[go: up one dir, main page]

KR900010819A - 플랫 코일의 실장 방법 - Google Patents

플랫 코일의 실장 방법 Download PDF

Info

Publication number
KR900010819A
KR900010819A KR1019890017838A KR890017838A KR900010819A KR 900010819 A KR900010819 A KR 900010819A KR 1019890017838 A KR1019890017838 A KR 1019890017838A KR 890017838 A KR890017838 A KR 890017838A KR 900010819 A KR900010819 A KR 900010819A
Authority
KR
South Korea
Prior art keywords
flat coil
connection surface
conductive pattern
flat coils
pattern
Prior art date
Application number
KR1019890017838A
Other languages
English (en)
Inventor
시게따까 히구찌
이사오 노구찌
도오루 오다시마
Original Assignee
오오가 노리오
소니 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 가부시끼 가이샤 filed Critical 오오가 노리오
Publication of KR900010819A publication Critical patent/KR900010819A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Windings For Motors And Generators (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

내용 없음

Description

플랫 코일의 실장 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3도는 본 발명에 관계하는 플랫 코일의 외관 사시도.

Claims (1)

  1. 절연층을 피착한 금속박을 감아서 이루어지는 플랫 코일의 시단부 및 종단부에 각각 폭방향에 걸쳐서 땜납층으로 되는 단자부를 형성하고, 그 플랫 코일을 도전 패턴이 형성된 회로 기판상에 상기 단자부가 상기도전 패턴의 접속면에 대해서 수직이 되게 배치하고, 상기 도전 패턴의 접속면에는 땜납재를 부착하고, 전체면에 걸쳐서 용착시켜서 상기 도전 패턴의 접속면과 상기 플랫 코일의 단자부를 접속토록 한 것을 특징으로 하는 플랫 코일의 실장 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890017838A 1988-12-05 1989-12-04 플랫 코일의 실장 방법 KR900010819A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63307535A JPH02153502A (ja) 1988-12-05 1988-12-05 フラットコイルの実装方法
JP307535 1988-12-05

Publications (1)

Publication Number Publication Date
KR900010819A true KR900010819A (ko) 1990-07-09

Family

ID=17970262

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017838A KR900010819A (ko) 1988-12-05 1989-12-04 플랫 코일의 실장 방법

Country Status (3)

Country Link
US (1) US5008998A (ko)
JP (1) JPH02153502A (ko)
KR (1) KR900010819A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172258A (ja) * 1994-12-16 1996-07-02 Sony Chem Corp 電子部品の実装方法
WO1998056217A1 (fr) * 1997-06-04 1998-12-10 Ibiden Co., Ltd. Element de brasage tendre pour cartes a circuit imprime
DE19947914A1 (de) * 1999-10-06 2001-04-12 Abb Research Ltd Verfahren zum Weichlöten von Komponenten und weichgelötete Anordnung
JP2006339329A (ja) * 2005-06-01 2006-12-14 Seiko Epson Corp 平面コイル装置及び基板並びに平面コイル固定方法
JP4823278B2 (ja) * 2008-08-04 2011-11-24 パナソニック株式会社 コイルの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2933412A (en) * 1957-08-15 1960-04-19 Western Electric Co Method of protecting solder-coated articles
US3911568A (en) * 1974-11-18 1975-10-14 Gen Motors Corp Method and apparatus for bonding miniature semiconductor pill-type components to a circuit board
DE2915240A1 (de) * 1978-06-28 1980-01-03 Mitsumi Electric Co Gedruckte schaltung
JPS5672772A (en) * 1979-11-19 1981-06-17 Toshiba Corp Storage retrieval system for picture information
US4503605A (en) * 1981-05-15 1985-03-12 Westinghouse Electric Corp. Method of making a cellulose-free electrical winding
US4644643A (en) * 1984-02-22 1987-02-24 Kangyo Denkikiki Kabushiki Kaisha Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin
JPS6313305A (ja) * 1986-07-04 1988-01-20 Sony Chem Corp フラツトコイル

Also Published As

Publication number Publication date
JPH02153502A (ja) 1990-06-13
US5008998A (en) 1991-04-23

Similar Documents

Publication Publication Date Title
KR840000080A (ko) 혼성집적회로부품 및 그 부착방법
KR880008730A (ko) 플렉시블 인쇄회로 기판용 단자구조물
KR930003869A (ko) 인쇄회로 기판을 이용한 전자조리기의 가열 장치
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR960005650A (ko) 박형푸시스위치
KR900010819A (ko) 플랫 코일의 실장 방법
US4725806A (en) Contact elements for miniature inductor
KR910013883A (ko) 용량성 트리밍 장치
JP2567186Y2 (ja) 面実装インダクタ
ES285583U (es) Una bobina electrica de alta frecuencia con espigas de co- nexion
JPS58170095A (ja) フレキシブル回路板
KR890015311A (ko) 칩형 콘덴서 및 그 제조방법
KR920015970A (ko) 복동조 회로용 프린트코일
KR970068767A (ko) 프린트기판의 고정구조(fixing structure for print substrate)
KR910007214A (ko) 전기 회로기판
KR900004230A (ko) 공심코일 및 그 공심 코일을 납땜한 프린트 기판 조립체
JP2974916B2 (ja) インダクタンス素子
JPH0236266Y2 (ko)
JPS5873108A (ja) チツプコンデンサの製造方法
KR960028714A (ko) 프린트 배선회로용 기판에 인쇄된 코일
KR920017525A (ko) 코일단자구조
JPH043513Y2 (ko)
JPS6223055Y2 (ko)
JPS618934U (ja) プリント回路基板用ヒユ−ズ
JPH021845Y2 (ko)

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19891204

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19941201

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19891204

Comment text: Patent Application

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19980130

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee