TW200631701A - Metal power for electrically conductive paste and electrically conductive paste - Google Patents
Metal power for electrically conductive paste and electrically conductive pasteInfo
- Publication number
- TW200631701A TW200631701A TW095103018A TW95103018A TW200631701A TW 200631701 A TW200631701 A TW 200631701A TW 095103018 A TW095103018 A TW 095103018A TW 95103018 A TW95103018 A TW 95103018A TW 200631701 A TW200631701 A TW 200631701A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive paste
- electrically conductive
- metal powder
- metal power
- paste
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 5
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 239000000843 powder Substances 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 208000000260 Warts Diseases 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 201000010153 skin papilloma Diseases 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005022502A JP4613362B2 (ja) | 2005-01-31 | 2005-01-31 | 導電ペースト用金属粉および導電ペースト |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200631701A true TW200631701A (en) | 2006-09-16 |
TWI295597B TWI295597B (en) | 2008-04-11 |
Family
ID=36814304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095103018A TWI295597B (en) | 2005-01-31 | 2006-01-26 | Metal power for electrically conductive paste and electrically conductive paste |
Country Status (5)
Country | Link |
---|---|
US (1) | US7618475B2 (zh) |
JP (1) | JP4613362B2 (zh) |
KR (1) | KR101236245B1 (zh) |
CN (1) | CN1827265B (zh) |
TW (1) | TWI295597B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI800294B (zh) * | 2021-03-10 | 2023-04-21 | 日商同和電子科技股份有限公司 | 銀粉及其製造方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5092630B2 (ja) * | 2007-09-04 | 2012-12-05 | 住友金属鉱山株式会社 | 微粒銀粉およびその製造方法並びにその微粒銀粉を用いた導電性ペースト用分散液 |
WO2011043265A1 (ja) * | 2009-10-05 | 2011-04-14 | 株式会社村田製作所 | 扁平形状のNi粒子、それを用いた積層セラミック電子部品、および扁平形状のNi粒子の製造方法 |
JP5425231B2 (ja) | 2010-01-28 | 2014-02-26 | 独立行政法人科学技術振興機構 | パターン状導電性膜の形成方法 |
US8313551B1 (en) * | 2010-03-17 | 2012-11-20 | Energetic Materials LLC | Copper alloy particle synthesis |
JP5700194B2 (ja) * | 2010-07-01 | 2015-04-15 | 住友ベークライト株式会社 | 扁平状導電性粒子の製造方法 |
JP5631841B2 (ja) * | 2011-10-21 | 2014-11-26 | 三井金属鉱業株式会社 | 銀被覆銅粉 |
EP2796228B1 (en) * | 2012-01-17 | 2020-10-28 | DOWA Electronics Materials Co., Ltd. | Silver-coated copper alloy powder and method for manufacturing same |
KR102017121B1 (ko) * | 2012-03-06 | 2019-09-02 | 토요잉크Sc홀딩스주식회사 | 도전성 미립자 및 그 제조 방법, 도전성 수지 조성물, 도전성 시트 및 전자파 차폐 시트 |
JP5510531B1 (ja) * | 2012-11-29 | 2014-06-04 | 住友金属鉱山株式会社 | 銀粉及び銀ペースト |
JP5937995B2 (ja) * | 2013-03-28 | 2016-06-22 | 日本碍子株式会社 | ポンプセルの内部電極の製法 |
CN106029266B (zh) * | 2014-03-28 | 2021-02-19 | 东洋铝株式会社 | 薄片状金属颜料及其制造方法,及其金属组合物和涂布物 |
JP5907301B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 |
JP5907302B1 (ja) * | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法 |
JP2018138687A (ja) * | 2017-02-24 | 2018-09-06 | 日立化成株式会社 | 接続構造、接続構造の製造方法、接続構造体及び半導体装置 |
JP6765328B2 (ja) | 2017-03-15 | 2020-10-07 | 株式会社堀場製作所 | 作成方法、グロー放電発光分析方法、器具、及びグロー放電発光分析装置 |
KR20230145159A (ko) | 2021-03-08 | 2023-10-17 | 도와 일렉트로닉스 가부시키가이샤 | 플레이크상 은 분말 및 그 제조 방법, 그리고 도전성 페이스트 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5917142B2 (ja) * | 1979-06-08 | 1984-04-19 | 旭化成株式会社 | 新規な鱗片状金属粉末顔料 |
US4663189A (en) * | 1982-12-20 | 1987-05-05 | Engelhard Corporation | Ceramic multilayer electrical capacitors |
JPH0711005B2 (ja) * | 1988-09-09 | 1995-02-08 | 昭和アルミパウダー株式会社 | メタリック顔料用整粒金属粉末及び整粒金属粉末の製造方法 |
US4884754A (en) * | 1989-01-03 | 1989-12-05 | Gte Products Corporation | Process for producing fine copper flakes |
US5389122A (en) * | 1993-07-13 | 1995-02-14 | E. I. Du Pont De Nemours And Company | Process for making finely divided, dense packing, spherical shaped silver particles |
JPH07118701A (ja) | 1993-10-22 | 1995-05-09 | Katayama Tokushu Kogyo Kk | フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法 |
US5492653A (en) * | 1994-11-07 | 1996-02-20 | Heraeus Incorporated | Aqueous silver composition |
JPH11264001A (ja) | 1998-03-16 | 1999-09-28 | Mitsui Mining & Smelting Co Ltd | フレーク銅粉及びその製造方法 |
JP3868671B2 (ja) * | 1999-07-16 | 2007-01-17 | 尾池工業株式会社 | 金属箔粉およびその製法 |
KR100743844B1 (ko) * | 1999-12-01 | 2007-08-02 | 도와 마이닝 가부시끼가이샤 | 구리 분말 및 구리 분말의 제조 방법 |
JP4701426B2 (ja) * | 1999-12-01 | 2011-06-15 | Dowaエレクトロニクス株式会社 | 銅粉および銅粉の製法 |
JP3474170B2 (ja) * | 2000-01-14 | 2003-12-08 | 三井金属鉱業株式会社 | ニッケル粉及び導電ペースト |
KR100877115B1 (ko) * | 2001-04-27 | 2009-01-07 | 도와 홀딩스 가부시끼가이샤 | 내산화성이 우수한 전기전도 페이스트용 구리 분말 및이의 제법 |
JP2002334614A (ja) * | 2001-05-07 | 2002-11-22 | Kawakado Kimiko | 導電性粒子 |
JP4227373B2 (ja) | 2001-08-07 | 2009-02-18 | 三井金属鉱業株式会社 | フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト |
JP2004027246A (ja) | 2002-06-21 | 2004-01-29 | Fukuda Metal Foil & Powder Co Ltd | 導電ペースト用銅粉及びその製造方法 |
JP4145127B2 (ja) * | 2002-11-22 | 2008-09-03 | 三井金属鉱業株式会社 | フレーク銅粉及びそのフレーク銅粉の製造方法並びにそのフレーク銅粉を用いた導電性ペースト |
JP4047304B2 (ja) * | 2003-10-22 | 2008-02-13 | 三井金属鉱業株式会社 | 微粒銀粒子付着銀粉及びその微粒銀粒子付着銀粉の製造方法 |
JP4868716B2 (ja) * | 2004-04-28 | 2012-02-01 | 三井金属鉱業株式会社 | フレーク銅粉及び導電性ペースト |
JP4879473B2 (ja) * | 2004-10-25 | 2012-02-22 | 三井金属鉱業株式会社 | フレーク銅粉及びフレーク銅粉の製造方法並びにフレーク銅粉を含む導電性スラリー |
-
2005
- 2005-01-31 JP JP2005022502A patent/JP4613362B2/ja not_active Expired - Lifetime
-
2006
- 2006-01-26 CN CN200610073970XA patent/CN1827265B/zh not_active Expired - Fee Related
- 2006-01-26 TW TW095103018A patent/TWI295597B/zh not_active IP Right Cessation
- 2006-01-27 KR KR1020060009130A patent/KR101236245B1/ko not_active Expired - Fee Related
- 2006-01-27 US US11/340,652 patent/US7618475B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI800294B (zh) * | 2021-03-10 | 2023-04-21 | 日商同和電子科技股份有限公司 | 銀粉及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4613362B2 (ja) | 2011-01-19 |
US20060179975A1 (en) | 2006-08-17 |
TWI295597B (en) | 2008-04-11 |
CN1827265A (zh) | 2006-09-06 |
KR20060088058A (ko) | 2006-08-03 |
JP2006210214A (ja) | 2006-08-10 |
KR101236245B1 (ko) | 2013-02-22 |
CN1827265B (zh) | 2012-09-19 |
US7618475B2 (en) | 2009-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |