KR20210045334A - Slurry supply device and wafer polishing system comprising the same, wafer ploishing method - Google Patents

Abstract

Disclosed are a slurry supply unit and a substrate polishing device having the same. According to one embodiment, the slurry supply unit supplying slurry to a polishing pad comprises: a supply pipe where the slurry is moved; an injection nozzle connected to the supply pipe and injecting the slurry to the polishing pad; and a temperature control unit connected to the supply pipe and controlling temperature of the slurry injected through the injection nozzle.

Description

Slurry supply device and substrate polishing system including the same, substrate polishing method TECHNICAL FIELD [Slurry SUPPLY DEVICE AND WAFER POLISHING SYSTEM COMPRISING THE SAME, WAFER PLOISHING METHOD}

The following embodiments relate to a slurry supply apparatus and a substrate polishing system including the same.

The fabrication of the substrate requires a chemical mechanical polishing (CMP) operation including polishing, buffing, and cleaning. In the CMP operation of the substrate, a step of polishing the surface to be polished of the substrate through a polishing pad is required. The CMP apparatus is a component for polishing, buffing, and cleaning one or both sides of a substrate, and includes a carrier supporting the substrate and a polishing pad that physically wears the surface of the substrate. During the substrate polishing process, a slurry may be supplied to a portion of the substrate that is polished by the polishing pad.

The slurry is supplied between the substrate and the polishing pad, so that the substrate is polished through mechanical friction caused by the slurry particles and the polishing pad surface protrusions, and the surface of the substrate is polished through a chemical reaction by the composition constituting the slurry. have. In this case, a chemical reaction through the slurry may induce a change in the physical properties of the polishing pad. This chemical reaction is related to the temperature of the slurry and may ultimately affect the polishing rate of the substrate.

Conventionally, the slurry was stored in a tank, and the temperature of the stored slurry was collectively adjusted to be supplied to the substrate, but it was difficult to precisely control the temperature of the slurry supplied to the polishing pad or the temperature changed during the flow of the slurry.

Accordingly, there is a need for a technique for uniformly and finely controlling the temperature of the slurry supplied during the substrate polishing process.

An object according to an embodiment is to provide a slurry supply device capable of controlling a temperature of a polishing pad through a slurry supplied to the polishing pad during a substrate polishing process, and a substrate polishing system including the same.

An object according to an embodiment is to provide a slurry supply device capable of simultaneously securing a polishing rate increase and deterioration prevention effect of a substrate through temperature control of a polishing pad, and a substrate polishing system including the same.

A slurry supplying apparatus according to an embodiment includes: a supply arm disposed on a polishing pad for polishing a substrate and forming an internal accommodation space; A heating module disposed inside the receiving space and configured to heat the slurry and spray it onto the polishing pad; And a cooling module disposed inside the accommodation space for cooling the slurry and spraying the slurry onto the polishing pad, and the temperature of the polishing pad may be adjusted through independent spraying of the slurry in each of the heating module and the cooling module.

The heating module is provided in plural, and the plurality of heating modules includes: a slurry heating module for heating and supplying the slurry; And one or more preliminary heating modules for heating and supplying pure water.

The supply arm includes a support plate constituting a bottom surface of the accommodation space; And a fixing plate disposed in the receiving space so as to be spaced apart from the support plate at a predetermined distance, wherein the cooling module is disposed under the fixing plate, and the plurality of heating modules may be disposed on an upper surface of the fixing plate. have.

Each of the heating module and the cooling module is connected to a discharge pipe for flow of the discharged slurry, and the support plate may include a discharge pipe fixing part to which an end of the discharge pipe is fitted and fixed.

The heating module includes: a housing having a flow path formed therein, an inlet port for supplying a fluid to the flow channel, and an outlet port for discharging the fluid to the outside of the flow channel; A heater for heating the fluid flowing through the flow path; A temperature sensor that detects the temperature of the fluid discharged through the discharge port; And a temperature controller controlling the operation of the heater based on the temperature detected by the temperature sensor.

The heater includes a heating flow path formed therein to allow fluid to flow, and a flow path formed in the housing includes a first heating flow path connected to the inlet at one side and the inlet of the heating flow path on the other side, and the heating flow path at the other side. The second heating passage connected to the outlet of the passage and the other side may be connected to the outlet.

A temperature measurement port communicating with the outside of the housing is formed in a flow path portion adjacent to the discharge port, and the temperature sensor may include a bimetal sensor installed on an outer surface of the housing in which the temperature measurement port is formed.

The heating module may further include a heater sensor connected to the heater to detect whether the heater is overheated.

The cooling module may include a cooling housing; A first flow path formed in the cooling housing and through which the slurry flows; A second flow passage formed inside the housing so as to be separated from the first flow passage, formed in the housing, and flowing coolant; And a heat exchanger configured to perform heat exchange between the first flow passage and the second flow passage.

The slurry supplying device further includes a rotating part disposed outside the polishing pad and connected to the supply arm, and the supply arm is rotatably connected to the rotating part, so that it can swing from the upper part of the polishing pad.

A substrate polishing system according to an embodiment includes a polishing plate having a polishing pad disposed thereon; A carrier head for polishing the substrate by pressing the polishing pad while holding the substrate; And a slurry supplying device that sprays the slurry onto the polishing pad during the polishing process of the substrate and controls the temperature of the polishing pad through temperature control of the sprayed slurry.

The slurry supplying device includes: a heating module for heating the slurry and spraying it onto the polishing pad; And a cooling module for cooling the slurry and spraying the slurry onto the polishing pad, wherein the heating module and the cooling module may respectively spray the slurry onto the polishing pad.

The slurry supplying device may further include a heating module for heating the pure water and spraying it onto the polishing pad.

The slurry supplying device may spray pure water heated through the heating module onto the polishing pad before polishing the substrate.

According to an exemplary embodiment, a substrate polishing method of polishing a substrate through a polishing pad includes a preheating step of increasing a temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; A heating step of adjusting a temperature of the polishing pad to a set temperature by supplying a heated slurry to the polishing pad during the polishing process of the substrate; And after the heating step, a cooling step of reducing a temperature of the polishing pad by supplying the cooled slurry to the polishing pad.

The slurry supplying apparatus and the substrate polishing system including the same according to an exemplary embodiment may control the temperature of the polishing pad through the slurry supplied to the polishing pad during the substrate polishing process.

The slurry supplying apparatus and the substrate polishing system including the same according to an exemplary embodiment may simultaneously secure a polishing rate increase and a deterioration prevention effect of a substrate through temperature control of the polishing pad.

In the slurry supply apparatus and the substrate polishing system including the same according to an embodiment, the effects of are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. .

The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the present invention. It is limited and should not be interpreted.
1 is a graph showing a correlation between a temperature of a slurry supplied during a substrate polishing process and a substrate polishing rate.
2 is a graph showing a correlation between a temperature of a slurry supplied during a substrate polishing process and a flatness of a substrate surface.
3 is a perspective view of a substrate polishing system according to an exemplary embodiment.
4 is a plan view of a substrate polishing system according to an exemplary embodiment.
5 is a perspective perspective view of a slurry supply device according to an embodiment.
6 is a perspective view of a heating module according to an embodiment.
7 is a plan view of a heating module according to an exemplary embodiment.
8 is a perspective view of a cooling module according to an embodiment.

Hereinafter, embodiments will be described in detail through exemplary drawings. In adding reference numerals to elements of each drawing, it should be noted that the same elements are assigned the same numerals as possible, even if they are indicated on different drawings. In addition, in describing the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the constituent elements of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are for distinguishing the constituent element from other constituent elements, and the nature, order, or order of the constituent element is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to that other component, but another component between each component It should be understood that may be “connected”, “coupled” or “connected”.

Components included in one embodiment and components including common functions will be described using the same name in other embodiments. Unless otherwise stated, the description in one embodiment may be applied to other embodiments, and a detailed description will be omitted in the overlapping range.

Hereinafter, a substrate polishing system including a slurry supply device will be described. The substrate polishing system may perform a chemical mechanical planarization (CMP) process of a substrate. The CMP process may include physical polishing in which a substrate is physically abraded through a polishing pad, and a chemical polishing process using a chemical reaction of a slurry.

The substrate on which the substrate polishing system is used may be a silicon wafer for manufacturing a semiconductor device (Semiconductor). The substrate may be formed in a multilayer structure formed by stacking metal or insulator layers. In order to secure a target profile, the surface must be planarized through a polishing process.

Slurry may be supplied during the polishing process of the substrate. The slurry is supplied between the substrate and the polishing pad to physically polish the surface of the substrate, while chemically reacting with the material of the substrate surface to form a compound. Meanwhile, in the process of polishing the substrate, the slurry may have a close influence on the polishing state of the substrate surface.

1 is a graph showing the correlation between the temperature of the slurry supplied during the substrate polishing process and the substrate polishing rate, and FIG. 2 is a graph showing the correlation between the temperature of the slurry supplied during the substrate polishing process and the flatness of the substrate surface. .

Referring to FIG. 1, it can be seen that the temperature of the slurry is related to the removal rate (RR) of the substrate. Although the polishing rate value differs according to the type of slurry, it can be seen that the polishing rate of the substrate increases as the temperature of the slurry increases up to a certain temperature. In addition, when a certain temperature is exceeded, it can be confirmed that the polishing rate of the substrate is maintained within a certain range. Therefore, it can be understood that if the slurry is supplied at a predetermined temperature or higher during the polishing process of the substrate, the polishing rate of the substrate is improved. The increase in the polishing rate of the substrate shortens the abrasion time of the substrate to the target thickness, and ultimately, the time required for polishing the substrate can be reduced.

Referring to FIG. 2, it can be seen that the temperature of the slurry supplied during the substrate polishing process is related to the flatness of the substrate surface. Although there is a difference in the nonuniformity value for the temperature range depending on the type of slurry, it can be seen that the nonuniformity of the substrate surface is low in a specific slurry temperature range. In general, in the process of polishing a multi-layered layer, a dishing phenomenon in which a specific portion is recessed may occur due to differences in materials constituting the layer. Accordingly, when the temperature of the slurry supplied during the polishing process of the substrate is controlled, the occurrence of dishing on the substrate surface is minimized, thereby greatly reducing the surface non-uniformity of the substrate, thereby improving the quality of the substrate.

3 is a perspective view of a substrate polishing system according to an exemplary embodiment, and FIG. 4 is a plan view of a substrate polishing system according to an exemplary embodiment.

3 and 4, the substrate polishing system 1 according to an exemplary embodiment may polish a substrate W. The substrate polishing system 1 may improve the polishing rate and polishing uniformity of the substrate W by adjusting the polishing process temperature of the substrate W through the slurry supplied during the polishing process of the substrate W. The substrate polishing system 1 may include a carrier head 12, a polishing plate 11, a conditioner 13 and a slurry supply device 10.

The carrier head 12 may hold the substrate W. The carrier head 12 can polish the substrate W by pressing it against a polishing pad 111 to be described later while holding the substrate W. The carrier head 12 may rotate while holding the substrate W. The carrier head 12 may rotate about an axis perpendicular to the surface of the substrate W, as shown in FIG. 3. The carrier head 12 may move in a first direction and a second direction perpendicular to the first direction on a plane parallel to the surface of the substrate W. Accordingly, the position of the substrate W may be adjusted above the polishing pad 111 according to the movement of the carrier head 12.

The polishing plate 11 may polish the substrate W by contacting the substrate W held by the carrier head 12. The polishing table 11 may include a rotary table 112 and a polishing pad 111.

The rotary table 112 may rotate about an axis perpendicular to the ground. A polishing pad 111 may be provided on the rotary table 112. The polishing pad 111 may have a groove formed on its surface. The polishing pad 111 may have a larger area than the substrate W. During the process of polishing the substrate W, the substrate W may contact a local point of the polishing pad 111. Hereinafter, for convenience of description, a portion of the polishing pad 111 in contact with the substrate W will be referred to as a polishing portion.

The conditioner 13 may condition the surface of the polishing pad 111. As the polishing is performed, the surface of the polishing pad 111 may be worn. For example, a groove formed on the surface of the polishing pad 111 may be flat. Since the wear of the groove reduces the polishing efficiency of the substrate W, the conditioner 13 recovers the surface of the polishing pad 111 to have sufficient roughness through a regeneration operation that sharpens the surface of the polishing pad 111 I can make it. The conditioner 13 may include a conditioning pad in contact with the polishing pad 111 and a conditioning head that rotates the conditioning pad with respect to the polishing pad 111.

The slurry supply device 10 may spray the slurry onto the polishing pad 111. The slurry supplying device 10 may control the temperature of the polishing pad 111 by controlling the temperature of the slurry sprayed onto the polishing pad 111 during the polishing process of the substrate W. In other words, the slurry supplying device 10 may control the polishing process temperature of the substrate W through the slurry.

5 is a perspective perspective view of a slurry supplying device 10 according to an embodiment, FIG. 6 is a perspective view of a heating module 102 according to an embodiment, and FIG. 7 is a heating module 102 according to an embodiment Is a plan view of, and FIG. 8 is a perspective view of the cooling module 103 according to an exemplary embodiment.

5 to 8, the slurry supplying apparatus 10 according to an embodiment may include a rotating part 104, a supply arm 101, a heating module 102, and a cooling module 103.

The rotating part 104 may be disposed outside the polishing pad 111. The rotating part 104 may have a longitudinal direction perpendicular to the surface of the polishing pad 111. The supply arm 101 is disposed above the polishing pad 111 to supply the slurry to the polishing pad 111. One side of the supply arm 101 is connected to the rotating part 104 and rotatably connected to the rotating part 104 so that it can swing from the top of the polishing pad 111. The supply arm 101 may include an internal accommodation space. A heating module 102 and a cooling module 103 to be described later may be disposed inside the accommodation space.

The supply arm 101 may include a support plate constituting a bottom surface of the receiving space, and a fixing plate disposed in the receiving space and spaced apart from the support plate at a predetermined interval. In this case, a cooling module may be disposed under the fixed plate, and a plurality of heating modules may be disposed on an upper surface of the fixed plate, respectively.

Meanwhile, as will be described later, the plurality of heating modules and cooling modules independently control and discharge the temperature of the slurry, and a discharge pipe for flowing the discharged slurry may be connected to each heating module and cooling module. In this case, the support plate may have an opening formed to be opened so that the discharge pipe can be discharged to the outside of the supply arm 101, and an end of the discharge pipe protruding to the outside may be fitted and fixed to the lower side of the opening. . An insertion hole into which the discharge pipe is inserted may be formed in the discharge pipe fixing part.

The heating module 102 may be disposed inside the supply arm 101. The heating module 102 may heat the slurry supplied to the inside, and spray the heated slurry to the polishing pad 111 through the supply arm 101. A plurality of heating modules 102 may be provided inside the supply arm 101. In this case, the slurry or pure water may be heated and supplied to the polishing pad 111 through the plurality of heating modules 102. For example, at least one of the plurality of heating modules 102 may be divided into a slurry heating module that heats and discharges the slurry, and a preliminary heating module that heats deionized water and supplies it to the polishing pad 111. . The plurality of heating modules 102 are formed in the same structure, and each heating module 102 may individually receive and heat a fluid, and discharge the heated fluid to the outside of the supply arm 101, respectively. The temperature of the fluid passing through each heating module 102 may be set individually.

The heating module 102 may include a housing 1021, a heater 1026, a heater sensor, a temperature sensor 1024, and a temperature controller.

The housing 1021 may have a flow path formed therein. An inlet 1022 and an outlet 1023 communicating with a flow path formed therein may be formed on an outer surface of the housing 1021, respectively. The fluid supplied into the housing 1021 through the inlet 1022 may flow through a flow path inside the housing 1021 and then be discharged to the outside of the housing 1021 through the outlet 1023. A supply pipe and a discharge pipe are connected to the inlet 1022 and the discharge port 1023, respectively, and the fluid to be heated is supplied into the heating module 102 through the supply pipe, and the fluid passing through the heating module 102 is discharged through the discharge pipe. I can.

The heater 1026 may heat a fluid flowing through a flow path. The heater may include a heating element installed inside the housing 1021 to directly apply heat to the flow path. On the other hand, the heater 1026 may include a heating flow path that communicates with the flow path of the housing 1021 as shown in FIG. 7. In this case, the fluid passing through the flow path of the housing 1021 may be heated while passing through the heating flow path. . For example, a flow path formed inside the housing has a first heating flow path connected to the inlet of one side and the inlet of the heating flow path on the other side, and a first heating flow path connected to the outlet of the heating flow path, and the other side connected to the outlet. 2 Heating flow path may be included.

The heater sensor may detect the temperature of the heater 1026. The heater sensor may prevent the heating module 102 from being damaged due to overheating of the heater.

The temperature sensor 1024 is installed around the discharge port and may detect the temperature of the fluid discharged through the discharge port 1023. Since the fluid discharged to the outside of the housing 1021 through the outlet 1023 is sprayed directly to the polishing pad 111, the temperature of the fluid sprayed to the polishing pad 111 through a temperature sensor can be detected in real time. On the other hand, in the portion of the flow path adjacent to the outlet, a temperature measuring port communicating with the outside of the housing may be formed. In this case, the temperature sensor is a bi-metal temperature sensor installed on the outer surface of the housing in which the temperature measuring port is formed. I can.

The temperature controller may control the operation of the heater based on the temperature of the fluid detected by the temperature sensor. Accordingly, the temperature of the fluid discharged to the polishing pad 111 through the discharge port can be controlled.

The cooling module 103 may be disposed inside the receiving space of the supply arm 101. The cooling module 103 may receive and cool the slurry, and spray the cooled slurry to the polishing pad 111 through the supply arm 101.

The cooling module 103 may receive the slurry independently from the heating module 102 and discharge it to the outside of the supply arm 101. The cooling module 103 may include a cooling housing 1031, a first flow path (not shown), a second flow path (not shown), and a heat exchange unit (not shown).

The cooling housing 1031 may form the exterior of the cooling module 103. A first flow passage and a second flow passage separated from each other may be formed in the housing 1021. The slurry and cooling water may each flow through the first flow passage and the second flow passage. Outside the housing 1021, a first inlet 1032 and a first outlet 1033 connected to the first passage are formed, and a second inlet 1034 and a second outlet 1035 connected to the second passage are formed, respectively. Can be formed.

The slurry may be supplied into the cooling housing through the first inlet 1032 to flow through the first flow path and then discharged to the outside of the housing 1021 through the first outlet 1033. A discharge pipe for flowing the slurry cooled by the polishing pad 111 may be connected to the first discharge port 1033. Likewise, the coolant may be supplied into the cooling housing through the second inlet 1034, flow through the second flow path, and then discharged to the outside of the housing 1021 through the second outlet 1035.

A heat exchange unit may be installed inside the housing 1021. The heat exchanger may include, for example, a Peltier element. The heat exchanger may perform heat exchange between the slurry flowing through the first passage and the cooling water flowing through the second passage. The heat exchanger may transfer heat from the slurry flowing through the first passage to the cooling water flowing through the second passage. Accordingly, the slurry passing through the first flow path may be discharged to the polishing pad 111 in a state in which the temperature is reduced.

Meanwhile, a discharge pipe for discharging the slurry may be connected to each of the heating module 102 and the cooling module 103, respectively, and a discharge pipe fixing the ends of the plurality of discharge pipes in the direction of the polishing pad 111 to the supply arm 101 A fixing part may be formed.

According to this structure, the slurry supply device 10 supplies slurries having different temperatures to the polishing pad 111 through the operation of the heating module 102 and the cooling module 103, thereby reducing the temperature of the polishing pad 111 Can be adjusted selectively. Accordingly, the slurry supplying device 10 can optimally control a process temperature acting on the substrate W during the polishing process of the substrate W by adjusting the temperature of the polishing pad 111.

In particular, the slurry supply device 10 sprays pure water heated through the heating module 102 to the polishing pad 111 before polishing of the substrate W is performed, so that polishing of the substrate W starts. At this point, by adjusting the temperature of the polishing pad 111 to an optimum range, the polishing rate and polishing uniformity of the substrate W may be improved. In particular, since the slurry whose temperature is controlled through the slurry supplying device 10 is directly supplied to the polishing pad 111, it is possible to minimize a change in the temperature of the slurry during the flow process of the slurry.

Hereinafter, a method of polishing a substrate according to an exemplary embodiment will be described. In describing the substrate polishing method, descriptions overlapping with those described above will be omitted.

The substrate polishing method may polish the substrate by pressing the substrate against a polishing pad. The substrate polishing method can effectively control the polishing process temperature of the substrate through the temperature of the slurry supplied to the polishing pad.

The substrate polishing method may include a pre-heating step, a heating step, and a cooling step.

In the pre-heating step, heated pure water may be supplied to the polishing pad to increase the temperature of the polishing pad. The preheating step is performed before the substrate is polished, so that the polishing pad may be preheated. Therefore, it is possible to shorten the time for the temperature of the polishing pad to reach the optimum range in the subsequent substrate polishing process.

In the heating step, the heated slurry may be supplied to the polishing pad and the temperature of the polishing pad may be positioned within a set temperature range. The heating step may be performed during the polishing process of the substrate. Through the slurry supplied in the heating step, the optimum process temperature required for polishing the substrate can be achieved. The heating step increases the polishing rate between polishing processes of the substrate, thereby shortening the polishing time of the substrate to reach the target profile, and ultimately improving the productivity of the polishing process of the substrate.

The cooling step may reduce the temperature of the polishing pad to a set range temperature by supplying the cooled slurry to the polishing pad after the heating step. In the latter stage of the substrate polishing process, dishing may occur on the substrate surface due to material differences between multiple layers. When the temperature of the polishing process is reduced, the occurrence of dishing is minimized, thereby increasing the polishing uniformity of the substrate surface. As a result, the yield of the substrate can be improved.

As described above, although the embodiments have been described by the limited drawings, various modifications and variations are possible from the above description to those of ordinary skill in the art. For example, the described techniques are performed in a different order from the described method, and/or components such as the described structure, device, etc. are combined or combined in a form different from the described method, or in other components or equivalents. Even if substituted or substituted by, appropriate results can be achieved.

1: substrate polishing system
10: slurry feeding device
W: substrate

Claims (15)

A supply arm disposed on a polishing pad for polishing a substrate and forming an internal accommodation space;
A heating module disposed inside the receiving space and configured to heat the slurry and spray it onto the polishing pad; And
It is disposed inside the receiving space and includes a cooling module for cooling the slurry and spraying it to the polishing pad,
A slurry supplying device for controlling the temperature of the polishing pad through independent spraying of slurry for each of the heating module and the cooling module. The method of claim 1,
The heating module is provided in plurality,
The plurality of heating modules,
A slurry heating module for heating and supplying the slurry; And
A slurry supplying device comprising one or more preliminary heating modules for heating and supplying pure water. The method of claim 2,
The supply arm,
A support plate constituting a bottom surface of the accommodation space; And
It includes a fixed plate disposed in the receiving space so as to be spaced apart from the support plate at a predetermined interval,
The cooling module is disposed under the fixed plate,
The slurry supplying device, wherein the plurality of heating modules are disposed on the upper surface of the fixed plate. The method of claim 3,
Each of the heating module and the cooling module is connected to a discharge pipe for flow of the discharged slurry,
The support plate includes a discharge pipe fixing portion to which the end of the discharge pipe is fitted and fixed. The method of claim 1,
The heating module,
A housing having a flow path formed therein, an inlet port for supplying a fluid to the flow channel, and an outlet port for discharging the fluid to the outside of the flow channel;
A heater for heating the fluid flowing through the flow path;
A temperature sensor that detects the temperature of the fluid discharged through the discharge port; And
And a temperature control unit for controlling the operation of the heater based on the temperature detected by the temperature sensor. The method of claim 5,
The heater includes a heating flow path formed therein so that the fluid flows,
The flow path formed inside the housing,
Slurry supply device comprising a first heating flow path connected to the inlet at one side and connected to the inlet of the heating flow path at the other end, and a second heating channel at the other end connected to the outlet of the heating flow path . The method of claim 5,
In a portion of the flow path adjacent to the discharge port, a temperature measuring port communicating with the outside of the housing is formed,
The temperature sensor includes a bimetal sensor installed on the outer surface of the housing on which the temperature measuring device is formed. The method of claim 5,
The heating module,
The slurry supplying device further comprising a heater sensor connected to the heater to detect whether the heater is overheated. The method of claim 1,
The cooling module,
Cooling housing;
A first flow path formed in the cooling housing and through which the slurry flows;
A second flow passage formed inside the housing so as to be separated from the first flow passage, formed in the housing, and flowing coolant; And
A slurry supplying device comprising a heat exchange unit for performing heat exchange between the first flow passage and the second flow passage. The method of claim 9,
Further comprising a rotating portion disposed outside the polishing pad and connected to the supply arm,
The supply arm is rotatably connected to the rotating part, thereby being able to swing from an upper portion of the polishing pad. A polishing table having a polishing pad thereon;
A carrier head for polishing the substrate by pressing the polishing pad while holding the substrate; And
And a slurry supplying device for spraying a slurry onto the polishing pad during the polishing process of the substrate and controlling a temperature of the polishing pad through temperature control of the sprayed slurry. The method of claim 11,
The slurry supply device,
A heating module for heating the slurry and spraying it onto the polishing pad; And
It includes a cooling module for cooling the slurry and spraying it to the polishing pad,
The heating module and the cooling module respectively spray the slurry to the polishing pad. The method of claim 12,
The slurry supply device,
The substrate polishing system further comprising a heating module for heating the pure water and spraying the pure water onto the polishing pad. The method of claim 13,
The slurry supply device,
Before the polishing of the substrate is performed, pure water heated through the heating module is sprayed onto the polishing pad. In the substrate polishing method of polishing a substrate through a polishing pad,
A preheating step of increasing a temperature of the polishing pad by supplying pure water heated to the polishing pad before polishing the substrate;
A heating step of adjusting a temperature of the polishing pad to a set temperature by supplying a heated slurry to the polishing pad during the polishing process of the substrate; And
After the heating step, a cooling step of reducing a temperature of the polishing pad by supplying the cooled slurry to the polishing pad.

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