K+].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O IIQJBVZYLIIMND-UHFFFAOYSA-J 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 description 44
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 37
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 24
- 239000003292 glue Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229950011260 betanaphthol Drugs 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 238000007792 addition Methods 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 238000013019 agitation Methods 0.000 description 6
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- 239000010405 anode material Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 241000054822 Lycaena cupreus Species 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- FXYGHKTWVGLQJG-UHFFFAOYSA-N [Sb].[Cu].[Sn] Chemical compound [Sb].[Cu].[Sn] FXYGHKTWVGLQJG-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001245 Sb alloy Inorganic materials 0.000 description 2
- 150000001463 antimony compounds Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000001996 bearing alloy Substances 0.000 description 1
- 239000002639 bone cement Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- -1 ferrous metals Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- the present invention relates to a method and bath for alloy electroplating and is more particularlyconcerned with the electroplating of alloys containing tin,fcopper and antimony.
- my invention consists in plating tin-copperantimony alloys by electrodeposition. from an aqueous bath containing the fluoborate salts of these metals.
- Bath additives such as betanaphthol and glue may be added to the bath to improvethe quality of the plate.
- Variations in the composition of the alloy can be accomplished by variations in the current density and in the anode'composition as Well as by variations in the concentrations of l Grams per liter Tin from 60 to 80 Copper from 1 to Antimony from 1 to 5 It is generally advantageous to add to the bath from .25 to 2 grams per liter glue, and to maintain thebath saturated with betanaphthol. At room temperature this amounts to approximately 1 gram per liter of betanaph thol.
- the pH is maintained at'between 0 and 1, and temperatures of from 70 to 100 F. may be used.
- the anode may either be pure tin or else an alloy of tin and copper, such as an alloy containing about 95% tin and about 5 %copper.- I have used the cathode current densities of from to 60 amperes per square foot in conjunction with this bath, depending upon the exact alloy composition desired.
- smooth, dense alloy platings containing from 79 to 97% tin, from 2 to 12% antimony and from 1 to'8% copper, may be plated.
- particularly useful bearing alloys such as SAE 10, 11 and 12, fall within this range.
- Example ll Anode Sn%, Cu-5%
- Cathode current density 60 amperes per square foot Bath:
- Example III Anode: Sn-95%, Ctr-5% Cathode current density: 60 amperes per square foot Bath:
- Example IV 100% Sn Cathode current density: 60 amperes per square foot Bath:
- Example V Anode: 100% Sn Cathode current density: 30 amperes per square foot Bath:
- tin fluoborate concentrate containing approximately 300 grams per liter of stannous tin is satisfactory for addition of the tin constitutent.
- copper fluoborate concentrate containing approximately I80 grams per liter of copper can be used.
- the required antimony may be supplied in a number of ways. Antimony trioxide, antimony trifluoride, potassium antimony tartrate, and antimony fiuoborate have all proved satisfactory. I have found that an antimony fiuoborate solution containing approximately 35% antimony fiuoborate, 9% fluoboric acid, and .3% hydrofi'ouric acid, to be the most convenient source of the antimony addition. In all cases, irrespective of the type of addition solution used, it ha been found best to add the antimony compound as the last ingredient and after pH adjustment, since at this stage the antimony compound is most soluble and thus no difiiculty is had from precipitants.
- the glue concentration is obtained by the addition of liquid glue obtained by dissolving bone glue pellets in a minimum amount of water. To maintain the solution saturated with'betanaphthol, an excessive amount of this additivecan be stirred into the solution and, after a period ofagitatio'n, the undissolved material filtered out.
- anode consisting of either pure tin or else of an alloyof tin and copper, it is to. be understood, of course, that an insoluble anode such as carbon or platinum may be used.
- an insoluble anode such as carbon or platinum.
- the chief advantage of a tin or of a tin-copper alloy anode is that it assists in maintaining the metal concentration of the solution.
- Anodes containing antimony have been found to be somewhat disadvantageous in that they sludge excessively.
- anode that is, the choice of whether it is to be internal or external, will of course depend upon the' shape of the base metal being plated. Where, for example, the interior surface of a bearing shell is to be plated, an internal anode is used. When an external anode such as a cylinder is used, then agitation can be accomplished by the use of a revolving cathode, which is, of course, the article beingplated.
- a bath having metal ion concentrations with the range of from 50 to 180 g./l. tin, from .5 to 20 g./l. copper and from .5 to 20 g./l. antimony, and containing fluoboric acid and boric acid and preferably glue and betan'aphthol within the ranges previously set forth, may be used.
- the current density can be from 10 to 60 amperes per square foot, the anode material being either pure tin, an alloy of tin and copper, or else an insoluble such as carbon or platinum.
- the temperature may be from 70 to F. I have obtained alloys containing from 1.5% to 99% tin, from .4% to 15.5% antimony and from .2% to 98% copper with my process, the exact percentage composition depending, upon the various metal ion concentrations in the bath and also upon the conditions used.
- the following table lists various plating baths and conditions along with the alloy deposited therefrom:
- the fluoborate bath and process of this invention can be electrodedeposited with the fluoborate bath and process of this invention.
- the process and bath of this invention make possible the electrodeposition of smooth dense deposits of varying thicknesses whichadhere to metal bases such as steel and other ferrous metals," copper, copper lead alloys, silver, nickel and other metals and alloys.
- anode material is selected from a group consisting of pure tin and the tincopper alloys predominantly of tin.
- -A process for electrodepositing a ternary alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin consisting of passing a current suflicient to yield a current density of from 10 to amperes per square foot between a cathode and an anode and through a bath containing from about 60 to g./l. tin as tin fluoborate, from about 1 to 5 g./l. antimony as antimony fluoborate, from about 1 to 5 g./l. copper as copper fluoborate, from about 15 to 25 g./l. boric acid, and sufficient fluoboric acid to maintain the pH of said bath at below 1.
- anode material is selected from a group consisting of pure tin and tin-copper alloys predominantly of tin.
- An aqueous bath for the electrodeposition of an alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin said bath containing from 50 to g./l. tin as tin fluoborate, from .5 to 20 g./1. antimony as a compound selected from the group consisting of antimony fluoborate, antimony trioxide, antimony trifluoride and potassium antimony tartrate, from .5 to 20 g./1. copper as copper fluoborate, from 10 to 40 g./l. boric acid and sufiicient fluoboric acid to maintain the pH of said bath below 1.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
ELECTRODEPOSITION F TIN-ANTIMONY- COPPER ALLOYS Quentin 0. Shockley, Indianapolis, Ind., assignor to General Motors Corporation, Detroit, Mich., a corporation of Delaware No Drawing. Application December 11, Serial No. 261,153
8 Claims. (Cl. 204 --44) The present invention relates to a method and bath for alloy electroplating and is more particularlyconcerned with the electroplating of alloys containing tin,fcopper and antimony.
Alloys of tin, copper and antimony, andmore particu.
ularly the tin base alloys containing copper and antimony, have long been accepted as satisfactory bearing materials. However, to prepare these alloys it has always been necessary to cast them from the molten state. In accordance with my invention such alloys are electrodeposited, thus accomplishing considerablesimplification in manufacturing methods and procedure; A hearing metal layer, for example, can be plated on to abacking metal and the thickness of the metal layer closely controlled so as to dispense with subsequent machining operations to remove excess metal. Also, in many instances, a superior bearing surface can be obtained'by electroplating than can be accomplished by means of the casting process.
It is an object of this invention to provide a new and useful method and bath for electroplating alloys of tin, copper and antimony. Other objects and advantages of my invention will be apparent in the following'description of the preferred embodiments. 7
Briefly, my invention consists in plating tin-copperantimony alloys by electrodeposition. from an aqueous bath containing the fluoborate salts of these metals. Bath additives, such as betanaphthol and glue may be added to the bath to improvethe quality of the plate. Variations in the composition of the alloy can be accomplished by variations in the current density and in the anode'composition as Well as by variations in the concentrations of l Grams per liter Tin from 60 to 80 Copper from 1 to Antimony from 1 to 5 It is generally advantageous to add to the bath from .25 to 2 grams per liter glue, and to maintain thebath saturated with betanaphthol. At room temperature this amounts to approximately 1 gram per liter of betanaph thol. The pH is maintained at'between 0 and 1, and temperatures of from 70 to 100 F. may be used. The anode may either be pure tin or else an alloy of tin and copper, such as an alloy containing about 95% tin and about 5 %copper.- I have used the cathode current densities of from to 60 amperes per square foot in conjunction with this bath, depending upon the exact alloy composition desired.
From a bath having the above range of metal concentrations and using current densities and anode materials within the range set forth, smooth, dense alloy platings containing from 79 to 97% tin, from 2 to 12% antimony and from 1 to'8% copper, may be plated. The
particularly useful bearing alloys, such as SAE 10, 11 and 12, fall Within this range.
The following specific examples of baths and of plating conditions from within the above range, together with the alloy compositions obtained therefrom, Will serve for purposes of illustration:
Example I Anode: Sn95 Cu5 Cathode current density: 30 amperes per square foot Bath:
Tin grams per liter Copper do 1.0 Antimony do- 1.0 Boric acid do 20 Glue do 1.0 Betanaphthol do 1.0 pH 0.3 Temperature F- 75 Agitation: Revolving anode Deposit: Cu1.5%, Sb1.5%, Sn-balance.
Example ll Anode: Sn%, Cu-5% Cathode current density: 60 amperes per square foot Bath:
Tin grams per liter 62 Copper do 3.5 Antimony do 4.5 Boric acid do 25 Glue do 1.0 Betanaphthol do 1.0 7 pH 0.3 Temperature F 75 Agitation: Revolving anode Deposit: Cu-2.6%, Sb--7.7%, Sn--balance.
Example III Anode: Sn-95%, Ctr-5% Cathode current density: 60 amperes per square foot Bath:
Agitation: Revolving anode Deposit: Cu6.3%, Sb5.1%, Snbalance.
Example IV Anode: 100% Sn Cathode current density: 60 amperes per square foot Bath:
Tin grams per liter 75 Copper do 1.5 Antimony do 1.5 Boric acid do 20 Glue do 1.0 Betanaphthol do 1.0 pH 0.3 Temperature F 75 Agitation: Revolving anode Deposit: Cu-8.9%, Sb--1l.2%, Snbalance.
Example V Anode: 100% Sn Cathode current density: 30 amperes per square foot Bath:
Tin ..grams per Men. 75 Copper do 1.5 Antimony do 3.5 Boric acid do 15 Glue do .5 Betanaphthol do 1 pH 0.3 Temperature F 75 Agitation: Revolving anode Deposit: Cu--l.0%, Sb-6.l%, Snbalance.
For solution makeup and for concentration control I have found that a tin fluoborate concentrate containing approximately 300 grams per liter of stannous tin is satisfactory for addition of the tin constitutent. For addition of the copper constituent a copper fluoborate concentrate containing approximately I80 grams per liter of copper can be used. The required antimony may be supplied in a number of ways. Antimony trioxide, antimony trifluoride, potassium antimony tartrate, and antimony fiuoborate have all proved satisfactory. I have found that an antimony fiuoborate solution containing approximately 35% antimony fiuoborate, 9% fluoboric acid, and .3% hydrofi'ouric acid, to be the most convenient source of the antimony addition. In all cases, irrespective of the type of addition solution used, it ha been found best to add the antimony compound as the last ingredient and after pH adjustment, since at this stage the antimony compound is most soluble and thus no difiiculty is had from precipitants.
To adjust. and maintain the pH, additions of a 42% commercial fiuoboric acid solution can be made. I have found it preferable to add about from 10 to 40 grams per liter and preferably from to 25 grams per liter of boric acid to the bath and then adjust and maintain the pH to that desired by additions of fiuoboric acid.
' The glue concentration is obtained by the addition of liquid glue obtained by dissolving bone glue pellets in a minimum amount of water. To maintain the solution saturated with'betanaphthol, an excessive amount of this additivecan be stirred into the solution and, after a period ofagitatio'n, the undissolved material filtered out.
While I prefer to use an anode consisting of either pure tin or else of an alloyof tin and copper, it is to. be understood, of course, that an insoluble anode such as carbon or platinum may be used. The chief advantage of a tin or of a tin-copper alloy anode is that it assists in maintaining the metal concentration of the solution. Anodes containing antimony have been found to be somewhat disadvantageous in that they sludge excessively.
It is generally preferable to agitate the bath solution during plating. This I accomplish by the use of a revolving anode; however, any suitable agitating means of course be used.
From the above listed examples it is apparent that differences in operating conditions and differences in bath concentrations result in very significant variations in the deposited alloy. It has been recognized, for example, that variations in anode composition and position have pronounced effect on the composition of the deposit. For example, using a bath having a composition of:
Tin grams per liter Copper 1.5 grams per liter Antimony 3.5 grams per liter Glue 1 gram per liter Betanaphthol Saturated solution (approx. 1
gram per liter) Temperature 75 F.
The following deposits were obtained under the conditions specified:
1. Rotating (approx. R. P. M.) internal anode Sn and 5% Cu) 60 amperes per square foot cathode current density. Deposit analysis: 5.5% Sb, 2.8% Cu, 91.7% Sn.
2. Stationary external anode (95% Sn and 5% Cu) and rotating cathode (approx. 80 R. P. M.) 60 amperes per square foot cathode current density. Deposit analysis: 3.6% Sb, 2.3% Cu, 94.1% Sn.
3. Stationary external anode (pure Sn) and rotating cathode (approx. 80 R. P. M.) 60 amperes per square foot cathode current density. Deposit analysis: 1.2% Sb, 1.5% Cu, 97.7% Sn.
The choice of location of the anode, that is, the choice of whether it is to be internal or external, will of course depend upon the' shape of the base metal being plated. Where, for example, the interior surface of a bearing shell is to be plated, an internal anode is used. When an external anode such as a cylinder is used, then agitation can be accomplished by the use of a revolving cathode, which is, of course, the article beingplated.
It will be apparent that under closely controlled conditions, various useful tin base tin-copper-antimony a1- loys within a wide range can be plated with our bath and process.
While the process and bath of my invention can be used, as above, to electrodeposit Sn base alloys within the range of about 79 to 97% Sn, 2 to 12% Sb, and l to 8% Cu, it can also be used to plate other tin-copperantimony alloys. A bath having metal ion concentrations with the range of from 50 to 180 g./l. tin, from .5 to 20 g./l. copper and from .5 to 20 g./l. antimony, and containing fluoboric acid and boric acid and preferably glue and betan'aphthol within the ranges previously set forth, may be used. The current density can be from 10 to 60 amperes per square foot, the anode material being either pure tin, an alloy of tin and copper, or else an insoluble such as carbon or platinum. As in the case of the previously mentioned baths, the temperature may be from 70 to F. I have obtained alloys containing from 1.5% to 99% tin, from .4% to 15.5% antimony and from .2% to 98% copper with my process, the exact percentage composition depending, upon the various metal ion concentrations in the bath and also upon the conditions used. The following table lists various plating baths and conditions along with the alloy deposited therefrom:
containing from 50 to 180 g./l. tin as tin fluoborate, from .5 to 20 g./l. antimony as antimony fluoborate, from .5
Anode Deposit Solution Ooficentratlon. current g. Cathode Composition fg gg Type pgsmon per Antimony, Copper, Tin,
Tm copper Amt sq. ft. Percent Percent Percent P 7 Percent Percent Tm Copper mony :32 s 2 .s 3-: as a 8 2 0. 100 90 10 10 35 0. 4 67. 2 Do. 100 125 10 10 35 0. 7 60. 5 Do. 100 175 19 10 35 0. 7 97. 6 Do. 100 75 0. 5 0. 5 35 1. 1 0. 2 D0. 100 i 75 1. 5 1. 5 35 0. 7 1. 6 Do. 100 75 3. 5 3. 5 35 7. 6 11. 9 D0. 100 75 0. 5 0.5 60 1. 1 0. 3 D0. 100 75 1. 5 1. 5 60 0. 7 0. 9 D0. 100 75 3. 5 3. 5 60 11. 2 8. 9 D0. 100 75 10 10 60 15. 5 29. 4 D0. 100 75 0. 5 0. 5 10 0. 4 2. D0. 95 75 1. 5 1. 5 0.6 4.0 Do. 95 5 75 3. 5 3. 5 10 14. 6 23. 1 D0. 95 V 5 v 75 1. 5 3. 5 35 15. 3 1. 3 D0. 95 5 75 1. 5 3. 5 35 15. 2 1. 5 Do. 95 5 75 1. 0 1. 0 60 0. 5 1. 5 Do. 95 5 75 2. 5 2. 5 30 2. 9 9. 6 Do. 95 5 75 2. 5 2. 5 60 0. 7 4. 3 Do. 95 5 75 2.5- 4. 5 '30 6. 3 19. 7 D0.
Satisfactory tin-antimony-copper alloys, and in par? ticular those alloys containing aflpreponderance of tin,
can be electrodedeposited with the fluoborate bath and process of this invention. By the close control of the bath composition, current density; circulation, anode material and the conditions enumerated, excellent'deposits of several thousandths and even of several hundredths of an inch thick can be obtained with close control over the exact composition of the deposit. The process and bath of this invention make possible the electrodeposition of smooth dense deposits of varying thicknesses whichadhere to metal bases such as steel and other ferrous metals," copper, copper lead alloys, silver, nickel and other metals and alloys.
Various changes and modifications of the embodiments of the invention described herein may be made by those skilled in the art without departing from the spirit and principles of the invention.
I claim:
1. The process of electroplating an alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin which consists in electrodepositing the alloy from an aqueous-bath containing from 50 to 180 g./l. tin as tin fluoborate, from .5 to g./l. antimony as antimony fluoborate, from .5 to 20 g./l. copper as copper fluoborate, from 10 to 40 g./l. boric acid, and sufiicient fluoboric acid to. maintain the pH of said bath at less than 1, the current density being from 10 to 60 amperes per square foot.
2. A process in accordance with claim 1 inwhich the anode material is selected from a group consisting of pure tin and the tincopper alloys predominantly of tin.
3. A process in accordance with claim 1 in which the bath contains from .25 to 2 g./l. glue and about 1 g./l. betanaphthol.
4. An aqueous bath for the electrodeposition of an alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin, saidbath to 20 g./l. copper as copper fluoborate, from .25 to 2 g./l. glue, from 10 to 40 g./l. boric acid, about 1 g./l. betanaphthol and sufiicient fluoboric acid to maintainthe pH of said bath below 1.
5. -A process for electrodepositing a ternary alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin consisting of passing a current suflicient to yield a current density of from 10 to amperes per square foot between a cathode and an anode and through a bath containing from about 60 to g./l. tin as tin fluoborate, from about 1 to 5 g./l. antimony as antimony fluoborate, from about 1 to 5 g./l. copper as copper fluoborate, from about 15 to 25 g./l. boric acid, and sufficient fluoboric acid to maintain the pH of said bath at below 1.
6'. A process in accordance with claim 5 in which the bath contains from .25 to 2 g./l. glue, and is saturated with betanaphthol.
7. A process in accordance with claim 5 in which the anode material is selected from a group consisting of pure tin and tin-copper alloys predominantly of tin.
8. An aqueous bath for the electrodeposition of an alloy containing from about 2 to 12% antimony, from about 1 to 8% copper and the balance tin, said bath containing from 50 to g./l. tin as tin fluoborate, from .5 to 20 g./1. antimony as a compound selected from the group consisting of antimony fluoborate, antimony trioxide, antimony trifluoride and potassium antimony tartrate, from .5 to 20 g./1. copper as copper fluoborate, from 10 to 40 g./l. boric acid and sufiicient fluoboric acid to maintain the pH of said bath below 1.
References Cited in the file of this patent UNITED STATES PATENTS 2,455,554 Brown Dec. 7, 1948 2,458,827 Booe Jan. 11, 1949 2,523,160 Struyk et a1. Sept. 19,1950
Claims (1)
- 8. AN AQUEOUS BATH FOR THE ELECTRODEPOSITION OF AN ALLOY CONTAINING FROM ABOUT 2 TO 12% ANTIMONY, FROM ABOUT 1 TO 8% COPPER AND THE BALANCE TIN, SAID BATH CONTAINING FROM 50 TO 180 G./L. TIN AS TIN FLUOBORATE, FROM 5 TO 20 G./L. ANTIMONY AS A COMPOUND SELECTED FROM THE GROUP CONSISTING OF ANITIMONY FLUOBORATE, ANTIMONY TRIOXIDE, ANTIMONY TRIFLUORIDE AND POTASSIUM ANTIMONY TARTRATE, FROM .5 TO 20 G./L. COPPER AS COPPER FLUOBORATE, FROM 10 TO 40 G./L. BORIC ACID AND SUFFICIENT FLUOBORIC ACID TO MAINTAIN THE PH OF SAID BATH BELOW L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US261153A US2744063A (en) | 1951-12-11 | 1951-12-11 | Electrodeposition of tin-antimonycopper alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US261153A US2744063A (en) | 1951-12-11 | 1951-12-11 | Electrodeposition of tin-antimonycopper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2744063A true US2744063A (en) | 1956-05-01 |
Family
ID=22992136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US261153A Expired - Lifetime US2744063A (en) | 1951-12-11 | 1951-12-11 | Electrodeposition of tin-antimonycopper alloys |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2744063A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2802780A (en) * | 1956-07-18 | 1957-08-13 | Platalloy Corp | Tin-copper-cadmium electro-plating |
| US2850441A (en) * | 1954-12-28 | 1958-09-02 | Gen Motors Corp | Chemical displacement process of plating cadmium on aluminum |
| US20060054347A1 (en) * | 2002-12-18 | 2006-03-16 | Paolo Agostinelli | Electric conductors |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2455554A (en) * | 1946-01-05 | 1948-12-07 | Udylite Corp | Electrodeposition of copper |
| US2458827A (en) * | 1946-05-10 | 1949-01-11 | Mallory & Co Inc P R | Electrodeposition of lead-tin-antimony alloys |
| US2523160A (en) * | 1947-11-28 | 1950-09-19 | Allied Chem & Dye Corp | Electrodeposition of metals |
-
1951
- 1951-12-11 US US261153A patent/US2744063A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2455554A (en) * | 1946-01-05 | 1948-12-07 | Udylite Corp | Electrodeposition of copper |
| US2458827A (en) * | 1946-05-10 | 1949-01-11 | Mallory & Co Inc P R | Electrodeposition of lead-tin-antimony alloys |
| US2523160A (en) * | 1947-11-28 | 1950-09-19 | Allied Chem & Dye Corp | Electrodeposition of metals |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2850441A (en) * | 1954-12-28 | 1958-09-02 | Gen Motors Corp | Chemical displacement process of plating cadmium on aluminum |
| US2802780A (en) * | 1956-07-18 | 1957-08-13 | Platalloy Corp | Tin-copper-cadmium electro-plating |
| US20060054347A1 (en) * | 2002-12-18 | 2006-03-16 | Paolo Agostinelli | Electric conductors |
| JP2006511041A (en) * | 2002-12-18 | 2006-03-30 | アゴスチネッリ・パオロ | Electrical conductor |
| JP4914009B2 (en) * | 2002-12-18 | 2012-04-11 | アゴスチネッリ・パオロ | Electrical conductor |
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