KR20020003619A - A structure of resistor for discharge heat - Google Patents

Abstract

PURPOSE: A radiation structure of a large resistor is provided to improve a radiation effect, enable a radiation of various electronic elements, reduce size of a resistor, and enhance production efficiency. CONSTITUTION: A radiation cover(23) made of metal having heat conductivity is formed on an outside of a resistor body(10) to form a predetermined space. A radiation plate(24) is installed to radiate heat with an external air inputted in the radiation cover(23). The radiation plate(24) promptly transfers heat generated in a resistance line wound on the outside of the resistor. Ventilation is focused between the radiation cover(23) and the resistor to enhance a radiation effect.

Description

Heat dissipation structure of large capacity resistor {A STRUCTURE OF RESISTOR FOR DISCHARGE HEAT}

The present invention relates to a resistor, and more particularly, provides a heat dissipation structure suitable for a large-capacity resistor in which a resistance wire is wound and is mainly used in a field where high power is applied, thereby suppressing an amount of change in resistance due to temperature rise, thereby generating an error. To improve and improve the reliability of the product.

In general, a large-capacity resistor generally winds resistance wires around a ceramic core tube at a predetermined interval and a predetermined length, and then coats the outer circumference of the core tube with an insulating material, prevents short circuit between the wound resistance wires, and insulates the outside. It is a normal structure.

Figure 1 shows a resistor according to an embodiment of the prior art, looking at the schematic configuration as follows.

Cylindrical resistor body 1 in which resistance wire 2 is wound along outer circumferential surface, insulator 4 for preventing electrical conduction between the body 1 and support 3 supporting both ends, and resistance wire 2 It consists of a terminal (5) for applying a voltage to the outer surface of the resistor is coated with an insulating paint (6).

In addition, in order to facilitate understanding on the drawings, a portion of the insulating paint 6 is shown in an expanded view.

On the other hand, while connected to a large power circuit and performing a function by applying an output current, the temperature of the resistor gradually increases due to the heat generation of the internal resistance wire, but as the temperature of the resistor increases, the resistance value increases and the resistance value changes. It appears that the use efficiency is lowered.

That is, as shown in the chart measurement of FIG. 2, as the temperature of the resistor increases, the load ratio increases proportionally, so that the resistor differs from the initially set resistance value by gradually increasing the error range of the predetermined resistance value. This will fall.

In the case of the resistor according to the prior art, both ends of the resistor main body 1 are blocked by the insulator 4 due to the installation of the frame, thereby preventing heat dissipation of the internal temperature, and even though forced air is blown out by the fan from the outer surface. Compared to the side where the air directly hits, the opposite side has a problem that the heat dissipation effect is extremely low, resulting in uneven heat dissipation.

The present invention has been proposed to solve the above-mentioned problems in the prior art, a resistor structure in which the heat dissipation effect is improved by allowing the heat dissipation to take place by intensively absorbing and releasing the internal and external heat sinks of the air-cooled or water-cooled heat exchanger. The purpose is to achieve the heat dissipation of various electronic devices.

In addition, another object of the present invention is to reduce the size of the resistor and at the same time to improve the production efficiency due to cost reduction.

The purpose of the resistor is that a resistance wire is wound along an outer circumferential surface between two terminal portions of a resistor main body, and an outer surface of the resistor body is installed on a large power control circuit board with an insulation coated thereon:

The resistor body is provided with a heat dissipation cover to form a predetermined space on the outside;

Between the heat dissipation cover and the resistor body can be realized through a heat dissipation structure of a large capacity resistor, characterized in that a heat dissipation plate made of a metal material forming a continuous concave-convex shape in cross section.

1 is a perspective view of a resistor according to a conventional embodiment.

2 is a graph showing the increase and decrease of the load ratio according to the surface temperature of the resistor.

3 is a perspective view of a resistor according to the present invention;

4A and 4B show different embodiments of the cross-sectional view taken along the line B-B 'of FIG. 3;

5A and 5B are enlarged views of a portion A of FIG. 3, showing another embodiment of the resistance wire winding structure.

Figure 6 is a perspective view of the main portion of the resistor according to another embodiment of the heat generating structure of the present invention.

7 is a perspective view of principal parts to which the FET device is applied to the resistor of the present invention;

8 is a schematic structural diagram of a water-cooled application of the present invention resistor.

9 is a partially cutaway perspective view of a polygonal resistor in accordance with the present application.

<Explanation of symbols for the main parts of the drawings>

10: resistor body 10 ': winding groove

11: primary insulating coating layer 12: resistance wire

13: protrusion 14: secondary insulating paint layer

15 terminal 16: fixed body

21: guide rod 22: coating layer

23: heat dissipation cover 24: heat sink

25: FET device

Hereinafter, some embodiments of the present invention will be described in detail with reference to FIGS. 3 to 8.

3 is a perspective view of a resistor to which the heat dissipation structure of the present invention is applied, and FIGS. 4A and 4B illustrate cross-sectional shapes of a portion B-B 'of the resistor, respectively, and FIGS. 3 is another example in which the portion A of FIG. 3 is enlarged, and FIG. 6 illustrates a structure of a resistor to which another embodiment is applied.

First, an example of the resistor of the present invention shown in FIG. 3 will be described.

The resistor main body 10 is made of aluminum having good thermal conductivity, and a continuous curved protrusion 13 is integrally formed on the inner circumferential surface of the through hole, and the primary insulating paint layer is formed on the outer circumferential surface of the main body 10. (11) is coated, and the resistance wire 12 is wound on a predetermined number of times at regular intervals.

In addition, both ends of the resistance wire winding portion are equipped with voltage input and output terminals 15, and the secondary insulating paint layer 14 for insulating the wound resistance wire 12 from the outside is reapplied therefor. The phosphorus resistor structure is completed.

For reference, the secondary insulating paint layer 14 serves to prevent a change in the winding position generated as the resistance line 12 increases with increasing temperature with the purpose of insulating the resistance line 12. .

In the figure, reference numeral 16 denotes a fixture for supporting the resistor on the electronic circuit board.

In the resistor configured as described above, the surface temperature is increased by the heat generation of the resistance wire 12, in order to reduce the forced air or forced exhaust of air through the internal through-holes. At this time, the cooling air is blown is guided along the outer circumferential surface and the inner through-hole of the resistor body 10, the heat generated from the resistance line of the resistor is to be able to perform a rapid heat dissipation action in the internal heat sink of the metal material.

Particularly, since the resistor of the present invention is made of aluminum, rapid thermal conduction occurs to the inner through side, and in the inner through hole, the surface area of the resistor main body 10 is increased due to the plurality of protrusions 13, thereby further improving heat exchange efficiency with the outside air. It can be seen that.

Therefore, when a voltage is applied to the resistor, it is possible to maintain a stable resistance value of the resistor by minimizing the change in the resistance value caused by the surface temperature rise of the resistor due to the voltage drop action.

On the other hand, Figure 4 is a cross-sectional view showing an embodiment for improving the efficiency of the internal through-hole structure.

That is, in FIG. 4A, the guide rod 21 is installed along the center of the through hole, and the flow path of the introduced external air is concentrated by the guide rod 21 only on the inner circumferential surface protrusion 13 of the resistor main body 10 so that the heat exchange ( Heat radiation) to further increase the efficiency.

In addition, in the case of Figure 4b by increasing the height of the protrusion 13 to the center side of the through hole so as to further increase the heat exchange area with the air introduced in place of the guide rod structure, the same effect of increasing the heat exchange efficiency Will be able to represent.

5 shows an enlarged view when applied to the portion A of FIG. 3 as another embodiment of the winding structure of the resistance wire 12.

That is, in FIG. 5A, the winding groove 10 ′ is formed in advance along the outer circumferential surface of the resistor body 10 made of aluminum, and the resistance wire 12 is wound along the formed winding groove 10 ′. Compared to the example, the contact area between the resistance wire and the heat sink is increased, and thus the heat conduction efficiency to the main body 10 can be further increased. In addition, even if the resistance wire 12 is extended by a predetermined length due to heat generation, the position is supported in each winding groove 10 ', thereby showing an advantage of preventing short due to contact between adjacent resistance wires. do.

FIG. 5B illustrates an embodiment in which the ceramic body coating layer 22 having heat resistance and corrosion resistance is coated on the resistance line 12 and then wound around the resistor body 10. In this case, the insulation layer is insulated from the outside by the covering layer 22, and thus, even when the winding work is performed in close contact with no winding interval as in the above-described embodiment, insulation between the resistance wires is prevented and short circuiting is prevented. . Therefore, the winding operation at the time of manufacture can be performed more easily, and even if the resistance wire of the same length is wound, it can be seen that the length of the entire resistor is smaller than that of the conventional resistor. In addition, the wound resistance wire 12 is in a state in which the insulation layer is insulated from the resistor body 10 by the coating layer 22, so that the process of applying the primary insulating paint layer 11 may be omitted.

6 is a partial cutaway view of a heat dissipation structure according to another exemplary embodiment of the present invention, and a heat dissipation cover 23 made of a thermally conductive metal material for forming a predetermined space on the outside of the resistor body 10 is installed. In the meantime, the heat dissipation plate 24 having a concave-convex shape for dissipating heat into external air introduced therebetween is provided to be in contact with each other.

This is to quickly transfer the heat generated from the resistance wire wound outside the resistor through the heat sink 24, to concentrate the ventilation between the heat dissipation cover 23 and the resistor to increase the heat dissipation effect, the heat sink 24 Even if installed in the internal through-hole of the resistor main body 10 can exhibit a predetermined heat dissipation effect.

Such a device is a device that enlarges the heat sink or attaches a separate heat dissipation guide film to the conventional resistor to increase the heat dissipation area, and covers and covers the heat sink between the cover and the resistor body to radiate heat and improve heat dissipation efficiency. As it can be used, it can be applied together with the internal through-hole structure to perform heat dissipation or to be applied alone.

7 shows that the FET device 25, which occupies a portion of the circuit on the electromagnetic plate, is bonded to one end of the resistor main body 10 so as to be cooled at the same time as the resistance, and is coupled to one end of the main body 10 as an application of the present invention. It can be seen that the attachment panel 26 for attaching the element 25 or the like is formed.

That is, the heat dissipation structure of the resistor of the present invention can also contribute to heat dissipation of the FET element 25. In this way, the FET, TR, diode, etc. are attached to one end of the resistor heat dissipation plate to form an integrated component on the same electronic circuit board. When attached and used, the connection line between FET and resistor is not needed, and the work time is shortened and leakage current is reduced due to longer wires. The installation space is reduced, and noise due to reduction of induced current caused by longer wires is prevented. There is also an effect that the malfunction of the electronic device is prevented.

On the other hand, while the air-cooled method using the heat dissipation structure of the present invention has been described, it can be applied to water-cooled.

That is, as an application example, one end of the plurality of the present invention resistors constituting the heat dissipation structure is coupled to the chamber 30 in which the cooling fluid is filled inside, as shown in the rear perspective view in FIG. One side of the 30 is provided with a normal heat pipe (31). At this time, one end of the resistor main body 10 is formed with a thread 10 "for coupling with the chamber 30, so that the leakage of the liquid is prevented by the coupling of the screw or by using a rubber seal (not shown). It is coupled in a way to prevent, and the other end of the opening and closing membrane 33 is coupled to maintain the inner seal.

Therefore, the chamber 30 and the inside of the resistor body 10 are in a state in which the fluid is filled in communication with each other.

Further, the connection tube 34 is selectively connected to the opening / closing film 33 side of the resistor, and then the other side thereof is connected to the heat sink 35 of the electric element 25 'such as a CPU. Will also apply to heat dissipation.

Reference numeral 32 in the drawing represents a heating wire winding.

In this configuration, the heat generated by the resistor is exchanged with the fluid filled therein, and the heated fluid is raised to the chamber 30 by natural convection and is disposed in the chamber 30. Cooling is repeated by (31) to achieve internal heat dissipation.

In addition, even when the connection tube 34 is connected, the chamber through the resistor due to the natural convection of the fluid (cooling water) filled in the heat sink 35 and the connection tube 34 when the electric element 25 'is heated. As heat exchange occurs with the 30) side, the heat dissipation effect of the electronic component can be additionally exhibited at the same time as the heat dissipation of the resistor.

While certain specific embodiments of the present invention have been described above, it is apparent that the resistor heat dissipation structure of the present invention may be implemented in various modifications in the art.

For example, the heat dissipation structure of the present invention may be used in the shape of the protrusion 13 in the shape of a fin rather than a curved shape, or in a rectangular resistor shown in FIG. 9 rather than a cylindrical resistor.

In the case of the rectangular resistor, the resistor 12 'is linearly printed on the insulating substrate or the ceramic substrate on which the insulating coating is formed, and the resistance plate 40 coated with the insulating paint is disposed, and both sides have a predetermined area through-hole. The heat dissipation cover 23 'is coupled to each other while maintaining a space to achieve the heat dissipation, and the heat dissipation plate 24' may be installed in the concave-convex shape inside the through holes on both sides.

At this time, it is natural that an insulator is applied to both surfaces of the resistance plate 40 which is in contact with the heat sink 24 '.

In this case, too, heat generated from the resistor 12 ′ printed on the resistor is quickly transferred through the heat sink 24 ′, and the heat is concentrated between the heat dissipation cover 23 ′ and the resistance plate 40 to effect heat dissipation. It will be able to increase.

Therefore, the embodiments to be modified as described above should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

As described above, the resistor of the present invention improves the heat dissipation efficiency of forced air intake or exhaust through the improved heat dissipation structure, thereby lowering the surface temperature rise of the resistor, thereby reducing the resistance value of the product due to the temperature rise. It is effective to prevent the rate of change from dropping.

In addition, the resistor of the present invention can be applied to not only air-cooled but also water-cooled heat dissipation using a fluid, and in addition, there is an advantage that the manufacturing process or size of the product can be simplified by changing the winding structure of the resistance wire. It will be useful to heat dissipation.

Claims (8)

The resistance wire 12 extends from both terminal portions 15 of the resistor main body 10, and an outer surface of the resistor body 10 is installed on the large power control circuit board in a state where the insulating layer 14 is formed to perform a voltage drop function. For resistors that: The resistor body 10 is provided with a heat dissipation cover 23 to form a predetermined space on the outside; A heat dissipation structure of a large capacity resistor, characterized in that between the heat dissipation cover 23 and the resistor main body 10 is provided with a heat dissipation plate 24 made of a metal in a continuous cross-sectional shape. The method according to claim 1, The resistor body 10 is a resistance wire 12 is wound along the outside in a state made of a metal material, therein forms a through structure communicating both ends in the longitudinal direction; The heat dissipation structure of the large-capacity resistor, characterized in that the inner circumferential surface forming the through hole is formed integrally with a plurality of protrusions 13 to increase the heat dissipation area at regular intervals. The method according to claim 1 or 2, On the outer circumferential surface of the resistor body 10, a winding groove (10 ') is formed along the portion where the resistance wire 12 is to be wound, characterized in that the heat radiation structure of a large capacity resistor. The method according to claim 1 or 2, The resistance wire 12 is a heat dissipation structure of a large capacity resistor, characterized in that the winding is made in a state covered by a coating layer 22 of insulating material having heat resistance and corrosion resistance. The method according to claim 2, Heat dissipation structure of a large capacity resistor, characterized in that the guide rod 21 is installed along the central axis in the through-hole of the resistor body (10). The method according to claim 1 or 2, Heat dissipation structure of a large capacity resistor, characterized in that the resistor main body 10 is attached to a variety of heat generating electronic components including the FET device (25). The method according to claim 2, One end of the resistor is coupled to the opening and closing membrane 33 for sealing, the other end of the chamber and the chamber 30 is connected to each other in communication with each other, the cooling fluid is filled in the chamber 30, one side of the chamber 30 Heat dissipation structure of a large-capacity resistor, characterized in that the heat pipe 31 for heat exchange is installed. The method according to claim 7, A connection tube (34) is connected between each other so that one end of the resistor is in communication with the heat dissipation plate (35) for the electric element, wherein the cooling fluid is filled therein.