JPS62272774A - Manufacture of solid-state image pickup device - Google Patents
Manufacture of solid-state image pickup deviceInfo
- Publication number
- JPS62272774A JPS62272774A JP61116539A JP11653986A JPS62272774A JP S62272774 A JPS62272774 A JP S62272774A JP 61116539 A JP61116539 A JP 61116539A JP 11653986 A JP11653986 A JP 11653986A JP S62272774 A JPS62272774 A JP S62272774A
- Authority
- JP
- Japan
- Prior art keywords
- opaque film
- image pickup
- solid
- film
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 238000003384 imaging method Methods 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 abstract 2
- 230000000593 degrading effect Effects 0.000 abstract 1
- 239000005357 flat glass Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 206010040925 Skin striae Diseases 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、ビデオカメラに使用される固体撮像装置の製
造方法に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a method of manufacturing a solid-state imaging device used in a video camera.
従来の技術
ビデオカメラに用いられる２次元間体撮像素子は、入射
光を光電変換する多数のフォトダイオードからなる撮像
部と、撮像部で生じた電荷を、画像情報としてとり出す
周辺回路部とから構成される。固体撮像素子では、通常
、撮像部の端部分にオプティ力ルブラウク（０ｐｔｉｃ
ａｌ １ｌａｃｋ ：以下０、Ｂ と略す）と称する
領域が設けられる。この領域は、フォトダイオードに光
が入射しないようにフォトダイオードを光遮へいする構
造となっており、このＯ，Ｂ 領域から得られる信号は
、撮像素子からとり出される画像信号の黒信号の基準と
なる。第２図は、撮像素子のＯ，Ｂ 部の構成を示した
従来例である。素子パッケージ２１にマウントされた撮
像素子２２の撮像部２３の端部２４は、透明ガラス基板
２６上に設けられた酸化クロム等の不透明膜２６で覆わ
れた構造となっている。ここで撮像素子２３と、透明ガ
ラス基板２６は、透明接着剤２了により、数μｍの間隔
で接着、固定されている。第２図のような構成により、
封止ガラス２８を通った入射光３０は、撮像部２３には
入射するが、不透明膜２６により、撮像部端部にあるＯ
、Ｂ 領域２４には入射しない。Conventional technology A two-dimensional interbody image sensor used in a video camera consists of an imaging section consisting of a large number of photodiodes that photoelectrically convert incident light, and a peripheral circuit section that extracts the charge generated in the imaging section as image information. configured. In a solid-state image sensor, an optical sensor is usually installed at the end of the image sensor.
An area called al 1lack (hereinafter abbreviated as 0, B) is provided. This area has a structure that shields the photodiode from light so that no light enters the photodiode, and the signals obtained from these O and B areas serve as the reference for the black signal of the image signal taken out from the image sensor. Become. FIG. 2 is a conventional example showing the configuration of the O and B portions of an image sensor. The end portion 24 of the imaging section 23 of the imaging device 22 mounted on the device package 21 is covered with an opaque film 26 made of chromium oxide or the like provided on a transparent glass substrate 26 . Here, the image sensor 23 and the transparent glass substrate 26 are bonded and fixed with a transparent adhesive 2 at intervals of several μm. With the configuration shown in Figure 2,
The incident light 30 that has passed through the sealing glass 28 enters the imaging section 23, but due to the opaque film 26, the O
, B does not enter the region 24.
発明が解決しようとする問題点
しかし、上述のような構成においては、撮像部を覆って
いるガラス基板のキズ、脈理、凹凸は、入射光の屈折反
射等を引きおこし、そのため再生画像を低下させる。ま
た、ガラス基板および透明接着剤による光の吸収、ある
いは、これらの界面での反射ロスにより、撮像素子感度
が低下する等の問題を生じる。Problems to be Solved by the Invention However, in the above-described configuration, scratches, striae, and irregularities on the glass substrate covering the imaging section cause refraction and reflection of incident light, which degrades the reproduced image. let Furthermore, absorption of light by the glass substrate and the transparent adhesive, or reflection loss at the interface between these causes problems such as a decrease in the sensitivity of the image sensor.
このように、ガラス基板に不透明膜をはりつけることに
より、光遮へいを行なう方法は、基板ガラスおよび、接
着剤による撮像素子の性能低下を避けられない。In this way, the method of shielding light by attaching an opaque film to a glass substrate inevitably deteriorates the performance of the image sensor due to the glass substrate and adhesive.
本発明は、上記欠点に鑑み、撮像部の所定の位置のみを
不透明膜により覆うことにより、上記欠点を解決するこ
とのできる固体撮像装置の製造方法を提供するものであ
る。In view of the above drawbacks, the present invention provides a method for manufacturing a solid-state imaging device that can solve the above drawbacks by covering only a predetermined position of the imaging section with an opaque film.
問題点を解決するための手段
本発明の固体撮像装置の製造方法は、真空チャック機能
を有する構造物の所定の場所に、不透明膜を固定し、前
記不透明膜の一方の表面に接着剤を塗布した後、固体撮
像素子上の所定の位置に、上記不透明膜を密着、固定さ
せ、その後、上記構造物と、上記不透明膜を分離するこ
とによって、上記撮像素子の所定の位置に上記不透明膜
を形成することから構成されている。Means for Solving the Problems The method for manufacturing a solid-state imaging device of the present invention includes fixing an opaque film at a predetermined location of a structure having a vacuum chuck function, and applying an adhesive to one surface of the opaque film. After that, the opaque film is tightly attached and fixed to a predetermined position on the solid-state image sensor, and then the structure and the opaque film are separated to place the opaque film at a predetermined position on the image sensor. It consists of forming.
作用
この構成により、撮像素子のＯ，Ｂ 領域だけが不透明
膜により遮光され、かつ他の撮像部に入射する光のロス
も発生せず、撮像素子特性を低下させることはない。Effect: With this configuration, only the O and B regions of the image sensor are shielded from light by the opaque film, and there is no loss of light incident on other image pickup sections, and the characteristics of the image sensor are not degraded.
実施例
本発明の実施例について、図面を参照しながら説明する
。第１図ａは、真空チャック機能を有するブロック１の
底面２の所定の位置に真空吸着により不透明膜３を固定
したものであり、その表面には、接着剤４が塗布されて
いる状態を示したものであり、第１図すは、第１図ａの
ブロックを、固体撮像素子６の撮像面端部６に密着させ
た状態を示している。ｂ図に示すように、固体撮像素子
に、不透明膜３を接着剤４を介して密着させ、固定させ
た後、第１図Ｃに示すように真空吸着を停止することに
よって、真空チャックプロ・ツク１と不透明膜３を分離
する。Embodiments An embodiment of the present invention will be described with reference to the drawings. FIG. 1a shows a block 1 having a vacuum chuck function, with an opaque film 3 fixed at a predetermined position on the bottom surface 2 by vacuum suction, and an adhesive 4 coated on its surface. FIG. 1A shows a state in which the block shown in FIG. As shown in Fig. b, after the opaque film 3 is closely attached and fixed to the solid-state image sensor via the adhesive 4, the vacuum suction is stopped as shown in Fig. 1C. The film 1 and the opaque film 3 are separated.
以上の方法により、不透明膜により、撮像部所定の位置
は、光遮へいされる。なお、第１図において、不透明膜
として、１６μｍ厚さのｈｌ薄膜を用い、接着剤として
エポキシ樹脂を用い、厚さ６μｍに塗布した。By the above method, the predetermined position of the imaging section is shielded from light by the opaque film. In FIG. 1, a HL thin film with a thickness of 16 μm was used as the opaque film, and an epoxy resin was used as the adhesive, which was coated to a thickness of 6 μm.
発明の効果
以上のように、本発明によれば、撮像素子０．Ｂ部に、
不透明薄膜を被着させることができる。本方法により、
撮像素子特性を低下させるガラス基板は不要となり、そ
の結果、光の損失がなくなり、撮像素子感度は従来にく
らべ２０％上昇した。Effects of the Invention As described above, according to the present invention, the image sensor 0. In part B,
An opaque thin film can be applied. With this method,
There is no need for a glass substrate that degrades the characteristics of the image sensor, and as a result, there is no loss of light, and the sensitivity of the image sensor has increased by 20% compared to the conventional technology.
第１図は本発明の一実施例を示した工程順の断面図、第
２図は従来のＯ，Ｂ用光遮へい膜の構成図である。
１・・・・・・真空チャックブロック、３・・・・・不
透明膜、４・・・・・・接着剤、６・・・・・・撮像素
子。FIG. 1 is a cross-sectional view of the process order showing an embodiment of the present invention, and FIG. 2 is a configuration diagram of a conventional O and B light shielding film. 1... Vacuum chuck block, 3... Opaque film, 4... Adhesive, 6... Imaging element.
Claims (1)
チャックにより固定された不透明膜の一方の表面に接着
剤を塗布し、固体撮像素子上の所定の位置に、上記不透
明膜を密着、固定させ、その後、上記構造物と、上記不
透明膜を分離することにより、上記固体撮像素子の所定
の位置に上記不透明膜を形成することを特徴とする固体
撮像装置の製造方法。An adhesive is applied to one surface of the opaque film fixed by the vacuum chuck at a predetermined location of a structure having a vacuum chuck function, and the opaque film is closely attached and fixed to a predetermined position on the solid-state image sensor. . A method of manufacturing a solid-state imaging device, characterized in that the opaque film is formed at a predetermined position of the solid-state imaging device by separating the structure and the opaque film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61116539A JPS62272774A (en) | 1986-05-21 | 1986-05-21 | Manufacture of solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61116539A JPS62272774A (en) | 1986-05-21 | 1986-05-21 | Manufacture of solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62272774A true JPS62272774A (en) | 1987-11-26 |
Family
ID=14689624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61116539A Pending JPS62272774A (en) | 1986-05-21 | 1986-05-21 | Manufacture of solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62272774A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014027476A1 (en) * | 2012-08-16 | 2014-02-20 | アオイ電子株式会社 | Semiconductor device |
-
1986
- 1986-05-21 JP JP61116539A patent/JPS62272774A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014027476A1 (en) * | 2012-08-16 | 2014-02-20 | アオイ電子株式会社 | Semiconductor device |
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