200933350 九、發明說明： 【發明所屬之技術領域】 種 本發明是有關於一種冷卻系統，且特別是有關於 電腦的冷卻系統。 【先前技術】 隨著電腦科技的快速發展，處理器的運算效能 快。相對的，處理器周邊的控制晶片，例如，緣圖晶片、 北橋晶片、南橋⑸’也賴加快速度並提高效能用以搭 配曰益快速的處理器。 眾所週知’控制晶片或者處理器的速度越快，產生的 熱能就會越多。而#控彻片或者處理n的溫度太高時， 會使％•控制晶片或者處理器的效率大幅下降或者當機。因 ❹ 此為了要維持處理器或者控制晶片的效能，這些控制晶 片或者處理n所產生的熱能就必須要快速的傳遞至控制晶 片或者處理ϋ之外 因此，運用於電腦的冷卻系統就應運 而生。 期’主機板的製造商可在處理11或者控制晶片上 i y、政熱片並在電腦的機殼上加裝散熱風扇。因此， 處理器或者控制晶片所產生的熱能經由金屬散教片傳遞至 空氣中’並經由機殼上的散熱風扇將= 乂工氣傳遞至電腦的機殼外部。或者，主機板的製造 200933350 商直接在金聽Μ上杨裝散熱_ 者控制W職生的缝傳遞至金屬 ==扇傳遞至機殼_空氣；==: =散風^機殼㈣較熱的空氣傳遞至電腦的機殼外 ^然而，狀馬齡時本身也會產生減減嗓音， 因此，並不受專業人士的青睞。 射要將處理器或者控制⑼操作於極速，也就是最 已财許多廠赫水冷式的冷卻纽於電腦 2機板h她於散朗達’水冷柄冷卻祕的噪音 乂-而搭配水冷摘冷H統可錢得魏祕更穩定 以及更快速地運作。 請參照第-圖，其_示為習知主機板上的水冷式冷 部系統。主機板1G上的控制晶#上加裝有_200933350 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a cooling system, and more particularly to a computer cooling system. [Prior Art] With the rapid development of computer technology, the computing power of the processor is fast. In contrast, control wafers around the processor, such as edge-mapped wafers, north-bridge wafers, and southbridges (5)', are also speeding up and improving performance for fast processor gains. It is well known that the faster the control chip or processor is, the more thermal energy will be generated. When the temperature of the control chip or the processing n is too high, the efficiency of the % control chip or the processor is greatly reduced or crashed. Therefore, in order to maintain the performance of the processor or control the wafer, the heat generated by these control wafers or processes must be transferred to the control wafer or processed, so that the cooling system applied to the computer is born. . The manufacturer of the motherboard can install the cooling fan on the processing 11 or the control chip, and on the computer case. Therefore, the heat generated by the processor or the control chip is transferred to the air via the metal-propagating sheet and transmitted to the outside of the casing of the computer via the cooling fan on the casing. Or, the manufacture of the motherboard 200933350 directly on the Jin listening 杨 Yang installed heat _ _ control the W student's seam transfer to the metal == fan to the chassis _ air; ==: = diffuse ^ chassis (four) hotter The air is transmitted to the outside of the computer's casing. However, the age of the horse itself will also reduce the noise, so it is not favored by professionals. The shot should be operated by the processor or control (9) at the top speed, that is, the most expensive of the factory, the water-cooled cooling is added to the computer 2 board, and she is in the water-cooled handle cooling secret 乂- H can make money more stable and faster. Please refer to the figure - shown as a water-cooled cold system on the conventional motherboard. Installed on the control board # on the motherboard 1G_
2〇,例如冷卻槽（C00lingtank)，用以傳遞控制晶片3〇所 產生的熱能。再者，該熱交換裝置2G具有-進人管22與 二輸出管24分合至冷卻f %、34，#低溫的冷卻流 體由該進人管22注人軸交婦置2㈣，低溫的冷卻流 體即可與控制晶片30傳遞至熱交換裝置2〇的熱能進行執 交換使得冷卻龍的溫度升高而㈣W 30的溫度下' 降。再者’高溫的冷卻流體經由該輸出管24離開該冷卻 槽。其中，該冷卻流體可為水、液態氣氣等冷卻液。7 然而，由於習知水冷式冷卻系統的熱交換裝置位於主 機板之内，因此，當冷卻管與熱交換裝置沒有完全的套合 或者冷卻管老⑽’冷卻流體可能由進人管或者輪出管^ 200933350 露出來並且造成主機板上線路的短路，更嚴重時也可能造 成主機板損毁。 此外，當水冷式冷卻系統的冷卻管需要進行更換時， 使用者必須打開電腦的機殼並進行更換冷卻管的動作。此 動作除了造成使用者不便之外也是造成冷卻流體滲露並造 成主機板上線路的短路的另一個原因。 【發明内容】2〇, for example, a cooling bath (C00lingtank) for transferring the heat energy generated by the control wafer. Furthermore, the heat exchange device 2G has a inlet pipe 22 and a two outlet pipe 24 that are coupled to the cooling fins %, 34, and a low temperature cooling fluid is injected into the human tube 22 by the inlet pipe 22 (4), and is cooled at a low temperature. The fluid can be exchanged with the thermal energy transferred from the control wafer 30 to the heat exchange device 2 such that the temperature of the chilled fin rises and (4) drops at the temperature of W30. Further, the high temperature cooling fluid exits the cooling tank via the output pipe 24. The cooling fluid may be a cooling liquid such as water or liquid gas. 7 However, since the heat exchange device of the conventional water-cooled cooling system is located inside the main board, when the cooling pipe and the heat exchange device are not completely fitted or the cooling pipe is old (10), the cooling fluid may be taken in or out of the tube. Tube ^ 200933350 is exposed and causes a short circuit on the motherboard board. In more serious cases, the motherboard may be damaged. In addition, when the cooling pipe of the water-cooled cooling system needs to be replaced, the user must open the casing of the computer and perform the action of replacing the cooling pipe. In addition to causing inconvenience to the user, this action is another cause of leakage of the cooling fluid and short circuit of the board on the motherboard. [Summary of the Invention]
、本發明的目的係提出一種主機板上的冷卻系統，使得 冷郃流體由進入管或者輸出管滲露出來時不會損害主機 板。 因此，本㈣提出-㈣腦的冷m用於冷卻該 電腦的-主機板上的多數個控制晶片所產生的熱能。電腦 =冷卻^統包括-熱交換裝置、—冷卻流體以及二冷卻 官。熱交換裝置接收控制晶片所產生的餘，且熱交換裝 f具有凸出於該域板外的—進人管與―輸出管。二冷卻 管士別套合至進人管與輸出f，使冷卻流體由進入管^入 熱交換裝置，冷卻碰再由細管賴絲交換裝置。 ^ 了使貴審查委員能更進一步瞭解本發明特徵及技 術内谷’請參閱以下有關本發明之詳細說明與附圖，铁而 所附圖式僅提供參考與說明，並非絲對本發明加以限制。 【實施方式】 7 200933350 本發明主要的特徵在於設計熱交換裝置的進入管與輪 =管凸出於主機板外，也就是說，進入管與輸出管與冷卻 &的套合點位於主機板外使得滲露出來的冷卻流體不會造 成主機板上線路的短路。 、、請參照第二圖’其所繪示為本發明主機板上的水冷式 冷郃系統。於主機板100上，該冷卻系統包括一熱交換裝 置110 ’例如冷卻槽（c〇〇Hngtank)，該熱交換裝置11〇與 金屬散熱片132、134、136、138之間可利用金屬熱管13〇 相互連接，或者熱交換裝置11〇與金屬散熱片134、136 連接後，然後再透過金屬熱管13〇使得金屬散熱片132與 ^屬散熱片134連接，以及再透過金屬熱管13〇使得金屬 散熱片136與金屬散熱片138連接。而金屬散熱片132、 134、136、138即可與控制晶片（位於金屬散熱片下方） 貼合，使得控制晶片產生的熱能能夠傳遞至金屬散熱片 U2' 134、136、138，其中，控制晶片一般為中央處理器 (cpu)或一晶片組，當然也可包括一顯示（VGA)卡或 一記憶體等任魅生熱能之树或晶#。#冷卻系統在運 作時，熱交換裝置110上的溫度相對地較低，而金屬散熱 ^ 132、134、136、138上的溫度相對地較高，因此，熱能 就傳遞至熱父換裝置110進行熱交換來達到冷卻效果。而 該熱交換裝置110具有一進入管112與一輸出管114分別 套合至二冷卻管14G、142。所以’當控制晶片在運作時， 其所產生的熱能可以經由金屬散熱片132、134、136、138、 8 200933350 金屬熱管i3〇、熱交換襞置no之冷卻流體而快速地傳遞 至電腦之外。 當主機板100與電腦的機殼組裝完成時’熱交換裝置 110的進入管112與輪出管n4可凸出於電腦的機殼之外。 此外本發明更k供二固定夾（clamper) 14〇、142用以提 供冷卻管與熱交換裴置更緊密的套合。此外，亦可針對位 於主機板上的熱交換裝置11〇，亦可設計一隔離板（圖未 繪不）與控制晶片隔開，用以避免熱交換裝置11〇損壞漏 水之情形，其隔離板一般使用金屬設計，可直接接收金屬 熱管130或金屬散熱片134等所傳送過來之熱能。 請參照第三圖，其所繪示為本發明主機板外的水冷式 冷部系統。當主機板與電腦機殼2⑻完成組裝之後，熱交 換裝置的進入管與輸出管更凸出於該電腦機殼200之外。 於主機板之外，該冷卻系統更包括一加壓幫浦170與一散 熱裝置180 ’該加壓f浦17〇、該散熱裝置18〇、與該熱交 換裂置110之間可利用冷卻管15〇、I52、I54與該加壓幫 浦口〇、該散齡置180、與該熱交換裝置m套合進而達 f彼此連接的冷卻迴路。也就是說，冷卻管中充滿著冷卻 流，’而_加壓㈣17〇可以使得低溫的冷卻流體由進 ▲入管注人該熱賴裝置UG，並使得高溫的冷卻流體經由 该輪出管離開該熱交換裝置11G到達散熱裝置⑽。再者， = 裝置18G可將两溫的冷卻流體進行散熱後使得高溫的 机體變成低溫的冷卻紐後再:欠注八該熱交換裝置 達成該冷卻迴路。因此，當低溫的冷卻流體由進入管 9 200933350 =熱，置110時，低溫的冷卻 =遞至料_齡妨熱賴， 體 管離開該熱交換裝置心其中 =輪出 態氮氣等冷卻液。 τ料.财為水、液 凸出施例’熱交換裝置的進人管與輸出管 或者冷卻管老化時，由進 =套口SUMMARY OF THE INVENTION The object of the present invention is to provide a cooling system on a main board such that the cold heading fluid is exposed from the inlet or outlet tube without damaging the main board. Therefore, this (4) proposes - (iv) the coldness of the brain to cool the thermal energy generated by the majority of the control wafers on the computer's motherboard. Computer = Cooling system includes - heat exchange unit, - cooling fluid and two cooling officers. The heat exchange device receives the remainder generated by the control wafer, and the heat exchange device f has a tube and an output tube protruding from the outside of the domain plate. The second cooling pipe is not fitted to the inlet pipe and the output f, so that the cooling fluid is taken into the heat exchange device by the inlet pipe, and the cooling pipe is then passed by the thin pipe. The detailed description of the present invention and the accompanying drawings are to be understood by reference to the accompanying drawings. [Embodiment] 7 200933350 The main feature of the present invention is that the inlet pipe and the wheel of the heat exchange device are designed to protrude from the main plate, that is, the connection point between the inlet pipe and the outlet pipe and the cooling & Externally, the exposed cooling fluid does not cause a short circuit on the board on the motherboard. Please refer to the second figure' which shows the water-cooled cold heading system on the motherboard of the present invention. On the motherboard 100, the cooling system includes a heat exchange device 110' such as a cooling tank (c〇〇Hngtank), and the metal heat pipe 13 can be utilized between the heat exchange device 11 and the metal fins 132, 134, 136, and 138. The 〇 is connected to each other, or the heat exchange device 11 连接 is connected to the metal fins 134 and 136, and then through the metal heat pipe 13 〇 to connect the metal heat sink 132 to the heat sink 134, and then through the metal heat pipe 13 〇 to dissipate the metal Sheet 136 is coupled to metal fins 138. The metal heat sinks 132, 134, 136, 138 can be bonded to the control wafer (below the metal heat sink), so that the thermal energy generated by the control wafer can be transferred to the metal heat sink U2' 134, 136, 138, wherein the control wafer Generally, it is a central processing unit (CPU) or a chipset. Of course, it can also include a display (VGA) card or a memory such as a tree or crystal. # When the cooling system is in operation, the temperature on the heat exchange device 110 is relatively low, and the temperature on the metal heat sinks 132, 134, 136, 138 is relatively high, so the heat energy is transferred to the hot parent changing device 110. Heat exchange to achieve a cooling effect. The heat exchange device 110 has an inlet pipe 112 and an outlet pipe 114 respectively fitted to the two cooling pipes 14G, 142. So 'when the control wafer is in operation, the heat energy generated by it can be quickly transferred to the computer via the metal fins 132, 134, 136, 138, 8 200933350 metal heat pipe i3〇, heat exchange device no cooling fluid. . When the assembly of the motherboard 100 and the casing of the computer is completed, the inlet pipe 112 and the wheel-out pipe n4 of the heat exchange device 110 may protrude beyond the casing of the computer. In addition, the present invention provides a second clamper 14 142, 142 for providing a tighter fit of the cooling tube to the heat exchange device. In addition, it is also possible to design a spacer (not shown) to be separated from the control wafer for the heat exchange device 11 located on the motherboard, in order to avoid damage to the heat exchange device 11 and the water leakage. Generally, the metal design is used to directly receive the heat energy transmitted by the metal heat pipe 130 or the metal heat sink 134. Please refer to the third figure, which is a water-cooled chiller system outside the motherboard of the present invention. After the motherboard is assembled with the computer casing 2 (8), the inlet and outlet pipes of the heat exchange device protrude beyond the computer casing 200. In addition to the motherboard, the cooling system further includes a pressurizing pump 170 and a heat sink 180', the heat sink 18, the heat sink 18, and the heat exchange crack 110 15〇, I52, I54 and the pressurized pump port, the age is set to 180, and the heat exchange device m is engaged to form a cooling circuit in which f is connected to each other. That is to say, the cooling pipe is filled with the cooling flow, and 'the pressure_four (17) 17〇 can cause the low-temperature cooling fluid to be injected into the heat-receiving device UG from the inlet pipe, and the high-temperature cooling fluid leaves the cooling fluid through the wheel-out pipe. The heat exchange device 11G reaches the heat sink (10). Furthermore, the device 18G can dissipate the two-temperature cooling fluid to cause the high-temperature body to become a low-temperature cooling button, and then the heat exchange device reaches the cooling circuit. Therefore, when the low temperature cooling fluid is taken into the tube 9 200933350 = heat, set to 110, the low temperature cooling = the feed to the age of the heat, the body tube leaves the heat exchange device, where = the nitrogen is cooled by the wheel. τ料. The money is water, liquid, the application of the heat exchanger, the inlet pipe and the output pipe, or the cooling pipe, when aging, by the inlet
流體並不會直接流至主機姑2，出&滲4出來的冷卻 毁的情形發生。 線路短路或者主機板損 與輸出管凸出於主機機殼外，當冷卻流體 渗路出來時，朗者可以辑察覺並作緊急_理。再者， 田使2者欲更新冷卻管時’使用者打開電腦的機殼即 可以直接進行更換冷卻管的動作。 、综上所述’雜本發明已以較佳實施例揭露如上，然 =非：以限定本發明’任何熟習此技藝者，在不脫離本 發月之精神和範_ ’當可作各種更動與潤飾，因此本發 明之保護範圍當視_之中請專利範圍所界定者為準。 【圖式簡單說明】 .本案得藉由下顯式及詳細說明，俾得—更深入之了 解. 第一圖所料為習知主機板上的水冷式冷卻系統。 200933350 第二圖所繪示為本發明主機板上的水冷式冷卻系統。 第三圖所繪示為本發明主機板外的水冷式冷卻系統。 【主要元件符號說明】 本案圖式中所包含之各元件列示如下： 10主機板 20熱交換裝置 22進入管 24輸出管The fluid does not flow directly to the host 2, and the cooling out of the & Short circuit or main board damage and the output tube protrude from the main unit casing. When the cooling fluid seeps out, the Langer can detect and make an emergency. Furthermore, when the two people want to renew the cooling pipe, the user can directly change the cooling pipe by opening the casing of the computer. In view of the above, the invention has been disclosed in the above preferred embodiments. However, the invention is not limited to the spirit of the present invention, and can be used in various ways. Retouching, therefore, the scope of protection of the present invention is subject to the definition of patent scope. [Simple description of the diagram] This case has to be explained in more detail by the following explicit and detailed description. The first picture is expected to be a water-cooled cooling system on a conventional motherboard. 200933350 The second figure shows the water-cooled cooling system on the motherboard of the present invention. The third figure shows the water-cooled cooling system outside the motherboard of the present invention. [Description of main component symbols] The components included in the diagram of this case are listed as follows: 10 motherboard 20 heat exchange device 22 inlet pipe 24 output pipe
30控制晶片 32、34冷卻管 100主機板 110熱交換裝置 112進入管 114輸出管 130金屬熱管 132、134、136、138 金屬散熱片 140、142固定夾 150、152、154冷卻管 170加壓幫浦 180散熱裝置 200電腦機殼30 control wafer 32, 34 cooling tube 100 main board 110 heat exchange device 112 into tube 114 output tube 130 metal heat pipe 132, 134, 136, 138 metal heat sink 140, 142 fixing clip 150, 152, 154 cooling tube 170 pressure help浦180 heat sink 200 computer case
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