KR101053701B1 - Manufacturing method of mold for glass molding - Google Patents
Manufacturing method of mold for glass molding Download PDFInfo
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- KR101053701B1 KR101053701B1 KR1020097012031A KR20097012031A KR101053701B1 KR 101053701 B1 KR101053701 B1 KR 101053701B1 KR 1020097012031 A KR1020097012031 A KR 1020097012031A KR 20097012031 A KR20097012031 A KR 20097012031A KR 101053701 B1 KR101053701 B1 KR 101053701B1
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- 238000000465 moulding Methods 0.000 title claims abstract description 23
- 239000011521 glass Substances 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002345 surface coating layer Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 229910018104 Ni-P Inorganic materials 0.000 claims abstract description 13
- 229910018536 Ni—P Inorganic materials 0.000 claims abstract description 13
- 238000005496 tempering Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000011651 chromium Substances 0.000 claims abstract description 9
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 9
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 238000010791 quenching Methods 0.000 claims abstract description 8
- 230000000171 quenching effect Effects 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 6
- 230000008859 change Effects 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 239000011733 molybdenum Substances 0.000 claims abstract description 6
- 239000010959 steel Substances 0.000 claims abstract description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010937 tungsten Substances 0.000 claims abstract description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 11
- 238000007493 shaping process Methods 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 8
- 229910052796 boron Inorganic materials 0.000 claims 2
- 238000007496 glass forming Methods 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 6
- 229910000734 martensite Inorganic materials 0.000 abstract description 4
- -1 austenitic Inorganic materials 0.000 abstract description 2
- 230000008520 organization Effects 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 11
- 229910001566 austenite Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D6/00—Heat treatment of ferrous alloys
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D6/00—Heat treatment of ferrous alloys
- C21D6/04—Hardening by cooling below 0 degrees Celsius
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/12—Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/22—Ferrous alloys, e.g. steel alloys containing chromium with molybdenum or tungsten
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/24—Ferrous alloys, e.g. steel alloys containing chromium with vanadium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/36—Ferrous alloys, e.g. steel alloys containing chromium with more than 1.7% by weight of carbon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/10—Die base materials
- C03B2215/11—Metals
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Chemically Coating (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
탄소가 0.3wt% 이상 2.7wt% 이하, 크롬이 13wt% 이하이며, 몰리브덴이 0.5wt% 이상 3wt% 이하, 바나듐이 0.1wt% 이상 5wt% 이하, 텅스텐이 1wt% 이상 7wt% 이하 중 적어도 하나를 만족하는 첨가물이 부가된 강제의 소재를 켄칭하는 동시에, 400℃ 이상 650℃ 이하에서 템퍼링함으로써 기재를 제작하고, 상기 기재의 표면에, 비정질의 Ni-P 합금으로 이루어지는 표면 피복층을 형성하고, 이것에 가열 처리를 실시함으로써, 상기 표면 피복층을 Ni와 Ni3P의 공정 조직으로 바꾼다. 이에 의해 성형 온도에 있어서 표면 피복층에 균열이 발생하는 것을 방지하는 동시에, 금형의 소성 변형을 방지함으로써, 금형의 형상을 높은 정밀도로 유지한다.At least one of 0.3 wt% or more and 2.7 wt% or less, chromium 13 wt% or less, molybdenum 0.5 wt% or more and 3 wt% or less, vanadium 0.1 wt% or more and 5 wt% or less, tungsten 1 wt% or more and 7 wt% or less. A substrate is produced by quenching a steel material to which a satisfactory additive is added, and tempering at 400 ° C. or higher and 650 ° C. or lower, and a surface coating layer made of an amorphous Ni-P alloy is formed on the surface of the substrate. by carrying out a heat treatment, change the surface coating layer to the process organization of Ni and Ni 3 P. This prevents cracking in the surface coating layer at the molding temperature and prevents plastic deformation of the mold, thereby maintaining the shape of the mold with high accuracy.
템퍼링, 켄칭, 스테인리스강, 오스테나이트, 마르텐사이트 Tempering, quenching, stainless steel, austenitic, martensite
Description
본 발명은, 정밀한 가공을 필요로 하는 글래스 성형용 금형의 제조 방법에 관한 것으로, 특히 금형의 형상을 높은 정밀도로 유지할 수 있는 것에 관한 것이다.TECHNICAL FIELD This invention relates to the manufacturing method of the metal mold | die for glass shaping | molding which requires precise processing, and it is especially related to being able to maintain the shape of a metal mold with high precision.
플라스틱 성형의 분야에서는, 성형 금형의 정밀 가공 기술이 확립되어 있고, 회절 격자 등, 미세 형상을 갖는 광학 소자의 양산이 실현되어 있다. 이 경우, 금형의 제작은 스테인리스강으로 이루어지는 기재(基材)의 표면에 무전해 Ni-P 도금을 실시하고, 계속해서 이 도금층을 다이아몬드 바이트로 정밀 가공함으로써 행해지고 있다.In the field of plastic molding, the precision processing technology of a molding die is established, and mass production of optical elements having a fine shape such as a diffraction grating is realized. In this case, manufacture of a metal mold | die is performed by performing electroless Ni-P plating on the surface of the base material which consists of stainless steel, and then precision-processing this plating layer with a diamond bite.
그러나, 이와 같은 금형을 글래스 성형에 적용하면, 무전해 Ni-P 도금층에 균열이 발생하는 문제가 발생한다. 이 현상은, 성형 온도에 기인하고 있다. 즉, Ni-P 도금층은, 도금 상태에서는 아몰퍼스(비정질) 구조를 취하고 있지만, 약 270℃ 이상으로 가열하면 결정화가 시작되고, 그때, 도금층에 체적 수축이 일어나, 인장 응력이 작용하여 도금층에 균열이 발생한다.However, when such a mold is applied to glass molding, a problem occurs that a crack occurs in the electroless Ni-P plating layer. This phenomenon is caused by the molding temperature. That is, the Ni-P plated layer has an amorphous (amorphous) structure in the plated state, but when heated to about 270 ° C. or more, crystallization starts, at which time a volume shrinkage occurs in the plated layer, and a tensile stress acts to crack the plated layer. Occurs.
이 문제의 대책으로서, 열팽창 계수가 10×10-6 내지 16×10-6(K-1)인 기재를 선정하여, 도금 후, 400 내지 500℃에서 열처리를 행하고 있다. 그러나, 기재의 열팽창 계수를 Ni-P 도금층에 맞추어도, 열처리시, 결정화에 수반하는 체적 수축이 도금층에만 발생하므로, 도금층에 큰 인장 응력이 작용하여, 균열이 발생하는 경우가 있었다(예를 들어 일본 특허 출원 공개 평11-157852호 공보 참조).As a countermeasure against this problem, a substrate having a coefficient of thermal expansion of 10 × 10 −6 to 16 × 10 −6 (K −1 ) is selected and heat-treated at 400 to 500 ° C. after plating. However, even if the thermal expansion coefficient of the substrate is matched with the Ni-P plating layer, since the volume shrinkage accompanying crystallization occurs only in the plating layer during heat treatment, a large tensile stress acts on the plating layer and cracks may occur (for example, See Japanese Patent Application Laid-Open No. 11-157852.
또한, 금형 사용 중에 고온이 되면, 금형에 소성 변형이 발생하여, 금형의 형상을 높은 정밀도로 유지할 수 없다는 문제도 있었다.In addition, when the temperature is high during use of the mold, plastic deformation occurs in the mold, and there is a problem that the shape of the mold cannot be maintained with high precision.
본 발명은, 성형 온도에 있어서 표면 피복층에 균열이 발생하는 것을 방지하는 동시에, 금형의 소성 변형을 방지함으로써, 금형의 형상을 높은 정밀도로 유지하는 동시에, 그 수명을 증대시킬 수 있는 글래스 성형용 금형의 제조 방법을 제공하는 것을 목적으로 하고 있다.The present invention provides a glass molding die which can prevent cracks in the surface coating layer at the molding temperature and prevent plastic deformation of the mold, thereby maintaining the shape of the mold with high accuracy and increasing its lifespan. It aims at providing the manufacturing method of the.
상기 과제를 해결하여 목적을 달성하기 위해, 본 발명의 글래스 성형용 금형의 제조 방법은 다음과 같이 구성되어 있다.In order to solve the said subject and achieve the objective, the manufacturing method of the metal mold | die for glass molding of this invention is comprised as follows.
탄소가 0.3wt% 이상 2.7wt% 이하, 크롬이 13wt% 이하이며, 몰리브덴이 0.5wt% 이상 3wt% 이하, 바나듐이 0.1wt% 이상 5wt% 이하, 텅스텐이 1wt% 이상 7wt% 이하 중 적어도 하나를 만족하는 첨가물이 가해진 강제의 소재를 켄칭하는 동시에, 400℃ 이상 650℃ 이하에서 템퍼링함으로써 기재를 형성하고, 상기 기재의 표면에, 비정질의 Ni-P 합금으로 이루어지는 표면 피복층을 형성하고, 이것에 가열 처리를 실시함으로써, 상기 표면 피복층을 Ni와 Ni3P의 공정 조직으로 바꾼다.At least one of 0.3 wt% or more and 2.7 wt% or less, chromium 13 wt% or less, molybdenum 0.5 wt% or more and 3 wt% or less, vanadium 0.1 wt% or more and 5 wt% or less, tungsten 1 wt% or more and 7 wt% or less. The substrate is formed by quenching the steel material to which a satisfactory additive has been applied, and tempering at 400 ° C. or more and 650 ° C. or less, and a surface coating layer made of an amorphous Ni-P alloy is formed on the surface of the substrate, and is heated thereon. by carrying out the process, change the surface coating layer to the process organization of Ni and Ni 3 P.
탄소가 0.3wt% 이상 2.7wt% 이하, 크롬이 13wt% 이하이며, 몰리브덴이 0.5wt% 이상 3wt% 이하, 바나듐이 0.1wt% 이상 5wt% 이하, 텅스텐이 1wt% 이상 7wt% 이하 중 적어도 하나를 만족하는 첨가물이 부가된 강제의 소재를 켄칭하는 동시에, 서브 제로 처리함으로써 기재를 형성하고, 상기 기재의 표면에, 비정질의 Ni-P 합금으로 이루어지는 표면 피복층을 형성하고, 이것에 가열 처리를 실시함으로써, 상기 표면 피복층을 Ni와 Ni3P의 공정 조직으로 바꾼다.At least one of 0.3 wt% or more and 2.7 wt% or less, chromium 13 wt% or less, molybdenum 0.5 wt% or more and 3 wt% or less, vanadium 0.1 wt% or more and 5 wt% or less, tungsten 1 wt% or more and 7 wt% or less. By quenching the steel material to which the satisfactory additives were added, the substrate was formed by sub-zero treatment, and the surface coating layer made of amorphous Ni-P alloy was formed on the surface of the substrate, and this was subjected to heat treatment. The surface coating layer is replaced with a process structure of Ni and Ni 3 P.
도 1은 본 발명의 일 실시 형태에 관한 글래스 성형용 금형의 제조 방법의 개요를 나타내는 블록도이다.BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the outline | summary of the manufacturing method of the metal mold | die for glass molding which concerns on one Embodiment of this invention.
도 1은 본 발명의 일 실시 형태에 관한 글래스 성형용 금형의 제조 공정의 개요를 나타내는 블록도이다. 글래스 성형용 금형의 제조는 다음과 같은 공정에서 행한다.BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the outline | summary of the manufacturing process of the metal mold | die for glass molding which concerns on one Embodiment of this invention. The manufacturing of the glass molding die is performed in the following steps.
또한, 기재로서, 탄소가 0.3wt% 이상 2.7wt% 이하, 크롬이 13wt% 이하이며, 몰리브덴이 0.5wt% 이상 3wt% 이하, 바나듐이 0.1wt% 이상 5wt% 이하, 텅스텐이 1wt% 이상 7wt% 이하 중 적어도 하나를 만족하는 첨가물이 부가된 강제의 소재를 사용한다.Further, the base material is 0.3 wt% or more, 2.7 wt% or less, chromium 13 wt% or less, molybdenum 0.5 wt% or more and 3 wt% or less, vanadium 0.1 wt% or more and 5 wt% or less, tungsten 1 wt% or more and 7 wt% or less. The steel material of which the additive which satisfy | fills at least one of the following was added is used.
이와 같은 기재에 초벌 가공을 행한 후(ST1), 켄칭ㆍ고온 템퍼링을 행한다(ST2). 계속해서, 도금 전 가공을 행한 후(ST3), 무전해 도금에 의해 Ni-P 합금 으로 이루어지는 표면 피복층(도금층)을 형성한다(ST4). 계속해서, 기재 및 표면 피복층에 가열 처리를 행하여(ST5), 표면 피복층을 결정화하는 동시에, 기재를 템퍼링 조직으로 바꾼다. 계속해서, 기재에 마무리 가공(ST6) 및 표면 피복층의 마무리 가공(ST7)을 행한 후, 표면 피복층에 이형막을 코팅한다(ST8).After primary processing is performed on such a substrate (ST1), quenching and high temperature tempering are performed (ST2). Subsequently, after performing a pre-plating process (ST3), the surface coating layer (plating layer) which consists of Ni-P alloy is formed by electroless plating (ST4). Subsequently, the substrate and the surface coating layer are subjected to heat treatment (ST5) to crystallize the surface coating layer and change the substrate into a tempering structure. Subsequently, after finishing processing (ST6) and finishing of surface coating layer (ST7) to a base material, a release film is coated on a surface coating layer (ST8).
본 실시 형태에 있어서의 제조 방법에서는, 기재로서 Mo, V, W를 첨가하여 고온 경도를 향상시킨 강재를 사용함으로써, 고온 템퍼링을 행해도 표면 피복층이 균열되지 않도록 하고 있다. 이는 켄칭 직후에는 잔류 오스테나이트가 많이 존재하지만, 고온 템퍼링을 행하면 저탄소 마르텐사이트 및 마르텐사이트의 조직으로 변화하기 때문이다.In the manufacturing method in this embodiment, by using Mo, V, and W as a base material which improved the high temperature hardness, even if high temperature tempering is performed, the surface coating layer is not cracked. This is because a large amount of retained austenite is present immediately after quenching, but changes to the structure of low carbon martensite and martensite when high temperature tempering is performed.
또한, 고온 템퍼링에 있어서의 온도는 400 내지 650℃ 이하로 할 필요가 있다. 400℃보다도 낮은 온도에서는 잔류 오스테나이트의 저감에 별로 효과가 없고, 650℃를 초과하면 기재의 연화가 현저하기 때문이다. 또한, 고온 템퍼링이 아닌, 서브 제로 처리를 행하도록 해도 좋다. 서브 제로 처리도 잔류 오스테나이트를 마르텐사이트로 변태시키는 효과가 있기 때문이다.In addition, the temperature in high temperature tempering needs to be 400-650 degreeC or less. This is because at temperatures lower than 400 ° C., there is little effect on the reduction of residual austenite, and when it exceeds 650 ° C., the softening of the substrate is remarkable. In addition, you may perform sub zero process instead of high temperature tempering. This is because the subzero treatment also has an effect of transforming retained austenite into martensite.
표면 피복층의 형성은, Ni-P 합금, 예를 들어, Ni-P, Ni-P-B 또는 Ni-P-W를 사용한다. 이들 조직은, 도금 상태에서는 비정질 혹은 부분적으로 비정질이며, 약 270℃ 이상의 가열에서, 완전히 결정화된 Ni와 Ni3P의 혼합 조직으로 변태한다.Formation of a surface coating layer uses Ni-P alloy, for example, Ni-P, Ni-PB, or Ni-PW. These structures are amorphous or partially amorphous in the plating state, and transform into a mixed structure of Ni and Ni 3 P that are completely crystallized when heated at about 270 ° C. or higher.
가열 처리의 온도는, 금형의 사용 온도(즉, 글래스의 성형 온도) 이상으로 할 필요가 있다. 금형의 사용 온도보다도 낮은 온도로 하면, 사용 중에 치수 변화 가 일어나, 성형품의 치수 정밀도가 저하되기 때문이다. 가열 처리 온도를 지나치게 높이면 도금면에 영향을 주므로, 가열 처리 온도의 상한은 700℃ 정도로 한다.It is necessary to make the temperature of heat processing more than the use temperature (namely, shaping | molding temperature of glass) of a metal mold | die. If the temperature is lower than the use temperature of the mold, dimensional change occurs during use, and the dimensional accuracy of the molded article is lowered. Too high a heat treatment temperature affects the plated surface, so the upper limit of the heat treatment temperature is about 700 ° C.
다음에, 기재를 상술한 성분의 강제의 소재를 사용하는 이유에 대해 설명한다. 즉, C 함유량은, 0.3wt% 이상 2.7wt% 이하로 하였다. C 함유량이 0.3wt%보다 낮아지면, 템퍼링에 있어서의 기재의 체적 수축량이 지나치게 작아져 버린다. 한편, C 함유량이 2.7wt%를 초과하면, 기재의 체적 수축량은 충분하지만, 인성 저하 등의 폐해가 나온다.Next, the reason for using the forcing material of the component mentioned above as a base material is demonstrated. That is, C content was made into 0.3 wt% or more and 2.7 wt% or less. When C content is lower than 0.3 wt%, the volume shrinkage of the base material in tempering will become too small. On the other hand, if the C content exceeds 2.7 wt%, the volume shrinkage of the substrate is sufficient, but adverse effects such as lowering of toughness occur.
또한, Cr 함유량은 13wt% 이하로 하였다. Cr 함유량이 13wt%를 초과하면 잔류 오스테나이트가 분해하기 어려워지기 때문이다. 또한, Cr 함유량의 하한값에 대해서는, 특별히 제약은 없다.In addition, Cr content was made into 13 wt% or less. This is because if the Cr content exceeds 13 wt%, the retained austenite becomes difficult to decompose. In addition, there is no restriction | limiting in particular about the lower limit of Cr content.
첨가물인 Mo, V, W에 대해서는, Mo가 0.5wt% 이상 3wt% 이하, V가 0.1wt% 이상 5wt% 이하, W가 1wt% 이상 7wt% 이하로 하였다. 이들 첨가물의 양이 지나치게 적으면 기재의 고온 경도가 충분하지 않아 프레스 압력에 의해 소성 변형될 우려가 있기 때문이다. 또한, 필요 이상으로 많게 하면 비용이 높아지기 때문에 상한을 정하고 있다.About Mo, V, and W which are additives, Mo was 0.5 to 3 wt%, V was 0.1 to 5 wt%, W was 1 to 7 wt%. This is because when the amount of these additives is too small, the high temperature hardness of the substrate is not sufficient, and there is a risk of plastic deformation due to press pressure. In addition, since the cost becomes high when it makes more than necessary, an upper limit is set.
다양한 성분의 기재에, 무전해 Ni-P 도금을 100㎛ 피복한 금형을 제작하여, 가열 열처리 중 및 성형 중에 발생한 균열의 수 및 글래스를 성형하였을 때의 기재의 소성 변형의 유무를 조사하였다. 표 1에, 기재의 성분, 템퍼링 온도, 균열 발생률, 소성 변형의 유무와의 관계를 나타낸다. 공시체 7은, 비교예로서 종래의 열처리를 행한 플라스틱 성형용 금형을 사용하고 있다. 또한, 성형 온도는 모두 550 ℃로 하였다.A mold having 100 µm of electroless Ni-P plating coated on a substrate of various components was fabricated, and the number of cracks generated during heat treatment and molding and the presence or absence of plastic deformation of the substrate when the glass was molded were examined. In Table 1, the relationship with the component of a base material, tempering temperature, a crack incidence rate, and the presence or absence of plastic deformation is shown. As the comparative example 7, the metal mold | die for plastic molding which performed the conventional heat processing as a comparative example is used. In addition, all the molding temperatures were 550 degreeC.
표 1로부터 알 수 있는 바와 같이, 본 발명의 제조 방법을 기초로 하여 제작된 금형(공시체 5, 공시체 6)에서는, 균열의 발생 및 소성 변형이 확인되지 않았다.As can be seen from Table 1, in the molds (sample 5, specimen 6) produced based on the production method of the present invention, the occurrence of cracks and plastic deformation were not confirmed.
상술한 바와 같이 본 실시 형태에 관한 글래스 성형용 금형의 제조 방법 및 글래스 성형용 금형에서는, 성형 온도에 있어서 표면 피복층에 균열이 발생하는 것을 방지하는 동시에, 금형의 소성 변형을 방지하고, 금형의 형상을 높은 정밀도로 유지하는 동시에, 그 수명을 증대시키는 것이 가능해진다.As mentioned above, in the manufacturing method of the metal mold | die for glass molding which concerns on this embodiment, and the metal mold | die for glass molding, while preventing a crack generate | occur | produce in a surface coating layer at molding temperature, the plastic deformation of a metal mold is prevented and the shape of a metal mold | die is prevented. It is possible to maintain a high accuracy and to increase its lifespan.
또한, 본 발명은 상기 실시 형태에 한정되는 것은 아니다. 예를 들어, 기재 및 표면 피복층의 가열 처리를, 기재의 마무리 가공 및 표면 피복층의 마무리 가공 후에 행하도록 해도 좋다. 이 밖에, 본 발명의 요지를 일탈하지 않는 범위에서 다양한 변형 실시 가능한 것은 물론이다.The present invention is not limited to the above-described embodiments. For example, the heat treatment of the substrate and the surface coating layer may be performed after the finishing treatment of the substrate and the finishing treatment of the surface coating layer. In addition, of course, various deformation | transformation is possible in the range which does not deviate from the summary of this invention.
본 발명에 따르면, 성형 온도에 있어서 표면 피복층에 균열이 발생하는 것을 방지하는 동시에, 금형의 소성 변형을 방지함으로써, 금형의 형상을 높은 정밀도로 유지하는 동시에, 그 수명을 증대시키는 것이 가능해진다.According to the present invention, it is possible to prevent the occurrence of cracks in the surface coating layer at the molding temperature and to prevent plastic deformation of the mold, thereby maintaining the shape of the mold with high accuracy and increasing its life.
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- 2007-12-12 DE DE112007003026T patent/DE112007003026B4/en not_active Expired - Fee Related
- 2007-12-13 JP JP2007322478A patent/JP5073469B2/en active Active
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Cited By (3)
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US9145323B2 (en) | 2013-01-21 | 2015-09-29 | Corning Incorporated | Molds for shaping glass and methods for making the same |
US9266768B2 (en) | 2013-01-21 | 2016-02-23 | Corning Incorporated | High purity nickel molds for optical quality glass forming |
US9475723B2 (en) | 2013-01-21 | 2016-10-25 | Corning Incorporated | Molds for shaping glass and methods for making the same |
Also Published As
Publication number | Publication date |
---|---|
US20090236016A1 (en) | 2009-09-24 |
TW200844056A (en) | 2008-11-16 |
WO2008072664A1 (en) | 2008-06-19 |
JP2008169107A (en) | 2008-07-24 |
JP5073469B2 (en) | 2012-11-14 |
DE112007003026T5 (en) | 2009-10-08 |
KR20090082478A (en) | 2009-07-30 |
DE112007003026B4 (en) | 2011-03-24 |
TWI351387B (en) | 2011-11-01 |
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