TW201446119A - Baffle assembly and server using the same - Google Patents
Baffle assembly and server using the same Download PDFInfo
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- TW201446119A TW201446119A TW102118527A TW102118527A TW201446119A TW 201446119 A TW201446119 A TW 201446119A TW 102118527 A TW102118527 A TW 102118527A TW 102118527 A TW102118527 A TW 102118527A TW 201446119 A TW201446119 A TW 201446119A
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Abstract
Description
本發明是有關於一種擋風組件,特別是有關於一種應用於伺服器中的擋風組件。 The present invention relates to a windshield assembly, and more particularly to a windshield assembly for use in a server.
電子設備於運轉過程中常會產生熱量,若不將此熱量有效排除,輕則導致電子設備發生當機狀況,嚴重時還可能燒毀電子設備中的電子元件,造成財產損失。一般解決電子設備散熱問題的方法,可能是在電子設備的機殼內設置散熱裝置,並藉由散熱裝置來排除電子設備於運轉過程中所產生的熱量。 Electronic equipment often generates heat during operation. If this heat is not effectively removed, it may cause the electronic equipment to crash, and in serious cases, it may burn electronic components in the electronic equipment, causing property damage. Generally, a method for solving the heat dissipation problem of an electronic device may be that a heat sink is disposed in the casing of the electronic device, and the heat generated by the electronic device during operation is excluded by the heat sink.
近年來,核心電子晶片(例如,中央處理器、記憶體模組等)因具有較高的效能而會產生較高的溫度,使得電子設備需設置多個風扇來增強散熱效果。舉例來說,在伺服器或桌上型個人電腦的機殼中,通常設置多台的風扇裝置,藉由風扇裝置引發的強制對流來移除運轉過程中電子元件所產生的熱量,使伺服器或桌上型個人電腦能穩定工作。 In recent years, core electronic chips (for example, central processing units, memory modules, etc.) have higher temperatures due to higher performance, so that electronic devices need to be provided with multiple fans to enhance the heat dissipation effect. For example, in the case of a server or a desktop personal computer, a plurality of fan devices are usually provided, and forced convection caused by the fan device is used to remove heat generated by electronic components during operation, so that the server Or a desktop PC can work stably.
舉例來說,以設置有複數個記憶體模組的伺服器為 例,其內通常會對應地設置複數個風扇以對各自的記憶體模組進行散熱。 For example, a server with a plurality of memory modules is provided For example, a plurality of fans are usually arranged correspondingly to dissipate heat from the respective memory modules.
然而,若伺服器內的主機板上有某些插槽未插設記憶體模組時,風扇所產生的散熱風流可能會從主機板上未插設記憶體模組的空缺處流動。如此一來,風扇所產生的散熱風流並無法正確地流動通過具有迫切散熱需求的記憶體模組,進而影響記憶體模組的散熱,並間接導致記憶體模組的運作效能降低。 However, if some of the slots on the motherboard in the server are not plugged into the memory module, the cooling airflow generated by the fan may flow from the vacant portion of the motherboard without the memory module inserted. As a result, the cooling airflow generated by the fan cannot flow correctly through the memory module having the urgent heat dissipation requirement, thereby affecting the heat dissipation of the memory module, and indirectly causing the operation performance of the memory module to be reduced.
本發明提供一種擋風組件,其係應用於伺服器中。伺服器包含機殼,以及設置於機殼中的框架及至少一風扇。框架具有通道。通道連通框架的第一側與第二側。風扇位於第一側。擋風組件包含鉸鏈支架、擋門及彈性件。鉸鏈支架於第二側固定至框架,並毗鄰通道。擋門樞接至鉸鏈支架,藉以相對鉸鏈支架轉動而蓋合或開啟通道。彈性件設置於鉸鏈支架與擋門之間,用以驅使擋門朝向通道進行蓋合。 The present invention provides a windshield assembly that is applied to a server. The server includes a casing, a frame disposed in the casing, and at least one fan. The frame has channels. The channel communicates with the first side and the second side of the frame. The fan is on the first side. The windshield assembly includes a hinge bracket, a door and an elastic member. The hinge bracket is fixed to the frame on the second side and adjacent to the passage. The door is pivotally connected to the hinge bracket to cover or open the passage relative to the hinge bracket. The elastic member is disposed between the hinge bracket and the blocking door to drive the blocking door to cover the passage.
於本發明的一實施方式中,上述的鉸鏈支架包含兩樞接部。每一樞接部具有樞接孔。擋門包含本體以及樞軸。本體用以蓋合通道。樞軸連接至本體的邊緣,並位於樞接部之間。樞軸的兩端分別插設至樞接孔中。 In an embodiment of the invention, the hinge bracket includes two pivoting portions. Each pivoting portion has a pivot hole. The door includes a body and a pivot. The body is used to cover the passage. The pivot is connected to the edge of the body and is located between the pivots. Both ends of the pivot are respectively inserted into the pivot holes.
於本發明的一實施方式中,上述的鉸鏈支架還包含固定部。固定部係固定至框架。樞接部係分隔地連接至固 定部。 In an embodiment of the invention, the hinge bracket further includes a fixing portion. The fixing portion is fixed to the frame. The pivoting portion is connected to the solid partition Department.
於本發明的一實施方式中,上述的彈性件為彈簧。彈簧套置於樞軸上。彈簧的兩端分別連接至本體與鉸鏈支架,並壓縮於本體與鉸鏈支架之間。 In an embodiment of the invention, the elastic member is a spring. The spring sleeve is placed on the pivot. The two ends of the spring are respectively connected to the body and the hinge bracket, and are compressed between the body and the hinge bracket.
本發明另提供一種伺服器,其係包含機殼、框架、至少一風扇以及複數個擋風組件。框架設置於機殼中,並具有複數個通道。每一通道連通框架的第一側與第二側。風扇設置於機殼中,並位於第一側。擋風組件設置於機殼中。每一擋風組件包含鉸鏈支架、擋門以及彈性件。鉸鏈支架於第二側固定框架,並毗鄰對應之通道。擋門樞接至鉸鏈支架,藉以相對鉸鏈支架轉動而蓋合或開啟對應之通道。彈性件設置於鉸鏈支架與擋門之間,用以驅使擋門朝向對應之通道進行蓋合。 The invention further provides a server comprising a casing, a frame, at least one fan and a plurality of windshield assemblies. The frame is disposed in the casing and has a plurality of channels. Each channel communicates with the first side and the second side of the frame. The fan is placed in the casing and is located on the first side. The windshield assembly is disposed in the casing. Each windshield assembly includes a hinge bracket, a door, and an elastic member. The hinge bracket fixes the frame on the second side and is adjacent to the corresponding passage. The door is pivotally connected to the hinge bracket to rotate or close the corresponding passage of the hinge bracket. The elastic member is disposed between the hinge bracket and the blocking door to drive the blocking door to cover the corresponding passage.
於本發明的一實施方式中,上述的伺服器還包含主機板。主機板設置於機殼中,並位於第二側。主機板包含複數個插槽。插槽分別對齊通道。 In an embodiment of the invention, the server further includes a motherboard. The motherboard is placed in the casing and is located on the second side. The motherboard contains a number of slots. The slots are aligned with the channels.
於本發明的一實施方式中,上述的伺服器還包含至少一記憶體模組。記憶體模組插設至插槽中之其一,並毗鄰對應之通道。對應之擋風組件的擋門係開啟對應之通道並抵靠記憶體模組,致使記憶體模組經由對應之通道連通至第一側。 In an embodiment of the invention, the server further includes at least one memory module. The memory module is inserted into one of the slots and adjacent to the corresponding channel. The corresponding door of the windshield assembly opens the corresponding channel and abuts the memory module, so that the memory module communicates to the first side via the corresponding channel.
本發明所提供的擋風組件以及伺服器的一主要技術特徵,在於當伺服器的主機板上未插設記憶體模組時,擋風組件的擋門會蓋合框架的通道,因此風扇所產生的散 熱風流並不會朝向框架的空缺處由框架的第一側(亦即,風扇所在的一側)流至第二側(亦即,主機板所在的一側),進而防止記憶體模組的散熱效果受到影響;當伺服器的主機板上插設有記憶體模組時,擋風組件的擋門會開啟框架的通道,並抵靠記憶體模組的側面,致使記憶體模組可經由通道連通至第一側,並獲得散熱風流。 A main technical feature of the windshield assembly and the server provided by the present invention is that when the memory module is not inserted into the motherboard of the server, the door of the windshield assembly covers the passage of the frame, so the fan Generated dispersion The hot air flow does not flow toward the vacancy of the frame from the first side of the frame (ie, the side where the fan is located) to the second side (ie, the side where the motherboard is located), thereby preventing the memory module from being The heat dissipation effect is affected; when the memory module is inserted into the motherboard of the server, the shutter of the wind shield component opens the channel of the frame and abuts the side of the memory module, so that the memory module can be The passage is connected to the first side and a cooling airflow is obtained.
1‧‧‧電測設備 1‧‧‧Electrical testing equipment
10‧‧‧承載盤 10‧‧‧ Carrying tray
100‧‧‧第一面 100‧‧‧ first side
102‧‧‧第二面 102‧‧‧ second side
104‧‧‧第一孔洞 104‧‧‧First hole
106‧‧‧第二孔洞 106‧‧‧Second hole
12‧‧‧測試針 12‧‧‧Test pin
14‧‧‧墊圈 14‧‧‧Washers
16‧‧‧殼體 16‧‧‧Shell
160‧‧‧通道 160‧‧‧ channel
162‧‧‧進氣口 162‧‧‧air inlet
164‧‧‧出氣口 164‧‧‧ outlet
18‧‧‧氣壓控制模組 18‧‧‧Pneumatic Control Module
180‧‧‧氣體加壓單元 180‧‧‧ gas pressurizing unit
182‧‧‧氣壓控制單元 182‧‧‧Pneumatic Control Unit
184‧‧‧氣壓感測單元 184‧‧‧Pneumatic sensing unit
20‧‧‧氣體變溫模組 20‧‧‧Gas temperature change module
200‧‧‧第一加熱單元 200‧‧‧First heating unit
202‧‧‧第一冷卻單元 202‧‧‧First cooling unit
204‧‧‧第一溫控單元 204‧‧‧First temperature control unit
206‧‧‧第一溫度感測器 206‧‧‧First temperature sensor
22‧‧‧控溫器 22‧‧‧temperature controller
220‧‧‧第二加熱單元 220‧‧‧second heating unit
222‧‧‧第二冷卻單元 222‧‧‧Second cooling unit
224‧‧‧第二溫控單元 224‧‧‧Second temperature control unit
226‧‧‧第二溫度感測器 226‧‧‧Second temperature sensor
3‧‧‧待測物 3‧‧‧Test object
4‧‧‧真空氣壓源 4‧‧‧Vacuum pressure source
S‧‧‧密閉空間 S‧‧‧Confined space
第1圖為繪示本發明一實施方式之伺服器的立體圖。 Fig. 1 is a perspective view showing a server according to an embodiment of the present invention.
第2圖為繪示第1圖中之框架與擋風組件的立體組合圖。 Fig. 2 is a perspective assembled view of the frame and the windshield assembly of Fig. 1.
第3圖為繪示第2圖中之擋風組件的立體分解圖。 Fig. 3 is an exploded perspective view showing the windshield assembly of Fig. 2.
第4圖為繪示第1圖中之伺服器的局部上視圖。 Figure 4 is a partial top elevational view of the server of Figure 1.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
請參照第1圖以及第2圖。第1圖為繪示本發明一實施方式之伺服器1的立體圖。第2圖為繪示第1圖中之 框架12與擋風組件16的立體組合圖。 Please refer to Figure 1 and Figure 2. Fig. 1 is a perspective view showing a server 1 according to an embodiment of the present invention. Figure 2 shows the picture in Figure 1. A perspective view of the frame 12 and the windshield assembly 16.
如第1圖所示,於本實施方式中,伺服器1包含機殼10、框架12、複數個風扇14、複數個擋風組件16、主機板18以及複數個記憶體模組20。以下將對伺服器1所包含的各元件的結構以及各元件之間的連接關係做詳細的解說。 As shown in FIG. 1, in the present embodiment, the server 1 includes a casing 10, a frame 12, a plurality of fans 14, a plurality of windshields 16, a main board 18, and a plurality of memory modules 20. The structure of each component included in the server 1 and the connection relationship between the components will be explained in detail below.
如第1圖與第2圖所示,於本實施方式中,伺服器1的機殼10具有一容置空間100。伺服器1的框架12設置於機殼10的容置空間100中,並具有複數個通道120。框架12的每一通道120連通框架12的第一側12a與第二側12b。亦即,框架12將機殼10的容置空間100分割為兩部分,一部分位於框架12的第一側12a,另一部分位於框架12的第二側12b。 As shown in FIGS. 1 and 2, in the present embodiment, the casing 10 of the server 1 has an accommodation space 100. The frame 12 of the server 1 is disposed in the accommodating space 100 of the casing 10 and has a plurality of channels 120. Each channel 120 of the frame 12 communicates with the first side 12a and the second side 12b of the frame 12. That is, the frame 12 divides the housing space 100 of the cabinet 10 into two parts, one portion being located on the first side 12a of the frame 12 and the other portion being located on the second side 12b of the frame 12.
伺服器1的風扇14設置於機殼10的容置空間100中,並位於框架12的第一側12a。於本實施方式中,伺服器1的每一風扇14皆對齊框架12的兩相鄰通道120,並朝向兩通道120吹拂散熱風流,致使每一風扇14所產生的散熱風流由框架12的第一側12a經由對應的通道120抵達框架12的第二側12b,然而本發明並不以此為限。 The fan 14 of the server 1 is disposed in the accommodating space 100 of the casing 10 and is located at the first side 12a of the frame 12. In this embodiment, each fan 14 of the server 1 is aligned with two adjacent channels 120 of the frame 12, and blows the cooling airflow toward the two channels 120, so that the heat dissipation flow generated by each fan 14 is first by the frame 12. The side 12a reaches the second side 12b of the frame 12 via the corresponding channel 120, although the invention is not limited thereto.
於另一實施方式中,伺服器1所包含的風扇14亦可不與框架12的通道120對齊(亦即,風扇14與通道120並未對應地設置),且風扇14所產生的散熱風流可在容置空間100於框架12的第一側12a的部分進行匯合,並經由框架12未被擋風組件16蓋合的通道120由框架12的第一 側12a抵達第二側12b。 In another embodiment, the fan 14 included in the server 1 may not be aligned with the channel 120 of the frame 12 (that is, the fan 14 and the channel 120 are not correspondingly disposed), and the cooling airflow generated by the fan 14 may be The accommodating space 100 meets at a portion of the first side 12a of the frame 12, and the passage 120 that is not covered by the windshield assembly 16 via the frame 12 is first by the frame 12. Side 12a reaches second side 12b.
伺服器1的主機板18設置於機殼10的容置空間100中,並位於框架12的第二側12b。伺服器1的主機板18包含複數個插槽180。主機板18的插槽180分別對齊框架12的通道120。於本實施方式中,主機板18上的每一插槽180的走向,皆垂直於框架12。 The motherboard 18 of the server 1 is disposed in the accommodating space 100 of the casing 10 and located at the second side 12b of the frame 12. The motherboard 18 of the server 1 includes a plurality of slots 180. The slots 180 of the motherboard 18 are aligned with the channels 120 of the frame 12, respectively. In the present embodiment, the orientation of each slot 180 on the motherboard 18 is perpendicular to the frame 12.
伺服器1的每一記憶體模組20係插設至主機板18的插槽180中之其一,並毗鄰框架12上對應之通道120。藉此,每一風扇14所產生的散熱風流在通過框架12的通道120而由框架12的第一側12a流動至第二側12b之後,即可流經記憶體模組20,並將記憶體模組20的熱量帶走而達到散熱之功效。伺服器1的記憶體模組20可為雙直列記憶體模組(Dual In-line Memory Module,DIMM),但本發明並不以此為限。 Each memory module 20 of the server 1 is inserted into one of the slots 180 of the motherboard 18 and adjacent to the corresponding channel 120 on the frame 12. Thereby, the heat dissipation airflow generated by each of the fans 14 can flow through the memory module 20 after flowing through the channel 120 of the frame 12 from the first side 12a of the frame 12 to the second side 12b, and the memory is The heat of the module 20 is taken away to achieve the effect of heat dissipation. The memory module 20 of the server 1 can be a dual in-line memory module (DIMM), but the invention is not limited thereto.
請參照第3圖,其為繪示第2圖中之擋風組件16的立體分解圖。 Please refer to FIG. 3 , which is an exploded perspective view of the wind shield assembly 16 in FIG. 2 .
如第1圖、第2圖與第3圖所示,於本實施方式中,伺服器1的擋風組件16設置於機殼10的容置空間100中。每一擋風組件16包含鉸鏈支架160、擋門162以及彈性件。擋風組件16的鉸鏈支架160於支架的第二側12b固定框架12上,並毗鄰框架12上對應之通道120。擋風組件16的擋門162樞接至鉸鏈支架160,藉以相對鉸鏈支架160轉動而蓋合或開啟對應之通道120。擋風組件16的彈性件設置於鉸鏈支架160與擋門162之間,用以驅使擋門162朝向 框架12上對應之通道120進行蓋合。 As shown in FIG. 1, FIG. 2, and FIG. 3, in the present embodiment, the windshield assembly 16 of the servo 1 is disposed in the housing space 100 of the casing 10. Each windshield assembly 16 includes a hinge bracket 160, a door 162, and an elastic member. The hinge bracket 160 of the windshield assembly 16 is secured to the frame 12 on the second side 12b of the bracket and adjacent the corresponding channel 120 in the frame 12. The shutter 162 of the windshield assembly 16 is pivotally connected to the hinge bracket 160, thereby rotating or closing the corresponding passage 120 with respect to the hinge bracket 160. The elastic member of the windshield assembly 16 is disposed between the hinge bracket 160 and the blocking door 162 for driving the blocking door 162 toward The corresponding channel 120 on the frame 12 is covered.
進一步來說,如第2圖與第3圖所示,於本實施方式中,擋風組件16的鉸鏈支架160包含固定部160a以及兩樞接部160b。鉸鏈支架160的固定部160a係固定至框架12。鉸鏈支架160的每一樞接部160b具有樞接孔160b1。鉸鏈支架160的兩樞接部160b係分隔地連接至固定部160a。並且,鉸鏈支架160的兩樞接部160b相互平行,致使兩樞接孔160b1相對。 Further, as shown in FIGS. 2 and 3, in the present embodiment, the hinge bracket 160 of the windshield assembly 16 includes a fixing portion 160a and two pivot portions 160b. The fixing portion 160a of the hinge bracket 160 is fixed to the frame 12. Each pivot portion 160b of the hinge bracket 160 has a pivot hole 160b1. The two pivot portions 160b of the hinge bracket 160 are connected to the fixing portion 160a in a spaced apart manner. Moreover, the two pivoting portions 160b of the hinge bracket 160 are parallel to each other, so that the two pivot holes 160b1 are opposed to each other.
擋風組件16的擋門162包含本體162a以及樞軸162b。擋門162的本體162a用以蓋合通道120。擋門162的樞軸162b連接至本體162a的邊緣,並位於鉸鏈支架160的兩樞接部160b之間。擋門162的樞軸162b兩端分別插設至兩樞接部160b的樞接孔160b1中。 The shutter 162 of the windshield assembly 16 includes a body 162a and a pivot 162b. The body 162a of the shutter 162 is used to cover the passage 120. The pivot 162b of the shutter 162 is coupled to the edge of the body 162a and is located between the two pivot portions 160b of the hinge bracket 160. The two ends of the pivot 162b of the blocking door 162 are respectively inserted into the pivot holes 160b1 of the two pivoting portions 160b.
另外,擋風組件16的彈性件為彈簧164。擋風組件16的彈簧164套置於擋門162的樞軸162b上。擋風組件16的彈簧164兩端分別連接至擋門162的本體162a與鉸鏈支架160的固定部160a,並壓縮於擋門162的本體162a與鉸鏈支架160的固定部160a之間,藉以提供驅使擋門162朝向框架12上對應之通道120進行蓋合的力量。然而,本發明的彈性件並不以彈簧164為限,還可為其他同樣可提供彈力的元件。 In addition, the elastic member of the wind shield assembly 16 is a spring 164. The spring 164 of the wind shield assembly 16 is placed over the pivot 162b of the door 162. The two ends of the spring 164 of the windshield assembly 16 are respectively connected to the body 162a of the shutter 162 and the fixing portion 160a of the hinge bracket 160, and are compressed between the body 162a of the door 162 and the fixing portion 160a of the hinge bracket 160, thereby providing driving The door 162 is biased toward the corresponding channel 120 on the frame 12. However, the elastic member of the present invention is not limited to the spring 164, and may be other members that also provide elasticity.
請參照第4圖,其為繪示第1圖中之伺服器的局部上視圖。 Please refer to FIG. 4, which is a partial top view of the server in FIG.
如第4圖所示,於本實施方式中,對於主機板18 上某些未插設記憶體模組20的位置來說(如第4圖的左半部所示),對應之擋風組件16的擋門162會蓋合框架12上的對應之通道120,因此風扇14所產生的散熱風流並不會朝向框架12的空缺處由框架12的第一側12a流至第二側12b,進而防止記憶體模組20的散熱效果受到影響。 As shown in FIG. 4, in the present embodiment, for the motherboard 18 In some positions where the memory module 20 is not inserted (as shown in the left half of FIG. 4), the corresponding door 162 of the windshield assembly 16 covers the corresponding channel 120 on the frame 12. Therefore, the heat dissipation airflow generated by the fan 14 does not flow from the first side 12a of the frame 12 to the second side 12b toward the vacancy of the frame 12, thereby preventing the heat dissipation effect of the memory module 20 from being affected.
相對地,對於主機板18上某些插設有記憶體模組20的位置來說(如第4圖的右半部所示),對應之擋風組件16的擋門162會開啟對應之通道120並抵靠記憶體模組20的側面,致使記憶體模組20可經由對應之通道120連通至框架12的第一側12a。 In contrast, for some positions on the motherboard 18 in which the memory module 20 is inserted (as shown in the right half of FIG. 4), the corresponding door 162 of the windshield assembly 16 opens the corresponding channel. 120 and against the side of the memory module 20, such that the memory module 20 can communicate to the first side 12a of the frame 12 via the corresponding channel 120.
藉此,本發明的伺服器1在支架的第二側12b所設置的擋風組件16,即可確保框架12的第二側12b僅有主機板18上插設有記憶體模組20的位置才會獲得散熱風流,並不會讓風扇14所產生的散熱風流流至主機板18上未插設記憶體模組20的位置,而被無謂的浪費掉。 Thereby, the windshield assembly 16 provided on the second side 12b of the bracket of the present invention ensures that the second side 12b of the frame 12 has only the position on which the memory module 20 is inserted into the motherboard 18. The heat dissipation airflow is obtained, and the heat dissipation airflow generated by the fan 14 is not allowed to flow to the position of the motherboard 18 on which the memory module 20 is not inserted, and is wasted wastelessly.
由以上對於本發明之具體實施例之詳述,可以明顯地看出,本發明所提供的擋風組件以及伺服器的一主要技術特徵,在於當伺服器的主機板上未插設記憶體模組時,擋風組件的擋門會蓋合框架的通道,因此風扇所產生的散熱風流並不會朝向框架的空缺處由框架的第一側(亦即,風扇所在的一側)流至第二側(亦即,主機板所在的一側),進而防止記憶體模組的散熱效果受到影響;當伺服器的主機板上插設有記憶體模組時,擋風組件的擋門會開啟框架的通道,並抵靠記憶體模組的側面,致使記憶體模組可經由 通道連通至第一側並獲得散熱風流。 From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that a main technical feature of the windshield assembly and the server provided by the present invention is that the memory module is not inserted on the motherboard of the server. When the group is set, the door of the windshield assembly will cover the passage of the frame, so the cooling airflow generated by the fan does not flow toward the vacancy of the frame from the first side of the frame (that is, the side where the fan is located) to the first The two sides (that is, the side where the motherboard is located) prevent the heat dissipation effect of the memory module from being affected; when the memory module is inserted into the motherboard of the server, the door of the windshield assembly is opened. The channel of the frame and against the side of the memory module, so that the memory module can be The passage is connected to the first side and obtains a cooling airflow.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
16‧‧‧擋風組件 16‧‧‧ Windshield components
160‧‧‧鉸鏈支架 160‧‧‧Hinged bracket
160a‧‧‧固定部 160a‧‧‧Fixed Department
160b‧‧‧樞接部 160b‧‧‧ pivotal department
160b1‧‧‧樞接孔 160b1‧‧‧ pivot hole
162‧‧‧擋門 162‧‧ ‧ door
162a‧‧‧本體 162a‧‧‧ Ontology
162b‧‧‧樞軸 162b‧‧‧ pivot
164‧‧‧彈簧 164‧‧ ‧ spring
Claims (10)
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TW102118527A TWI547231B (en) | 2013-05-24 | 2013-05-24 | Baffle assembly and server using the same |
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TW102118527A TWI547231B (en) | 2013-05-24 | 2013-05-24 | Baffle assembly and server using the same |
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TW201446119A true TW201446119A (en) | 2014-12-01 |
TWI547231B TWI547231B (en) | 2016-08-21 |
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CN113597183A (en) * | 2020-04-30 | 2021-11-02 | 勤诚兴业股份有限公司 | Server system and server case thereof |
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TWI675286B (en) | 2018-02-09 | 2019-10-21 | 緯創資通股份有限公司 | Server unit and server |
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CN113597183A (en) * | 2020-04-30 | 2021-11-02 | 勤诚兴业股份有限公司 | Server system and server case thereof |
CN113597183B (en) * | 2020-04-30 | 2023-03-28 | 勤诚兴业股份有限公司 | Server system and server case thereof |
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