TW201301968A - Substrate structure and manufacturing method thereof - Google Patents

Abstract

A manufacturing method of a substrate structure including the following steps is provided. A transparent substrate having a surface is provided. A patterned ink layer is formed on the surface of the transparent substrate by performing a screen printing process. The patterned ink layer is located on a portion of the surface of the transparent substrate. A heat-resistant temperature of the patterned ink layer is between 250 DEG C and 450 DEG C. An optical density of the patterned ink layer is greater than or equal to 3.5.

Description

Substrate structure and manufacturing method thereof

The invention relates to a substrate structure and a manufacturing method thereof, and in particular to a substrate structure with better reliability and a manufacturing method thereof.

A method of forming a black frame on a transparent substrate was preceded by a spin coating method. First, an ink coating is applied to the transparent substrate, wherein the ink coating covers the transparent substrate in a comprehensive manner. Then, through a medium-low temperature pre-baking method, a part of the solvent in the ink coating is volatilized, and then a patterning ink coating is formed through the film exposure and lyophilization development, which is a black frame ( Intentional ink for the nameplate). The patterned ink coating is located on a partially transparent substrate or a region around the surface of the transparent substrate, and the patterned ink coating has a high shielding rate and an opaque property.

Since it is conventional to firstly cover the ink coating on a transparent substrate in a comprehensive manner, a part of the ink coating is removed by exposure and emulsification to form an optimal patterned ink coating. However, the manufacturing process of the black frame (meaning the ink for the nameplate) is complicated, and the consumption cost of the ink material used is relatively high. Moreover, since the surface hardness of the ink coating used in the prior art is insufficient, and the ink coating cannot withstand the high temperature process of 200 ° C or higher, the applicability of the subsequent products is limited.

The present invention provides a substrate structure having the advantages of improving conventional defects and improving the reliability and applicability of the product.

The invention provides a method for fabricating a substrate structure for fabricating the above substrate structure.

The invention provides a method for fabricating a substrate structure, which comprises the following steps. A transparent substrate is provided wherein the transparent substrate has a surface. A screen printing step is performed to form a patterned ink coating on the surface of the transparent substrate. The patterned ink coating is on a portion of the surface of the transparent substrate, and the patterned ink coating has a thermal temperature between 250 ° C and 450 ° C and the patterned ink coating has an optical density greater than or equal to 3.5.

In one embodiment of the invention, the patterned ink coating has a pencil hardness specification greater than 6H.

In one embodiment of the invention, the patterned ink coating has a thickness between about 3 microns and 20 microns.

In an embodiment of the invention, the color of the patterned ink coating comprises black, white, red, gray, green, blue or yellow.

In an embodiment of the invention, the edge of the patterned ink coating and the surface of the transparent substrate have an ink angle, and the ink angle is between 7 and 45 degrees.

In an embodiment of the invention, after forming the patterned ink coating layer, a transparent metal conductive coating is formed on the transparent substrate, wherein the transparent metal conductive coating covers the surface of the transparent substrate simultaneously Patterned ink coating. Next, a photoresist layer is formed on the transparent metal conductive coating, and then an image exposure and alkali emulsification development step is performed on the photoresist layer to form a patterned photoresist layer. The patterned photoresist layer is an etch mask to etch a transparent metal conductive coating outside the patterned photoresist layer to form a patterned transparent metal conductive coating. Thereafter, the patterned photoresist layer is removed to expose the patterned transparent metal conductive coating.

In another embodiment of the present invention, after forming the patterned ink coating layer, a transparent metal conductive coating is formed on the transparent substrate, wherein the transparent metal conductive coating simultaneously covers the surface of the transparent substrate and is patterned. On the ink coating. Next, a patterned etching paste is printed on the transparent metal conductive coating, and a baking step is successively performed to accelerate the reaction of the patterned etching paste coating and the transparent metal conductive coating, and remove the patterned etching paste. A transparent metallic conductive coating on the bottom of the coating. Thereafter, the patterned etching paste layer is an acid etching mask to remove the transparent metal conductive coating in the pattern etching paste coating to form a patterned transparent metal conductive coating. Finally, a cleaning step is performed and the patterned etch paste coating is removed to expose the patterned transparent metal conductive coating.

The present invention also provides a substrate structure comprising a transparent substrate and a patterned ink coating. The transparent substrate has a surface. The patterned ink coating is disposed on a transparent substrate and is located on a portion of the surface. The patterned ink coating has a heat resistant temperature between 250 ° C and 450 ° C and the patterned ink coating has an optical density greater than 3.5.

In one embodiment of the invention, the patterned ink coating has a pencil hardness specification greater than 6H.

In one embodiment of the invention, the patterned ink coating has a thickness between 3 microns and 20 microns.

In an embodiment of the invention, the color of the patterned ink coating comprises black, white, red, gray, green, blue or yellow.

In an embodiment of the invention, the edge of the patterned ink coating has an ink angle with the surface of the transparent substrate, and the ink angle is between 7 and 45 degrees.

In an embodiment of the invention, the substrate structure further includes a patterned transparent metal conductive coating disposed on a surface of the transparent substrate.

Based on the above, since the substrate structure of the present invention is formed by screen printing, a patterned ink coating is formed on any transparent substrate, which is compared with the conventional method of spin coating, exposure and development. In order to form a patterned ink coating, the manufacturing method of the substrate structure of the present invention and the manufacturing process thereof are relatively simple, and the manufacturing cost is also low. Furthermore, since the patterned ink coating of the present invention can withstand a heat resistant temperature of between 250 ° C and 450 ° C, and the patterned ink coating has a high light source masking ratio, its optical density is greater than 3.5. Therefore, the value-added operation of the subsequent substrate structure can be increased, for example, forming a substrate structure with a touch function, and the process yield and product reliability can be improved.

The above described features and advantages of the present invention will be more apparent from the following description.

1A to 1H are schematic views showing a method of fabricating a substrate structure according to an embodiment of the present invention. It should be noted that, for convenience of description, FIG. 1A and FIG. 1B are respectively a schematic plan view of the transparent substrate 110 and the substrate structure 100a, and FIGS. 1C to 1H illustrate the substrate structure 100a and the substrate structure. A schematic cross-sectional view of the fabrication steps of 100b. Referring to FIG. 1A , in accordance with the method for fabricating the substrate structure 100 a of the present embodiment, first, a transparent substrate 110 is provided, wherein the transparent substrate 110 has a surface 112 . In the embodiment, the transparent substrate 110 is, for example, a plastic substrate, a glass substrate or a flexible substrate. Herein, the present invention does not impose any limitation on the material of the transparent substrate 110.

Next, referring to FIG. 1B and FIG. 1C, a screen printing step is performed to form a patterned ink coating layer 120 on the surface 112 of the transparent substrate 110, wherein the patterned ink coating layer 120 is located on the transparent substrate 110. The periphery of the surface 112. In particular, the patterned ink coating 120 can withstand a heat resistant temperature between 250 ° C and 450 ° C, and the patterned ink coating 120 has an optical density greater than 3.5. Further, the edge of the patterned ink coating 120 and the surface 112 of the transparent substrate 110 have an angle θ, and the included angle θ is, for example, between 7 and 45 degrees. Moreover, the pencil hardness specification of the patterned ink coating 120 of the present embodiment is greater than 6H, and the thickness T of the patterned ink coating 120 is, for example, between 3 micrometers and 20 micrometers.

It is worth mentioning that the color of the patterned ink coating 120 of the present embodiment may be black or white. For example, when the color of the patterned ink coating layer 120 is black, the patterned ink coating layer 120 may include a plurality of carbon black particles (not shown) and a plurality of titanium dioxide powder particles (not shown). The carbon black particles have a particle diameter of about 0.02 to 0.08 μm, and the titanium dioxide powder particles have a particle diameter of about 0.3 to 0.7 μm. Different levels of black patterned ink coating 120 are formed by coating these different sized particles with a resin coating. In addition, when the color of the patterned ink coating layer 120 is white, the patterned ink coating layer 120 may include a plurality of light blue powder particles (not shown) and a plurality of titanium dioxide powder particles (not shown) via The resin coating composition, through these differently sized particle distributions, constitutes varying degrees of white patterned ink coating 120. So far, the fabrication of the substrate structure 100a has been substantially completed.

Structurally, referring again to FIG. 1C , the substrate structure 100 a includes a transparent substrate 110 and a patterned ink coating 120 , wherein the patterned ink coating 120 is disposed on the surface 112 of the transparent substrate 110 and located on the transparent substrate 110 . A portion or surrounding area of surface 112. In particular, the patterned ink coating 120 can withstand a heat resistant temperature of between 250 ° C and 450 ° C, and the patterned ink coating 120 has an optical density greater than 3.5, which means that the optical density of the patterned ink coating 120 is Greater than or equal to 3.5.

Since the substrate structure 100a of the present embodiment is formed by screen printing, the patterned ink coating layer 120 is formed on the transparent substrate 110, which is formed by spin coating, exposure and development. In the case of the patterned ink coating, the manufacturing method of the substrate structure 100a of the present embodiment has a simple manufacturing process and a relatively low manufacturing cost. Moreover, since the patterned ink coating 120 can withstand a heat resistant temperature of between 250 ° C and 450 ° C, and the patterned ink coating 120 has an optical density greater than 3.5. Therefore, the patterned ink coating 120 has a high temperature process resistance requirement and an excellent light shielding effect, and can improve the applicability of the substrate structure 100a. In addition, since the patterned ink coating 120 has a pencil hardness specification greater than 6H, it has a certain degree of scratch and abrasion resistance of the ink surface.

The application of the plurality of substrate structures 100b, 100c extending based on the characteristics of the patterned ink coating 120 will be described in detail below.

Referring to FIG. 1D, after the patterned ink coating 120 is formed, a transparent metal conductive coating 130a is formed on the transparent substrate 110 by, for example, high temperature metal vacuum sputtering, wherein the transparent metal conductive coating 130a is simultaneously covered. Above the surface 112 of the transparent substrate 110, over the patterned ink coating 120. Since the ink edge of the patterned ink coating 120 and the surface 112 of the transparent substrate 110 have an included angle θ of, for example, between 7 and 45 degrees. Therefore, the transparent metal conductive coating 130a and the transparent substrate 110 and the patterned ink coating 120 may have better ink continuity and adhesion, and the transparent metal conductive coating 130a may be conformally and uniform. The cover is over the transparent substrate 110 and over the patterned ink coating 120.

Next, referring to FIG. 1E, a photoresist layer 140a is formed on the transparent metal conductive coating 130a, wherein the photoresist layer 140a can be conformally and uniformly covered on the transparent metal conductive coating 130a. And, a low temperature baking step is performed to volatilize a part of the solvent to cure the photoresist layer 140a. then. Referring to FIG. 1F, an image exposure and alkali emulsification development step is performed on the photoresist layer 140a to form a patterned photoresist layer 140. Then, referring to FIG. 1G, the patterned photoresist layer 140 is an etch-resistant mask to etch away the transparent metal conductive coating 130a outside the patterned photoresist layer 140 to form a patterned transparent metal. Conductive coating 130. Finally, referring to FIG. 1H, the patterned photoresist layer 140 is removed with an alkali solution to expose the patterned transparent metal conductive coating 130. Thus, the fabrication of the substrate structure 100b is completed.

Structurally, the substrate structure 100b includes a transparent substrate 110, a patterned ink coating 120, and a patterned transparent metal conductive coating 130, wherein the patterned ink coating 120 is disposed on the surface 112 of the transparent substrate 110 and located A portion or surrounding area of the surface 112 of the transparent substrate 110. In particular, the patterned ink coating 120 can withstand a heat resistant temperature between 250 ° C and 450 ° C, and the patterned ink coating 120 has an optical density greater than 3.5. In addition, the patterned transparent metal conductive coating 130 is disposed on the transparent substrate 110, wherein the patterned transparent metal conductive coating 130 can be covered or not covered by the patterned ink coating 120 according to the use requirements of the product. Here, FIG. 1H illustrates that the patterned transparent metal conductive coating 130 does not cover the patterned ink coating 120, but is not limited thereto.

Since the ink edge of the patterned ink coating 120 and the surface 112 of the transparent substrate 110 have an angle θ, the transparent metal conductive coating 130a and the photoresist layer 140 are subsequently formed on the transparent substrate 110 and the patterned ink coating 120. In the upper case, it has better ink continuity and adhesion, thereby improving the process yield. In addition, since the heat resistant temperature of the patterned ink coating 120 is between 250 ° C and 450 ° C, and the optical density of the patterned ink coating 120 is greater than 3.5, that is, the patterned ink coating 120 has a high temperature resistant process. With excellent shading effect. Thus, the patterned ink coating 120 can still maintain its material properties during subsequent baking, exposure, and development, or can improve the reliability of the substrate structure 100b. Moreover, the patterned transparent metal conductive coating 130 formed on the transparent substrate 110 can enable the substrate structure 100b to function as a touch. The substrate of the embodiment is similar to the conventional structure in which the patterned transparent metal electrocoat layer is formed on another substrate and then attached to the light-transmitting substrate to form a substrate structure having a touch function. Structure 100b can have a relatively thin structural thickness.

In other embodiments, other methods may be used to form the substrate structure 100b with the touch function. For example, FIG. 2A to FIG. 2C are schematic cross-sectional views showing a partial step of a method for fabricating a substrate structure according to another embodiment of the present invention. Referring to FIG. 2C, the structure of the substrate structure 100c of FIG. 2C is similar to that of the substrate structure 100b of FIG. 1H, except that the patterned transparent metal conductive coating 130' of the substrate structure 100c of FIG. 2C is It is overlaid over the patterned ink coating 120.

In the process, the substrate structure 100c of FIG. 2C can be fabricated in substantially the same manner as the substrate structure 100b of the previous embodiment, and is transparent after the step of FIG. 1D, that is, through a special high-temperature metal sputtering process. After the conductive conductive coating 130a is on the transparent substrate 110, please refer to FIG. 2A, and a screen 150 is disposed above the transparent metal conductive coating 130a. Then, referring to FIG. 2B, the etch paste coating 160 is applied to the transparent metal conductive coating 130a by screen printing or by printing a patterned stencil. Also, a moderate temperature baking step is performed to accelerate the reaction of the patterned etch paste coating 160 with the transparent metal conductive coating 130a. Finally, please refer to FIG. 2C to enable the patterned etch paste coating 160 to remove the transparent metal conductive coating 130a at its bottom. The patterned etch paste layer is an acid etch mask and the transparent metal conductive coating 130a within the patterned etch paste coating 160 is removed to form a patterned transparent metal conductive coating 130'. Next, a cleaning step, such as rinsing with a large amount of water, and removing the patterned etch paste coating 160, exposes the patterned transparent metal conductive coating 130'. Thus, the fabrication of the substrate structure 100c is completed.

In summary, since the substrate structure of the present invention is fabricated by screen printing, and a patterned ink coating is formed on the transparent substrate, compared with the conventional method of spin coating, exposure and development. In order to form a patterned ink coating, the manufacturing method of the substrate structure of the present invention and the manufacturing process thereof are relatively simple, and the manufacturing cost is also low. Furthermore, since the patterned ink coating of the present invention can withstand a heat resistant temperature of between 250 ° C and 450 ° C and the optical density of the patterned ink coating is greater than 3.5, the application of the subsequent substrate structure can be increased, for example It is formed into a substrate structure with touch function, and can improve process yield and product reliability.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100a, 100b, 100c. . . Substrate structure

110. . . Transparent substrate

112. . . surface

120. . . Patterned ink coating

130, 130’. . . Patterned transparent metal conductive coating

130a. . . Transparent metal conductive coating

140. . . Photoresist layer

140a. . . Patterned photoresist layer

150. . . Web version

160. . . Patterned etch paste coating

T. . . thickness

θ. . . Ink angle

1A to 1H are schematic views showing a method of fabricating a substrate structure according to an embodiment of the present invention.

2A-2C are cross-sectional views showing a partial step of a method of fabricating a substrate structure according to another embodiment of the present invention.

100a. . . Substrate structure

110. . . Transparent substrate

112. . . surface

120. . . Patterned ink coating

T. . . thickness

θ. . . Ink angle

Claims (13)

A method of fabricating a substrate structure, comprising: providing a transparent substrate having a surface; and performing a screen printing step to form a patterned ink coating on a surface of the transparent substrate, wherein The patterned ink coating is located on a portion of the surface, and the patterned ink coating has a heat resistant temperature between 250 ° C and 450 ° C, and the patterned ink coating has an optical density greater than or equal to 3.5. The method for fabricating a substrate structure according to claim 1, wherein the patterned ink coating has a pencil hardness specification greater than 6H. The method of fabricating a substrate structure according to claim 1, wherein the patterned ink coating has a thickness of between 3 micrometers and 20 micrometers. The method of fabricating a substrate structure according to claim 1, wherein the color of the patterned ink coating comprises black, white, red, gray, green, blue or yellow. The method for fabricating a substrate structure according to claim 1, wherein an edge of the patterned ink coating has an ink angle between the edge of the transparent substrate and the ink is between 7 and 45 degrees. Between degrees. The method for fabricating a substrate structure according to claim 1, further comprising: after forming the patterned ink coating, forming a transparent metal conductive coating on the transparent substrate, wherein the transparent metal conductive coating Covering the surface of the transparent substrate with the patterned ink coating; forming a photoresist layer on the transparent metal conductive coating; performing an image exposure and alkali emulsification development step on the photoresist layer, Forming a patterned photoresist layer; the patterned photoresist layer is an etch mask to etch the transparent metal conductive coating outside the patterned photoresist layer to form a patterned transparent metal conductive coating And removing the patterned photoresist layer to expose the patterned transparent metal conductive coating. The method for fabricating a substrate structure according to claim 1, further comprising: after forming the patterned ink coating, forming a transparent metal conductive coating on the transparent substrate, wherein the transparent metal conductive coating Covering the surface of the transparent substrate with the patterned ink coating; printing a patterned etching paste on the transparent metal conductive coating; performing a baking step to accelerate the patterned etching paste Reacting the layer with the transparent metal conductive coating and removing the transparent metal conductive coating at the bottom of the patterned etch paste coating; removing the pattern by using the patterned etch paste coating as an acid etch mask Etching the transparent metal conductive coating within the paste coating to form a patterned transparent metal conductive coating; and performing a cleaning step and removing the patterned etch paste coating to expose the patterned transparent metal conductive coating. A substrate structure comprising: a transparent substrate having a surface; and a patterned ink coating disposed on the transparent substrate and located on a portion of the surface, wherein the patterned ink coating has a heat resistant temperature The optical density of the patterned ink coating is greater than or equal to 3.5 between 250 ° C and 450 ° C. The substrate structure of claim 8, wherein the patterned ink coating has a pencil hardness specification greater than 6H. The substrate structure of claim 8, wherein the patterned ink coating has a thickness of between 3 microns and 20 microns. The substrate structure of claim 8, wherein the color of the patterned ink coating comprises black, white, red, gray, green, blue or yellow. The substrate structure of claim 8, wherein an edge of the patterned ink coating has an ink angle between the edge of the transparent substrate and the ink is between 7 and 45 degrees. . The substrate structure of claim 8 further comprising a patterned transparent metal conductive coating disposed on the surface of the transparent substrate.