TW201333796A - Capacitive touch unit - Google Patents
Capacitive touch unit Download PDFInfo
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- TW201333796A TW201333796A TW101150825A TW101150825A TW201333796A TW 201333796 A TW201333796 A TW 201333796A TW 101150825 A TW101150825 A TW 101150825A TW 101150825 A TW101150825 A TW 101150825A TW 201333796 A TW201333796 A TW 201333796A
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- Taiwan
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- transparent substrate
- disposed
- capacitive touch
- conductive layer
- touch unit
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000010410 layer Substances 0.000 claims abstract description 87
- 229920000642 polymer Polymers 0.000 claims description 42
- 239000000084 colloidal system Substances 0.000 claims description 16
- -1 polyethylene terephthalate Polymers 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 4
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 6
- 239000010409 thin film Substances 0.000 claims 6
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000012790 adhesive layer Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
- H03K2217/960765—Details of shielding arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Landscapes
- Position Input By Displaying (AREA)
Abstract
Description
一種電容式觸控單元，尤指一種可減少厚度，並降低製造成本的電容式觸控單元。
A capacitive touch unit, especially a capacitive touch unit that reduces thickness and reduces manufacturing costs.
隨著近年來觸控面板技術之發展，現今具有顯示功能的可攜式電子裝置，如智慧型手機、平板電腦及MP5等皆改採用觸控面板來取代傳統佔據空間的機械式按鍵。
綜觀現有觸控面板中，較常被使用於可攜式電子裝置的多為電容式觸控面板，而一般電容式的觸控面板，該觸控面板係於一透明基板底面上設置一氧化銦錫(ITO)層，且底面周緣作為一佈線區， 該氧化銦錫層上則形成有複數電極，並於該佈線區上則設置複數導線分別與該複數電極電連接；而由於上述導線為非透明物，因此當製作電子裝置的廠商拿到上述觸控面板時，又必須於一保護板底部周緣塗佈一油墨層，並於上述觸控面板的頂面設置一黏貼層且與該保護板黏合，使該保護板底面油墨層對應觸控面板的佈線區，以將觸控面板佈線區內的導線遮蔽，而油墨層及黏貼層之使用除會對電子裝置的製造廠造成製程及材料成本的問題外，亦會使電子裝置的整體厚度增加，無法滿足可攜式電子裝置輕薄短小的需求，因此整體厚度等缺點勢必需要有所改良。
再者，亦有業者以黃光製程製造，雖可達到薄型化之需求，但相對製造成本卻需大幅提升；故習知具有下列缺點：
1.厚度較厚；
2.製造成本較高。
With the development of touch panel technology in recent years, portable electronic devices with display functions, such as smart phones, tablet computers, and MP5s, have adopted touch panels instead of traditional mechanical buttons that occupy space.
In the conventional touch panel, the capacitive touch panel is more commonly used in portable electronic devices, and the general capacitive touch panel is provided with an indium oxide on the bottom surface of a transparent substrate. a tin (ITO) layer, and a periphery of the bottom surface serves as a wiring region, a plurality of electrodes are formed on the indium tin oxide layer, and a plurality of wires are respectively disposed on the wiring region to be electrically connected to the plurality of electrodes; a transparent material, so when the manufacturer of the electronic device obtains the touch panel, an ink layer must be applied on the periphery of the bottom of the protective plate, and an adhesive layer is disposed on the top surface of the touch panel and the protective plate is Bonding, the ink layer on the bottom surface of the protection board corresponds to the wiring area of the touch panel to shield the wires in the wiring area of the touch panel, and the use of the ink layer and the adhesive layer may cause process and material costs for the manufacturer of the electronic device. In addition, the overall thickness of the electronic device is also increased, and the portable electronic device is not required to be light, thin, and short. Therefore, the overall thickness and other disadvantages are inevitably required to be improved.
In addition, some manufacturers use the Huangguang process to manufacture. Although the demand for thinning can be achieved, the relative manufacturing cost needs to be greatly improved. Therefore, the following drawbacks are known:
1. Thicker thickness;
2. Higher manufacturing costs.
爰此，為解決上述習知技術之缺點，本發明之主要目的，係提供一種減少電容式觸控單元整體厚度的電容式觸控單元。
本發明之另一目的，係提供一種可大幅降低製造成本的電容式觸控單元。
為達上述目的本發明係提供一種電容式觸控單元，係包含：一透明基板、一高分子透明基板、一第二導電層、一膠體層；
所述透明基板具有一第一側及一第二側，該第二側披附至少一第一導電層；所述高分子透明基板具有一第三側及一第四側，所述第三側與前述第一導電層對應貼合；所述第二導電層係選擇設於前述高分子透明基板之第三、四側其中任一；所述膠體層設於前述透明基板及該高分子透明基板之間。
透過本發明之電容式觸控單元，不僅可大幅減少電容式觸控單元之整體厚度外，更可降低電容式觸控單元之製造成本者。
Therefore, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a capacitive touch unit that reduces the overall thickness of the capacitive touch unit.
Another object of the present invention is to provide a capacitive touch unit that can greatly reduce manufacturing costs.
The present invention provides a capacitive touch unit comprising: a transparent substrate, a polymer transparent substrate, a second conductive layer, and a colloid layer;
The transparent substrate has a first side and a second side, the second side is covered with at least one first conductive layer; the polymer transparent substrate has a third side and a fourth side, the third side And the second conductive layer is selected to be disposed on any one of the third and fourth sides of the polymer transparent substrate; the colloid layer is disposed on the transparent substrate and the polymer transparent substrate between.
The capacitive touch unit of the present invention can not only greatly reduce the overall thickness of the capacitive touch unit, but also reduce the manufacturing cost of the capacitive touch unit.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
請參閱第1、2圖所示，係為本發明電容式觸控單元第一實施例之立體圖及剖視圖，如圖所示，所述電容式觸控單元1，係包含：一透明基板11、一高分子透明基板12、一第二導電層13、一膠體層14；
所述透明基板11具有一第一側111及一第二側112，該第二側112披附至少一第一導電層1121。
所述高分子透明基板12具有一第三側121及一第四側122，所述第三側121與前述第一導電層1121對應貼合。
所述第二導電層13係選擇設於前述高分子透明基板12之第三、四側121、122其中任一；本實施例係設於該第三側121。
所述膠體層14設於前述透明基板11及該高分子透明基板12之間。
所述透明基板11係為一玻璃基板及一高分子透明基板其中任一，本實施例係以玻璃基板作為說明實施例，但並不引以為限。
所述高分子透明基板12係選擇為聚乙烯對苯二甲酸酯、聚碳酸酯、聚乙烯、聚氯乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯及環烯烴共聚物其中任一材質，本實施例係以聚乙烯對苯二甲酸酯（Polyethylene Terephthalate，PET）基板做為說明，但並不引以為限。
所述膠體層14選擇為光學膠脂及光學膠其中任一。
請參閱第3圖係為本發明電容式觸控單元第二實施例之剖視圖，如圖所示，本實施例係與前述第一實施例部分結構相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為，所述第二導電層13係設於前述高分子透明基板12之第四側122。
請參閱第4圖係為本發明電容式觸控單元第三實施例之剖視圖，如圖所示，本實施例係與前述第一實施例部分結構相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述電容式觸控單元1更具有一遮蔽物2，所述遮蔽物2係設於該透明基板11與該第一導電層1121之間，並靠近該透明基板11之側邊。
請參閱第5圖係為本發明電容式觸控單元第四實施例之剖視圖，如圖所示，本實施例係與前述第一實施例部分結構相同，故在此將不再贅述，惟本實施例之所述電容式觸控單元1，係包含：一透明基板11、一高分子透明基板12、一觸控區3、一非觸控區4、一遮蔽物2、一第一導電層1121、一第二導電層13、一膠體層14、一第一導線層15、一第二導線層16、一軟性基板17；
所述透明基板11具有一第一側111及一第二側112，該高分子透明基板12具有一第三側121及一第四側122；並該透明基板11與該高分子透明基板12相互對應，並該觸控區3設置於前述透明基板11及該高分子透明基板12中央處，該非觸控區4對應設置於前述觸控區3周側。
所述遮蔽物2設於前述第二側112之非觸控區4，所述第一導電層1121披覆於該第二側112之觸控區3，並部分延伸至該第二側112之非觸控區4，所述第一導線層15設於該遮蔽物2相反該第二側112之一側與前述第一導電層1121比鄰；所述第二導電層13係設於前述高分子透明基板12之第三側121的觸控區3，並部分延伸至該非觸控區4，該第二導線層16設於該高分子透明基板12之第三側121，與前述第二導電層13比鄰；該軟性基板17設於該非觸控區4，該軟性基板17兩側分別具有一第一導電膠171及一第二導電膠172，並透過該第一、二導電膠171、172分別與該第一、二導線層15、16電性連接，所述膠體層14設於前述透明基板11及該高分子透明基板12之間。
請參閱第6圖係為本發明電容式觸控單元第五實施例之剖視圖，如圖所示，所述電容式觸控單元1，係包含：一透明基板11、一高分子透明基板12、一觸控區3、一非觸控區4、一遮蔽物2、一第一導電層1121、一第二導電層13、一膠體層14、一第一導線層15、一第二導線層16、一軟性基板17，本實施例係與前述第四實施例部分結構相同，故在此將不再贅述，惟本實施例與前述第四實施例之不同處係為所述第二導電層13係設於前述高分子透明基板12之第四側122的觸控區3，並部分延伸至該非觸控區4，所述第二導線層16設於該高分子透明基板12之第四側122，與前述第二導電層13比鄰。
請參閱第7圖係為本發明電容式觸控單元第六實施例之剖視圖，如圖所示，本實施例係與前述第五實施例部分結構相同，故在此將不再贅述，惟本實施例與前述第五實施例之不同處係為更具有一保護層5，所述保護層5係分別覆蓋前述軟性基板17之一端及該第二導電層13一側，以及該第二導線層16一側。
前述第一~六實施例中之第一、二導電層1121、13係為一透明導電層，該透明導電層係為以塗佈凝膠、電鍍、蒸鍍或濺鍍其中任一之方式所形成之薄膜結構，並該薄膜結構係為銦錫氧化物(ITO)、銦鋅氧化物(IZO)及氧化銻錫氧化物(ATO)其中任一。
透過本發明之電容式觸控單元1之結構設計，可改良傳統習知觸控面板無法薄型化之設置，再者，更可大幅降低製造成本者。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
The first embodiment of the capacitive touch unit of the present invention is a perspective view and a cross-sectional view of the first embodiment of the present invention. As shown in the figure, the capacitive touch unit 1 includes a transparent substrate 11 . a polymer transparent substrate 12, a second conductive layer 13, a colloid layer 14;
The transparent substrate 11 has a first side 111 and a second side 112. The second side 112 is covered with at least one first conductive layer 1121.
The polymer transparent substrate 12 has a third side 121 and a fourth side 122. The third side 121 is correspondingly bonded to the first conductive layer 1121.
The second conductive layer 13 is selected from any one of the third and fourth sides 121 and 122 of the polymer transparent substrate 12; the embodiment is disposed on the third side 121.
The colloid layer 14 is disposed between the transparent substrate 11 and the polymer transparent substrate 12 .
The transparent substrate 11 is a glass substrate and a polymer transparent substrate. The present embodiment uses a glass substrate as an illustrative embodiment, but is not limited thereto.
The polymer transparent substrate 12 is selected from the group consisting of polyethylene terephthalate, polycarbonate, polyethylene, polyvinyl chloride, polypropylene, polystyrene, polymethyl methacrylate and cyclic olefin copolymer. A material, this embodiment is based on a polyethylene terephthalate ( PET ) substrate, but is not limited.
The colloid layer 14 is selected to be either an optical glue or an optical glue.
FIG. 3 is a cross-sectional view showing a second embodiment of the capacitive touch unit of the present invention. As shown in the figure, the embodiment is identical to the first embodiment, and therefore will not be described herein. The difference between the embodiment and the first embodiment is that the second conductive layer 13 is disposed on the fourth side 122 of the polymer transparent substrate 12.
FIG. 4 is a cross-sectional view showing a third embodiment of the capacitive touch unit of the present invention. As shown in the figure, the embodiment is identical to the first embodiment, and therefore will not be described herein. The difference between the embodiment and the first embodiment is that the capacitive touch unit 1 further has a shield 2, and the shield 2 is disposed between the transparent substrate 11 and the first conductive layer 1121. And close to the side of the transparent substrate 11.
FIG. 5 is a cross-sectional view showing a fourth embodiment of the capacitive touch unit of the present invention. As shown in the figure, the embodiment is identical to the first embodiment, and therefore will not be described herein. The capacitive touch unit 1 of the embodiment includes a transparent substrate 11, a polymer transparent substrate 12, a touch area 3, a non-touch area 4, a mask 2, and a first conductive layer. a second conductive layer 13, a colloid layer 14, a first wiring layer 15, a second wiring layer 16, a flexible substrate 17;
The transparent substrate 11 has a first side 111 and a second side 112. The polymer transparent substrate 12 has a third side 121 and a fourth side 122. The transparent substrate 11 and the polymer transparent substrate 12 are mutually Correspondingly, the touch area 3 is disposed at the center of the transparent substrate 11 and the polymer transparent substrate 12, and the non-touch area 4 is correspondingly disposed on the circumferential side of the touch area 3.
The mask 2 is disposed on the non-touch area 4 of the second side 112. The first conductive layer 1121 is disposed on the touch area 3 of the second side 112 and extends to the second side 112. In the non-touch area 4, the first conductive layer 15 is disposed on the side of the second side 112 opposite to the first conductive layer 1121; the second conductive layer 13 is disposed on the polymer The touch area 3 of the third side 121 of the transparent substrate 12 extends partially to the non-touch area 4, and the second wire layer 16 is disposed on the third side 121 of the polymer transparent substrate 12 and the second conductive layer. The first substrate and the second conductive paste 171 are respectively disposed on the two sides of the flexible substrate 17 and are respectively permeable to the first and second conductive adhesives 171 and 172 respectively. The first and second conductive layers 15 and 16 are electrically connected to each other, and the colloid layer 14 is disposed between the transparent substrate 11 and the polymer transparent substrate 12 .
FIG. 6 is a cross-sectional view showing a fifth embodiment of the capacitive touch unit of the present invention. As shown, the capacitive touch unit 1 includes a transparent substrate 11 and a polymer transparent substrate 12 . a touch area 3, a non-touch area 4, a shield 2, a first conductive layer 1121, a second conductive layer 13, a colloid layer 14, a first conductive layer 15, and a second conductive layer 16. A flexible substrate 17 is the same as that of the foregoing fourth embodiment, and therefore will not be described herein again. However, the difference between the present embodiment and the foregoing fourth embodiment is the second conductive layer 13. The touch area 3 is disposed on the fourth side 122 of the polymer transparent substrate 12 and extends to the non-touch area 4, and the second wire layer 16 is disposed on the fourth side 122 of the polymer transparent substrate 12. And adjacent to the foregoing second conductive layer 13.
FIG. 7 is a cross-sectional view showing a sixth embodiment of the capacitive touch unit of the present invention. As shown in the figure, the embodiment is identical to the foregoing fifth embodiment, and therefore will not be described herein again. The difference between the embodiment and the foregoing fifth embodiment is that there is a protective layer 5 covering one end of the flexible substrate 17 and the side of the second conductive layer 13 respectively, and the second conductive layer 16 side.
The first and second conductive layers 1121 and 13 in the first to sixth embodiments are a transparent conductive layer, which is coated, electroplated, vapor-deposited or sputtered. The film structure is formed, and the film structure is any one of indium tin oxide (ITO), indium zinc oxide (IZO), and antimony tin oxide (ATO).
Through the structural design of the capacitive touch unit 1 of the present invention, it is possible to improve the conventional thinning of the conventional touch panel, and further reduce the manufacturing cost.
1．．．電容式觸控單元1. . . Capacitive touch unit
11．．．透明基板11. . . Transparent substrate
111．．．第一側111. . . First side
112．．．第二側112. . . Second side
1121．．．第一導電層1121. . . First conductive layer
12．．．高分子透明基板12. . . Polymer transparent substrate
121．．．第三側121. . . Third side
122．．．第四側122. . . Fourth side
13．．．第二導電層13. . . Second conductive layer
14．．．膠體層14. . . Colloid layer
15．．．第一導線層15. . . First wire layer
16．．．第二導線層16. . . Second wire layer
17．．．軟性基板17. . . Flexible substrate
171．．．第一導電膠171. . . First conductive adhesive
172．．．第二導電膠172. . . Second conductive adhesive
2．．．遮蔽物2. . . Shield
3．．．觸控區3. . . Touch area
4．．．非觸控區4. . . Non-touch area
5．．．保護層5. . . The protective layer
第1圖係為本發明電容式觸控單元第一實施例之立體圖；
第2圖係為本發明電容式觸控單元第一實施例之剖視圖；
第3圖係為本發明電容式觸控單元第二實施例之剖視圖；
第4圖係為本發明電容式觸控單元第三實施例之剖視圖；
第5圖係為本發明電容式觸控單元第四實施例之剖視圖；
第6圖係為本發明電容式觸控單元第五實施例之剖視圖；
第7圖係為本發明電容式觸控單元第六實施例之剖視圖。
1 is a perspective view of a first embodiment of a capacitive touch unit of the present invention;
2 is a cross-sectional view showing a first embodiment of the capacitive touch unit of the present invention;
3 is a cross-sectional view showing a second embodiment of the capacitive touch unit of the present invention;
4 is a cross-sectional view showing a third embodiment of the capacitive touch unit of the present invention;
Figure 5 is a cross-sectional view showing a fourth embodiment of the capacitive touch unit of the present invention;
Figure 6 is a cross-sectional view showing a fifth embodiment of the capacitive touch unit of the present invention;
Figure 7 is a cross-sectional view showing a sixth embodiment of the capacitive touch unit of the present invention.
1．．．電容式觸控單元1. . . Capacitive touch unit
11．．．透明基板11. . . Transparent substrate
111．．．第一側111. . . First side
112．．．第二側112. . . Second side
1121．．．第一導電層1121. . . First conductive layer
12．．．高分子透明基板12. . . Polymer transparent substrate
121．．．第三側121. . . Third side
122．．．第四側122. . . Fourth side
13．．．第二導電層13. . . Second conductive layer
14．．．膠體層14. . . Colloid layer
Claims (17)
一透明基板，具有一第一側及一第二側，該第二側披附至少一第一導電層；
一高分子透明基板，具有一第三側及一第四側，所述第三側與前述第一導電層對應貼合；
一第二導電層，係選擇設於前述高分子透明基板之第三、四側其中任一；
一膠體層，設於前述透明基板及該高分子透明基板之間。A capacitive touch unit includes:
a transparent substrate having a first side and a second side, the second side being covered with at least one first conductive layer;
a polymer transparent substrate having a third side and a fourth side, wherein the third side is correspondingly bonded to the first conductive layer;
a second conductive layer is selected from any one of the third and fourth sides of the polymer transparent substrate;
A colloid layer is disposed between the transparent substrate and the polymer transparent substrate.
一透明基板，具有一第一側及一第二側；
一高分子透明基板，具有一第三側及一第四側；
一觸控區，設置於前述透明基板及該高分子透明基板中央處；
一非觸控區，對應設置於前述觸控區周側；
一遮蔽物，設於前述第二側之非觸控區；
一第一導電層，披覆於該第二側之觸控區，並部分延伸至該第二側之非觸控區；
一第二導電層，係設於前述高分子透明基板之第三側的觸控區，並部分延伸至該非觸控區；
一第一導線層，設於該遮蔽物相反該第二側之一側；
一第二導線層，設於該高分子透明基板之第三側，與前述第二導電層比鄰；
一軟性基板，設於該非觸控區，該軟性基板兩側分別具有一第一導電膠及一第二導電膠，並透過該第一、二導電膠分別與該第一、二導線層電性連接；
一膠體層，設於前述透明基板及該高分子透明基板之間。A capacitive touch unit includes:
a transparent substrate having a first side and a second side;
a polymer transparent substrate having a third side and a fourth side;
a touch area disposed at a center of the transparent substrate and the polymer transparent substrate;
a non-touch area corresponding to the peripheral side of the touch area;
a mask disposed on the non-touch area of the second side;
a first conductive layer is disposed on the touch area of the second side and partially extends to the non-touch area of the second side;
a second conductive layer is disposed on the touch area of the third side of the polymer transparent substrate, and partially extends to the non-touch area;
a first wire layer disposed on one side of the shielding opposite the second side;
a second wire layer disposed on the third side of the polymer transparent substrate adjacent to the second conductive layer;
A flexible substrate is disposed on the non-touch area, and each of the two sides of the flexible substrate has a first conductive paste and a second conductive paste, and the first and second conductive layers are respectively electrically connected to the first and second conductive layers. connection;
A colloid layer is disposed between the transparent substrate and the polymer transparent substrate.
一透明基板，具有一第一側及一第二側；
一高分子透明基板，具有一第三側及一第四側；
一觸控區，設置於前述透明基板及該高分子透明基板中央處；
一非觸控區，對應設置於前述觸控區周側；
一遮蔽物，設於前述第二側之非觸控區；
一第一導電層，披覆於該第二側之觸控區，並部分延伸至該第二側之非觸控區；
一第二導電層，係設於前述高分子透明基板之第四側的觸控區，並部分延伸至該非觸控區；
一第一導線層，設於該遮蔽物相反該第二側之一側；
一第二導線層，設於該高分子透明基板之第四側，與前述第二導電層比鄰；
一軟性基板，設於該非觸控區，該軟性基板兩側分別具有一第一導電膠及一第二導電膠，並透過該第一、二導電膠分別與該第一、二導線層電性連接；
一膠體層，設於前述透明基板及該高分子透明基板之間。A capacitive touch unit includes:
a transparent substrate having a first side and a second side;
a polymer transparent substrate having a third side and a fourth side;
a touch area disposed at a center of the transparent substrate and the polymer transparent substrate;
a non-touch area corresponding to the peripheral side of the touch area;
a mask disposed on the non-touch area of the second side;
a first conductive layer is disposed on the touch area of the second side and partially extends to the non-touch area of the second side;
a second conductive layer is disposed on the touch area of the fourth side of the polymer transparent substrate, and partially extends to the non-touch area;
a first wire layer disposed on one side of the shielding opposite the second side;
a second wire layer disposed on the fourth side of the polymer transparent substrate adjacent to the second conductive layer;
A flexible substrate is disposed on the non-touch area, and each of the two sides of the flexible substrate has a first conductive paste and a second conductive paste, and the first and second conductive layers are respectively electrically connected to the first and second conductive layers. connection;
A colloid layer is disposed between the transparent substrate and the polymer transparent substrate.
The capacitive touch unit of claim 12, further comprising a protective layer covering one end of the flexible substrate and one side of the second conductive layer, and the second conductive layer side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150825A TW201333796A (en) | 2012-02-15 | 2012-12-28 | Capacitive touch unit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101104831 | 2012-02-15 | ||
| TW101150825A TW201333796A (en) | 2012-02-15 | 2012-12-28 | Capacitive touch unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201333796A true TW201333796A (en) | 2013-08-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150825A TW201333796A (en) | 2012-02-15 | 2012-12-28 | Capacitive touch unit |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20130209808A1 (en) |
| TW (1) | TW201333796A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130264183A1 (en) * | 2012-04-10 | 2013-10-10 | Chih-Chung Lin | Capacitive touch unit |
| US20140008199A1 (en) * | 2012-07-06 | 2014-01-09 | Chih-Chung Lin | Capacitive touch panel structure |
| US8987625B2 (en) * | 2012-07-06 | 2015-03-24 | Chih-Chung Lin | Capacitive touch panel structure |
| DE202014101407U1 (en) * | 2014-03-26 | 2015-06-29 | Rehau Ag + Co | Profile and electrical circuit arrangement with at least one such profile |
| CN104441872A (en) * | 2014-12-22 | 2015-03-25 | 常熟市赛蒂镶嵌玻璃制品有限公司 | Light-weight organic glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989160A (en) * | 2009-08-07 | 2011-03-23 | 铼宝科技股份有限公司 | Capacitive touch panel |
-
2012
- 2012-04-10 US US13/442,869 patent/US20130209808A1/en not_active Abandoned
- 2012-12-28 TW TW101150825A patent/TW201333796A/en unknown
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| US20130209808A1 (en) | 2013-08-15 |
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