TW200509285A - Die carrier - Google Patents

Die carrier

Info

Publication number: TW200509285A
Authority: TW; Taiwan
Prior art keywords: die carrier; fluid chamber; die; port; attachment
Prior art date: 2003-08-27

Application number

TW093104950A

Other languages

English (en)

Other versions

TWI239068B (en

Inventor

Ronald A Hellekson

Chien Hua Chen

William R Boucher

Joshua W Smith

David M Craig

Gary J Watts

Original Assignee

Hewlett Packard Development Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-08-27

Filing date

2004-02-26

Publication date

2005-03-01

2004-02-26 Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co

2005-03-01 Publication of TW200509285A publication Critical patent/TW200509285A/zh

2005-09-01 Application granted granted Critical

2005-09-01 Publication of TWI239068B publication Critical patent/TWI239068B/zh

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
- B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
Health & Medical Sciences (AREA)
General Health & Medical Sciences (AREA)
Toxicology (AREA)
Micromachines (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Manipulator (AREA)
Reciprocating Pumps (AREA)
Die Bonding (AREA)

TW093104950A 2003-08-27 2004-02-26 Die carrier TWI239068B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US10/650,572 US6917099B2 (en)	2003-08-27	2003-08-27	Die carrier with fluid chamber

Publications (2)

Publication Number	Publication Date
TW200509285A true TW200509285A (en)	2005-03-01
TWI239068B TWI239068B (en)	2005-09-01

Family

ID=34104710

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW093104950A TWI239068B (en)	2003-08-27	2004-02-26	Die carrier

Country Status (6)

Country	Link
US (1)	US6917099B2 (zh)
EP (1)	EP1510500A3 (zh)
JP (1)	JP4133970B2 (zh)
KR (1)	KR20050021323A (zh)
CN (1)	CN1590278A (zh)
TW (1)	TWI239068B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20050012197A1 (en) *	2003-07-15	2005-01-20	Smith Mark A.	Fluidic MEMS device
US7249302B2 (en) *	2003-08-01	2007-07-24	Intermec Ip Corp.	Integrated test-on-chip system and method and apparatus for manufacturing and operating same
US7395474B2 (en) *	2003-08-01	2008-07-01	Intermec Ip Corp.	Lab-on-chip system and method and apparatus for manufacturing and operating same
US6858466B1 (en) *	2003-11-03	2005-02-22	Hewlett-Packard Development Company, L.P.	System and a method for fluid filling wafer level packages
US7397067B2 (en) *	2003-12-31	2008-07-08	Intel Corporation	Microdisplay packaging system
JP2006245356A (ja) *	2005-03-04	2006-09-14	Hitachi Ltd	電子デバイスの冷却装置
JP2007027279A (ja) *	2005-07-13	2007-02-01	Shinko Electric Ind Co Ltd	半導体装置および半導体装置の製造方法
US7417307B2 (en) *	2005-07-29	2008-08-26	Hewlett-Packard Development Company, L.P.	System and method for direct-bonding of substrates
IT1392230B1 (it) *	2008-12-15	2012-02-22	Sgm Technology For Lighting	Strtuura di impianto di raffreddamento per dispositivi digitali a microspecchi
JP5649125B2 (ja) *	2011-07-01	2015-01-07	Ｎｅｃエンジニアリング株式会社	テープ貼付装置
KR101468881B1 (ko) *	2013-04-15	2014-12-05	이엘케이 주식회사	캐리어 기판 및 이를 이용한 터치스크린 패널의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1303238C (en) *	1988-05-09	1992-06-09	Kazuhiko Umezawa	Flat cooling structure of integrated circuit
US5171132A (en) *	1989-12-27	1992-12-15	Seiko Epson Corporation	Two-valve thin plate micropump
US5016090A (en) *	1990-03-21	1991-05-14	International Business Machines Corporation	Cross-hatch flow distribution and applications thereof
JP2995590B2 (ja) *	1991-06-26	1999-12-27	株式会社日立製作所	半導体冷却装置
JP3328300B2 (ja) *	1991-07-18	2002-09-24	アイシン精機株式会社	流体制御装置
US5514906A (en) *	1993-11-10	1996-05-07	Fujitsu Limited	Apparatus for cooling semiconductor chips in multichip modules
US5707850A (en) *	1995-11-09	1998-01-13	Cole; Kenneth D.	Concentration and size-fractionation of nucleic acids and viruses in porous media
US6299300B1 (en) *	1997-07-15	2001-10-09	Silverbrook Research Pty Ltd	Micro electro-mechanical system for ejection of fluids
US6215221B1 (en) *	1998-12-29	2001-04-10	Honeywell International Inc.	Electrostatic/pneumatic actuators for active surfaces
US6567138B1 (en) *	1999-02-15	2003-05-20	Rainbow Displays, Inc.	Method for assembling a tiled, flat-panel microdisplay array having imperceptible seams
DE10202996A1 (de) *	2002-01-26	2003-08-14	Eppendorf Ag	Piezoelektrisch steuerbare Mikrofluidaktorik

2003
- 2003-08-27 US US10/650,572 patent/US6917099B2/en not_active Expired - Fee Related
2004
- 2004-02-26 TW TW093104950A patent/TWI239068B/zh not_active IP Right Cessation
- 2004-05-27 CN CNA2004100476599A patent/CN1590278A/zh active Pending
- 2004-08-23 JP JP2004242393A patent/JP4133970B2/ja not_active Expired - Fee Related
- 2004-08-25 EP EP04255119A patent/EP1510500A3/en not_active Withdrawn
- 2004-08-26 KR KR1020040067550A patent/KR20050021323A/ko not_active Withdrawn

Also Published As

Publication number	Publication date
US20050045974A1 (en)	2005-03-03
TWI239068B (en)	2005-09-01
JP4133970B2 (ja)	2008-08-13
KR20050021323A (ko)	2005-03-07
CN1590278A (zh)	2005-03-09
US6917099B2 (en)	2005-07-12
EP1510500A3 (en)	2006-11-15
EP1510500A2 (en)	2005-03-02
JP2005072593A (ja)	2005-03-17

Publication	Publication Date	Title
USD542682S1 (en)	2007-05-15	Fluid pressure cylinder
USD487838S1 (en)	2004-03-30	Outsole
USD556900S1 (en)	2007-12-04	Seal ring
USD584324S1 (en)	2009-01-06	Fluid power cylinder
TW200509285A (en)	2005-03-01	Die carrier
AU2003241283A1 (en)	2003-10-20	Time or time-temperature indicating articles
ATE386641T1 (de)	2008-03-15	Ventil, tintenpatrone mit diesem ventil und tintenversorgungsverfahren
MY141471A (en)	2010-04-30	Ink cartridge
DE602004009328D1 (de)	2007-11-15	Druckfluidbehälter
WO2004052540A3 (en)	2004-09-16	Configurable microfluidic substrate assembly
CA110102S (en)	2007-03-06	Elbow coupling
USD583157S1 (en)	2008-12-23	Container surface
AU2003240417A1 (en)	2003-11-11	Cleaning device for floors
TW200605392A (en)	2006-02-01	Optoelectronic component with several partial housing-bodies
TW200722334A (en)	2007-06-16	Reservoir apparatus for a bicycle brake lever device
USD527027S1 (en)	2006-08-22	Excavator tool carrier
USD992383S1 (en)	2023-07-18	O-ring seal installation tool
WO2009015798A3 (en)	2009-04-23	Mounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
AU304631S (en)	2005-12-14	Valve of a seal valve assembly
USD522090S1 (en)	2006-05-30	Fluid pressure cylinder
USD556860S1 (en)	2007-12-04	Fluid pressure cylinder
TW200516731A (en)	2005-05-16	A system and a method for fluid filling wafer level packages
USD575177S1 (en)	2008-08-19	Fluid pressure cylinder
AU2000279451A1 (en)	2002-04-15	An hydraulic pump for vehicles controllable by handlebars
USD577447S1 (en)	2008-09-23	Decorative candleholder

Legal Events

Date	Code	Title	Description
2010-06-21	MM4A	Annulment or lapse of patent due to non-payment of fees