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TW200708348A - Apparatus for treatment works - Google Patents

Apparatus for treatment works

Info

Publication number
TW200708348A
TW200708348A TW095131270A TW95131270A TW200708348A TW 200708348 A TW200708348 A TW 200708348A TW 095131270 A TW095131270 A TW 095131270A TW 95131270 A TW95131270 A TW 95131270A TW 200708348 A TW200708348 A TW 200708348A
Authority
TW
Taiwan
Prior art keywords
treating
solution
substrate
box body
storing
Prior art date
Application number
TW095131270A
Other languages
English (en)
Other versions
TWI303190B (en
Inventor
Yong-Seok Park
Original Assignee
Dms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dms Co Ltd filed Critical Dms Co Ltd
Publication of TW200708348A publication Critical patent/TW200708348A/zh
Application granted granted Critical
Publication of TWI303190B publication Critical patent/TWI303190B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/01—Generalised techniques
    • H01J2209/017—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
TW095131270A 2005-08-31 2006-08-25 Apparatus for treatment works TWI303190B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050080857A KR100767005B1 (ko) 2005-08-31 2005-08-31 기판처리장치

Publications (2)

Publication Number Publication Date
TW200708348A true TW200708348A (en) 2007-03-01
TWI303190B TWI303190B (en) 2008-11-21

Family

ID=37818109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131270A TWI303190B (en) 2005-08-31 2006-08-25 Apparatus for treatment works

Country Status (3)

Country Link
KR (1) KR100767005B1 (zh)
CN (1) CN100505986C (zh)
TW (1) TWI303190B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103794428A (zh) * 2011-12-31 2014-05-14 四川虹欧显示器件有限公司 刻蚀装置和刻蚀方法
CN103805998B (zh) * 2014-03-03 2016-07-13 常州天合光能有限公司 硅片湿法刻蚀设备及其刻蚀方法
KR102634034B1 (ko) * 2019-04-05 2024-02-08 주식회사 디엠에스 기판처리장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040064992A (ko) * 2003-01-13 2004-07-21 엘지전자 주식회사 플라즈마 디스플레이 패널의 제조장치 및 그 방법

Also Published As

Publication number Publication date
TWI303190B (en) 2008-11-21
KR20070025091A (ko) 2007-03-08
CN100505986C (zh) 2009-06-24
KR100767005B1 (ko) 2007-10-15
CN1925723A (zh) 2007-03-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees