200810621 九、發明說明: 本發明係由Reis等人於2005年11月4臼提出申請之 美國第1 1 /267,93 3號專利申請案「散熱電路總成」之部分 連續案,兩案同處審理中;該連續案之詳細內容以參考方 式倂於本案中。 【發明所屬之技術領域】 本發明槪括地關於由異向性石墨平面材料所製成之 熱分散器,且尤指包括熱通道以利將熱傳遞穿過熱分散器 之厚度的該類熱分散器。 【先前技術】 石墨熱分散器先前已被提出來用以從若干的分散熱 源處而將熱移走。分散器之表面被安置成與離散熱源相 抵,且熱從其處移至分散器中。然後,熱被傳導通過分散 器,並從分散器之兩表面處藉由傳導或輻射而被消散至較 冷之諸相鄰表面處,或藉由對流而被消散至空氣中。具有 高平面內熱傳導率之厚石墨分散器具有大截面面積,以便 可傳導熱並可比一由相同材料製成之薄分散器移去更多 熱。然而,具有高平面內熱傳導率之石墨材料具有相對較 低之厚度貫穿熱傳導率。此低厚度貫穿熱傳導率妨礙貫穿 石墨厚度之流動,且使經由分散器之熱傳遞無法達到最 大。 此問題可藉由將熱通道埋置在位於熱源位置處之石 墨分散器中而被克服。熱通道係由一等向性材料所製成, 而此等向性材料之熱傳導率則係較高於石墨之厚度貫穿 200810621 熱傳導率。候選之通道材料包括:金、銀、銅、鋁等及其 各種合金。熱通道典型地係爲圓形,且大小被設定成使其 直徑大到足以大致覆蓋住熱源之整個表面。通道之端部接 觸熱源’且熱流入通道內並穿過其中。熱經由通道之外徑 而被傳遞至石墨內。通道有效地經由石墨之厚度傳遞熱, 並可利用石墨分散器之全厚度以使熱傳遞達到最大。一個 有關在石墨熱分散器中使用通道之先前技藝範例被揭示 於經頒予Krassowski等人且被讓與給本發明之受讓人的 美國第6,7 5 8,263號專利中,而該美國專利之詳細內容被 以參考方式倂於本案中。 由局平面內熱傳導率石墨所製成且倂入一熱通道之 厚石墨熱分散器爲一比相對等之全石墨、全銅或全鋁製熱 分散器更有效率之熱分散器,且其通常係比全銅或全鋁製 熱分散器更輕。 在一特別應用中,使用熱分散器與印刷電路板相結 合。印刷電路板傳統上係由諸如玻璃纖維層板(熟知爲 FR4板)、聚四氟乙烯、及類似材料等之介電質材料所製 成。在此類板之諸表面中之一者上,或在諸介電質材料層 之間的係爲通常由銅所構成之電路。此等電路一般係藉由 光微影法、濺鍍、網版印刷、或其他類似之方法而被形成 (就被配置在諸層間之電路而論,在層板形成之前需先將 電路鋪設於介電質材料上)。此外,諸如LED、處理器或 其他類似物等之組件可被配置在該板之表面上,並與此表 面上之電路相接觸。此諸組件可能產生大量之熱,其必須 -6-200810621 IX. INSTRUCTIONS: The present invention is a contiguous case of the "heat dissipation circuit assembly" of the US Patent Application No. 1 /267,93 3 filed by Reis et al. The trial is in the process; the details of the consecutive case are referred to in this case by reference. TECHNICAL FIELD OF THE INVENTION The present invention is generally directed to a heat spreader made of an anisotropic graphite planar material, and more particularly to such a heat dispersion comprising a heat tunnel to facilitate heat transfer through the thickness of the heat spreader. Device. [Prior Art] Graphite heat spreaders have previously been proposed to remove heat from a number of dispersed heat sources. The surface of the disperser is placed against a discrete heat source and heat is moved therefrom into the disperser. Heat is then conducted through the disperser and dissipated from the two surfaces of the disperser by conduction or radiation to the cooler adjacent surfaces or dissipated into the air by convection. Thick graphite dispersers with high in-plane thermal conductivity have large cross-sectional areas to allow heat to be transferred and remove more heat than a thin disperser made of the same material. However, graphite materials having a high in-plane thermal conductivity have a relatively low thickness throughout thermal conductivity. This low thickness throughout the thermal conductivity impedes the flow through the graphite thickness and does not maximize heat transfer through the disperser. This problem can be overcome by embedding the hot aisle in a graphite disperser located at the location of the heat source. The thermal pathway is made of an isotropic material, and the thermal conductivity of the isotropic material is higher than the thickness of graphite throughout 200810621. The candidate channel materials include: gold, silver, copper, aluminum, etc. and various alloys thereof. The hot aisle is typically circular and sized to have a diameter large enough to substantially cover the entire surface of the heat source. The end of the channel contacts the heat source' and heat flows into and through the channel. Heat is transferred into the graphite via the outer diameter of the channel. The channels effectively transfer heat through the thickness of the graphite and can utilize the full thickness of the graphite disperser to maximize heat transfer. A prior art example of the use of a channel in a graphite heat dissipator is disclosed in U.S. Patent No. 6,7,8,263, issued to the assignee of The details of the U.S. patents are incorporated herein by reference. A thick graphite heat disperser made of thermal conductivity graphite in a planar plane and breaking into a hot aisle is a more efficient heat disperser than a relative graphite, all copper or all aluminum heat disperser, and It is usually lighter than a full copper or all-aluminum heat spreader. In a particular application, a heat spreader is used in conjunction with a printed circuit board. Printed circuit boards have traditionally been fabricated from dielectric materials such as fiberglass laminates (known as FR4 panels), polytetrafluoroethylene, and the like. On one of the surfaces of such a board, or between layers of dielectric material, is a circuit typically composed of copper. These circuits are typically formed by photolithography, sputtering, screen printing, or the like (as far as the circuitry is placed between the layers, the circuitry must be laid before the laminate is formed) On the dielectric material). In addition, components such as LEDs, processors or the like can be disposed on the surface of the board and in contact with circuitry on the surface. These components may generate a lot of heat, which must be -6-
200810621 被消散以使諸組件能可靠地運作, 平° 由於這些熱產生組件,印刷電 的量可能很大。所謂之”熱板”被 合金等之熱分散材料層與介電質相 電路及熱產生組件之表面相對向之 便作爲一用於分散由諸電子組件 器。重要的是熱分散器必須被定位 料層可將熱分散器與(諸)電路分 料通常係可導電的,而如果其相接 運作。 市面上存在許多可購得之”絜 金屬芯印刷電路板(MCPCB ) ,Μ 之 Insulated Metal SubstrateTM 熱板 之T-CladTM熱板、來自Denka公司 來自 TT Electronics 之 Anotherm TN 導熱性之介電質層,例如前三種熱 塡充以複數個導熱顆粒,或者例贫 位在鋁熱分散器層頂部上的薄陽種 粒之使用可能很昂貴,且後續之層 保其無針孔,此卻增加了設計上之 制因素在於其缺乏製造彎曲或非4 介電質材料覆蓋熱分散器層之整仿 理層作爲介電質層可克服上述之涛 並達到其預期之性能水 路板必須協助消散之熱 形成於諸如銅或鋁及其 ‘料相層疊之處,並在與 .表面上或諸層板中,以 =所產生之熱的熱分散 成使得至少一介電質材 開,因爲諸熱分散器材 觸,則將妨礙諸電路之 ί板”,其有時被稱作爲 ί如來自 Bergquist公司 、來自 Thermagon公司 之HITT Plate板、以及 [板。這些熱板可利用具 板者可透過將介電質層 1 Anotherm板者可透過 〖處理層。然而,導熱顆 板必須夠厚,以便可確 熱阻。此方法之額外限 =面電路結構之彈性,及 ί表面的事實。將陽極處 Ϊ些問題,但因爲銅無法 -7- 200810621 被陽極處理,故只能強制使用鋁以作爲其熱分散器層。由 於鋁的熱傳導率顯著小於銅的熱傳導率,故此可能成爲一 項熱缺失。然而,所有前述之方法均可能遭受焊接之困難 性,因爲在印刷電路板及諸組件運作期間係有益之相同散 熱性質會抑制需要點熱源以供焊接(例如,熱棒黏結)之 組裝程序。 爲克服上述之某些而非全部問題,傳統之印刷電路板 可在一分離之程序中與一分離之金屬熱分散器層相互結 合。在此一配置中,此印刷電路板可被設計成具有若干熱 通道(典型地係爲被鍍以銅之鑽製孔),以便可更佳地將 熱傳導通過印刷電路板之未經塡充的介電質層,但這些只 可被用於組件與組件間並不需電絕緣之場合中。 此外,傳統之熱分散材料(例如,銅或鋁)將會大幅 地增加板之重量,此係爲不樂見者,且這些材料之熱膨脹 係數(CTE )無法與玻璃纖維層板之熱膨脹係數緊密地相 匹配,而此在熱的作用下將導致在印刷電路板上產生物理 應力,且潛在地可能導致脫層或龜裂。 此外,因爲位於這些板上之熱分散器層係由一等向性 之薄(相對其長度及寬度)金屬材料所構成,故熱將可立 即流動穿過熱分散器之厚度,且所形成之熱點可出現在與 熱源直接相對置之位置上。 另一類在本業中被稱爲「軟性電路」之電路總成面臨 相似之熱管理問題。軟性電路係藉由在作爲介電質層之聚 合物材料(例如聚亞醯胺或聚酯)表面上提供一電路(例 200810621 如前述之銅電路)而被構成。如名稱所暗示的,這些電路 材料係軟性的且甚至能以電路材料捲之型式提供,其可在 後來與一如銅或銘之熱分散器層相結合。雖然非常薄,但 軟性電路中之介電質層仍顯著地增加了一給定設計之熱 阻,並面臨某些在印刷電路板中所觀察到的相同問題。通 道之使用仍被限制在如前述之電絕緣用途。而且顯然地, 硬性金屬層(例如銅或鋁)之使用將使得無法利用軟性電 路之柔軟性,而此一特性在終端應用上卻是很重要的^ 使用經壓縮之已剝離石墨顆粒的(諸)薄片所構成之 熱分散器將可補救許多在使用銅或鋁熱分散器時所遭遇 之缺失,此乃因爲此類石墨材料提供相較於銅可減少8 0 % 重量之優點,同時可相符或甚至超過銅在平面內方向上使 熱分散遍及印刷電路板之表面所需之熱傳導率。此外,石 墨具有實質爲零之平面內熱膨脹係數(CTE ),及較低於 銅成鋁之剛度,因此可減小在石墨-介電質黏結處之熱應 力。 雖然經壓縮之已剝離石墨顆粒的薄片甚至可具有能 與軟性電路配合使用之柔軟性,但是增加含石墨之熱分散 器層並無法克服所有之缺失,而此諸缺失係產生自熱分散 器之位置將使熱分散器與諸熱產生組件之間被一或多層 之介電質材料所隔開,而導致從諸組件至熱分散器層處之 熱傳遞降低。 疊層板諸層中之一或多層係由軟性石墨薄片所構成 爲在本藝中係習知的。這些結構例如可在襯墊製造中見到 -9- 200810621 其效用。參見頒予Howard之美國第4,961,991號專利。 Howard案揭示各種疊層結構,其包括若干被黏結在諸軟 性石墨薄片間之金屬或塑膠薄片。Howard案揭示該類結 構可藉由在金屬網之兩側上冷加工軟性石墨薄片並接著 將該石墨壓黏至該金屬網而被製備成。How.ard案亦揭示 將一被塗層以聚合物樹脂之布放置在兩軟性石墨薄片之 間,同時加熱至一足以軟化該聚合物樹脂之溫度,藉此將 該被塗層以聚合物樹脂之布黏結於該兩軟性石墨薄片 間,以製成一軟性石墨疊層板。同樣地,Hirschvogel之美 國第5,509,993號專利揭示軟性石墨/金屬疊層板,其係藉 由一種方兹而被製備成,而該方法之主要步驟係將表面活 性劑塗敷至諸欲被黏結之表面上。Mercuri之美國第 5,1 92,605號專利亦以被黏結至可爲金屬、玻璃纖維或碳 之芯材上之軟性石墨薄片構成疊層板。Mercuri案在將芯 材及軟性石墨進給通過輪壓機壓輥以形成疊層板之前,將 先沈積並接著固化位於芯材上之環氧樹脂的塗層及熱塑 劑之顆粒。 除了在襯墊材料上之效用外,石墨疊層板亦具有作爲 熱傳遞或冷卻裝置之效用。將各種實心結構作爲熱傳送體 在本藝中係爲習知的。例如Banks之美國第5,3 1 6,080及 5,224,030號專利揭示鑽石及氣體衍生石墨纖維之效用, 其等係由一適當之黏結劑所連結以作爲熱傳遞裝置。此類 裝置被用以被動地將熱從一熱源(例如一半導體)處傳導 至一散熱器。 -10- 200810621 在Krassowski及Chen之美國第6,758,263號專利中揭 示將一高導熱插件倂合入一散熱組件(例如石墨散熱基 底)內,以便可從該處以一平面方向將熱從一熱源處傳導 通過該組件之厚度。然而,Krassowski及Chen案之揭示 內容中並無敘述可將熱從一熱源處傳導通過複數層相對 而言係非傳導性之材料(諸如電路總成之介電質層)。 如前所指明的,較好用作爲本發明之熱分散器材料之 石墨材料係由經壓縮之已剝離石墨顆粒的薄片,其通常被 稱爲軟性石墨薄片材料。 以下係石墨及成形方式之簡要說明,其中該成形方式 通常被進行以構成軟性石墨薄片材料。在顯微規格上,石 墨係由碳原子六角陣列或網絡之層板平面所構成。這些呈 六角形配置之碳原子的層板平面係大致成平坦,並被定向 或排列成大致彼此平行且等距。此諸大致成平坦、平行且 等距之碳原子薄片或層(通常被稱爲石墨薄片層或基底平 面被連結或鍵結在一起,且其諸群被排列成微晶。高度 有序之石墨材料係由具有相當大尺寸之微晶所組成,而此 等微晶相對於彼此被高度地對準或定向,且具有若干相當 有序之碳層。換言之,高度有序之石墨具有一高度之優選 微晶定向。應注意的是,從定義上來說,石墨具有異向性 結構,且因此展現或具有許多高度方向性之特性,例如熱 與電傳導性及流體擴散性。 簡要地說,石墨之特徵在於碳之K層結構’亦即 '由 若干藉弱凡得瓦爾(van der Waal s )力而被連接在一起之 -11- 200810621 碳原子的疊置層或薄層所組成之結構。就該石墨結構而 論,通常會提及兩軸線或方向,即” C”軸線或方向 及” a ”軸線或方向。爲簡化起見,” C ”軸線或方向可被 認定爲垂直於諸碳層之方向。” a”軸線或方向可被認定 爲平行於諸碳層之方向,或垂直於” c ”方向之方向。適 用於製造軟性石墨板片之石墨具有一極高度之方向性。 如上所提及的,將諸平行碳原子層固定在一起之鍵結 力係只是弱凡得瓦爾力。天然石墨可經化學處理成使得諸 碳原子疊置層或薄層之間的間隔可被顯著敞開,以便可提 供一沿著垂直於諸層之方向(即沿著” c”方向)的顯著 膨脹,並因而形成一膨脹或腫大之石墨結構,其中諸碳層 之薄層特性大體上被保留。 已被化學或熱膨脹之石墨薄片,更具體而言已被膨脹 成可具有一最終厚度或” c”方向尺寸,其係大約爲原 始” c ”方向尺寸之8 0倍或更多倍大,則可在不使用黏結 劑下將石墨薄片成形爲黏合或整體之膨脹石墨板片,例如 網、紙、條、帶或其他類似者(通常被稱爲「軟性石墨」)。 由於在諸已大量膨脹之石墨顆粒間所達到之機械連結或 黏合,使得可在不使用任何黏結材料下,藉由壓縮而將石 墨顆粒成形爲整體之軟性板片,其中該等石墨顆粒已被膨 脹成可具有一最終厚度或” c”方向尺寸,其大約爲原 始” c”方向尺寸之80倍或更多倍大° 除了柔軟性之外,如上所提出之板片材料亦被發現在 熱及電傳導性及流體擴散性上具有高度之異向性’雖較不 -12- 200810621 如,但卻可比得上天然石墨起始材料,此乃因爲諸膨脹石 墨顆粒之方向大致平行於由非常高壓縮(例如輥壓加工處 理)所形成之板片的諸相對向面。因而所製成之板片材料 具有絕佳之柔軟性、良好之強度及非常高度之方向性。存 在一種對能更完全地利用這些性質之加工處理的需求。 簡要而言,用於製進軟性無黏結劑異向性石墨板片材 料(例如網、紙、條、帶、箔、墊、或其他類似物)包括 在一預定負載下且無黏結劑之情形下壓縮或緊實諸膨脹 • 石墨顆粒,其具有一大約爲諸原始顆粒之”C”方向尺寸之 80倍或更多倍大之”c”方向尺寸,以便可形成一大體上平 坦,軟性,且成一體之石墨板片。通常在外觀上呈蟲狀或 蠕蟲狀之諸膨脹石墨顆粒一旦被壓縮將維持壓縮變形,並 與板片之相對主要表面相對齊。板片之性質可藉由在壓縮 步驟前先予塗層及/或加入黏結劑及添加物而被改變。見 頒予Shane等人之美國第3,404,0 61號專利。板片材料之 密度及厚度可藉由控制壓縮程度而被改變。 • 較低密度在表面細節必需進行壓印或模製之處是有 利的,且較低密度有助於獲得良好之細節。然而,較密集 之板片通常具有較高之平面內強度及熱傳導率。典型地, 板片材料之密度將在從大約0.04g/cm3至大約1.9 g/cm3之 範圍內。 如上述般被製成之軟性石墨板片材料,由於與板片之 諸主要相對向平行表面相平行之諸石墨顆粒的對齊,而通 常展現一可觀程度之異向性,同時使得異方性之程度在輥 -13- 200810621 壓該板片材料以增加密度之後隨即增加。在經輥壓之異方 性板片材料中’厚度(亦即,垂直於諸相對向平行板片表 面)包括’’C”方向及諸沿著長度延伸之方向,而寬度(亦 即’沿著或平行於諸相對向主要表面)包括” a”方向,且 通常就大小而言,板片在” c”及” a”方向上之熱性質係非常 不同的。 【發明內容】 因此’本發明之目的在於提供石墨熱分散器中之通道 P 的改良結構。 本發明之另一目的在於提供用於製造具有熱通道之 石墨熱分散器之改良方法。 本發明之另一目的在於提供一種凸緣通道,其具有一 與石墨熱分散器之諸主要表面中之一者相啣合的凸緣,以 便可改善通道與石墨熱分散器之間的熱傳遞。 本發明之另一目的在於提供一種利用價廉之推置螺 帽來製造具有通道之熱分散器的低成本方法。 • 本發明之另一目的在於提供用於建構具有齊平式熱 通道之石墨熱分散器的結構及方法。 本發明之另一目的在於提供石墨熱分散器,其具有若 干熱通道及一層可提供有利於固定該熱分散器之結構完 整性的包覆層。 本發明之再另一目的在於提供可將熱通道與石墨熱 分散器一起鍛造之方法。 對熟習本藝之人士而言,在閱讀本揭示內容並配合參 -14- 200810621 照附圖之後’隨即可輕易且顯然了解本發明之其 之目的、特徵與優點。 【實施方式】 本發明提供用於製造具有熱通道之石墨熱: 較佳結構及方法。在一實施例中,凸緣通道被提 至少一凸緣’其與石墨熱分散器之石墨平面元件 平面表面中之一者相啣合。此一凸緣通道可被透 推置螺帽,或是透過使用一被剛性地連接至通道 第二凸緣,而被繫固於石墨分散器上。因此,此 包含至少一凸緣及一第二凸緣或一推置螺帽,其 至石墨熱元散器元件之表面上方。在另一實施例 一種齊平式熱通道,其在最終位置上係與石墨熱 件之諸主要平面表面相齊平。各種不同可用於製 施例之較佳技術將被提供。 兩實施例較佳地涉及一種製造方法,其中通 被壓入配合至一具相同形狀但略爲較小且貫穿 元件之孔內,以便可提供一在心柱與貫穿石墨平 孔間的緊密配合。 此類石墨熱分散器之一特別用途係其可與 路板之電路總成配合使用。當在熱產生組件(尤3 與熱分散器層之間的熱路徑(亦即熱通路)被提 路總成上之熱分散器層的熱分散功能被實質地改 正地,藉由此一熱路徑之使用,石墨基熱分散器 可提供改良之熱分散’甚至是可比得上使用鋁或 他及另外 分散器的 供成具有 的諸主要 過使用一 心柱上之 凸緣通道 全均伸出 中則提供 元散器元 造此兩實 道之心柱 石墨平面 面元件之 一印刷電 ί 是 LED) 供時,電 :善了。真 層之使用 銅製熱分 -15- 200810621 散器者,同時還具有減輕重量之優點。 「電路總成」用辭係指一包括一或多個被定位在介電 質材料上之電子電路的總成,且可包括疊層板,其中諸電 路中之一或多個被夾置於諸介電質層之間。電路總成之具 體範例係爲印刷電路板及軟性電路,如同熟習本項技術之 人士所熟知者。 在說明本發明改良現有材料之方法前,將先依序簡要 地說明石墨及其如何成形爲軟性板片,而此諸軟性板片將 會變爲用於構成本發明產品之主要熱分散器。 石墨係碳之微晶型式,其包括被共價地鍵結在諸平坦 疊層平面中之諸原子,且使諸平面之間成較弱之鍵結。藉 著用一例如硫酸及硝酸溶液之插層劑來處理石墨顆粒(諸 如天然石墨薄片),石墨之結晶體結構將會起作用而形成 一石墨與該插層劑之化合物。經處理之石墨顆粒在下文中 被稱之爲「已插層石墨顆粒」。在暴露至高溫之後,石墨 內之插層劑隨即分解並揮發,此導致諸已插層石墨顆粒之 尺寸可沿著” C”方向(亦即沿著垂直於石墨之諸結晶表 面的方向)以一類似手風琴之型式膨脹至其原始體積的 80倍或更多倍大。已剝離石墨顆粒在外觀上係呈蠕蟲狀, 而因此普遍地被稱爲蠕蟲。此諸蠕蟲可被一起壓縮成軟性 板片,其不像原始之石墨薄片,而是可被成形且切割成各 種不同形狀。 適用於本發明中之石墨起始材料包括高度石墨化含 碳材料,其可將有機與無機酸以及鹵素插入,然後當被暴 -16- 200810621 露在熱之下時會膨脹。這些高度石墨化含碳材料最佳地具 鶚 有約1 · 0之石墨化度。如同在本文中所使用的,「石墨化 ' 度」一詞係指根據下列公式所得之g値: =3.45 X d(Q02) g— ~ ~0.095 其中d(002)係在以埃(Angstrom)單位所量測之晶體 結構中之碳的諸石墨層間的間隔。介於諸石墨層間之間隔 係由標準X光繞射技術所測量。對應於(002)、(004)及(006) 米勒指標(Miller Indices )之諸繞射峰的位置被測得,且 標準之最小平方技術被用以導出間隔,其最小化所有這些 峰之總誤差。筒度石墨化含碳材料之範例包含自各種來源 處所取之天然石墨,以及其他含碳材料,諸如以化學汽相 沉積、聚合物之高溫熱解 '或結晶化及類似方法所製備之 石墨。天然石墨則係最佳的。 本發明中所使用之石墨起始材料可包含非石墨組 件,只要諸起始材料之晶體結構保持所要之石墨化度且其 可剝離便可。一般而言,任何含碳材料均適於配合本發明 使用,而此諸含碳材料之晶體結構均具有所要之石墨化度 且可剝離。此類石墨較佳地具有一至少約爲80%重量百分 比之純度。更佳地,被用於本發明之石墨具有一至少約爲 94%之純度。在最佳之實施例中,所使用之石墨將具有至 少約爲98%之純度。 一種用於製造石墨板片之普遍方法被敘述於Shane等 人之美國第3,404,061號專利中,其揭示內容以引用之方 式被倂於本文中。在Shane等人之方法的典型實施中,天 -17- 200810621 然石墨薄片藉由將諸薄片消散在一包括例如硝酸及硫酸 混合物之溶液中而被插層,而最有利地係在重量上以每 100份石墨薄片(pph )大約20至大約300份插層溶液之 標準。插層溶液包括氧化劑及本藝中所習知之其他插層 劑。範例包括那些包含:氧化劑及氧化混合物,諸如含硝 酸、氯酸鉀、鉻酸、高錳酸鉀、鉻酸鉀、重鉻酸鉀、過氯 酸及類似物之溶液;或混合物,諸如濃縮硝酸及氯酸鹽、 鉻酸及磷酸、硫酸及硝酸;或例如三氟醋酸之強有機酸的 混合物;及溶解在該有機酸中之強氧化劑。或者,電位可 被用以引起石墨之氧化。可利用電解氧化而被導入石墨晶 體中之化學物質包括硫酸及其他酸。 在一較佳實施例中,插層劑爲硫酸、或硫酸與磷酸、 及氧化劑之混合物的溶液,其中氧化劑亦即硝酸、過氯 酸、鉻酸、高錳酸紳、過氧化氫、碘酸、過碘酸、或其他 類似物。雖非較佳的,但插層溶液可包含:金屬鹵化物, 諸如氯化鐵、及與硫酸相混合之氯化鐵;或鹵化物,諸如 作爲溴與硫酸之溶液的溴、或在一有機溶劑中之溴。 插層溶液之量可在從大約20至大約35 Opph之範圍, 且更典型地係在大約40至大約160pph之範圍。在諸薄片 被插層後,任何過剩之溶液從諸薄片處被排出,且諸薄片 被水洗。或者,插層溶液之量可被限制在大約1 0至大約 40pph之間,其將使水洗步驟可如美國第4,895,7 1 3號專利 中所教示且建議地被消去,此美國專利所揭示內容亦以引 用之方式被倂於本文中。 -18- 200810621 以插層溶液處理之石墨薄片的顆粒可例如藉由混合 而與一還原有機劑接觸,該還原有機劑係選擇自醇類、糖 類、醛類及酯類,其在25 °C至125 °C之溫度範圍中可與 氧化插層溶液之表面薄膜反應。適宜之特定有機劑包括: 十六烷醇、十八碳醇、1-辛醇、2-辛醇、癸醇、U0癸二 醇、癸醒、1 -丙醇、1,3丙二醇、乙二醇、聚丙二醇、葡 萄糖、果糖、乳糖、蔗糖、馬鈴薯澱粉、乙二醇單硬脂酸 酯、二苯甲酸二乙二醇酯、丙二醇單硬脂酸酯、單硬脂酸 甘油酯、羧酸二甲酯、羧酸二乙酯、甲酸甲酯、甲酸乙酯、 抗壞血酸、以及由木質素衍生之化合物,諸如木質素磺酸 鈉。有機還原劑之量係適當地佔石墨薄片顆粒重量之大約 0.5 至 4%。 在插層之前、插層期間、或就在插層之後使用膨脹輔 助劑亦可提供改良。在這些改良中可爲降低之剝離溫度及 增大之膨脹體積(亦被稱爲「蠕蟲體積」)。在本文中之 膨脹輔助劑將最好係爲一種可充分溶解於插層溶液中以 便可達成膨脹改良之有機材料。更嚴密地說,可使用該類 包含碳、氫及氧(較佳係獨佔的)之有機材料。羧酸被發 現是特別有效的。一可用爲膨脹輔助劑之適當羧酸可被選 自芳香族、脂肪族或脂環族、直鏈或支鏈、飽和及不飽和 單羧酸、二羧酸及聚羧酸,其具有至少1個碳原子(較佳 係多達1 5個碳原子)’其能以一可有效針對一或多個剝 離態樣提供可預見改良之量而溶解於插層溶液中。適當之 有機溶劑可被用以改善插層溶液中之有機膨脹輔助劑的 -19- 200810621 溶解性。 ^ 飽和脂肪族羧酸之代表性範例係諸如具有化學式爲 、 H(CH2)nCOOH的那些酸類,其中η係一從〇至大約5之數 字,而此諸酸類包括:甲酸、乙酸、丙酸、丁酸、戊酸、 己酸、及其他類似者。亦可用酐或反應性羧酸衍生物(諸 如烷基酯)來代替羧酸。烷基酯的代表係甲酸甲酯及甲酸 乙酯。硫酸、硝酸及其他習知之水性插層劑均具有將甲酸 最終分解成水及二氧化碳之能力。因此,甲酸及其他敏感 φ 之膨脹輔助劑最好在石墨薄片浸沒入水性插層劑之前先 與石墨薄片相接觸。二羧酸之代表係具有2至12個碳原 子之脂肪族二羧酸,尤其是草酸、反丁烯二酸、丙二酸、 順丁烯二酸、琥珀酸、戊二酸、己二酸、1,5-戊烷二羧酸、 1,6-己烷二羧酸、1,10-癸烷二羧酸、環.已烷-1,4·二羧酸、 及芳香族二羧酸,諸如鄰苯二甲酸或對苯二甲酸。烷基酯 之代表係羧酸二甲酯及羧酸二乙酯。環脂族酸類之代表係 環已烷二羧酸,而芳香族羧酸之代表係安息香酸、萘酸、 # 鄰胺基苯甲酸、Ρ-對氨基苯甲酸、水楊酸、〇-,m-及ρ-甲苯 基酸、甲氧基及乙氧基安息香酸、乙醯基乙醯胺安息香及 乙醯胺安息香酸、苯乙酸及萘甲酸。羥基芳香族酸類之代 表係對羥基苯甲酸、3-羥基-1-萘酸、3-羥基-2-萘酸、4-羥基-2-萘酸、5-羥基-1-萘酸、5-羥基-2-萘酸、6-羥基-2· 萘酸、及7 -經基-2-萘酸。聚竣酸類中之重要者係檸檬酸。 插層溶液係水性的,且較佳地含有從1至10%之膨脹 輔助劑的量。此量將有效地增加剝離。在其中膨脹輔助劑 -20- 200810621 於浸沒入水性插層溶液中之前或之後與石墨薄 之實施例中,膨脹輔助劑可藉由適當裝置(例如 合機)而與石墨相混合,其通常係佔石墨薄片之 約0.2%至大約10%之量。 在插入石墨薄片後,且在將被塗以插層劑之 墨薄片與有機還原劑混合後,該混合物被暴露在 125 °C之溫度範圍中,以便可促進還原劑與插層 反應。加熱期間將可長達大約20小時,而在上 之較高溫度處則只需例如至少大約10分鐘之較 間。在諸較高之溫度處可使用半小時或更少之時 依次爲1 0至2 5分鐘。 被如此處理之石墨顆粒有時被稱爲「已插層 粒」。當暴露在高溫下(例如至少大約160°C, 約700°C至1000°C,及更高之溫度),已插層石 沿著” c”方向(亦即沿著垂直於諸構成石墨顆 平面的方向)以一類似手風琴之型式膨脹至其原 80至1 000倍或更多倍大。諸經膨脹(亦即經剝 墨顆粒在外觀上係呈蠕蟲狀,而因此普遍被稱爲 諸蠕蟲可被一起壓縮成軟性板片,其不像原始 片,而是可被成形且切割成各種不同形狀。 具有良好處理強度之軟性石墨板片及箔片 合的,且適於例如藉由輥壓而被壓縮至一大約在 至3.75mm間之厚度,及一在每立方公分上具有 公克(g/cm3 )之典型密度。如美國第5,902,762 片相接觸 ,V型混 重量的大 已插層石 :25°C 至 劑塗層之 述範圍內 短加熱時 間,例如 之石墨顆 特別是大 墨顆粒可 粒之微晶 始體積的 離)之石 蠕蟲。此 之石墨薄 係相互黏 :0.075mm 0·1 至 1.9 號專利中 -21- 200810621 所述(該案以引用之方式被倂合於本文中),佔重量之 1 · 5至3 0 %的陶瓷添加劑可與已插層石墨薄片相混合,以 便可在最終軟性石墨產品中提供增大之樹脂植入。此諸添 加劑包括陶瓷纖維顆粒,其具有一約爲0.丨5至i.5mm間 之長度。諸顆粒的寬度係適當地從〇· 〇4至〇.〇〇4mm。諸陶 瓷纖維顆粒對石墨係不起反應且不黏著的,並在溫度達到 約1100 °C,較佳約1400 °C或更高係穩定的。適當之陶瓷 纖維顆私係由浸軟石央玻璃纖維、碳及石墨纖維、氧化 • 鉻、氮化硼、碳化矽及氧化鎂纖維、天然生成礦物纖維, 諸如偏矽酸鈣纖維、矽酸鈣鋁纖維、氧化鋁纖維,及其他 類似物所構成。 上述用於插層及剝離石墨薄片之方法可藉由石墨薄 片在石墨化溫度處(亦即,在大約3000°C及以上之範圍 內之溫度)之預處理,以及藉由在插層劑中包含潤滑添加 劑而被有利地加強,此如第PCT/US02/39749號國際專利 申請案中所述,其揭示內容以引用之方式被倂於本文中。 • 當石墨薄片隨後經歷插層及剝離時,石墨薄片之預處 理或退火將導致顯著增加之膨脹(亦即,膨脹體積增加至 300%或更大)。確實地,與無退火步驟之相似處理方式相 比較,令人滿意地,在膨脹上之增加係至少大約50%。用 於退火步驟之溫度應不可顯著低於3000°C,此乃因爲連較 低100°C之溫度都會導致實質上減小之膨脹。 本發明之退火被進行一段足以導致薄片之時間,而此 薄片在進行插層及隨後之剝離之後隨即具有一增大之膨 -22- 200810621 脹度。通常所需時間係1小時或更多,較佳係1至3小時, 且最有利地係在惰性環境中進行。爲求最大利益結果,經 ' 退火之石墨等片將亦可經歷在本藝中係爲習知之其他可 增大膨脹度的方法,亦即插層法,其包含一有機還原劑、 一諸如有機酸之插層輔助劑、及在插層完成後之表面活性 劑沖洗。此外,爲求最大利益結果,插層步驟可被重複。 本發明之退火步驟可在一感應爐或其他此類設備中 被進行,如同在石墨化技藝中所熟知且明瞭的;至於此處 Φ 所用之溫度係在3000°C之範圍內,而此溫度應位於在石 墨化程序中所遭遇之溫度範圍中的上端溫度處。 因爲已觀察到諸利用已進行預插層退火處理之石墨 所製造之蠕蟲有時可能「成塊」在一起,其可能負面地影 響衝撃面釋重量均一性,故可協助成形「自由流動」之蠕 蟲的添加劑係高度必要的。將潤滑添加劑加入插層溶液中 有助於蠕蟲可更均勻地分布橫跨壓縮設備之機床(例如一 輪壓機工作站之機床),其傳統上被用於將石墨蠕蟲壓縮 • (輥壓)成軟性石墨板片。因此,最終所得之板片具有較 高之面積重均一性及較大之抗拉強度。潤滑添加劑較佳係 爲一長鍵碳氧化合物,更佳係具有至少大約1 0個碳之碳 氧化合物。即使存在其他之功能群,亦可使用其他具有長 鍵碳氧化合物群之有機化合物。 更佳地,潤滑添加劑係油,最佳係爲礦油,尤其是考 量到礦油較不易腐敗及發臭,對於需長期儲放者,此係爲 一項重要之考量。將可注意到的,已於上文中詳述之某些 -23- 200810621 膨脹輔助劑亦符合潤滑添加劑之定義。當這些材料被用作 膨脹輔助劑時’則並不需要在插層劑中包含一個別之潤滑 添加劑。 潤滑添加劑在插層劑中係以至少約1 ·4ρρ1ι之量存 在’較佳係至少約1 · 8pph。雖然包潤滑添加劑含量之上限 並不如下限般重要,但潤滑添加劑含量在較大於約4pph 之水平下似乎並沒有任何顯著之附加利益。 本發明之軟性石墨板片,如果必要,可利用再經硏磨 軟性石墨板片之顆粒而非剛膨脹完成之懦蟲,此如美國第 6,673,289號專利案中所述,其揭示內容以引用之方式被 倂於本文中。諸板片可爲剛新完成之板片材料、回收之板 片材料、廢棄之板片材料、或任何其地適當之來源。 本發明之方法亦可使用未用過之材料與回收之材料 的混合品。 回收材料之來源材料可爲板片或板片之經修剪掉的 部分,其已如上述般地被壓縮模製,或者可爲已經被例如 預先輪壓輥所壓縮但尙未被植入樹脂之板片。此外,來源 材料可爲已被植入樹脂但尙未固化之板片或板片之經修 剪掉的部分,或已被植入樹脂且已固化之板片或板片之經 修剪掉的部分。來源材料亦可爲回收之軟性石墨質子交換 膜(PEM )燃料電池組件,諸如流程板或電極。各種石墨 來源中之每一者均可被使用作爲天然石墨薄片,或可用與 天然石墨薄片相混合。 一旦軟性石墨板片之來源材料可取得,其接著便可用 -24- 200810621 習知之方法或裝置(諸如一噴射硏磨機、氣磨機、攪拌機 等)予以硏成粉末,以便可製成顆粒。較佳地,大多數顆 粒均具有一可使其通過美國國家標準20篩目之直徑;更 佳地,大部分(較大於約20%,最佳係較大於約50% )將 無法通過美國國家標準80篩目。最佳地,諸顆粒具有一 較大於約美國國家標準20篩目之顆粒大小。最好可在軟 性石墨板片正在被硏成粉末且同時被植入樹脂之時將其 冷卻,以便可避免樹脂系統在硏成粉末期間受到熱損壞。 經硏成粉末之顆粒的大小可被選定,以便可平衡具有 所要熱特性之石墨物品的可加工性及可成形性。因此,較 小顆粒將導致一種較易於加工及/或成形之石墨物品,而 較大顆粒將導致一種具有較高之異向性且因此具有較大 之平面內電及熱傳導性之石墨物品。 一旦來源材料被硏成粉末,其接著被再膨脹。該再膨 脹可藉由利用上述之插層及剝離法,以及如頒予Shane等 人之美國第3,404,061號專利與頒予Greinke等人之美國第 4,895,7 1 3號專利中所敘述的那些方法而發生。 一般而言,在插層之後,諸顆粒藉由在爐中加熱諸已 插層顆粒而被剝離。在此剝離步驟期間,已插層天然石墨 薄片可被加入回收之已插層顆粒中。較佳地,在再膨脹步 驟期間’諸顆粒被膨脹成具有一在至少約100cC/g及達約 35Occ/g或更大之範圍中的比體積。最後,在再膨脹之後, 諸已再膨脹之顆粒可被壓縮成軟性板片,如下文中所述。 根據本發明,如上述般被製備之石墨板片(其通常具 -25- 200810621 有約0.075mm至約1 0mm之厚度,但其可例如按所用之壓 縮度而改變)可用樹脂予以處理,而經吸收的樹脂在固化 ' 之後可加強板片之抗濕及操作強度(亦即剛性),並且「固 定」板片之形態。在環氧植入石墨板片內之樹脂的量必須 爲一足以確保最終組合及固化層狀結構係密集且具有黏 著力之量,而與密集化石墨結構相關聯之異向性熱傳導率 則尙未被不利地影響。適當之樹脂含量較佳係至少佔重量 之約5 %,更佳地係佔重量之約1 0至3 5 %,且適當地可達 φ 佔重量之約6 0 %。 被發現尤有利於實施本發明之樹脂包括:丙烯酸基、 環氧基及酚醛基樹脂系統、氟基聚合物、或其混合物。適 當之環氧樹脂系統包括那些以雙酚A (DGEBA)之環氧樹 脂爲基者,以及其他多功能之樹脂系統;可被使用之酚醛 樹脂包含Re sole及Νονοί ac型酚醛樹脂。可選擇地,除了樹 脂外,軟性石墨可被植入纖維及/或鹽類;或軟性石墨可 被植入纖維及/或鹽類以取代樹脂。除此之外,反應或不 # 反應之添加劑可與樹脂系統一起使用,以便可修正性質 (諸如黏著性、材料流動性、厭水性等)。 一種用於連續成形樹脂且經壓縮之軟性石墨材料的 設備被揭示在頒予Mercuri,Capp,Warddrip及Weber之美 國第6,706,400號專利案中,其揭示內容以引用之方式被 倂於本文中。 有利地,當由經壓縮之已剝離石墨顆粒所構成之板片 被浸漬樹脂時,在壓縮步驟(例如藉由輪壓)之後,經浸 -26-200810621 is dissipated to allow components to operate reliably, flat. Due to these heat generating components, the amount of printed electricity can be large. The so-called "hot plate" is opposed to the surface of the dielectric phase circuit and the heat generating component by a layer of a heat dispersing material such as an alloy for dispersing from the electronic components. It is important that the heat spreader must be positioned to direct the heat spreader to the circuit(s) to be electrically conductive, if they are in contact with each other. There are many commercially available "絜-metal core printed circuit boards (MCPCB), T-CladTM hot plates of Insulated Metal SubstrateTM hot plates, and dielectric layers from Denka's Anotherm TN thermal conductivity from TT Electronics. For example, the first three types of heat can be filled with a plurality of heat conductive particles, or the thin positive particles on the top of the aluminum heat disperser layer may be expensive, and the subsequent layers are protected from pinholes, which increases the design. The above factor is due to its lack of manufacturing a curved or non-dielectric material covering the entire layer of the thermal disperser layer as a dielectric layer to overcome the above-mentioned difficulties and achieve its expected performance. The water-path board must assist in the dissipation of heat. For example, where copper or aluminum and its materials are stacked, and in conjunction with . On the surface or in the plies, the heat of the heat generated by = is dispersed such that at least one of the dielectric materials is opened, because the heat dissipating devices touch the plates of the circuit, which is sometimes referred to as ί is from Bergquist, HITT Plate from Thermagon, and [board. These hot plates can be used by those who can pass through the dielectric layer 1 Anotherm board can be processed through the layer. However, the thermal plate must be enough Thick enough to confirm the thermal resistance. The extra limit of this method = the elasticity of the surface circuit structure, and the fact of the surface. Some problems are caused at the anode, but because copper can not be anodized, it can only be used. Aluminum acts as its heat disperser layer. Since aluminum has a thermal conductivity significantly less than that of copper, it may become a heat loss. However, all of the aforementioned methods may suffer from soldering difficulties because of printed circuit boards and The same heat dissipation properties during operation of the assembly inhibit assembly procedures that require a point source for soldering (eg, hot rod bonding). To overcome some of the above, not all Conventional printed circuit boards can be combined with a separate metal heat spreader layer in a separate process. In this configuration, the printed circuit board can be designed to have a number of hot runners (typically plated) Holes are drilled with copper so that heat can be better conducted through the unfilled dielectric layer of the printed circuit board, but these can only be used where there is no need for electrical insulation between the components and the components. In addition, conventional heat-dispersible materials (for example, copper or aluminum) will greatly increase the weight of the board, which is unpleasant, and the coefficient of thermal expansion (CTE) of these materials cannot be closely related to the thermal expansion coefficient of the glass fiber laminate. Ground matching, which under thermal action will cause physical stress on the printed circuit board, and potentially can cause delamination or cracking. Furthermore, because the thermal diffuser layer on these plates is an isotropic The thin (relative to its length and width) metal material is formed so that heat can flow immediately through the thickness of the heat spreader and the resulting hot spot can occur directly opposite the heat source. A circuit assembly class is called "flexible circuit" of face similar problems of thermal management in this industry. The flexible circuit is constructed by providing a circuit (e.g., 200810621 copper circuit as described above) on the surface of a polymer material (e.g., polyimide or polyester) as a dielectric layer. As the name implies, these circuit materials are soft and can even be provided in the form of a coil of circuit material that can later be combined with a layer of heat disperser such as copper or Ming. Although very thin, the dielectric layer in a flexible circuit still significantly increases the thermal resistance of a given design and faces some of the same problems observed in printed circuit boards. The use of the channel is still limited to electrical insulation as described above. Moreover, it is clear that the use of a hard metal layer (such as copper or aluminum) will make it impossible to utilize the softness of the flexible circuit, which is important in end applications. ^ Use of compressed, exfoliated graphite particles ( The heat spreader consisting of flakes will remedy many of the losses encountered with copper or aluminum heat spreaders because such graphite materials offer the advantage of being reduced by 80% by weight compared to copper, and at the same time Or even more than the thermal conductivity required for copper to disperse heat throughout the surface of the printed circuit board in the in-plane direction. In addition, graphite has a coefficient of thermal expansion (CTE) in the plane of substantially zero and a lower stiffness than that of copper, thereby reducing the thermal stress at the graphite-dielectric bond. Although the compressed sheet of exfoliated graphite particles may even have the flexibility to be used in conjunction with a flexible circuit, the addition of a graphite-containing thermal disperser layer does not overcome all of the defects that result from the self-heating disperser. The location will separate the heat spreader from the heat generating components by one or more layers of dielectric material, resulting in reduced heat transfer from the components to the heat spreader layer. One or more of the layers of the laminate are composed of soft graphite flakes as is well known in the art. These structures can be seen, for example, in the manufacture of gaskets, -9-200810621. See U.S. Patent No. 4,961,991 issued to Howard. The Howard case discloses various laminate structures comprising a plurality of metal or plastic sheets bonded between soft graphite sheets. The Howard case discloses that such a structure can be prepared by cold working a soft graphite flake on both sides of a metal mesh and then pressing the graphite to the metal mesh. How. The ard case also discloses that a coating of a polymer resin is placed between two soft graphite sheets while heating to a temperature sufficient to soften the polymer resin, thereby coating the polymer resin with a cloth. Bonded between the two soft graphite sheets to form a soft graphite laminate. No. 5,509,993 to Hirschvogel discloses a soft graphite/metal laminate which is prepared by a method in which the main step of the method is to apply a surfactant to the bond to be bonded. On the surface. U.S. Patent No. 5,1,92,605 to Mercuri also incorporates a laminate of flexible graphite sheets bonded to a core material of metal, fiberglass or carbon. The Mercuri case deposits and then cures the coating of the epoxy resin on the core material and the particles of the thermoplastic prior to feeding the core material and soft graphite through the roller press roll to form the laminate. In addition to its utility on gasket materials, graphite laminates also have utility as heat transfer or cooling devices. The use of various solid structures as heat transfer bodies is well known in the art. For example, U.S. Patent Nos. 5,3,6,080 and 5,224,030, the disclosure of each of each of each each each each each each each each each Such devices are used to passively conduct heat from a heat source (e.g., a semiconductor) to a heat sink. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Through the thickness of the assembly. However, the disclosures of Krassowski and Chen do not describe materials that conduct heat from a source of heat through a plurality of layers that are relatively non-conductive (such as a dielectric layer of a circuit assembly). As indicated previously, the graphite material which is preferably used as the heat disperser material of the present invention is a sheet of compressed exfoliated graphite particles, which is commonly referred to as a soft graphite flake material. The following is a brief description of graphite and the manner of forming, wherein the forming method is usually carried out to constitute a soft graphite sheet material. In microscopic form, the graphite consists of a hexagonal array of carbon atoms or a laminate plane of the network. The planes of the layers of carbon atoms in a hexagonal configuration are generally flat and are oriented or arranged to be substantially parallel and equidistant from one another. These generally flat, parallel and equidistant carbon atom flakes or layers (often referred to as graphite flake layers or substrate planes are joined or bonded together, and their groups are arranged in microcrystals. Highly ordered graphite The material consists of crystallites of considerable size, and the crystallites are highly aligned or oriented relative to one another and have a number of relatively ordered carbon layers. In other words, highly ordered graphite has a height. Microcrystal orientation is preferred. It should be noted that, by definition, graphite has an anisotropic structure and thus exhibits or has many properties of high directivity, such as thermal and electrical conductivity and fluid diffusivity. Briefly, graphite It is characterized by a K-layer structure of carbon 'that is, a structure composed of a stack of layers or thin layers of -11-200810621 carbon atoms which are connected by a weak van der Waal s force. As far as the graphite structure is concerned, two axes or directions are usually mentioned, namely the "C" axis or direction and the "a" axis or direction. For the sake of simplicity, the "C" axis or direction can be considered to be perpendicular to the carbons. The direction of the "a" axis or direction can be considered to be parallel to the direction of the carbon layers, or perpendicular to the direction of the "c" direction. Graphite suitable for the manufacture of soft graphite sheets has a very high degree of directivity. As mentioned, the bonding force that holds the parallel layers of carbon atoms together is only a weak van derma force. Natural graphite can be chemically treated so that the intervals between layers or thin layers of carbon atoms can be significantly opened. So that a significant expansion along the direction perpendicular to the layers (i.e., along the "c" direction) can be provided, and thus an expanded or swollen graphite structure is formed, wherein the thin layer properties of the carbon layers are substantially retained Graphite sheets that have been chemically or thermally expanded, and more specifically, have been expanded to have a final thickness or "c" direction dimension that is about 80 times or more larger than the original "c" direction dimension, The graphite sheet can be formed into a bonded or integral expanded graphite sheet without the use of a binder, such as a mesh, paper, strip, tape or the like (generally referred to as "soft graphite"). The mechanical bonding or bonding achieved between the expanded graphite particles allows the graphite particles to be formed into a unitary flexible sheet by compression without the use of any bonding material, wherein the graphite particles have been expanded to have a final thickness or "c" direction dimension that is approximately 80 times or more larger than the original "c" direction dimension. In addition to softness, the sheet material as set forth above is also found in thermal and electrical conductivity. And the high degree of anisotropy in fluid diffusibility, although less than -12-200810621, but comparable to natural graphite starting materials, because the direction of the expanded graphite particles is roughly parallel to the very high compression (for example The roll processing comprises the opposite faces of the formed sheets. The resulting sheet material thus has excellent softness, good strength and very high directivity. There is a need for processing that can more fully utilize these properties. Briefly, the use of a non-adhesive anisotropic graphite sheet material (such as a mesh, paper, strip, tape, foil, mat, or the like) for forming a non-adhesive agent is included under a predetermined load and without a binder. Lower compression or compaction of the graphite particles, which have a size of about 80 times or more the "c" direction of the "C" direction of the original particles so as to form a substantially flat, soft, And integrated into the graphite sheet. Expanded graphite particles, which are generally in the form of insects or worms in appearance, will remain compressively deformed once compressed and aligned with the opposite major surfaces of the sheet. The nature of the sheet can be altered by precoating and/or adding binders and additives prior to the compression step. See US Patent No. 3,404,0 61 to Shane et al. The density and thickness of the sheet material can be varied by controlling the degree of compression. • Lower density is advantageous where surface details must be embossed or molded, and lower density helps to achieve good detail. However, denser sheets typically have higher in-plane strength and thermal conductivity. Typically, the density of the sheet material will be from about 0. 04g/cm3 to about 1. Within the range of 9 g/cm3. The soft graphite sheet material produced as described above generally exhibits an appreciable degree of anisotropy due to the alignment of the graphite particles parallel to the main opposite parallel surfaces of the sheet, while making the anisotropy The degree is increased immediately after the sheet material is pressed to increase the density in rolls-13-200810621. In the rolled anisotropic sheet material, the 'thickness (ie, perpendicular to the opposite parallel sheet surfaces) includes the ''C' direction and the direction along the length, and the width (ie, 'edge' Or parallel to the opposing major surfaces, including the "a" direction, and generally in terms of size, the thermal properties of the sheets in the "c" and "a" directions are very different. [Invention] It is an object of the invention to provide an improved structure of a channel P in a graphite heat disperser. Another object of the present invention is to provide an improved method for fabricating a graphite heat disperser having a hot aisle. Another object of the present invention is to provide a convex a rim channel having a flange that engages one of the major surfaces of the graphite heat spreader to improve heat transfer between the channel and the graphite heat spreader. Another object of the present invention is to provide a A low cost method of manufacturing a heat spreader with channels using inexpensive push nuts. • Another object of the present invention is to provide a graphite heat spreader for constructing a flushed hot aisle Structure and Method Another object of the present invention is to provide a graphite heat spreader having a plurality of heat passages and a layer that provides a coating layer that facilitates structural integrity of the heat spreader. Still another object of the present invention is A method of forging a hot aisle with a graphite heat disperser is provided. For those skilled in the art, the present invention can be easily and clearly understood after reading the disclosure and referring to the accompanying drawings. The object, features and advantages of the invention are provided. The invention provides for the manufacture of graphite heat having a hot aisle: a preferred structure and method. In one embodiment, the flange channel is provided with at least one flange 'with graphite One of the planar surfaces of the graphite planar element of the heat spreader is engaged. The flange channel can be pushed through the nut or can be secured by using a second flange that is rigidly connected to the channel. On the graphite disperser. Thus, this comprises at least one flange and a second flange or a push nut that is above the surface of the graphite thermal element. In another embodiment A hot runner that is flush with the major planar surfaces of the graphite hot component in a final position. A variety of different techniques that can be used in the fabrication of the embodiments are provided. Two embodiments preferably relate to a method of manufacture, wherein The through is press fit into a hole of the same shape but slightly smaller and extending through the element so as to provide a close fit between the stem and the through hole of the graphite. One of the special uses of such a graphite heat spreader is Can be used in conjunction with a circuit board circuit assembly. When the heat generating component (the heat path between the heat sink layer and the heat spreader layer (ie, the heat path) is thermally dispersed by the heat dissipator layer on the lifter assembly) Substantially corrected, by virtue of the use of this thermal path, the graphite-based heat spreader can provide improved thermal dispersion 'even comparable to the use of aluminum or other and other dispersers. The flange channel on the column is fully extended to provide the element of the element. The two elements of the graphite column are printed on the surface of the graphite. The light is LED). Time: electricity: good. The use of the real layer Copper heat score -15- 200810621 The person who has the weight also has the advantage of reducing weight. By "circuit assembly" is meant an assembly comprising one or more electronic circuits positioned on a dielectric material, and may include a laminate in which one or more of the circuits are sandwiched Between the dielectric layers. Specific examples of circuit assemblies are printed circuit boards and flexible circuits, as is well known to those skilled in the art. Before explaining the method of the present invention for improving existing materials, the graphite and how it is formed into a flexible sheet will be briefly described in the first place, and the soft sheets will become the main heat dispersers for constituting the product of the present invention. A microcrystalline version of graphite-based carbon that includes atoms that are covalently bonded in the plane of the flat stack and that bond the planes to a weaker bond. By treating the graphite particles (such as natural graphite flakes) with an intercalant such as a solution of sulfuric acid and nitric acid, the crystalline structure of the graphite will act to form a compound of graphite and the intercalant. The treated graphite particles are hereinafter referred to as "intercalated graphite particles". After exposure to elevated temperatures, the intercalating agent in the graphite then decomposes and volatilizes, which causes the intercalated graphite particles to be sized along the "C" direction (ie, along the direction perpendicular to the crystalline surfaces of the graphite). A type like the accordion expands to 80 times or more of its original volume. The exfoliated graphite particles are worm-like in appearance and are therefore commonly referred to as worms. The worms can be compressed together into a flexible sheet which, unlike the original graphite sheet, can be formed and cut into various shapes. Graphite starting materials suitable for use in the present invention include highly graphitized carbonaceous materials which can be inserted into organic and inorganic acids and halogens and then swell when exposed to heat by the storm. These highly graphitized carbonaceous materials preferably have a degree of graphitization of about 1.0. As used herein, the term "graphitization" refers to the g値 obtained from the following formula: =3. 45 X d(Q02) g— ~ ~0. 095 wherein d(002) is the interval between the graphite layers of carbon in the crystal structure measured in Angstrom units. The spacing between the graphite layers is measured by standard X-ray diffraction techniques. The positions of the diffraction peaks corresponding to the (002), (004), and (006) Miller Indices are measured, and the standard least squares technique is used to derive the interval, which minimizes the total of all of these peaks. error. Examples of tubular graphitized carbonaceous materials include natural graphite from various sources, as well as other carbonaceous materials such as graphite prepared by chemical vapor deposition, high temperature pyrolysis of polymers, or crystallization and the like. . Natural graphite is the best. The graphite starting material used in the present invention may comprise a non-graphite component as long as the crystal structure of the starting materials maintains the desired degree of graphitization and is peelable. In general, any carbonaceous material is suitable for use in conjunction with the present invention, and the crystal structure of the carbonaceous materials has a desired degree of graphitization and is exfoliable. Such graphite preferably has a purity of at least about 80% by weight. More preferably, the graphite used in the present invention has a purity of at least about 94%. In the preferred embodiment, the graphite used will have a purity of at least about 98%. A general method for the manufacture of a graphite sheet is described in U.S. Patent No. 3,404,061, the entire disclosure of which is incorporated herein by reference. In a typical implementation of the method of Shane et al., Day-17-200810621 graphite flakes are intercalated by dispersing the flakes in a solution comprising, for example, a mixture of nitric acid and sulfuric acid, most advantageously by weight. Approximately 20 to about 300 parts of the intercalation solution per 100 parts of graphite flakes (pph). The intercalation solution includes an oxidizing agent and other intercalating agents known in the art. Examples include those comprising: an oxidizing agent and an oxidizing mixture such as a solution containing nitric acid, potassium chlorate, chromic acid, potassium permanganate, potassium chromate, potassium dichromate, perchloric acid, and the like; or a mixture such as concentrated nitric acid and chlorine a mixture of an acid salt, chromic acid and phosphoric acid, sulfuric acid and nitric acid; or a strong organic acid such as trifluoroacetic acid; and a strong oxidizing agent dissolved in the organic acid. Alternatively, the potential can be used to cause oxidation of the graphite. Chemical substances which can be introduced into the graphite crystal by electrolytic oxidation include sulfuric acid and other acids. In a preferred embodiment, the intercalating agent is a solution of sulfuric acid, or a mixture of sulfuric acid and phosphoric acid, and an oxidizing agent, wherein the oxidizing agent is nitric acid, perchloric acid, chromic acid, barium permanganate, hydrogen peroxide, iodic acid. , periodic acid, or the like. Although not preferred, the intercalation solution may comprise: a metal halide such as ferric chloride, and ferric chloride mixed with sulfuric acid; or a halide such as bromine as a solution of bromine and sulfuric acid, or in an organic Bromine in the solvent. The amount of intercalation solution can range from about 20 to about 35 Opph, and more typically from about 40 to about 160 pph. After the sheets are intercalated, any excess solution is discharged from the sheets and the sheets are washed with water. Alternatively, the amount of the intercalation solution can be limited to between about 10 and about 40 pph, which will allow the water wash step to be eliminated as taught and suggested in U.S. Patent No. 4,895,731, the disclosure of which is incorporated herein. The content is also incorporated herein by reference. -18- 200810621 The particles of the graphite flakes treated with the intercalation solution can be contacted, for example by mixing, with a reducing organic agent selected from the group consisting of alcohols, saccharides, aldehydes and esters at 25 ° C. It can react with the surface film of the oxidized intercalation solution in the temperature range of 125 °C. Suitable specific organic agents include: cetyl alcohol, octadecyl alcohol, 1-octanol, 2-octanol, decyl alcohol, U0 diol, awake, 1-propanol, 1,3 propylene glycol, ethylene Alcohol, polypropylene glycol, glucose, fructose, lactose, sucrose, potato starch, ethylene glycol monostearate, diethylene glycol dibenzoate, propylene glycol monostearate, glyceryl monostearate, carboxylic acid Dimethyl ester, diethyl carboxylate, methyl formate, ethyl formate, ascorbic acid, and compounds derived from lignin, such as sodium lignosulfonate. The amount of the organic reducing agent is suitably about 0. 5 to 4%. The use of expansion aids prior to intercalation, during intercalation, or just after intercalation may also provide improvements. Among these improvements may be a reduced peel temperature and an increased expansion volume (also referred to as "worm volume"). The swelling aid herein will preferably be an organic material which is sufficiently soluble in the intercalation solution to achieve expansion improvement. More strictly speaking, such organic materials containing carbon, hydrogen and oxygen (preferably exclusively) can be used. Carboxylic acids have been found to be particularly effective. A suitable carboxylic acid which may be used as an expansion aid may be selected from aromatic, aliphatic or alicyclic, linear or branched, saturated and unsaturated monocarboxylic acids, dicarboxylic acids and polycarboxylic acids having at least one One carbon atom (preferably up to 15 carbon atoms) can be dissolved in the intercalation solution in an amount effective to provide a predictable improvement for one or more exfoliation patterns. A suitable organic solvent can be used to improve the solubility of the organic expansion aid in the intercalation solution from -19 to 200810621. ^ Representative examples of saturated aliphatic carboxylic acids such as those having the formula H(CH2)nCOOH, wherein η is a number from 〇 to about 5, and the acids include: formic acid, acetic acid, propionic acid, Butyric acid, valeric acid, caproic acid, and the like. An aldehyde or a reactive carboxylic acid derivative such as an alkyl ester may also be used in place of the carboxylic acid. Representative of alkyl esters are methyl formate and ethyl formate. Sulfuric acid, nitric acid, and other conventional aqueous intercalants have the ability to ultimately decompose formic acid into water and carbon dioxide. Therefore, formic acid and other sensitive φ expansion aids are preferably contacted with the graphite flakes before the graphite flakes are immersed in the aqueous intercalation agent. The dicarboxylic acid is represented by an aliphatic dicarboxylic acid having 2 to 12 carbon atoms, especially oxalic acid, fumaric acid, malonic acid, maleic acid, succinic acid, glutaric acid, adipic acid. 1,5-pentanedicarboxylic acid, 1,6-hexanedicarboxylic acid, 1,10-decanedicarboxylic acid, ring. Hexane-1,4.dicarboxylic acid, and an aromatic dicarboxylic acid such as phthalic acid or terephthalic acid. Representative of alkyl esters are dimethyl carboxylic acid and diethyl carboxylic acid. Representative of cycloaliphatic acids are cyclohexanedicarboxylic acids, and representatives of aromatic carboxylic acids are benzoic acid, naphthoic acid, #o-aminobenzoic acid, hydrazine-p-aminobenzoic acid, salicylic acid, hydrazine-, m - and ρ-tolyl acid, methoxy and ethoxybenzoic acid, acetyl acetamide benzoin and acetamide benzoic acid, phenylacetic acid and naphthoic acid. Representative of hydroxyaromatic acids are p-hydroxybenzoic acid, 3-hydroxy-1-naphthoic acid, 3-hydroxy-2-naphthoic acid, 4-hydroxy-2-naphthoic acid, 5-hydroxy-1-naphthoic acid, 5- Hydroxy-2-naphthoic acid, 6-hydroxy-2.naphthoic acid, and 7-carbamoyl-2-naphthoic acid. The important one of the polyphthalic acids is citric acid. The intercalation solution is aqueous and preferably contains from 1 to 10% of the swelling adjuvant. This amount will effectively increase the peeling. In embodiments in which the expansion aid -20-200810621 is thinner than graphite before or after immersion in the aqueous intercalation solution, the expansion aid may be mixed with the graphite by a suitable device (eg, a machine), which is typically It accounts for about 0. 2% to about 10%. After the graphite flakes are inserted, and after the ink flakes to be coated with the intercalant are mixed with the organic reducing agent, the mixture is exposed to a temperature range of 125 ° C to promote the reaction of the reducing agent with the intercalation. The heating period can be as long as about 20 hours, while at the upper temperature it is only necessary, for example, at least about 10 minutes. It can be used at higher temperatures for half an hour or less, followed by 10 to 25 minutes. The graphite particles thus treated are sometimes referred to as "intercalated particles". When exposed to high temperatures (eg, at least about 160 ° C, about 700 ° C to 1000 ° C, and higher temperatures), the intercalated stone is along the "c" direction (ie, perpendicular to the constituent graphite particles) The direction of the plane is expanded to an original 80 to 1,000 times or more in an original accordion type. The swells (i.e., the smear-off particles are worm-like in appearance, and thus are generally referred to as worms that can be compressed together into a soft sheet which, unlike the original sheet, can be shaped and cut A variety of different shapes. Soft graphite sheets and foils with good processing strength, and suitable for being compressed to a pressure of about 3. The thickness between 75 mm, and a typical density of grams per cubic centimeter (g/cm3). For example, in the United States, the 5th, 902,762 pieces are in contact with the V-type mixed weight of the intercalated stone: 25 ° C to the coating surface within the range of short heating time, for example, the graphite particles, especially the large ink particles, the microcrystalline starting volume The stone worm. The graphite thin system is mutually adhesive: 0. 075mm 0·1 to 1. In the patent No. 9-200810621 (which is incorporated herein by reference), the ceramic additive of the weight of 1.5 to 30% can be mixed with the intercalated graphite flakes so that Provides increased resin implantation in the final soft graphite product. The additives include ceramic fiber particles having a value of about 0. 丨5 to i. The length between 5mm. The width of the particles is suitably from 〇·〇4 to 〇. 〇〇 4mm. The ceramic fiber particles do not react to the graphite and are not adherent, and are stable at a temperature of about 1100 ° C, preferably about 1400 ° C or higher. Appropriate ceramic fiber particles are made of soaked soft glass fiber, carbon and graphite fiber, oxidized • chromium, boron nitride, tantalum carbide and magnesia fiber, naturally occurring mineral fiber, such as calcium metasilicate fiber, calcium aluminum silicate Made up of fibers, alumina fibers, and the like. The above method for intercalating and stripping graphite flakes can be pretreated by graphite flakes at a graphitization temperature (i.e., at a temperature in the range of about 3000 ° C and above), and by intercalating agents. It is advantageously enhanced by the inclusion of a lubricating additive, as described in the International Patent Application No. PCT/US02/39749, the disclosure of which is incorporated herein by reference. • Pre-treatment or annealing of the graphite flakes will result in a significantly increased expansion (i.e., an increase in expansion volume to 300% or greater) as the graphite flakes subsequently undergo intercalation and exfoliation. Indeed, the increase in expansion is satisfactorily at least about 50%, as compared to a similar treatment without the annealing step. The temperature used in the annealing step should not be significantly lower than 3000 ° C because even a lower temperature of 100 ° C results in a substantially reduced expansion. The annealing of the present invention is carried out for a period of time sufficient to cause the sheet, which sheet then has an increased bulk -22-200810621 after the intercalation and subsequent stripping. The time usually required is 1 hour or more, preferably 1 to 3 hours, and most advantageously carried out in an inert environment. For the best benefit results, the annealed graphite sheet will also be subjected to other methods of increasing the degree of expansion in the art, that is, the intercalation method, which comprises an organic reducing agent, such as organic The acid intercalation aid and the surfactant rinse after the intercalation is completed. In addition, the intercalation step can be repeated for maximum benefit results. The annealing step of the present invention can be carried out in an induction furnace or other such apparatus as is well known and understood in the art of graphitization; as for the temperature used for Φ here is in the range of 3000 ° C, and this temperature It should be at the upper end temperature in the temperature range encountered in the graphitization procedure. It has been observed that worms made from graphite that has been subjected to pre-intercalation annealing may sometimes "block" together, which may negatively affect the uniformity of the weight of the punched surface, thus assisting in the formation of "free flow" The worm additive is highly necessary. The addition of a lubricating additive to the intercalation solution helps the worm to more evenly distribute the machine across the compression equipment (eg a machine tool of a press station), which has traditionally been used to compress graphite worms (rolling) Into a soft graphite sheet. Therefore, the resulting sheet has a higher area uniformity and a larger tensile strength. The lubricating additive is preferably a long bond carbon oxide, more preferably a carbon oxide having at least about 10 carbons. Other organic compounds with long-chain carbon oxide groups can be used even in the presence of other functional groups. More preferably, the lubricating additive is an oil, and the best is mineral oil, especially considering that the mineral oil is less prone to spoilage and odor, which is an important consideration for those who need long-term storage. It will be noted that certain -23-200810621 swelling aids, which have been detailed above, also meet the definition of lubricating additives. When these materials are used as expansion aids, it is not necessary to include a separate lubricant additive in the intercalant. The lubricating additive is present in the intercalant in an amount of at least about 1 · 4 ρ ρ 1 , preferably at least about 1 · 8 pph. Although the upper limit of the amount of the lubricant additive is not as important as the following, the lubricating additive content does not appear to have any significant additional benefit at levels greater than about 4 pph. The soft graphite sheet of the present invention, if necessary, can be used to temper the granules of the soft graphite sheet instead of the newly expanded mites, as described in U.S. Patent No. 6,673,289, the disclosure of which is incorporated herein by reference. The way is to be included in this article. The sheets may be freshly finished sheet material, recycled sheet material, discarded sheet material, or any suitable source thereof. The method of the present invention may also use a mixture of unused materials and recycled materials. The source material of the recycled material may be the trimmed portion of the sheet or sheet which has been compression molded as described above, or may have been compressed by, for example, a pre-rolling roll but not impregnated with resin. Plate. In addition, the source material may be the trimmed portion of the sheet or sheet that has been implanted with the resin but not cured, or the trimmed portion of the cured sheet or sheet that has been implanted with the resin. The source material can also be a recycled soft graphite proton exchange membrane (PEM) fuel cell assembly, such as a flow plate or electrode. Each of the various graphite sources can be used as a natural graphite flake or can be mixed with natural graphite flakes. Once the source material of the soft graphite sheet is available, it can then be powdered by a conventional method or apparatus (such as a jet honing machine, air mill, mixer, etc.) so that it can be made into granules. Preferably, most of the particles have a diameter that allows them to pass through the U.S. National Standard 20 mesh; more preferably, most (greater than about 20%, the best system is greater than about 50%) will not pass the United States. Standard 80 mesh. Most preferably, the particles have a particle size greater than about 20 U.S. National Standards. It is preferable to cool the soft graphite sheet while it is being powdered and simultaneously implanted with the resin so that the resin system can be prevented from being thermally damaged during the powder formation. The size of the granulated particles can be selected so as to balance the processability and formability of the graphite article having the desired thermal characteristics. Thus, smaller particles will result in a graphite article that is easier to process and/or shape, while larger particles will result in a graphite article that has a higher anisotropy and therefore greater in-plane electrical and thermal conductivity. Once the source material is broken into powder, it is then re-expanded. The re-expansion can be achieved by the use of the above-described intercalation and exfoliation methods, as well as those described in U.S. Patent No. 3,404,061, issued to the entire entire entire entire disclosure of And it happened. In general, after intercalation, the particles are stripped by heating the intercalated particles in an oven. During this stripping step, the intercalated natural graphite flakes can be added to the recovered intercalated particles. Preferably, the particles are expanded to have a specific volume in the range of at least about 100 cC/g and up to about 35 cc/g or greater during the re-expansion step. Finally, after re-expansion, the re-expanded particles can be compressed into flexible sheets, as described below. According to the present invention, a graphite sheet prepared as described above (which usually has -25-200810621 has about 0. A thickness of from 075 mm to about 10 mm, but which may vary, for example, according to the degree of compression used) may be treated with a resin, and the absorbed resin may enhance the moisture resistance and handling strength (i.e., rigidity) of the sheet after curing. And "fixed" the shape of the plate. The amount of resin in the epoxy-implanted graphite sheet must be an amount sufficient to ensure that the final combined and cured layered structure is dense and adhesive, while the anisotropic thermal conductivity associated with the dense graphite structure is Not adversely affected. A suitable resin content is preferably at least about 5% by weight, more preferably from about 10% to about 5% by weight, and suitably up to about 60% by weight. Resins found to be particularly advantageous for practicing the invention include: acrylic based, epoxy based and phenolic based resin systems, fluorine based polymers, or mixtures thereof. Suitable epoxy resin systems include those based on bisphenol A (DGEBA) epoxy resins and other multifunctional resin systems; phenolic resins that can be used include Resol and Νονοί ac phenolic resins. Alternatively, in addition to the resin, the soft graphite may be implanted with fibers and/or salts; or the soft graphite may be implanted with fibers and/or salts to replace the resin. In addition, reactive or non-reactive additives can be used with resin systems to modify properties such as adhesion, material flow, water repellency, and the like. An apparatus for the continuous molding of a resin and a compressed soft graphite material is disclosed in U.S. Patent No. 6,706,400 issued to thessssssssssssssssssssssssssssssssssssssssssssssssssssssss Advantageously, when the sheet consisting of the compressed exfoliated graphite particles is impregnated with resin, after the compression step (for example by means of wheel pressing), it is impregnated -26-
200810621 漬之材料被切割成適當大小之切片,並被 中,在此處該樹脂將在一提高之溫度下被@ 性石墨薄片可以一疊層板之型式被運用,其 別之石墨板片一起堆疊在壓機中而被製備辰 被用於壓機中之溫度必須足以確保石 壓力下被密集化,同時該結構之熱性質並不 響。一般而言,此將需要一至少大約爲90 通常可達到大約200°C。最佳地,固化係S 至20 0°C之溫度範圍下。用於固化之壓力將 溫度之函數,但將足以確保石墨結構在不會 性質形成不利影響下被密集化。一般而言, 利性,將要利用到可將該結構密集化至所要 需壓力。此一壓力將通常爲至少約7Mpa ( 英吋1000磅),且不需超過約35Mpa (相當 而更普遍地係從約7至約21 Mpa ( 1000至 化時間可依據樹脂系統及所用之溫度與壓 常係在約0.5小時至2小時之範圍內。在E 材料被發現具有一至少約爲1.8g/cm3之密 從約 1.8g/cm3 至 2.0g/cm3。 有利地,當軟性石墨板片本身呈現爲-在於經植入之板片中的樹脂將可作爲疊層 而,根據本發明之另一實施例,在軟性板片 之前,經輪壓及植入之軟性石墨板片將先 劑。適當之黏著劑包括環氧基、丙烯酸基 放置在一壓機 Ϊ化。此外,軟 可藉由將諸個 墨結構在固化 會被不利地影 °C之溫度,且 ί從大約150°C 多少係爲所用 對該結構之熱 爲了製造之便 程度之最小必 相當於每平方 於 5 0 0 0 p s i ), 3000psi)。固 3而改變,但通 丨化完成之後, I,且通常係在 -疊層板時,存 5之黏著劑。然 被堆疊且固化 :塗層以一黏著 I酚醛基樹脂。 -27- 200810621 被發現尤有利於實施本發明之酚醛樹脂包括:R e s c Novolak型酚醛樹脂。 雖然經由輪壓或模製而形成板片係爲最常用 可用以實施本發明之石墨材料的方法,但亦可使用 成形法。 本發明之經溫度及壓力固化的石墨/樹脂複合 了 一種石墨基複合材料,其在只有銅重量之一小部 有可比得上或超越銅之熱傳導率的平面內熱傳導琴 體而言,諸複合物具有至少約300W/m°K之平面內 率,同時具有小於約15W/m°K之穿透平面熱傳導 佳地係小於約10W/m°K。 現參照圖式,尤其參照第1圖,一根據本發明 石墨熱分散器與若干熱通道相倂合之電路總成被 元件符號1 0。電路總成1 0包括至少一介電質層2 0 分散器30,其中熱分散器30鄰接介電質層20。彰 熱分散器3 0包括至少一由經壓縮之已剝離石墨顆 成之板片,其係如前述般地被製備成。電路總成 係爲一印刷電路板或軟性電路,但亦可包括例如一 電質層20上之導電墨水式印刷或絲網圖案。 電路總成10通常亦包括一傳統上由銅所製成 40於其上,其藉由光罩飩刻法、濺鍍法、網版印 其他類似方法而被鋪設於介電質層20上。如前所 電路40亦可由導電墨水所構成,其係藉由例如印 網方法而被鋪設於介電質層20上。 >le型及 於成形 其他之 物提供 分下具 g。更具 熱傳導 率,更 而將一 標不以 及一熱 $佳地, 粒所構 1 0通常 位於介 之電路 刷法或 提及, 刷或絲 -28- 200810621 介電質層20可爲在印刷電路板工業中所習知者,諸 " 如:具有樹脂之玻璃纖維(FR-4 ),較佳係成形爲一疊層 ' 板;聚四氟乙烯(PTFE ),市面上可購得之鐵氟龍品牌材 料;及擴張性PTFE,有時被標示爲ePTFE ;以及上述項 目之浸漬或吸入樹脂型式者。此外,介電質層20可爲一 聚合物,諸如聚亞醯胺或聚酯,如同使用於軟性電路之成 形者。介電質層20亦可包括陶瓷材料,諸如氮化鋁、氧 化鋁、礬土,其以一分離層之型式呈現,或經由例如陽極 φ 處理、汽相沉積、或火焰熔射法而被鋪設於一基底層(例 如熱分散器層30 )上;陽極處理之使用係特別與熱分散 器層30係爲鋁之場合有關的。 此外,在某些情況下,最好是至少部分地包封住熱分 散器層30,或提供一包覆層於熱分散器層30之表面上, 以便可防止微粒物質自熱分散器層30上剝落。例如,某 些人的看法係石墨材料易於成片剝落。無論是否事實,提 供一由例如M y 1 a r之聚合材料(通常在厚度小於2 〇微米 Φ 之等級)所構成之包覆層以防止成片剝落將可與上述之看 法相關聯。在此情形下,該聚合材料可當作電路總成1 〇 之介電質層20,因爲所使用之材料可爲不導電,且薄到 足以不實質地干擾熱傳導至熱分散器層3〇。或者,一經 陽極處理之銘層亦可被用以抑制剝落,而同時該陽極處理 層亦可作爲介電質層20。 較佳地,熱分散器層30在厚度上係從大約〇.25mm至 大的25mm’更佳係從大約〇.5mm至大的14mm,且包括至 •29- 200810621 少一板片。有利地,熱分散器層30可爲一由多達1 〇或更 多石墨板片所構成之疊層板,以便可提供所要之熱分散能 力。該石墨複合物可被用以至少部分地取代用作爲電路總 成熱分散器之銅或其他金屬,而在諸較佳之實施例中則可 完全地取代。 出人意外地,當熱分散器層30例如藉由油漆而成爲 黑色時,尤其是當其係由一或多個經壓縮之已剝離石墨顆 粒的板片所構成時,將可獲得改良之熱阻。換言之,在未 與介電質層20相鄰接之石墨熱分散器層30之諸表面係黑 色處,自熱產生組件處起之熱路徑的有效熱阻被減小。雖 然此情況之精確原因未明,但一般相信使石墨熱分散器層 30成爲黑色將可改善分散器層30之發射率,藉此可改良 熱分散器層30散發熱之能力。 熱分散器層30並不需必然爲平面狀,亦可包含一或 多個「彎曲」,以便可形成三維之形狀。此在電路總成 1 0必須位在一與熱分散器層3 0不同之平面上的場合處係 特別有利的。此配置例如被用於側光型液晶顯示器(LCD 顯示器),其中若干LED被安裝在電路總成1 〇上且位於 一具有受限空間(亦即,LCD顯示器之厚度)之平面中, 而熱分散器層30則垂直於該LED安裝平面伸展。200810621 The material of the stain is cut into the appropriate size of the slice, and the resin is used here at a raised temperature by the @ graphite sheet can be applied in the form of a laminate, and the other graphite sheets together The temperature that is stacked in the press and prepared for use in the press must be sufficient to ensure that the stone pressure is densified while the thermal properties of the structure are not loud. In general, this would require a minimum of about 90 and typically up to about 200 °C. Most preferably, the curing system is at a temperature range of S to 20 °C. The pressure used for curing will be a function of temperature, but will be sufficient to ensure that the graphite structure is densified without adversely affecting the properties. In general, the benefits will be exploited to intensify the structure to the required pressure. This pressure will typically be at least about 7 MPa (1000 lbs) and no more than about 35 MPa (comparably and more generally from about 7 to about 21 MPa (1000 liters depending on the resin system and the temperature used) The pressure is usually in the range of from about 0.5 hours to about 2 hours. The E material is found to have a density of from about 1.8 g/cm3 to about 2.0 g/cm3 of at least about 1.8 g/cm3. Advantageously, when the graphite sheet is soft. It appears in itself that the resin in the implanted sheet will serve as a laminate, and according to another embodiment of the invention, the soft graphite sheet will be pre-formed prior to the soft sheet. Suitable adhesives include epoxy, acrylic based on a press. In addition, soft can be adversely affected by curing the ink structure, and ί from about 150 ° C How much is used to heat the structure for the minimum degree of manufacturing must be equivalent to 500 psi per square, 3000 psi). The solid 3 changes, but after the completion of the pass, I, and usually in the laminated plate, the adhesive of 5 is stored. They are then stacked and cured: the coating is adhered to a phenolic based resin. -27- 200810621 The phenolic resin found to be particularly advantageous for the practice of the present invention comprises: R e s c Novolak type phenolic resin. Although the formation of the sheet by means of wheel pressing or molding is the most commonly used method for carrying out the graphite material of the present invention, a forming method can also be used. The temperature- and pressure-cured graphite/resin of the present invention is a composite of a graphite-based composite material which has a planar heat-conducting body which is comparable to or exceeds the thermal conductivity of copper in only a small part of the weight of copper. The article has an in-plane rate of at least about 300 W/m ° K while having a through-plane heat transfer of less than about 15 W/m ° K of less than about 10 W/m ° K. Referring now to the drawings, and in particular to Figure 1, a circuit assembly in accordance with the present invention in which a graphite heat spreader is coupled to a plurality of hot channels is designated by the component symbol 10. The circuit assembly 10 includes at least one dielectric layer 20 disperser 30, wherein the heat spreader 30 abuts the dielectric layer 20. The heat dissipator 30 includes at least one sheet of compressed exfoliated graphite which is prepared as previously described. The circuit assembly is a printed circuit board or a flexible circuit, but may also include, for example, a conductive ink print or screen pattern on an electrolyte layer 20. The circuit assembly 10 also typically includes a conventionally formed 40 of copper which is applied to the dielectric layer 20 by photomask engraving, sputtering, screen printing, and the like. The circuit 40 as before may also be formed of conductive ink which is applied to the dielectric layer 20 by, for example, a screen printing method. >le type and other parts of the forming offer g. More thermal conductivity, but more than a standard and a heat of $ good, the structure of the grain is usually located in the circuit brush or mentioned, brush or wire -28- 200810621 dielectric layer 20 can be printed As is well known in the circuit board industry, such as: glass fiber with resin (FR-4), preferably formed into a laminated 'plate; polytetrafluoroethylene (PTFE), commercially available Teflon brand materials; and expanded PTFE, sometimes labeled as ePTFE; and the impregnated or inhaled resin type of the above items. Additionally, dielectric layer 20 can be a polymer such as polyamidamine or polyester, as is used in the formation of flexible circuits. The dielectric layer 20 may also comprise a ceramic material, such as aluminum nitride, aluminum oxide, alumina, which is presented in the form of a separate layer or is laid through, for example, anode φ processing, vapor deposition, or flame spraying. On a substrate layer (e.g., heat spreader layer 30); the use of anodization is particularly relevant to the case where the heat spreader layer 30 is aluminum. Moreover, in some cases, it is preferred to at least partially enclose the heat spreader layer 30 or provide a coating on the surface of the heat spreader layer 30 so as to prevent particulate matter from the heat spreader layer 30. Peel off. For example, some people's opinion is that graphite materials are prone to flakes. Whether or not it is true, providing a cladding layer of a polymeric material such as My y 1 a r (typically at a level less than 2 〇 micron Φ) to prevent sheet flaking will be associated with the above-described teachings. In this case, the polymeric material can serve as the dielectric layer 20 of the circuit assembly 1 because the material used can be non-conductive and thin enough to not substantially interfere with thermal conduction to the heat spreader layer 3〇. Alternatively, an anodized layer may be used to inhibit spalling, while the anodized layer may also serve as dielectric layer 20. Preferably, the heat spreader layer 30 is from about 〇25 mm to about 25 mm' in thickness, more preferably from about 〇5 mm to about 14 mm in thickness, and includes one sheet to be from -29 to 200810621. Advantageously, the heat spreader layer 30 can be a laminate of up to 1 inch or more of graphite sheets to provide the desired heat dissipating ability. The graphite composite can be used to at least partially replace copper or other metals used as circuit assembly heat spreaders, and in the preferred embodiment can be completely replaced. Surprisingly, when the heat spreader layer 30 becomes black, for example by paint, especially when it is composed of one or more sheets of compressed, exfoliated graphite particles, improved heat is obtained. Resistance. In other words, where the surfaces of the graphite heat disperser layer 30 not adjacent to the dielectric layer 20 are black, the effective thermal resistance of the thermal path from the heat generating component is reduced. Although the exact cause of this situation is not known, it is generally believed that making the graphite heat disperser layer 30 black will improve the emissivity of the disperser layer 30, thereby improving the ability of the heat spreader layer 30 to dissipate heat. The heat spreader layer 30 need not necessarily be planar, but may also include one or more "bends" so as to form a three-dimensional shape. This is particularly advantageous where the circuit assembly 10 must be positioned on a different plane than the heat spreader layer 30. This configuration is used, for example, for an edge-lit liquid crystal display (LCD display) in which a plurality of LEDs are mounted on a circuit assembly 1 且 and in a plane having a confined space (ie, the thickness of the LCD display), and the heat is The diffuser layer 30 extends perpendicular to the LED mounting plane.
確實地,在本發明之一實施例中,熱分散器層30具 有一較大於介電質層20及任何位於其上之電路40的表面 積。在此情形下,介電質層20與(諸)熱產生組件50以 及(諸)電路40可位於一平面中(例如用於側光型LCD -30- 200810621 顯示器之LED平面),而熱分散器層30則如前述 伸展至另一平面內(例如一具有大約90°之彎曲的 面,如位於LCD顯示器之後平面中者),並因此 分散至其他平面內而達額外之消散。 石墨/介電質材料疊層板可藉由將若干介電質) 熱分散器層30例如以一在成形電路總成疊層板中 之方式並利用習知之黏著劑予以層疊在一起而被精 者,石墨/介電質材料疊層板可被形成爲預壓成之 並同時加壓固化諸石墨材料。在諸經植入之石墨板 環氧聚合物在固化時係足以將該結構之非石墨及 之石墨層黏結於適當位置中。不管如何,在較佳之 中,石墨複合物被用作爲電路總成1 0之熱分散器 以便可取代在一所謂「金屬背襯型」印刷電路板或 性電路中之銅或鋁熱分散器。 如前所提及,形成電路總成1 0之中央部分的 材料20具有兩個主要表面20a及20b。熱分散器乃 接介電質材料20之諸表面20a中之一者;另一表 已在其上設置至少一熱產生組件50,且經常有複 產生組件50a、50b、50c等,諸如LED、晶片組、 本技藝之人士所熟悉之其他組件。熱產生組件50 成可與電路40之一部分相接觸,而電路40則係平 上設有組件5 0之電路總成1 0的表面20b上。 某些製造商之LED包含熱嵌條以協助將熱自 身處消散;這些熱嵌條一般而言被認爲係帶電的。 般地可 垂直平 可將熱 罾20及 所習知 I成。或 堆疊, 片中之 經植入 實施例 層3 0, 在一軟 介電質 i 30鄰 :面 20b 數個熱 或熟習 被定位 置於其 LED本 因此, -31- 200810621 當此諸LED中之一個以上被設於電路總成10上時,必須 ^ 小心避免在該總成之兩或更多個LED上之諸嵌條間造成 、 短路;因此,諸個別之LED經常必須被電絕緣。 爲了促使熱從熱產生組件50傳遞至熱分散器層30 ’ 一熱通路60 (亦稱爲熱通道或只稱爲通道60)延伸穿過 熱分散器層30並鄰接熱產生組件50。有利地,通道60 亦延伸穿過介於各熱產生組件50與熱分散器層30之間的 電路總成1 0。雖然其他像鋁或經壓縮之已剝離石墨顆粒 φ 之其他高導熱性材料可被使用,但通道60仍包括一由諸 如銅或其合金之高導熱性材料所製成之嵌條或「鉚釘」。 「高導熱性」意指通道60在熱產生組件50與熱分散器層 30間之方向上的熱傳導率係較大於介電質層30之厚度貫 穿熱傳導率;較佳地,通道 60之熱傳導率係至少約 100W/m°K,更佳係至少約200W/m°K,甚至更佳係至少約 350W/m°K。雖照通道60最普遍地係呈圓柱形狀,但各通 道60仍可採用任何特定之截面形狀。 # 通道60可爲一單一整體元件,但亦可包括一個以上 之部分,諸如一對分開之部件,其被壓入配合或以其他方 式連接在一起,如下文中將配合第7至27圖而說明者。 此外,基於位置之考量,通道60可有利地具有一位在側 邊鄰接之介電質層上之肩部或階狀部61。如果需要電絕 緣,則一介電質層(諸如經陽極處理之鋁、氮化鋁、氧化 鋁或礬土等)可被安置於其上或通道60之所有表面上,像 經火焰熔射或汽相沉積之礬土被安置於銅上,或例如使用經 -32- 200810621 陽極處理之鋁作爲通道60。此外,通道60的表面能保持 爲可焊接的,或可被覆層以成爲可焊接的,藉而有利於將 " 熱產生組件50連接至通道60。 各通道60延伸至熱分散器層30內且與其成熱接觸。 例如,通道60可被裝配入一位於熱分散器層30中之狹縫 或孔內,此係利用熱黏著劑或壓力.配合,諸如所謂之「快 速螺帽」或推置螺帽,以便可確保通道60與熱分散器層 30間之良好熱接觸,並確保自通道60處之熱傳遞可穿過 φ 分散器層30之厚度。一使通道60被裝配入分散器層30 內以便可建立充分熱接觸之適當方式係強迫通道60通過 一位於分散器層30中之孔,其具有一較小於通道60直徑 之直徑,如以下配合例如第14、20、30及36圖所說明者; 在此方式中,強迫通道60通過該孔之動作將提供兩者間 之壓力配合。或者,位於分散器層30中之孔可藉由利用 通道60本身作爲一衝頭而被形成。經壓縮之已剝離石墨 顆粒之性質可允許該配合被完成,而不致對熱通道60或 • 熱分散器層3〇造成不當之損壞。 同樣地,通道60必需處於與熱產生組件50成良好熱 接觸之狀態。因此,通道60必需被熱連接或黏結至熱產 生組件50,此係藉由利用焊料、導熱膏、熱黏著劑,如 環氧樹脂、經壓縮之已剝離石墨顆粒的板片、或其他類似 物。因此,通道60較佳地延伸穿過電路總成1 〇,並被暴 露在電路總成1 0之表面處,其上則設置熱產生組件50。 因此,在此實施例中,通道60具有一長度,其大致等於 -33· 60 200810621 介電質層20與熱分散器層30之組合厚度,加上通道 自介電質層20或熱分散器層30處伸出之任一距離,如 ^ 2A圖中所示。或者,熱通道或導熱介電質材料可被用 從熱產生組件處熱傳遞至通道60,並使得通道6〇只延 通過熱分散器層30,以便將熱分散通過熱分散器層30 厚度;因此,在此情況下,通道60將具有一長度,其 致等於熱分散器層30之厚度,加上通道60自熱分散器 30處伸出之任何距離。 φ 爲了提供通道6 0與熱產生組件5 0間之良好熱接觸 通道60可如第2A圖中所示般地伸出至介電質層20之 面2 0b上方。或者,通道60可如第2B圖中所示般地放 成與介電質層20之表面20b齊平,或可如第2C圖中所 般地相對於介電質層2 0之表面2 0成凹入,而此將決定 熱產生組件5 0之性質,及用於提供通道6 0與熱產生組 50間之熱連接的較佳方法。 一用於提供通道60與熱分散器層30間良好熱接觸 Φ 有利方法係藉由使用一「鉚釘」型式通道60,如下文 配合第7至27圖所述者。在此一方式中,以相同於鉚 被壓縮以封抵基底之方法,一鉚釘型通道60可被壓縮 壓擠以封抵熱分散器層30之外表面(亦即未與介電質 鄰接之表面),此將形成兩者間之良好熱連接。 如前所提及,熱分散器層30被有利地層疊或黏結 介電質層20。然而,可預期到通道60之使用將使熱分 器層30與介電質層20之間存在一間隙,以便可最佳化 第 以 伸 之 大 層 表 置 示 於 件 之 中 釘 或 層 至 散 熱 -34- 200810621 消散。換言之,因爲熱產生組件5〇與熱分散器層30 熱傳遞主要係經由通道60而非經由介電質層20,故 散器層30並不需要與介電質層20接觸。因此,大至約 或甚至更大之間隙可例如藉由使用分隔件等(未示东 而被提供於熱分散器層30與介電質層20之間。在此 式中,假如熱分散器層30保持與通道60成熱接觸, 分散器層30之更多表面積會被暴露出,且更多之熱 此處被消散掉。簡要言之,在此一實施例中,熱分散 g 30可同時作爲一熱分散器及一熱消散籍片。 在第4圖所示之可替代實施例中,通道60可與 生組件50成爲一體。例如,如果一 LED被用作爲熱 組件50,則該LED可具有一延伸自其處之高導熱性 或鉚釘,其可接著延伸穿過電路總成1 〇並與熱分散 30成熱接觸(例如,如前述般地經由壓力配合或鉚 式之連接),以便有助於熱從該LED處分散至熱分 層30。 φ 在第6A及6B圖所示之另一實施例中,(諸) 60可出現在一延伸穿過熱分散器層30之收集條62, 之收集條62包括一長形件,其具有若千延伸自其處 上穿過介電質層20之個別通道單元64a、64b、64c 如第6B圖所示。或者,收集條可延伸穿過介電質層 同時諸個別通道單元延伸穿過熱分散器層30(未示於 在第5圖所示之另一實施例中,通道60可延伸 並超越熱分散器層30’以便可作爲另外之熱消散層 間之 熱分 1 mm 、圖) 一方 則熱 可從 器層 熱產 產生 嵌條 器層 釘型 散器 通道 其中 並向 等, 20, 圖)。 穿過 30a、 -35- 200810621 30b、3 0c等(例如,熱分散器層或熱消散鰭片)的支撐。 換言之’如果空間允許,通道60可延伸穿過熱分散器層 30,且其他熱分散器層或熱消散鰭片30a、3 0b、30c等(較 佳地亦係由經壓縮之已剝離石墨顆粒的板片所構成)可接 著被安置成與通道60呈熱接觸,且藉著一位在諸額外層 或鰭片30a、30b、30c等之間的氣隙,可提供額外之熱消 散。若干間隔件(未示於圖)可被用以維持諸層30a、30b、 30c等之分隔。 § 如第3圖所示,本發明在當電路總成係一軟性電路 1 00時係特別有用。因爲軟性電路1 00之性質,相較於經 壓縮之已剝離石墨板片呈相對地堅硬之傳統熱分散材料 係不實用的。然而,使用一或多片經壓縮之已剝離石墨板 片作爲熱分散器層30將可有效地將熱從熱產生組件50處 經由通道60而消散,不致嚴重地損及柔軟性。此外,因 爲各通道60通常係爲一不連續物件,故即使包含了複數 個通道60a、60b、60c亦將不會損及柔軟性。 φ 因此,藉由運用本發明,在一電路總成中之有效分散 將可達到一前所未見之程度,甚至在軟性電路情況中,及 甚至在熱源係LED的場合。 凸緣通道 .第7至27圖說明凸緣通道之構造,且說明組裝具有 石墨平面元件之凸緣通道的方法。 1. 低費用之熱鉚釘 在某些應用中,熱通道被允許或有必要突出至分散器 -36- 200810621 之表面上方。同樣地,在某些應用中則有必要降低分散器 之費用,同時卻仍嘗試.使通過分散器之熱流量達到最大。 " 這些衝突之目標可藉由在分散器中使用一凸緣化之鉚釘 型通道而達到,如第7圖所示。 在第7圖中,一熱管理系統被槪括地標示以元件符號 100。系統100包含一異向性石墨平面元件102,其具有第 一及第二相對向之平面表面104及106,並具有一形成於 此諸平面表面間之厚度108。平面元件102具有一相當高 φ 之平行於諸平面表面1 04及1 06的熱傳導率,及一相當低 之穿過厚度1 08的熱傳導率。平面元件1 〇2具有一貫穿其 中且位於諸平面表面1 0 4及1 0 6間之圓形凹穴或孔1 1 〇, 此凹穴100係由一圓筒形內穴壁112所界定。鉚釘型熱通 道114具有一圓柱形心柱116,其延伸穿過凹穴110並緊 密地啣合內凹穴壁112。通道114另包含一凸緣,其從心 柱Π 6處側向地延伸並緊密地啣合石墨平面元件1 〇 2之第 一平面表面1 04。 • 如前所提及,通道1 1 4較佳係由等向性材料所構成, 以便使來自熱源(例如1 20 )之熱可被傳導通過通道1 1 4, 並進入石墨平面元件102之厚度108中。通道114較佳係 由一選自由金、銀、銅、鋁及其合金所組成之群中的材料 所構成。異方性石墨平面元件1 〇2較佳係由經壓縮之已剝 離石墨顆粒所製成。 如第7圖中明顯展示的,鉚釘型通道丨丨4之凸緣端1 1 8 從石墨平面元件102之一側突出,而心柱U6則自石墨平 -37- 200810621 面元件1 02之另一側突出。鉚釘型通道1 1 4之大小被設定 成可使心柱1 1 6之直徑大到足以大致覆蓋熱源1 20之整個 ^ 表面。 凸緣通道114藉由壓置一市面上可購得之推置螺帽 122於通道114之心柱116上,而可相對於石墨平面元件 102被保持於適當位置。推置螺帽122並不需由與通道114 相同之材料所製成,因其不會促成熱傳遞;其唯一之目的 係可相對於石墨平面元件1 02將鉚釘型通道1 1 4保持於適 φ 當位置。推置螺帽1 22之內徑略小於心柱1 1 6之外徑,以 便使推置螺帽可與通道114之心柱116密切地接觸。通道 114之上端或自由端124接觸熱源120,且熱從熱源120 流入通道11 4之心柱1 1 6及凸緣1 1 8內。熱經由心柱1 1 6 之外徑與凸緣1.18之內側表面126兩者而被傳遞至石墨平 面元件102內。因爲凸緣118接觸與熱源120相對向之石 墨平面元件102的第一側104,故傳遞至石墨平面元件102 之熱達到最大。 # 將可察覺的是,在熱源120與心柱116的自由端124 之間具有一接觸面積,其可被稱爲一被界定在熱源120上 之熱傳導接觸面積。雖然熱源可適度地大於心柱1 1 6之自 由端1 24的面積,且本發明之優點一樣可實質地達到,但 該接觸面積仍較佳係小於心柱1 1 6之自由端1 24的面積。 推置螺帽122被容納於心柱116上方並與其成摩擦啣 合。推置螺帽122緊貼地啣合石墨平面元件i〇2之第二平 面表面106,以致使石墨平面元件1〇2被夾層於凸緣118 •38- 200810621 與推置螺帽122之間。在第7圖所示之實施例中,心柱116 之自由端124整個延伸穿過推置螺帽122。 ' 凸緣11 8之直徑與厚度應被選定成確保熱可良好地傳 遞至石墨平面元件102內。凸緣118之直徑亦應大到足以 使凸緣118不會在推置螺帽122被下壓時產生過度之壓力 或切入石墨平面元件102內。如果推置螺帽122之外徑無 法充分地增大以防止石墨平面元件1 02受過度壓力之損 壞,那麼一較大直徑之墊圈1 28可被用於推置螺帽1 22下 φ 方,如第7A圖所示。因爲墊圈128之使用主要係爲機械 之目的(亦即非用以傳導熱),故其可鬆驰地裝配在心柱 116上,且不需以與熱通道114相同之材料製成。 第8及9圖分別地顯示熱通道1 1 4之詳細平面及正視 圖。第1 0及1 1圖則分別地顯示推置螺帽1 22之詳細平面 及正視圖。 最佳如第12圖所顯示,爲可使用鉚釘型熱通道114, 孔1 1 0較佳地被模切入石墨平面元件1 02內。模切產生一 • 孔徑,其具有一與其有關之大公差。爲可確保熱通道114 與石墨平面元件1 02間之良好熱傳遞,該模切孔1 1 〇之直 徑1 3 0較佳地被選定成使得藉模切所得之最大孔仍略小於 熱通道1 1 4之心柱1 1 6的外徑。 最佳如第1 4圖所示,在孔,1 1 0被模切入石墨平面元 件102內之後,通道1 14之心柱1 1 6被如第14圖中所示 般地向上推並穿過孔1 1 0。因爲通道1 1 4之心柱1 1 6具有 一略大於孔110之直徑,故石墨將會在心柱116周圍呈覃 -39- 200810621 狀向上,藉以形成一環形蕈狀突出部132。 爲確保良好之熱傳遞,此蕈狀突出部1 3 2接 一如第14圖中所示之衝頭134下壓在蕈狀突出 而被強迫向下成與石墨平面元件102之頂表面或 表面106相齊平。衝頭134在其中具有一圓筒狀 其尺寸係略大於心柱1 1 6之外徑。 在蕈狀突出部1 3 2已被壓平之後,推置螺帽 置在心柱11 6之自由端1 24上,並被強迫下壓抵 面元件之心柱1 1 6至如第7圖之最終總成中所开 類似於第14圖中所示之衝頭1 34且具有一較大 納推置螺帽1 22之突起部分的另一衝頭(未示於 用以達成推置螺帽122在心柱116之放置。應有 被用以將石墨平面元件· 1 02穩固地夾定於推置螺 鉚釘凸緣1 1 8之間,以便可確保熱可良好地傳遞 凸緣1 1 8。 雖然在第7至14圖中所示之範例中,孔1 且心柱亦爲圓形或圓柱形,但應了解的是亦可用 面形狀。更槪括地說,孔110可被描述成具有一 1 其具有一與石墨平面元件102之平面相平行之最 寸,而在此情形下之最大截面尺寸即爲第12圖 直徑130。同樣地,通道114之心柱116可被描 一截面形狀,其與孔110之截面形狀互補’且具 範例中係心柱1 1 6之外徑直徑的最小截面尺寸’ 孔110之最大截面尺寸130。或者,如果孔110 著藉由以 部132上 第二平面 凹部1 3 6, 122被放 住石墨平 ;之位置。 凹部以容 ‘圖)可被 足夠之力 丨帽122與 穿過鉚釘 1 0係圓形 其他之截 說面形狀, 大截面尺 中所見之 述成具有 有一在本 其較大於 較大於心 -40- 200810621 柱Π 6,則在其之間的間係應被塡充以導熱膏或類似物, 以便可使石墨平面元件1 02與通道114間之熱傳遞達到最 大。 2. 具雙凸緣之凸緣涌措 如前所提及,在某些應用中,通道有必要突出至石墨 熱分散器元件之表面上方,以便使其可接觸熱源。此外, 在非常高性能之應用中,儘可能地將通道與周圍石墨材料 間之熱阻減到最小係很重要的。此可藉由倂合一亦可被稱 爲雙凸緣通道(諸如第15圖中所示者)之圓形凸緣通道 及墊圈總成而達到。 在第1 5圖中,本發明之一可替代實施例包含一熱管 理系統,其槪括地被標以元件符號200。熱管理系統200 包括一石墨平面元件202,其類似於第7圖中所示之石墨 平面元件102。石墨平面元件202具有相對向之第一及第 二主要平面表面204及206。厚度208被界定於諸表面204 及206之間。由內壁212所界定之孔210係穿過石墨平面 元件202而成形。系統200包含一熱通道214,其在此例 中係由第一及第二部分215及217所構成。第一部分215 包括心柱2 1 6及第一凸緣2 1 8。 在此情形中,熱通道214藉由第二部分217 (亦可被 稱爲一墊圈或第二凸緣2 1 7 )而可被裝固於石墨平面元件 202上之適當位置。第二凸緣217係由與通道214之第一 部分215的心柱=216及第一凸緣218相同之材料所製成。 第18及19圖分別顯示第二凸緣217之詳細平面圖及 -41- 200810621 剖面正視圖。第二凸緣217具有一內徑219,其被選 略小於心柱2 1 6之外徑,以便使第二凸緣2 1 7之內徑 ~ 可與心柱2 1 6密切接觸,其中第二凸緣2 1 7被壓入配 心柱2 1 6上。較佳地,第二凸緣2 1 7之外徑槪略地相 第一凸緣218之外徑。心柱216之長度221之大小被 成使得石墨平面元件202將被壓縮於第一及第二凸緣 及217之間,以便使第一及第二凸緣218及217兩者 墨平面元件202成密切之熱傳導啣合。 φ 雖然熱通道2 1 4之第一及第二部分2 1 5及2 1 7已 述成較佳係藉由將第二部分217壓入配合於第一部分 上而被被組裝,但將可察覺的是亦可利用其他之組 術。例如,第二部分2 1 7可被緊縮配合於心柱2 1 6上 兩部分可被焊接在一起。 在第1 5至19圖所示之實施例中,心柱2 1 6具有 成於其上且面朝背離第一凸緣2 1 8之心柱肩部223。 地,第二凸緣217之內孔219具有一形成於其上且與 • 肩部22 3互補並鄰接之凸緣肩部22 5。 在第15A圖中顯示雙凸緣熱管理系統之一可替 施例,其槪括地被標示以元件符號200A。熱管理系統 係相同於第15圖中所示之熱管理系統200,除了第二 217A之設計被修改成使其可呈蓋狀且具有一盲孔, 代具有一穿孔之墊圈形狀。在其他方面,以上針對| 圖中所示之熱管理系統200所作之敘述可對等地適用 15A圖中所示之熱管理系統200A。 疋爲 219 合於 同於 設定 :218 與石 被描 ‘215 裝技 ,或 一形 同樣 心柱 代實 200A 凸緣 以取 I 15 於第 -42- 200810621 憑藉著第15至19圖之雙凸緣通道214,一諸如220 之熱源可接的第一凸緣218或第二凸緣。較佳地,心柱216 將具有一至少與熱源220之外徑或最大尺寸一樣大之直 徑,以便可有效地協助熱傳遞遍及熱源220與通道2 1 4之 間的整個接觸面積。 憑藉著第1 5至1 9圖之雙凸緣通道214,熱經由心柱 2 1 6之外徑與諸凸緣2 1 8及2 1 7之內徑而被傳遞至石墨平 面元件202內。相對照於第7圖中所示僅將熱傳遞通過心 柱及一個凸緣之單凸緣通道,因本雙凸緣通道設計而自然 形成之大量位於通道214與石墨平面元件202間之接觸表 面將使得傳遞至石墨平面元件202之熱可達到最大。 當第二凸緣217與通道214之第一部分215被組裝 時,諸肩部225及223將對接在一起。心柱216之較大直 徑部分的長度227被選定成較小於石墨平面元件202之厚 度208,以便可確保當第二凸緣217被壓至第一部分215 上且諸肩部225及223對接在一起時,在諸凸緣218及217 間之環狀石墨面積將被處於壓縮狀態下。此確保熱從諸凸 緣218及217良好地傳遞至石墨平面元件202內。 第20圖顯示通道214之第一部分215被安裝在石墨 平面元件202內之適當位置處。石墨平面元件20 2具有以 一類似於先前配合第12圖所述之石墨平面元件102者之 方式而被模切成形於其內之孔2 1 0。再者,此模切孔2 1 0 之直徑被選定成使因而可得之最大孔仍略小於心柱2 1 6之 較大部分的第小可能直徑。熱通道214之第一部分215如 •43- 200810621 第20圖中所示般地被向上推至石墨平面元件202之? 內,再次地形成一環形蕈狀突出部232。爲確保良好 傳遞,此蕈狀突出部232藉由如第20圖所示之衝頭 而被強制向下成與石墨平面元件202之頂表面206齊 此外,衝頭234具有一圓筒形凹部236於其中,而此 之大小被設定成略大於心柱2 1 6之最大外徑。 在覃狀突出部232已被壓平之後,第二凸緣217 置在心柱216之端部上,且足夠的力被施以將第二 217向下推至心柱216上,直到諸肩部223及225彼 抵爲止。 諸凸緣218及217之直徑及厚度應被予選定,以 保熱可良好地傳遞至石墨平面元件202內。這些直徑 大到足以使諸凸緣218及217,在當第二凸緣217被 在心柱216上時,不會產生過度之壓力或切入石墨平 件中。 第21.至24圖顯示雙凸緣通道21 4A之第二種設 其再次包含第一部分215A及第二部分217A。與第 17圖相較,唯一之差異在於本實施例中並無肩部被 成心柱2 1 6 A。用以取代地,心柱2 1 6 A係爲一在其上 處具有一個小去角之直圓筒形心柱。同樣地,第二 217A具有一貫穿其中之直圓柱孔219A。心柱216A之 略大於第二凸緣217A之內徑21 9A,因而提供了心柱 與第二墊圈2 1 7 A間之干涉配合。在組裝處,一實心 (未示於圖)被用以強迫第二凸緣21 7A向下至心柱Indeed, in one embodiment of the invention, the heat spreader layer 30 has a surface area that is larger than the dielectric layer 20 and any circuitry 40 located thereon. In this case, the dielectric layer 20 and the heat generating component(s) 50 and the circuit(s) 40 can be located in a plane (eg, for the LED plane of the side-lit LCD-30-200810621 display), while thermally dispersing The layer 30 then stretches into another plane as previously described (e.g., a face having a curvature of about 90°, such as in a plane behind the LCD display), and thus dispersed into other planes for additional dissipation. The graphite/dielectric material laminate can be refined by laminating a plurality of dielectric heat disperser layers 30, for example, in a laminated circuit board of a forming circuit assembly and using conventional adhesives. The graphite/dielectric material laminate may be formed to be pre-compressed and simultaneously pressurize and cure the graphite materials. The implanted graphite sheet epoxy polymer is sufficient to bond the non-graphite and graphite layers of the structure to the proper location when cured. In any event, preferably, the graphite composite is used as a thermal disperser for the circuit assembly 10 to replace a copper or aluminum heat spreader in a so-called "metal backed" printed circuit board or circuit. As mentioned previously, the material 20 forming the central portion of the circuit assembly 10 has two major surfaces 20a and 20b. The heat spreader is one of the surfaces 20a of the dielectric material 20; the other meter has been provided with at least one heat generating component 50 thereon, and often has replica generating components 50a, 50b, 50c, etc., such as LEDs, Chipsets, other components familiar to those skilled in the art. The heat generating assembly 50 is in contact with a portion of the circuit 40, and the circuit 40 is mounted on the surface 20b of the circuit assembly 10 of the assembly 50. Some manufacturers' LEDs contain hot fillets to help dissipate the heat itself; these hot fillets are generally considered to be charged. In general, the heat can be made horizontally and the conventional one can be formed. Or stacked, in the slice implanted embodiment layer 30, in a soft dielectric i 30 o: face 20b several heat or familiar are placed in their LEDs therefore, -31- 200810621 when these LEDs When more than one is provided on the circuit assembly 10, care must be taken to avoid shorting between the slugs on the two or more LEDs of the assembly; therefore, the individual LEDs often must be electrically insulated. To facilitate the transfer of heat from the heat generating assembly 50 to the heat spreader layer 30', a heat path 60 (also referred to as a hot channel or simply channel 60) extends through the heat spreader layer 30 and abuts the heat generating assembly 50. Advantageously, the passage 60 also extends through the circuit assembly 10 between the respective heat generating assemblies 50 and the heat spreader layer 30. While other highly thermally conductive materials such as aluminum or compressed exfoliated graphite particles φ can be used, the channel 60 still includes a fillet or "rivet" made of a highly thermally conductive material such as copper or its alloy. . By "high thermal conductivity" is meant that the thermal conductivity of the channel 60 in the direction between the heat generating component 50 and the heat spreader layer 30 is greater than the thickness of the dielectric layer 30 throughout the thermal conductivity; preferably, the thermal conductivity of the channel 60 It is at least about 100 W/m °K, more preferably at least about 200 W/m °K, and even more preferably at least about 350 W/m °K. Although channel 60 is most generally cylindrical in shape, each channel 60 can take any particular cross-sectional shape. #通道 60 may be a single integral component, but may also include more than one portion, such as a pair of separate components that are press fit or otherwise joined together, as will be described below in conjunction with Figures 7-27. By. Moreover, based on location considerations, the channel 60 can advantageously have a shoulder or step 61 on a side adjacent dielectric layer. If electrical insulation is required, a dielectric layer (such as anodized aluminum, aluminum nitride, alumina or alumina, etc.) can be placed thereon or on all surfaces of the channel 60, such as by flame spraying or The vapor deposited alumina is placed on the copper or, for example, the aluminum treated with -32-200810621 anodized as the channel 60. In addition, the surface of the channel 60 can remain solderable or can be coated to be solderable, thereby facilitating the attachment of the "heat generating assembly 50 to the channel 60. Each channel 60 extends into and is in thermal contact with the heat spreader layer 30. For example, the channel 60 can be assembled into a slit or hole in the heat spreader layer 30, which utilizes a thermal adhesive or pressure fit, such as a so-called "fast nut" or push nut, so that Ensure good thermal contact between the channel 60 and the heat spreader layer 30 and ensure that heat transfer from the channel 60 can pass through the thickness of the φ diffuser layer 30. A suitable way for the channel 60 to be assembled into the diffuser layer 30 so as to establish sufficient thermal contact is to force the passage 60 through a hole in the diffuser layer 30 having a diameter smaller than the diameter of the passage 60, such as For example, as illustrated in Figures 14, 20, 30 and 36; in this manner, the action of forcing passage 60 through the aperture will provide a pressure fit between the two. Alternatively, the apertures in the diffuser layer 30 can be formed by utilizing the channel 60 itself as a punch. The nature of the compressed exfoliated graphite particles allows the mating to be accomplished without undue damage to the hot aisle 60 or the heat disperser layer 3〇. Likewise, the passage 60 must be in good thermal contact with the heat generating assembly 50. Therefore, the channel 60 must be thermally bonded or bonded to the heat generating assembly 50 by using solder, a thermal paste, a thermal adhesive such as an epoxy resin, a sheet of compressed exfoliated graphite particles, or the like. . Accordingly, the passage 60 preferably extends through the circuit assembly 1 〇 and is exposed at the surface of the circuit assembly 10, on which the heat generating assembly 50 is disposed. Thus, in this embodiment, the channel 60 has a length that is substantially equal to -33.60 200810621 The combined thickness of the dielectric layer 20 and the heat spreader layer 30, plus the channel self-dielectric layer 20 or heat spreader Any distance from the layer 30, as shown in Fig. 2A. Alternatively, the hot aisle or thermally conductive dielectric material can be transferred from the heat generating assembly to the passage 60 and the passage 6 〇 extends only through the heat disperser layer 30 to disperse heat through the thickness of the heat disperser layer 30; Thus, in this case, the passage 60 will have a length that is equal to the thickness of the heat spreader layer 30, plus any distance that the passage 60 extends from the heat spreader 30. φ To provide good thermal contact between the channel 60 and the heat generating component 50. The channel 60 can extend above the face 20b of the dielectric layer 20 as shown in Fig. 2A. Alternatively, the channel 60 may be placed flush with the surface 20b of the dielectric layer 20 as shown in FIG. 2B, or may be opposite the surface of the dielectric layer 20 as shown in FIG. 2C. It is recessed and this will determine the nature of the heat generating component 50 and a preferred method for providing a thermal connection between the channel 60 and the heat generating group 50. One is to provide good thermal contact between the channel 60 and the heat spreader layer 30. The advantageous method is by using a "rivet" type channel 60, as described below in conjunction with Figures 7-27. In this manner, a rivet-type passage 60 can be compression-compressed to seal against the outer surface of the heat spreader layer 30 (i.e., not adjacent to the dielectric), in the same manner as the rivet is compressed to seal against the substrate. Surface), which will form a good thermal connection between the two. As mentioned previously, the heat spreader layer 30 is advantageously laminated or bonded to the dielectric layer 20. However, it is contemplated that the use of the channel 60 will result in a gap between the heat divider layer 30 and the dielectric layer 20 so that the large layer of the stretched layer can be optimized to be placed in the piece of the pin or layer to dissipate heat - 34- 200810621 Dissipation. In other words, since the heat transfer between the heat generating component 5 and the heat spreader layer 30 is primarily via the channel 60 rather than via the dielectric layer 20, the diffuser layer 30 does not need to be in contact with the dielectric layer 20. Therefore, a gap of up to about or even larger can be provided between the heat spreader layer 30 and the dielectric layer 20, for example, by using a separator or the like (not shown in the east). In this formula, if it is a heat spreader Layer 30 remains in thermal contact with channel 60, more surface area of diffuser layer 30 is exposed, and more heat is dissipated therefrom. Briefly, in this embodiment, heat dispersion g 30 can At the same time, as a heat disperser and a heat dissipating piece. In an alternative embodiment shown in Fig. 4, the channel 60 can be integrated with the green component 50. For example, if an LED is used as the thermal component 50, then The LED can have a high thermal conductivity or rivet extending therefrom that can then extend through the circuit assembly 1 〇 and in thermal contact with the thermal dispersion 30 (eg, via a press fit or riveted connection as previously described) In order to facilitate heat dispersion from the LED to the thermal stratification 30. φ In another embodiment illustrated in Figures 6A and 6B, the 60(s) may be present in a collection extending through the heat spreader layer 30. Strip 62, the collecting strip 62 includes an elongated member having a thousand extensions extending from there The individual channel elements 64a, 64b, 64c of the dielectric layer 20 are as shown in Figure 6B. Alternatively, the collector strips may extend through the dielectric layer while the individual channel units extend through the heat spreader layer 30 (not shown) In another embodiment, shown in Figure 5, the channel 60 can extend and extend beyond the heat spreader layer 30' so that it can be used as another heat dissipation layer between the heat points of 1 mm, Figure 1 and the heat can be thermally produced from the layer. The inserter layer pin-shaped diffuser channel is generated and the direction is equal, 20, Fig.). Support through 30a, -35-200810621 30b, 30c, etc. (eg, a heat spreader layer or a heat dissipating fin). In other words, if space permits, the channel 60 can extend through the heat spreader layer 30, and other heat spreader layers or heat dissipation fins 30a, 30b, 30c, etc. (preferably also from compressed exfoliated graphite particles) The slabs can then be placed in thermal contact with the channel 60, and additional heat dissipation can be provided by an air gap between the additional layers or fins 30a, 30b, 30c, and the like. A plurality of spacers (not shown) may be used to maintain separation of the layers 30a, 30b, 30c, and the like. § As shown in Figure 3, the present invention is particularly useful when the circuit assembly is a flexible circuit 100. Because of the nature of the flexible circuit 100, conventional heat dissipating materials that are relatively rigid compared to the compressed exfoliated graphite sheets are not practical. However, the use of one or more compressed exfoliated graphite sheets as the heat spreader layer 30 will effectively dissipate heat from the heat generating assembly 50 via passage 60 without severely compromising softness. In addition, since each of the channels 60 is generally a discontinuous article, even if a plurality of channels 60a, 60b, 60c are included, the flexibility will not be compromised. φ Thus, by utilizing the present invention, effective dispersion in a circuit assembly can be achieved to an unprecedented level, even in the case of flexible circuits, and even in the case of heat source LEDs. Flange passages. Figures 7 through 27 illustrate the construction of the flange passage and illustrate a method of assembling a flange passage having a graphite planar member. 1. Low cost hot rivets In some applications, the hot aisle is allowed or necessary to protrude above the surface of the diffuser -36- 200810621. Similarly, in some applications it is necessary to reduce the cost of the disperser while still attempting to maximize the heat flow through the disperser. " The goal of these conflicts can be achieved by using a flanged rivet-type channel in the diffuser, as shown in Figure 7. In Fig. 7, a thermal management system is indicated by the symbol 100. System 100 includes an anisotropic graphite planar element 102 having first and second opposing planar surfaces 104 and 106 and having a thickness 108 formed between the planar surfaces. The planar element 102 has a relatively high φ parallel to the planar surfaces 104 and 106 and a relatively low thermal conductivity through the thickness 108. The planar element 1 〇 2 has a circular recess or hole 1 1 贯穿 therethrough and located between the planar surfaces 10 4 and 106, the recess 100 being defined by a cylindrical inner cavity wall 112. The rivet-type thermal passage 114 has a cylindrical stem 116 that extends through the pocket 110 and tightly engages the inner pocket wall 112. The passage 114 further includes a flange that extends laterally from the stem 6 and closely engages the first planar surface 104 of the graphite planar member 1 〇 2 . • As mentioned previously, the channel 141 is preferably constructed of an isotropic material such that heat from a heat source (e.g., 1 20) can be conducted through the channel 1 14 and into the thickness of the graphite planar element 102. 108. Channel 114 is preferably comprised of a material selected from the group consisting of gold, silver, copper, aluminum, and alloys thereof. The anisotropic graphite planar element 1 〇 2 is preferably made of compressed exfoliated graphite particles. As is apparent from Fig. 7, the flange end 1 1 8 of the rivet-type channel 丨丨 4 protrudes from one side of the graphite planar member 102, and the stem U6 is self-contained from the graphite flat-37-200810621 surface element 102 One side stands out. The rivet-type channel 1 14 is sized such that the diameter of the stem 1 16 is large enough to substantially cover the entire surface of the heat source 120. The flange passage 114 is held in position relative to the graphite planar member 102 by pressing a commercially available push nut 122 on the stem 116 of the passage 114. The push nut 122 does not need to be made of the same material as the channel 114 because it does not contribute to heat transfer; its sole purpose is to maintain the rivet type channel 1 1 4 relative to the graphite planar element 102. φ is the position. The inner diameter of the push nut 1 22 is slightly smaller than the outer diameter of the stem 1 16 so that the push nut can be in intimate contact with the stem 116 of the passage 114. The upper end or free end 124 of the passage 114 contacts the heat source 120, and heat flows from the heat source 120 into the stem 1 16 and the flange 1 18 of the passage 11 4 . Heat is transferred into the graphite planar element 102 via both the outer diameter of the stem 1 16 and the inner side surface 126 of the flange 1.18. Because the flange 118 contacts the first side 104 of the graphite planar element 102 opposite the heat source 120, the heat transferred to the graphite planar element 102 is maximized. # It will be appreciated that there is a contact area between the heat source 120 and the free end 124 of the stem 116, which may be referred to as a thermally conductive contact area defined on the heat source 120. Although the heat source may be moderately larger than the area of the free end 1 24 of the stem 1 16 and the advantages of the present invention are substantially achieved, the contact area is preferably less than the free end 1 24 of the stem 1 16 area. The push nut 122 is received over and in frictional engagement with the stem 116. The push nut 122 abuts the second planar surface 106 of the graphite planar element i〇2 such that the graphite planar element 1〇2 is sandwiched between the flange 118•38-200810621 and the push nut 122. In the embodiment illustrated in FIG. 7, the free end 124 of the stem 116 extends entirely through the push nut 122. The diameter and thickness of the flange 11 8 should be selected to ensure that heat is well transferred into the graphite planar member 102. The diameter of the flange 118 should also be large enough that the flange 118 does not create excessive pressure or cut into the graphite planar member 102 when the push nut 122 is depressed. If the outer diameter of the push nut 122 is not sufficiently increased to prevent the graphite planar element 102 from being damaged by excessive pressure, a larger diameter washer 1 28 can be used to push the lower radius φ of the nut 1 22, As shown in Figure 7A. Because the gasket 128 is used primarily for mechanical purposes (i.e., not for conducting heat), it can be loosely assembled to the stem 116 and does not need to be made of the same material as the hot aisle 114. Figures 8 and 9 show the detailed plane and front view of the hot aisle 1 1 4, respectively. The 10th and 1st drawings respectively show the detailed plane and front view of the push nut 1 22 . Preferably, as shown in Fig. 12, in order to use the rivet type hot aisle 114, the aperture 110 is preferably die cut into the graphite planar element 102. Die cutting produces an aperture that has a large tolerance associated with it. In order to ensure good heat transfer between the hot aisle 114 and the graphite planar element 102, the diameter of the die-cut hole 1 1 1 1 3 0 is preferably selected such that the largest hole obtained by die-cutting is still slightly smaller than the hot aisle 1 1 4 of the heart column 1 1 6 outer diameter. Preferably, as shown in Fig. 14, after the hole, 110 is die cut into the graphite planar member 102, the stem 1 16 of the channel 14 is pushed up and passed through as shown in Fig. 14. Hole 1 1 0. Since the stem 1 1 6 of the channel 1 14 has a diameter slightly larger than the diameter of the hole 110, the graphite will be in the shape of 覃 -39-200810621 around the stem 116, thereby forming an annular beak-like projection 132. To ensure good heat transfer, the beak-like projections 132 are pressed down into the dome-like projections as shown in Fig. 14 and forced downwardly to the top surface or surface of the graphite planar member 102. 106 is flush. The punch 134 has a cylindrical shape therein and has a size slightly larger than the outer diameter of the stem 1 16 . After the beak-like projection 1 3 2 has been flattened, the push-on nut is placed on the free end 1 24 of the stem 11 6 and forced to press against the stem of the facing element 1 16 to FIG. 7 Another punch in the final assembly that is similar to the punch 134 shown in Figure 14 and has a raised portion of the larger push nut 1 22 (not shown for achieving the push nut) 122 is placed in the stem 116. It should be used to firmly clamp the graphite planar member 0.02 between the push screw rivet flanges 1 18 to ensure that the heat can be transmitted well to the flange 1 18 . Although in the example shown in Figures 7 to 14, the hole 1 and the stem are also circular or cylindrical, it should be understood that the shape of the face can also be used. More generally, the hole 110 can be described as having A 1 has an inch parallel to the plane of the graphite planar element 102, and in this case the largest cross-sectional dimension is the diameter 130 of Figure 12. Similarly, the stem 116 of the channel 114 can be depicted in a cross-sectional shape. , which is complementary to the cross-sectional shape of the hole 110 and has the smallest cross-sectional dimension of the outer diameter of the stem 1 1 6 in the example. Inch 130. Alternatively, if the hole 110 is held by the second planar recess 1 3 6, 122 on the portion 132, the position of the graphite flat; the recess can be sufficiently strong to cap 122 and pass through The rivet 10 is rounded and the other cross-sectional shape, as seen in the large-section ruler, has a larger than the heart -40 - 200810621, and the inter-system between them should be smashed. It is filled with a thermal paste or the like to maximize heat transfer between the graphite planar member 102 and the passage 114. 2. Flange surge with double flanges As mentioned earlier, in some applications it is necessary for the channel to protrude above the surface of the graphite heat spreader element so that it can contact the heat source. In addition, in very high performance applications, it is important to minimize the thermal resistance between the channel and the surrounding graphite material. This can be achieved by a circular flange channel and washer assembly that can also be referred to as a dual flange channel (such as shown in Figure 15). In Fig. 15, an alternative embodiment of the present invention includes a thermal management system, which is collectively labeled with the component symbol 200. Thermal management system 200 includes a graphite planar element 202 that is similar to graphite planar element 102 shown in FIG. The graphite planar element 202 has opposing first and second major planar surfaces 204 and 206. Thickness 208 is defined between surfaces 204 and 206. A hole 210 defined by the inner wall 212 is formed through the graphite planar member 202. System 200 includes a hot aisle 214, which in this example is comprised of first and second portions 215 and 217. The first portion 215 includes a stem 2 16 and a first flange 2 18 . In this case, the hot aisle 214 can be secured to the graphite planar member 202 by a second portion 217 (which can also be referred to as a gasket or second flange 2 17). The second flange 217 is made of the same material as the stem 216 of the first portion 215 of the passage 214 and the first flange 218. Figures 18 and 19 show a detailed plan view of the second flange 217 and a cross-sectional front view of -41-200810621, respectively. The second flange 217 has an inner diameter 219 which is selected to be slightly smaller than the outer diameter of the stem 2 16 so that the inner diameter of the second flange 2 17 can be in close contact with the stem 2 16 , wherein The two flanges 2 1 7 are pressed into the dosing column 2 16 . Preferably, the outer diameter of the second flange 2 17 is slightly opposite the outer diameter of the first flange 218. The length 221 of the stem 216 is sized such that the graphite planar member 202 will be compressed between the first and second flanges 217 such that the first and second flanges 218 and 217 are both ink planar members 202. Close heat transfer. φ although the first and second portions 2 1 5 and 2 17 of the hot aisle 2 1 4 have been described as being preferably assembled by press fitting the second portion 217 into the first portion, but will be detectable It is also possible to use other groups of techniques. For example, the second portion 2 17 can be tightened onto the stem 2 1 6 and the two portions can be welded together. In the embodiment illustrated in Figures 15 through 19, the stem 2 16 has a stem shoulder 223 formed thereon and facing away from the first flange 2 1 8 . The inner bore 219 of the second flange 217 has a flange shoulder 22 formed thereon and complementary to and abutting the shoulder 22 3 . An alternative embodiment of the dual flange thermal management system is shown in Fig. 15A, which is collectively labeled with the component symbol 200A. The thermal management system is the same as the thermal management system 200 shown in Fig. 15, except that the design of the second 217A is modified such that it can be capped and has a blind hole with a perforated washer shape. In other respects, the above description of the thermal management system 200 shown in the Figure can be applied equally to the thermal management system 200A shown in Figure 15A.疋 219 is the same as the setting: 218 and the stone is depicted as '215 loading technique, or the same heart column is the same as the 200A flange to take I 15 on the -42- 200810621 by the 15th to 19th The edge channel 214 is a first flange 218 or a second flange to which a heat source such as 220 can be attached. Preferably, the stem 216 will have a diameter that is at least as large as the outer or maximum dimension of the heat source 220 to effectively assist heat transfer throughout the entire contact area between the heat source 220 and the channel 2 14 . By virtue of the double flange passages 214 of Figures 15 to 19, heat is transferred into the graphite planar member 202 via the outer diameter of the stems 2 16 and the inner diameters of the flanges 2 18 and 2 17 . In contrast to the single flange channel, which transfers heat only through the stem and a flange, as shown in Figure 7, a large number of contact surfaces naturally formed between the channel 214 and the graphite planar member 202 are formed by the dual flange channel design. The heat transferred to the graphite planar element 202 will be maximized. When the second flange 217 is assembled with the first portion 215 of the passage 214, the shoulders 225 and 223 will be butted together. The length 227 of the larger diameter portion of the stem 216 is selected to be smaller than the thickness 208 of the graphite planar member 202 to ensure that when the second flange 217 is pressed onto the first portion 215 and the shoulders 225 and 223 are docked at Together, the annular graphite area between the flanges 218 and 217 will be in a compressed state. This ensures that heat is well transferred from the flanges 218 and 217 into the graphite planar element 202. Figure 20 shows that the first portion 215 of the channel 214 is mounted at a suitable location within the graphite planar element 202. The graphite planar element 20 2 has a hole 2 1 0 that is die cut into it in a manner similar to that previously described with the graphite planar element 102 described in Fig. 12. Moreover, the diameter of the die cut hole 2 10 is selected such that the largest hole thus available is still slightly smaller than the third possible diameter of the larger portion of the stem 2 16 . The first portion 215 of the hot aisle 214 is pushed up to the graphite planar element 202 as shown in Fig. 20 of 2008-200810621. Inside, an annular beak-like projection 232 is formed again. To ensure good transmission, the beak-like projection 232 is forced downwardly to be flush with the top surface 206 of the graphite planar member 202 by a punch as shown in Fig. 20, the punch 234 having a cylindrical recess 236 Wherein, the size is set to be slightly larger than the maximum outer diameter of the stem 2 1 6 . After the beak-like projection 232 has been flattened, the second flange 217 is placed on the end of the stem 216 and sufficient force is applied to push the second 217 down onto the stem 216 until the shoulders 223 and 225 arrived. The diameters and thicknesses of the flanges 218 and 217 should be selected to provide good heat transfer into the graphite planar member 202. These diameters are large enough that the flanges 218 and 217 do not create excessive pressure or cut into the graphite flat when the second flange 217 is placed on the stem 216. Figures 21 through 24 show a second arrangement of the dual flange channel 21 4A which again includes a first portion 215A and a second portion 217A. Compared with Fig. 17, the only difference is that no shoulder is formed into the stem 2 1 6 A in this embodiment. Instead, the stem 2 1 6 A is a straight cylindrical stem with a small chamfer on it. Similarly, the second 217A has a straight cylindrical bore 219A therethrough. The stem 216A is slightly larger than the inner diameter 21 9A of the second flange 217A, thus providing an interference fit between the stem and the second washer 2 17 A. At the assembly, a solid (not shown) is used to force the second flange 21 7A down to the stem
L 210 之熱 Ϊ 234 〔平 〇 凹部 被安 凸緣 此承 ,便確 亦應 下壓 面元 計, 16及 機製 端部 凸緣 直徑 216A 衝頭 216A -44- 200810621 上。動作在當第二凸緣217A之上表面229與心柱21 6A之 上端部231齊平時便停止。爲可控制位於第一及第二凸緣 ^ 218A及217A間之石墨平面元件的壓縮量,心柱216A之 長度233及第二凸緣217A之厚度235將被管制。 3. 齊平式熱通道 前述之熱通道全都具有一或兩個突出於石墨平面元 件之表面上方的凸緣。然而,在某些應用中,熱分散器卻 有必要具有一完全齊平之面,亦即並無熱通道之部分可突 φ 出於石墨平面元件之表面上方。這些目標可利用一如第 25圖所示之已被埋置在石墨分散器中之熱通道而達成。 第25圖顯示一包括石墨平面元件302之熱管理系統 3 00,而此石墨平面元件則具有第一及第二主要平面表面 304及306。石墨平面元件302具有一被界定於諸表面304 及306間之厚度308。一由內壁312所界定之孔310係穿 過石墨平面元件302之厚度而形成。 熱通道3 1 4被容納於孔3 1 0中。在此一實施例中,通 Φ 道314係一在其上及下端部3 20及3 22上具有去角316及 3 18之圓盤,最佳如第26及27圖所示。如下文中將進一 步敘述的,在第25圖所示之此一具有被埋置在石墨平面 元件302內之盤形熱通道314的構造中,石墨材料緊密地 配合盤形熱通道314,並疊置在熱通道314之去角316及 318上。通道314具有其上及下端320及322,其分別與 石墨平面元件302之第二主要平面表面306及第一主要平 面表面304齊平。此構造在通道314與石墨平面元件302 -45- 200810621 之間增加了熱傳遞並提供了機械連結。 盤形熱通道314具有一厚度,其大體上相等於石墨平 面元件3 02之厚度308。 第28、29、30圖係一系列方法之說明性圖式,其中 顯示盤形熱通道314被埋置在石墨平面元件302內。再一 次地,石墨平面元件302具有在其中模切成形之孔310。 此模切孔3 1 0之尺寸被選定爲可使得在給定之相關公差 下,可由模切成形之最大孔仍將略小於盤形熱通道3 1 4之 外徑。在埋置作業期間,通道3 1 4將伸張並擴大孔3 1 0。 第28圖顯示一埋置設備324之分解圖,其包含上及 下鋼模半體326及328與一衝頭330。 上鋼模半體326中具有一貫穿孔3 3 2,且下鋼模半體 3 28中具有一部分孔3 34。 孔3 3 2及334之直徑係相同且略大於熱通道314之外 徑。對齊導件(未示於圖)被用以將位於上及下鋼模半體 3 26及3 28中之孔3 32及3 34與位於石墨平面元件302中 之模切孔310排列成直線。止動件3 36被設於下鋼模半體 328中。止動件3 36之上端部3 3 8係與模切孔310排列成 直線。止動件336被設於之頂表面340齊平,且止動件之 直徑係較小於盤形熱通道3 14之直徑,如此使得一環形凹 穴342可環繞止動件336。衝頭3 3 0具有與盤形熱通道314 相同之外徑,且被用以將通道314壓在適當位置處。 設備324之操作可最佳如第29圖所示。石墨平面元 件3 02被對準並夾持於上及下鋼模半體326及328之間。 •46- 200810621 一旦被夾持於定位,石墨材料之薄緣(未示於圖)便伸入 位於上及下鋼模半體326及328中之孔332及334。熱通 道314被安置在位於上鋼模半體3 26中之孔332內,其後 隨著衝頭330。壓力被施加至衝頭,其向上面對通道314 並通過突出之石墨材料。一些突出之石墨材料被切掉,而 一些則被壓縮在通道314周圍。通道314抵住止動件336 之端部338而停止,並與石墨平面元件302之下表面304 齊平。石墨材料之經切除的廢料則收集在止動件33 6周圍 之環形空間342內。 當上及下鋼模半體3 26及328被移離且與盤形熱通道 314組裝在一起之石墨平面元件3 02被從設備處移去時, 由通道314所壓縮之石墨材料形成周邊凸塊346及348, 其鄰接盤形熱通道314之去角邊緣316及318。 爲使這些凸塊346及348予以平坦,總成302及314 於是被置於一如第30圖所示壓機之上及下壓板之間,且 壓力被施加至總成302及314上。此一壓力應大於1 500psi 並小於lOOOOpsi,此係石墨材料之最小壓縮強度。此壓力 將凸塊346及348壓縮成與盤形熱通道314之諸端面320 及322齊平,並將石墨材料壓抵住通道314之諸去角邊緣 316及318,因而緊固地將通道314鎖制在石墨平面元件 3 02內之適當位置處。此結果便導致如第25圖中所示之熱 分散器元件302及314。 盤形熱通道3 1 4之諸去角邊緣3 1 6及3 1 8槪括地可被 描述爲形成於通道3 1 4上之凹部。如第25圖中所示’石 -47·L 210 heat 234 234 [The flat recess is flanged, it should also be pressed down, 16 and the mechanism end flange diameter 216A punch 216A -44- 200810621. The action is stopped when the upper surface 229 of the second flange 217A is flush with the upper end portion 231 of the stem 21 6A. To control the amount of compression of the graphite planar elements between the first and second flanges 218A and 217A, the length 233 of the stem 216A and the thickness 235 of the second flange 217A will be regulated. 3. Flush hot aisles The aforementioned hot aisles all have one or two flanges that protrude above the surface of the graphite planar element. However, in some applications, it is necessary for the heat spreader to have a perfectly flush surface, i.e., there is no portion of the hot runner that protrudes above the surface of the graphite planar component. These goals can be achieved using a hot aisle that has been embedded in the graphite disperser as shown in Figure 25. Figure 25 shows a thermal management system 300 comprising a graphite planar element 302 having first and second major planar surfaces 304 and 306. The graphite planar element 302 has a thickness 308 defined between the surfaces 304 and 306. A hole 310 defined by the inner wall 312 is formed through the thickness of the graphite planar member 302. The hot aisle 3 1 4 is housed in the hole 310. In this embodiment, the pass Φ 314 is a disc having chamfers 316 and 318 on its upper and lower ends 3 20 and 3 22, as best shown in Figures 26 and 27. As will be further described below, in the configuration of the disk-shaped hot aisle 314 having the embedded in the graphite planar member 302 shown in Fig. 25, the graphite material closely fits the disk-shaped hot aisle 314 and is superposed. On the corners 316 and 318 of the hot aisle 314. Channel 314 has upper and lower ends 320 and 322 that are flush with second major planar surface 306 and first major planar surface 304 of graphite planar member 302, respectively. This configuration adds heat transfer between the channel 314 and the graphite planar elements 302-45-200810621 and provides a mechanical bond. The disk shaped hot aisle 314 has a thickness that is substantially equal to the thickness 308 of the graphite planar element 302. Figures 28, 29, and 30 are illustrative diagrams of a series of methods in which the disk shaped hot aisle 314 is shown embedded within the graphite planar element 302. Again, the graphite planar element 302 has a hole 310 in which the die cut is formed. The die cut hole 310 is sized such that, given the relevant tolerances, the largest hole that can be formed by die cutting will still be slightly smaller than the outer diameter of the disk shaped hot aisle 3 1 4 . During the embedding operation, the channel 3 1 4 will stretch and enlarge the hole 3 10 . Figure 28 shows an exploded view of a buried device 324 including upper and lower steel mold halves 326 and 328 and a punch 330. The upper steel mold half 326 has a consistent perforation 3 3 2 and the lower steel mold half 3 28 has a portion of the bore 3 34 therein. The diameters of the holes 3 3 2 and 334 are the same and slightly larger than the outer diameter of the hot aisle 314. Alignment guides (not shown) are used to align the holes 3 32 and 3 34 in the upper and lower steel mold halves 3 26 and 3 28 with the die cut holes 310 in the graphite planar member 302. A stopper 3 36 is provided in the lower steel mold half 328. The upper end portion 3 3 8 of the stopper 3 36 is aligned with the die-cut hole 310. The stop member 336 is disposed flush with the top surface 340 and the diameter of the stop member is smaller than the diameter of the disk shaped heat passage 314 such that an annular recess 342 can surround the stop member 336. The punch 303 has the same outer diameter as the disk-shaped hot aisle 314 and is used to press the channel 314 in place. The operation of device 324 is best as shown in Figure 29. The graphite planar member 322 is aligned and clamped between the upper and lower steel mold halves 326 and 328. • 46- 200810621 Once clamped in position, the thin edge of the graphite material (not shown) extends into holes 332 and 334 in the upper and lower steel mold halves 326 and 328. The hot aisle 314 is positioned within the aperture 332 in the upper steel mold half 3 26, followed by the punch 330. Pressure is applied to the punch, which faces up the channel 314 and passes through the protruding graphite material. Some of the prominent graphite material is cut away and some are compressed around the channel 314. Channel 314 stops against end 338 of stop 336 and is flush with lower surface 304 of graphite planar element 302. The cut scrap of graphite material is collected in an annular space 342 around the stop 336. When the upper and lower steel mold halves 3 26 and 328 are removed and the graphite planar member 322 assembled with the disc shaped hot aisle 314 is removed from the apparatus, the graphite material compressed by the passage 314 forms a peripheral convex. Blocks 346 and 348 abut the chamfered edges 316 and 318 of the disk shaped hot aisle 314. To flatten the bumps 346 and 348, the assemblies 302 and 314 are then placed between the press and the lower platen as shown in Fig. 30, and pressure is applied to the assemblies 302 and 314. This pressure should be greater than 1 500 psi and less than 1000 psi, which is the minimum compressive strength of the graphite material. This pressure compresses the bumps 346 and 348 into flush with the end faces 320 and 322 of the disk shaped hot aisle 314 and presses the graphite material against the chamfered edges 316 and 318 of the channel 314, thereby securely channeling the channel 314. The lock is placed at a suitable location within the graphite planar element 302. This result in the heat spreader elements 302 and 314 as shown in Fig. 25. The chamfered edges 3 1 6 and 3 1 8 of the disk-shaped hot aisle 3 1 4 can be described as recesses formed in the channel 3 1 4 . As shown in Figure 25, '石-47·
200810621 墨平面元件302之石墨材料疊置在此諸凹部或 3 1 6 及 3 1 8 上。 現參照第3 1及3 2圖’此相同之方法可被用 上具有若干薄表面層354之熱分散器。此諸表面 型地係由Mylar、鋁、鋁或類似物所構成。在此 表面層354將在石墨平面元件302中模切孔310 鋪在石墨平面元件302上。然後,孔310被模切 面兀件302及表面層354兩者之內。孔310之直 3 1 4之外徑必須被選定成使穿過表面層之孔可完 一諸如320之熱源,其被安置成與通道314相接 如第32圖中所示具有表面層3 54之組裝產品之美 步驟係如先前參照第28至30圖所示者。此獲致-置型熱通道之熱分散器,且通道之兩側如第32 g 般地藉由位於表面層354中之諸孔而可被露出。!t| 通道3 1 4與熱源3 2 0間得以直接地接觸,同時可拍 面元件302之所有暴露區域上方提供表面層354。 一般而言,此表面層3 54可被描述成一較薄灰 面元件302之厚度308的表面層,其並覆蓋住石墨 件3 02之諸相對向之主要平面表面304及306。 包覆型分散器及齊平式熱涌道 第33圖係相似於第25圖。箭頭35 6代表將盤 道3 1 4壓抵熱源3 20之一安裝負載,如此使得無< 加至石墨平面元件302本身。石墨平面元件302 狀,且在石墨平面元件302與熱通道3 1 4之間有 角邊緣 製造其 354典 形中, 前先被 石墨平 與通道 地包圍 。導致 餘組裝 具有埋 中所示 使得熱 石墨平 石墨平 平面元 形熱通 載被施 持平坦 好之接 -48- 200810621 觸,而在熱通道314與石墨平面元件302之間的熱傳遞則 是絕佳。 如第34圖所示,然而必需常將諸如358及3 60之安 裝孔設置穿過石墨平面元件302並安置螺絲,施加安裝螺 絲負載至石墨平面元件302上之鄰接諸孔358及360處, 如箭頭362及364所代表。此安裝負載此刻被直接施於石 墨平面元件302上。因爲石墨平面元件302之相當低彈性 係數,如箭頭362及364所代表之典型安裝負載可造成石 墨平面元件3 02如第34圖所示般地彎曲,而石墨平面元 件302之若干部分在被標以366之區域中被拉離熱通道 314,因此而造成若干可敞開於石墨平面元件302與熱通 道3 1 4間之間隙。此導致熱通道3 1 4與石墨平面元件3 0 2 間之熱傳遞減小,及在熱分散器之熱性能上之顯著降低。 甚至如第34圖所示之不太大的安裝負載都足以永久地彎 曲石墨平面元件302。 爲克服此一問題,一連續且相當堅硬之材料薄層3 6 8 可被包覆在石墨平面元件302之下側304,如第35圖中所 示。包覆層材料可包括銅、銘等及其合金。例如,具有 0.00 3in最小厚度之鋁片係用作爲包覆層之典型選擇。包 覆層368可利用諸如Ashland Aroset 3250之黏著劑而被黏 附於石墨平面元件302之表面304上,以及通道314之下 端部322上。一旦經黏附,諸安裝螺絲孔3 5 8及360被衝 壓或鑽孔穿過包覆層368及石墨平面元件302。應注意的 是,包覆層368在熱通道314之下端面3 22上係連續的, -49- 200810621 唯一穿過包覆層之穿孔係貫穿石墨平面元件3 02之安裝螺 _ 絲孔35 8及3 60。當包覆型分散器被如第3圖所示意般地 、 壓抵熱源320時,分散器將維持平坦狀,且由於形成在熱 通道314與石墨平面元件302之材料間的間隙之故,使得 不再有性能上之降低情形。 共同鍛造之齊平式熱通道 第36至39圖包括一系列說明圖例,其顯示具有齊平 式熱通道之熱分散器的另一修改型式,而其中之齊平式熱 φ 通道類似於先前配合第25至35圖而描述者。 在一些非常高性能之應用中,將盤形通道及周圍石墨 材料3 0 2間之熱阻完全減至最小係很重要的。此可藉由在 通道已被嵌入石墨平面元件之後再一起鍛造通道及周圍 石墨材料而達成。共同鍛造將導致通道及石墨平面材料兩 者之塑性變形,且將使通道材料儘可能緊地連結至周圍石 龜材料,並使這些材料間之熱阻降低至最小程度。 首先,石墨平面元件302及盤形熱通道314被如先前 馨 配合第28至30圖所述般地組裝在一起。此導致了如第36 圖所示之結構,其具有伸出盤形熱通道3 14上方及下方之 $裹材料的環形凸塊346及348。 爲可一起鍛造石墨及通道材料,第圖中所示之總 成302及314被放置於由如第37圖中所示之上及下鋼模 半體370及372所構成之閉合凹穴鍛模368內。凹穴374 及376被分別機製成鋼模半體370及372,且相匹配之止 動表面378及380分別形成凹穴374及376之邊緣。兩凹 -50- 200810621 八部分3 7 4及3 7 6所構成之凹穴的總深度係較小於原始石 墨材料或原始盤形熱通道314之厚度。閉合凹穴之大小被 選定成可使得在通道314及石墨平面元件302被塑性變形 時’凹穴將可大到足以使這些材料能流動並塡充此凹穴, 如第3 8圖所示,諸止動表面3 7 8及3 8 〇控制經允許之塑 性變形量。諸止動表面3 7 8及3 8 0之大小被設定成使得其 一旦彼此接觸,鍛造負載便被轉移至諸止動表面,且不會 再有通道314及石墨平面元件302之塑性變形發生。 # 通道314及石墨平面元件3 02之此一共同鍛造被顯示 於第3 8圖中。被施加於鍛模3 6 8上之最小力必須足以確 保石墨平面元件302之石墨材料及熱通道314之材料的瞬 間塑性變形。此使得通道3 14及石墨可垂直地壓縮並水平 地流動。 已完成共同鍛造之分散器被顯示於第39圖中。在共 同鍛造期間之塑性流動導致通道314及石墨平面元件302 間之密切接觸,並使兩材料間之熱阻減到最小。在共同鍛 • 造之後,若干表面層可如先前配合第31及32圖所述般地 被鋪於已完成之分散器上,及/或一包覆層可如先前配合 第35圖所述般地被鋪設。 在本文中被提及之所有引據之專利、專利申請案及公 告案均以引用方式被倂入本文中。 上列說明係意欲使熟習本項技藝之人士可據以實施 本發明。本文之目的不在於詳述所有可能之變更及修改型 式之細節,而此諸變更及修改型式係熟習本項技藝之人士 -51- 200810621 經由閱讀本說明便顯而可知者。然而,可預期 更及修改型式均將包含於由後附諸申請專利 界定之本發明範圍內。這些申請專利範圍權項 以任何配置或順序所表示之元件及步驟,其可 本發明之預期目的,除非本文中有特別地相反 【圖式簡單說明】 第1圖係根據本發明所實施之電路總成 立體圖,其中電路總成在其一表面上具有一熱 及一位於熱分散器層與熱產生組件之間的熱路 生組件則係位在電路總成之第二表面上。 第2A-2C圖係第1圖中所示電路總成之熱 不同可替代配置之部分剖面圖,其係沿第1圖 所取,且分別顯示伸出至電路總成之第二表面 路總成之第二表面相齊平、及凹陷入電路總成 內的熱路徑。 第3圖係根據本發明之軟性電路的部 圖,其中軟性電路在其一表面上具有一熱分散 數條位於熱分散器層與多個熱產生組件之間纪 諸熱產生組件則係位在軟性電路之第二表面i: 第4圖係根據本發明之電路總成的部分音1 電路總成在其一表面上具有一熱分散器層以 分散器層與熱產生組件之間的熱路徑,而熱產 位在電路總成之第二表面上,其中熱路徑與熱 整合成一體。 所有此類變 範圍權項所 係意欲涵蓋 有效地達成 :表示。 的部分斷裂 分散器層以 •徑,而熱產 路徑的多個 中之2-2線 上方、與電 之第二表面 汗斷裂立體 器層以及複 f熱路徑,而 〇 丨面圖,其中 及一位於熱 生組件則係 產生組件係 -52- 200810621 第5圖係根據本發明之電路總成的部分剖面圖,其中 電路總成在其一表面上具有一熱分散器層以及一位於熱 " 分散器層與熱產生組件之間的熱路徑,而熱產生組件則係 位在電路總成之第二表面上,其中熱路徑延伸超過熱分散 器層並支承額外之熱消散層。 第6A圖係根據本發明之電路總成的仰視平面圖,其 中電路總成具有一長形基底式熱路徑組合。 第6B圖係第6A圖中所示電路總成之俯視平面圖。 φ 第7圖係具有熱鉚釘型式通道之石墨熱分散器的正 視部份剖面圖,其中通道上安裝有一推置螺帽。 第7A圖係類似於第7圖之視圖,其顯示位於推置螺 帽下方之墊圈的可選擇性使用。 第8圖係第7圖中所示凸緣熱通道之平面圖。 第9圖係第8圖中所示凸緣熱通道之正視圖。 第10圖係第7圖中所示推置螺帽之平面圖。 第1 1圖係第1 0圖中所示推置螺帽之正視剖面圖。 • 第12圖係第7圖中所示石墨平面元件之一部分的平 面圖,其顯示設有模切孔以接納通過其內之凸緣通道。 第1 3圖係第7及1 2圖中所示石墨平面元件之正視剖 面圖。 第1 4圖係凸緣通道已被強制裝配穿過位於石墨平面 元件上之模切孔後而形成蕈狀石墨凸邊之正視剖面圖。位 於石墨平面元件及通道正上方者係一衝頭,其被用以壓縮 石墨凸邊。 -53- 200810621 第1 5圖係本發明之另一實施例的正視部分剖面圖, 其利用一具有兩各位於一端部上之凸緣的熱通道。本範例 ' 中之熱源雖被顯示位於與下凸緣相抵處,但亦可被置於與 此通道之任一個凸緣相抵處。由第15圖中之剖面部分可 見,通道係由兩個部分所構成,其第一部分包括心柱及下 凸緣,而第二部分則包括上凸緣。 第15A係類似第第15圖之視圖,其顯示雙凸緣通道 之可替代形式。 φ 第16圖係第15圖中所示心柱及下凸緣之平面圖。 第17圖係第16圖中所示具有與下凸緣成一體之心柱 的正視圖。 第18圖係上凸緣在被裝配以第15圖熱通道前之平面 圖。 第1 9圖係第1 8圖中所示上凸緣之正視剖面圖。 第20圖係一稍類似第14圖且顯示第17圖中所示凸 緣通道之心柱的視圖,其中凸緣通道之心柱已被壓入穿過 • 石墨平面元件而形成一蕈狀石墨凸邊。一衝頭被顯示位於 通道之上方並預備向下移動以壓縮石墨凸邊。 第21圖係凸緣通道之可替代結構的平面圖。 第22圖係第21圖中所示凸緣通道之正視圖。 第23圖係一具有直孔之第二凸緣的平面圖,其中直 孔將與第21及22圖中所示凸緣通道配合使用。 第24圖係第23圖中所示第二凸緣之正視剖面圖。 第25圖係本發明具有齊平通道之另一實施例的正視 -54- 200810621 部分剖面圖,其中齊卒通道係與石墨平面元件之主要平面 表面相齊平。 第26圖係第25圖中所示熱通道之平面圖,而此熱通 道係呈一在各端部上具有若干去角邊緣之圓盤形狀。 第27圖係第26圖中所示熱通道之正視圖。 第28圖係一設備之正視部分剖面分解圖,而此設備 被用以將第26及27圖中所示熱通道埋置於石墨平面元件 中以形成如第25圖所示熱分散器結構。從第28圖頂部至 § 底部依序顯示衝頭、熱通道,上鋼模半體、石墨分散器、 及下鋼模半體。 第29圖係第28圖中所示設備在衝頭已強制使熱通道 貫穿上鋼模半體並進入石墨分散器內適當位置處後之正 視剖面圖。 第30圖係一壓機之兩壓板的分解正視剖面圖,其中 兩壓板係用於壓縮具有齊平通道之石墨分散器的諸環狀 凸塊。 • 第31圖係在其上具有一表面層之石墨熱分散器的正 視剖面圖。 第32圖係類似第25圖之視圖,其顯示已被組裝完成 並具有一表面層之石墨熱分散器,且包括齊平熱通道並具 有一被顯示於其上適當位置處之熱源。 第3 3圖係類似第2 5圖之視圖,其說明出現在熱分散 器的一種使用模式下之諸安裝模式。 第3 4圖係類似第3 3圖之視圖,其顯示另一種安裝模 -55- 200810621 式,其中兩螺絲延伸穿過石墨平面元件,此因而導致石墨 熱分散器之彎曲。 第35圖係爲類似本發明之一經修改實施例之第34圖 之視圖,其中一包覆層已被加至石墨熱分散器,且諸安裝 孔延伸穿過包覆層,其提供石墨熱分散器結構完整性,因 而使其彎曲得以減至最小。 第3 6圖係具有齊平式通道之石墨平面元件的正視剖 面圖,其中通道可藉由第28及29圖中所說明之程序而被 • 埋置於石墨平面元件中。 第37圖係一用於將熱通道連同石墨平面元件一起鍛 造之鋼模的分解圖。兩鋼模半體被分開,且石墨熱分散器 被顯示位於兩鋼模半體間之適當位置處。 第3 8圖係第37圖中所示鋼模總成之另一視圖,其顯 示兩鋼模半體已被組合在一起,以便可將熱通道連同石墨 平面元件一起鍛造,從而導致熱通道與石墨平面元件之側 向伸展。 ® 第39圖係由第37及38圖中所示程序經共同鍛造而 得之石墨平面元件。如第36圖所示的,熱通道與石墨平 面元件兩者因鍛造而已側向地伸展。 【主要元件符號說明】 10 電路總成 20 介電質層 20a/20b 主要表面 30 熱分散器 -56- 200810621200810621 The graphite material of the ink planar element 302 is superposed on the recesses or 3 1 6 and 3 1 8 . Referring now to Figures 31 and 3, the same method can be used with a heat spreader having a plurality of thin surface layers 354. These surface types are composed of Mylar, aluminum, aluminum or the like. Here the surface layer 354 will be laid over the graphite planar element 302 in the die plane element 302. Hole 310 is then die cut into both the face member 302 and the surface layer 354. The outer diameter of the straight hole 310 of the hole 310 must be selected such that the hole through the surface layer can complete a heat source such as 320 that is placed in contact with the channel 314 as shown in Fig. 32 having a surface layer 3 54 The aesthetic steps of assembling the product are as previously described with reference to Figures 28-30. The heat dissipator of the heat-inducing channel is formed, and both sides of the channel are exposed by holes located in the surface layer 354 as in the 32nd g. ! The channel 3 1 4 is in direct contact with the heat source 3 2 0 while the surface layer 354 is provided over all exposed areas of the facet element 302. In general, the surface layer 3 54 can be described as a surface layer of a thickness 308 of a thinner gray component 302 that covers the opposing major planar surfaces 304 and 306 of the graphite member 302. Coated Disperser and Flush Hot Drain Figure 33 is similar to Figure 25. Arrow 35 6 represents pressing the tray 3 14 against one of the heat sources 3 20 to mount the load such that no < is applied to the graphite planar element 302 itself. The graphite planar element 302 is shaped and has an angular edge between the graphite planar element 302 and the hot aisle 3 1 4 to create a 354 pattern which is previously surrounded by the graphite flat and channel. The result is that the residual assembly has a buried heat so that the hot graphite flat graphite flat planar heat transfer is flattened, and the heat transfer between the hot channel 314 and the graphite planar element 302 is Great. As shown in Fig. 34, however, mounting holes such as 358 and 366 are often placed through the graphite planar member 302 and screws are placed, and mounting screws are applied to the adjacent holes 358 and 360 on the graphite planar member 302, such as Represented by arrows 362 and 364. This mounting load is now applied directly to the graphite planar element 302. Because of the relatively low modulus of elasticity of the graphite planar element 302, typical mounting loads as represented by arrows 362 and 364 can cause the graphite planar element 302 to bend as shown in Figure 34, while portions of the graphite planar element 302 are labeled The zone 366 is pulled away from the hot aisle 314, thus creating a number of gaps between the graphite planar element 302 and the hot aisle 3 14 . This results in a reduced heat transfer between the hot aisle 3 1 4 and the graphite planar element 3 0 2 and a significant decrease in the thermal performance of the heat spreader. Even a less large mounting load as shown in Figure 34 is sufficient to permanently bend the graphite planar member 302. To overcome this problem, a continuous and relatively rigid thin layer of material 386 can be coated on the underside 304 of the graphite planar element 302, as shown in Figure 35. The cladding material may include copper, indium, etc., and alloys thereof. For example, aluminum sheets having a minimum thickness of 0.003 in. are typically used as a coating. The cladding 368 can be adhered to the surface 304 of the graphite planar element 302 and to the lower end 322 of the channel 314 using an adhesive such as Ashland Aroset 3250. Once adhered, the mounting screw holes 358 and 360 are stamped or drilled through the cladding layer 368 and the graphite planar member 302. It should be noted that the cladding layer 368 is continuous over the lower end face 32 of the hot aisle 314, and the perforation through the cladding layer is through the mounting screw _ wire hole 35 8 of the graphite planar member 322. And 3 60. When the coated disperser is pressed against the heat source 320 as shown in Fig. 3, the disperser will remain flat and due to the gap formed between the hot channel 314 and the material of the graphite planar member 302, There is no longer a performance degradation. Co-forged flush-type hot runners 36 through 39 include a series of illustrative illustrations showing another modification of a heat spreader with a flush-type hot aisle, wherein the flush-type hot φ channel is similar to the previous fit Described in Figures 25 to 35. In some very high performance applications, it is important to minimize the thermal resistance between the disk channel and the surrounding graphite material. This can be achieved by forging the channel and surrounding graphite material together after the channel has been embedded in the graphite planar element. Co-forging will result in plastic deformation of both the channel and the graphite planar material and will bond the channel material as tightly as possible to the surrounding stone material and minimize the thermal resistance between these materials. First, the graphite planar member 302 and the disk shaped hot aisle 314 are assembled as previously described in conjunction with Figures 28 through 30. This results in a structure as shown in Fig. 36 having annular projections 346 and 348 extending over the wrap material above and below the disk-shaped hot aisle 3 14 . In order to forge graphite and channel materials together, the assemblies 302 and 314 shown in the figures are placed in a closed pocket forging die formed by upper and lower steel mold halves 370 and 372 as shown in FIG. Within 368. The pockets 374 and 376 are machined into steel mold halves 370 and 372, respectively, and the mating stop surfaces 378 and 380 form the edges of the pockets 374 and 376, respectively. The two recesses -50- 200810621 The total depth of the pockets formed by the eight sections 3 7 4 and 3 7 6 is smaller than the thickness of the original graphite material or the original disk shaped heat tunnel 314. The size of the closed pocket is selected such that when the channel 314 and the graphite planar element 302 are plastically deformed, the pocket will be large enough to allow the material to flow and fill the pocket, as shown in FIG. The stop surfaces 3 7 8 and 3 8 〇 control the amount of plastic deformation allowed. The stop surfaces 377 and 380 are sized such that once they are in contact with one another, the forge load is transferred to the stop surfaces and no further plastic deformation of the channels 314 and graphite planar elements 302 occurs. The common forging of # channel 314 and graphite planar element 3 02 is shown in Figure 38. The minimum force applied to the forging die 386 must be sufficient to ensure transient plastic deformation of the graphite material of the graphite planar member 302 and the material of the hot aisle 314. This allows the channels 3 14 and graphite to be vertically compressed and flow horizontally. A disperser that has completed co-forging is shown in Figure 39. Plastic flow during common forging results in intimate contact between channel 314 and graphite planar element 302 and minimizes thermal resistance between the two materials. After co-forging, a number of surface layers may be applied to the finished disperser as previously described in conjunction with Figures 31 and 32, and/or a cladding layer may be as previously described in connection with Figure 35. The ground is laid. All cited patents, patent applications, and publications are herein incorporated by reference. The above description is intended to enable those skilled in the art to practice the invention. The purpose of this document is not to clarify the details of all possible variations and modifications, and such changes and modifications are apparent to those skilled in the art of the present invention -51-200810621. However, it is contemplated that modifications and variations are intended to be included within the scope of the invention as defined by the appended claims. These claims are intended to be in any configuration or order of elements and steps, which are intended for the purpose of the present invention, unless specifically described herein. A total body image is shown in which the circuit assembly has a heat on one surface thereof and a thermal path component between the heat spreader layer and the heat generating component is tied to the second surface of the circuit assembly. 2A-2C is a partial cross-sectional view of a different alternative configuration of the heat of the circuit assembly shown in FIG. 1, taken along the first figure, and showing the second surface path extending to the circuit assembly, respectively. The second surface is flush and recessed into the thermal path within the circuit assembly. Figure 3 is a partial view of a flexible circuit in accordance with the present invention, wherein the flexible circuit has a plurality of thermally dispersed strips on one surface thereof between the heat spreader layer and the plurality of heat generating components. Second surface i of the flexible circuit: Figure 4 is a partial sound 1 circuit assembly of a circuit assembly according to the present invention having a heat spreader layer on one surface thereof to provide a thermal path between the diffuser layer and the heat generating component And the heat is placed on the second surface of the circuit assembly, wherein the heat path is integrated with the heat. All such variable scope rights are intended to cover effectively: representation. The partial rupture disperser layer has a diameter, and the thermal production path is above the 2-2 line, the second surface of the electric sweat ruptures the stereoscopic layer, and the complex f heat path, and A thermal component is a component assembly-52-200810621. FIG. 5 is a partial cross-sectional view of a circuit assembly according to the present invention, wherein the circuit assembly has a heat spreader layer on one surface thereof and a heat collector The heat path between the diffuser layer and the heat generating component, and the heat generating component is positioned on the second surface of the circuit assembly, wherein the heat path extends beyond the heat spreader layer and supports an additional heat dissipation layer. Figure 6A is a bottom plan view of a circuit assembly in accordance with the present invention, wherein the circuit assembly has an elongated base-type thermal path combination. Figure 6B is a top plan view of the circuit assembly shown in Figure 6A. φ Figure 7 is a front elevational cross-sectional view of a graphite heat spreader with a hot rivet type channel with a push nut mounted on the channel. Figure 7A is a view similar to Figure 7 showing the optional use of the gasket under the push nut. Figure 8 is a plan view of the flange hot aisle shown in Figure 7. Figure 9 is a front elevational view of the flanged hot aisle shown in Figure 8. Figure 10 is a plan view of the push nut shown in Figure 7. Fig. 1 is a front cross-sectional view showing the push nut shown in Fig. 10. • Fig. 12 is a plan view of a portion of the graphite planar member shown in Fig. 7, showing a die cut hole for receiving a flange passage therethrough. Figure 13 is a front cross-sectional view of the graphite planar member shown in Figures 7 and 12. Figure 14 is a front cross-sectional view of the flanged channel having been forcedly assembled through the die cut holes in the graphite planar member to form a serpentine graphite flange. Located directly above the graphite planar element and the channel is a punch that is used to compress the graphite rim. -53- 200810621 Figure 15 is a front elevational, cross-sectional view of another embodiment of the present invention utilizing a hot aisle having two flanges on each end. Although the heat source in this example is shown to be in contact with the lower flange, it can also be placed against any of the flanges of this channel. As can be seen from the section of the section in Fig. 15, the channel is composed of two parts, the first part comprising the stem and the lower flange, and the second part comprising the upper flange. Section 15A is a view similar to Figure 15, which shows an alternative form of a double flange channel. φ Fig. 16 is a plan view of the stem and the lower flange shown in Fig. 15. Fig. 17 is a front elevational view of the stem having an integral with the lower flange as shown in Fig. 16. Figure 18 is a plan view of the upper flange before it is assembled with the heat path of Figure 15. Figure 19 is a front cross-sectional view of the upper flange shown in Figure 18. Figure 20 is a view similar to Figure 14 and showing the stem of the flange channel shown in Figure 17, wherein the stem of the flange channel has been pressed through the graphite planar element to form a serpentine graphite Convex edge. A punch is shown above the channel and is ready to move down to compress the graphite rim. Figure 21 is a plan view of an alternative construction of the flange channel. Figure 22 is a front elevational view of the flange channel shown in Figure 21. Figure 23 is a plan view of a second flange having a straight bore which will be used in conjunction with the flange passages shown in Figures 21 and 22. Figure 24 is a front cross-sectional view of the second flange shown in Figure 23. Figure 25 is a partial cross-sectional view of another embodiment of the present invention having a flush channel, -54-200810621, wherein the channel is flush with the major planar surface of the graphite planar element. Figure 26 is a plan view of the hot aisle shown in Figure 25, and the thermal path is in the shape of a disk having a plurality of chamfered edges at each end. Figure 27 is a front elevational view of the hot aisle shown in Figure 26. Figure 28 is a cross-sectional exploded view of a front view of a device which is used to embed the thermal channels shown in Figures 26 and 27 in a graphite planar member to form a heat spreader structure as shown in Figure 25. The punch, the hot aisle, the upper steel mold half, the graphite disperser, and the lower steel mold half are sequentially displayed from the top of Fig. 28 to the bottom of the §. Figure 29 is a front elevational view of the apparatus shown in Figure 28 after the punch has forced the hot aisle through the upper steel mold half and into position within the graphite disperser. Figure 30 is an exploded front elevational cross-sectional view of two press plates of a press for compressing the annular bumps of the graphite disperser having flush channels. • Figure 31 is a front cross-sectional view of a graphite heat spreader having a surface layer thereon. Figure 32 is a view similar to Figure 25 showing a graphite heat spreader that has been assembled and has a surface layer and includes a flush heat channel and has a heat source that is shown at a suitable location thereon. Fig. 3 is a view similar to Fig. 5, which illustrates the installation modes appearing in one mode of use of the heat spreader. Figure 34 is a view similar to Figure 3, which shows another type of mounting die -55-200810621 in which two screws extend through the graphite planar element, which in turn causes bending of the graphite heat spreader. Figure 35 is a view similar to Figure 34 of a modified embodiment of the present invention in which a cladding layer has been applied to the graphite heat spreader and the mounting holes extend through the cladding layer to provide graphite heat dispersion. The structural integrity of the device thus minimizes its bending. Figure 36 is a front elevational cross-sectional view of a graphite planar element having flush channels in which the channels can be embedded in the graphite planar elements by the procedures illustrated in Figures 28 and 29. Figure 37 is an exploded view of a steel mold for forging a hot aisle along with a graphite planar element. The two steel mold halves are separated and the graphite heat spreader is shown in place between the two steel mold halves. Figure 38 is another view of the steel mold assembly shown in Figure 37, showing that the two steel mold halves have been combined so that the hot aisle can be forged together with the graphite planar element, resulting in a hot aisle The lateral faces of the graphite planar elements are stretched. ® Figure 39 is a graphite planar element obtained by co-forging from the procedures shown in Figures 37 and 38. As shown in Fig. 36, both the hot aisle and the graphite planar element have been laterally stretched for forging. [Main component symbol description] 10 Circuit assembly 20 Dielectric layer 20a/20b Main surface 30 Heat disperser -56- 200810621
30a/30b/30c 熱消散層 40 電路 50 熱產生組件 50a/50b/50c 熱產生組件 60 熱通道 6 0 a / 6 0 b / 6 0 c 通道 61 肩部 62 收集條 64a/64b/64c 通道單元 100 軟性電路/熱管理系統 102 石墨平面元件 104/106 平面表面 108 厚度 110 模切孔 112 內穴壁 114 熱通道 116 心柱 118 凸緣 120 熱源 122 推置螺帽 124 自由端 126 內側表面 128 墊圈 130 直徑 132 蕈狀突出部 -57- 200810621 134 衝頭 136 凹部 200 熱管理系統 200A 雙凸緣熱管理系統 202 石墨平面元件 204/206 主要平面表面 208 厚度 210 孔 212 內壁 214 熱通道 215 第一部分 21 5 A 第一部分 216 心柱 21 6A 心柱 217 第二部分/第二凸緣 217A 第二部分/第二凸緣 218 第一凸緣 21 8A 第一凸緣 219 內徑 219A 孔 223 心柱肩部 225 凸緣肩部 227 長度 232 蕈狀突出部 -58- 20081062130a/30b/30c Heat dissipation layer 40 Circuit 50 Heat generation assembly 50a/50b/50c Heat generation assembly 60 Hot aisle 6 0 a / 6 0 b / 6 0 c Channel 61 Shoulder 62 Collection strip 64a/64b/64c Channel unit 100 Flexible Circuit/Thermal Management System 102 Graphite Plane Element 104/106 Planar Surface 108 Thickness 110 Die Cut Hole 112 Inner Hole 114 Heat Pass 116 Heart Post 118 Flange 120 Heat Source 122 Push Nut 124 Free End 126 Inner Surface 128 Washer 130 Diameter 132 Tabular projection -57- 200810621 134 Punch 136 Recession 200 Thermal management system 200A Double flange thermal management system 202 Graphite planar element 204/206 Main planar surface 208 Thickness 210 Hole 212 Inner wall 214 Hot aisle 215 Part 1 21 5 A First part 216 Pillar 21 6A Pillar 217 Second part / Second flange 217A Second part / Second flange 218 First flange 21 8A First flange 219 Inner diameter 219A Hole 223 Pillar shoulder Section 225 flange shoulder 227 length 232 蕈 突出 -58- 200810621
233 長 度 234 衝 頭 234A 雙 凸 緣 通 道 235 厚 度 236 凹 部 300 熱 管 理 系 統 302 石 墨 平 面 元 件 304/306 主 要 平 面 表 面 308 厚 度 310 孔 312 內 壁 3 14 熱 通 道 316/318 去 角 320/322 上 及 下 端 部 324 埋 置 設 備 326/328 上 及 下 鋼 模 半體 330 衝 頭 33 2 穿 孔 334 部 分 孔 33 6 止 動 件 340 頂 表 面 342 凹 穴 346/348 凸 塊 354 表 面 層 -59- 200810621 358/360 安 裝 孔 368 閉 合 凹 穴 鍛 模 370/372 上 及 下 鋼 模 半體 374/376 凹 穴 378/380 止 動 表 面 -60-233 Length 234 Punch 234A Double Flange Channel 235 Thickness 236 Recess 300 Thermal Management System 302 Graphite Plane Element 304/306 Main Plane Surface 308 Thickness 310 Hole 312 Inner Wall 3 14 Hot Passage 316/318 Degauss 320/322 Upper and Lower Ends Section 324 Embedding Equipment 326/328 Upper and Lower Steel Moulds 330 Punch 33 2 Perforations 334 Partial Holes 33 6 Stops 340 Top Surface 342 Pockets 346/348 Bumps 354 Surface Layers -59- 200810621 358/360 Mounting hole 368 Closed pocket forging die 370/372 Upper and lower steel mold half 374/376 Pocket 378/380 Stop surface -60-