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TW200728375A - Quinolinols as fluxing and accelerating agents for underfill compositions - Google Patents

Quinolinols as fluxing and accelerating agents for underfill compositions

Info

Publication number
TW200728375A
TW200728375A TW095131063A TW95131063A TW200728375A TW 200728375 A TW200728375 A TW 200728375A TW 095131063 A TW095131063 A TW 095131063A TW 95131063 A TW95131063 A TW 95131063A TW 200728375 A TW200728375 A TW 200728375A
Authority
TW
Taiwan
Prior art keywords
compositions
fluxing
quinolinols
quinolinol
accelerating agents
Prior art date
Application number
TW095131063A
Other languages
English (en)
Other versions
TWI398474B (zh
Inventor
Osama M Musa
Zhen Liu
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of TW200728375A publication Critical patent/TW200728375A/zh
Application granted granted Critical
Publication of TWI398474B publication Critical patent/TWI398474B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • H10W74/47—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W72/01271—
    • H10W72/072—
    • H10W72/07232—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/856—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095131063A 2005-08-25 2006-08-24 作為底填料組成物之助熔與加速劑之喹啉類化合物 TWI398474B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/211,406 US7378523B2 (en) 2005-08-25 2005-08-25 Quinolinols as fluxing and accelerating agents for underfill compositions

Publications (2)

Publication Number Publication Date
TW200728375A true TW200728375A (en) 2007-08-01
TWI398474B TWI398474B (zh) 2013-06-11

Family

ID=37487469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131063A TWI398474B (zh) 2005-08-25 2006-08-24 作為底填料組成物之助熔與加速劑之喹啉類化合物

Country Status (9)

Country Link
US (1) US7378523B2 (zh)
EP (1) EP1758163B1 (zh)
JP (1) JP4648881B2 (zh)
KR (1) KR20070024402A (zh)
CN (1) CN1919525B (zh)
AT (1) ATE444565T1 (zh)
DE (1) DE602006009448D1 (zh)
SG (1) SG130161A1 (zh)
TW (1) TWI398474B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878959B (zh) * 2023-05-25 2025-04-01 台灣積體電路製造股份有限公司 半導體裝置及垂直堆疊半導體裝置的製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100457375C (zh) * 2007-08-11 2009-02-04 厦门大学 一种可抑制焊点界面化合物生长的免清洗水基型助焊剂
KR102455429B1 (ko) * 2015-03-19 2022-10-14 나믹스 가부시끼가이샤 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물
WO2017065957A1 (en) * 2015-10-16 2017-04-20 Basf Se Energy curable high reactivity multi vinylether or acrylate functional resins
CN108495893A (zh) 2015-11-17 2018-09-04 汉高知识产权控股有限责任公司 用于三维硅通孔(tsv)封装的底部填充膜的树脂组合物及用于其制备的组合物
JP6660771B2 (ja) * 2016-03-03 2020-03-11 ナミックス株式会社 フィルム状樹脂組成物
WO2025162109A1 (en) * 2024-01-29 2025-08-07 Basf Se A stabilized isocyanate composition and two-component system for preparing polyurethane

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Publication number Priority date Publication date Assignee Title
US5344592A (en) * 1993-02-16 1994-09-06 E. I. Du Pont De Nemours And Company Organic vehicle for electronic composition
JPH07316399A (ja) * 1994-05-26 1995-12-05 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物および電子部品
US5482809A (en) * 1994-06-16 1996-01-09 Minnesota Mining And Manufacturing Company Liquid toners from soluble polymeric dispersants with reactive groups
US5521271A (en) * 1994-09-29 1996-05-28 Minnesota Mining And Manufacturing Company Liquid toners with hydrocarbon solvents
US5744533A (en) * 1997-06-04 1998-04-28 Johnson Matthey, Inc. Adhesive composition for bonding a semiconductor device
JPH11140276A (ja) * 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd 多官能シアン酸エステル樹脂組成物および樹脂封止型半導体装置
JP2000273317A (ja) 1999-02-12 2000-10-03 Natl Starch & Chem Investment Holding Corp エレクトロニクスデバイス用の電気的安定性をもつ導電性および抵抗性材料
CN1196744C (zh) 1999-12-20 2005-04-13 3M创新有限公司 室温稳定的一份式可固化环氧树脂粘合剂
US6498260B2 (en) * 2000-03-29 2002-12-24 Georgia Tech Research Corp. Thermally degradable epoxy underfills for flip-chip applications
US6849940B1 (en) * 2000-11-20 2005-02-01 Ati Technologies, Inc. Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same
NL1016779C2 (nl) * 2000-12-02 2002-06-04 Cornelis Johannes Maria V Rijn Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs.
US20020111420A1 (en) * 2001-02-12 2002-08-15 International Business Machines Corporation Underfill compositions
US6583201B2 (en) * 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US20040113127A1 (en) * 2002-12-17 2004-06-17 Min Gary Yonggang Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
US7001938B2 (en) * 2003-01-27 2006-02-21 Resolution Performance Products Llc Epoxy resin curing compositions and resin compositions including same
WO2004073030A2 (en) 2003-02-06 2004-08-26 Georgia Tech Research Corporation Metal 8-hydroxyquinoline -functionalized polymers and related materials and methods of making and using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
WO2005080505A1 (ja) * 2004-02-20 2005-09-01 Ube Industries, Ltd. ポリイミドシロキサン溶液組成物
US20050247916A1 (en) * 2004-05-06 2005-11-10 Mccormick Demetrius Compositions for use in electronics devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878959B (zh) * 2023-05-25 2025-04-01 台灣積體電路製造股份有限公司 半導體裝置及垂直堆疊半導體裝置的製造方法

Also Published As

Publication number Publication date
TWI398474B (zh) 2013-06-11
JP2007056266A (ja) 2007-03-08
SG130161A1 (en) 2007-03-20
KR20070024402A (ko) 2007-03-02
EP1758163A1 (en) 2007-02-28
JP4648881B2 (ja) 2011-03-09
CN1919525B (zh) 2010-06-09
US20070049722A1 (en) 2007-03-01
DE602006009448D1 (de) 2009-11-12
EP1758163B1 (en) 2009-09-30
CN1919525A (zh) 2007-02-28
ATE444565T1 (de) 2009-10-15
US7378523B2 (en) 2008-05-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees