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TW200740949A - Masking tape for substrate - Google Patents

Masking tape for substrate

Info

Publication number
TW200740949A
TW200740949A TW096105885A TW96105885A TW200740949A TW 200740949 A TW200740949 A TW 200740949A TW 096105885 A TW096105885 A TW 096105885A TW 96105885 A TW96105885 A TW 96105885A TW 200740949 A TW200740949 A TW 200740949A
Authority
TW
Taiwan
Prior art keywords
base member
film
masking tape
tape
adhesive layer
Prior art date
Application number
TW096105885A
Other languages
English (en)
Other versions
TWI437069B (zh
Inventor
Mitsushi Yamamoto
Kazuhito Okumura
Mikio Masuichi
Masafumi Kawagoe
Tsuyoshi Matsuka
Original Assignee
Nitto Denko Corp
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp, Dainippon Screen Mfg filed Critical Nitto Denko Corp
Publication of TW200740949A publication Critical patent/TW200740949A/zh
Application granted granted Critical
Publication of TWI437069B publication Critical patent/TWI437069B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • B05B12/24—Masking elements, i.e. elements defining uncoated areas on an object to be coated made at least partly of flexible material, e.g. sheets of paper or fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Coating Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW096105885A 2006-02-28 2007-02-16 基板用遮罩帶 TWI437069B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006053533 2006-02-28
JP2007024150A JP4884249B2 (ja) 2006-02-28 2007-02-02 基板用マスキングテープ

Publications (2)

Publication Number Publication Date
TW200740949A true TW200740949A (en) 2007-11-01
TWI437069B TWI437069B (zh) 2014-05-11

Family

ID=38614562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105885A TWI437069B (zh) 2006-02-28 2007-02-16 基板用遮罩帶

Country Status (4)

Country Link
JP (1) JP4884249B2 (zh)
KR (1) KR100816694B1 (zh)
CN (1) CN101104780B (zh)
TW (1) TWI437069B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101324756B (zh) * 2008-07-10 2011-04-06 电子科技大学 一种在旋涂法中提高所制备薄膜厚度的方法
CN102785496B (zh) * 2012-08-17 2014-12-24 湖北联合天诚防伪技术股份有限公司 一种喷银板边框银层处理的方法
CN104607342A (zh) * 2013-11-05 2015-05-13 沈阳芯源微电子设备有限公司 旋转外环粘贴保护装置
JP6610247B2 (ja) * 2015-12-25 2019-11-27 三菱ケミカル株式会社 粘着剤組成物、これを架橋させてなる粘着剤、マスキングフィルム用粘着剤、耐熱粘着フィルム用粘着剤、マスキング用耐熱粘着フィルム
JP6815740B2 (ja) * 2016-03-29 2021-01-20 日東電工株式会社 マスキングシート
CN107645012A (zh) * 2016-07-21 2018-01-30 新丰杰力电工材料有限公司 一种用于锂离子电池阳极热敏胶带的表面处理方法及热敏胶带的应用方法
JP2023048932A (ja) * 2021-09-28 2023-04-07 トヨタ自動車株式会社 見切り線の形成方法
CN113941473A (zh) * 2021-10-30 2022-01-18 芜湖徽氏新材料科技有限公司 一种半导体晶圆切割用撕片胶带
KR102703141B1 (ko) * 2022-06-03 2024-09-04 연세대학교 산학협력단 쇼트 방지를 위한 태양전지의 제조방법
CN114958082A (zh) * 2022-06-23 2022-08-30 惠州市浩明科技股份有限公司 油墨组合物及其制备方法、胶带

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227198A (en) * 1989-04-20 1993-07-13 A-Line Products Corporation Aqueous coating composition and method of use
JP3622931B2 (ja) * 1996-04-04 2005-02-23 ソニーケミカル株式会社 塗装マスキングテープ用基材及び塗装マスキングテープ
US20030176585A1 (en) * 2000-06-28 2003-09-18 Hironobu Iyama Insulating resin composition, adhesive resin composition and adhesive sheeting
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US6699347B2 (en) * 2002-05-20 2004-03-02 The Procter & Gamble Company High speed embossing and adhesive printing process
KR20050007953A (ko) * 2003-07-12 2005-01-21 두산중공업 주식회사 질화티타늄 코팅방법

Also Published As

Publication number Publication date
TWI437069B (zh) 2014-05-11
CN101104780B (zh) 2011-01-19
CN101104780A (zh) 2008-01-16
JP4884249B2 (ja) 2012-02-29
KR20070089624A (ko) 2007-08-31
KR100816694B1 (ko) 2008-03-27
JP2007260665A (ja) 2007-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees