JPS6175554U - - Google Patents
Info
- Publication number
- JPS6175554U JPS6175554U JP16081884U JP16081884U JPS6175554U JP S6175554 U JPS6175554 U JP S6175554U JP 16081884 U JP16081884 U JP 16081884U JP 16081884 U JP16081884 U JP 16081884U JP S6175554 U JPS6175554 U JP S6175554U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- portion provided
- bead portion
- bead
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Diaphragms And Bellows (AREA)
Description
第１図Ａは本考案のダイヤフラムのビード部の
形状の断面図、第１図Ｂは本考案のダイヤフラム
を機器に装着した場合の態様図、第２図Ａは従来
のダイヤフラムのビード部の形状の断面図、第２
図Ｂは従来のダイヤフラムを機器に装着した場合
の態様図。
１…ダイヤフラム膜部、２，２′…ビード、３
…ビードの切欠部、４…はみ出し、５…機器内壁
、６…フランジ、７…フランジ締め具（ボルト、
ナツト）。
Figure 1A is a cross-sectional view of the shape of the bead of the diaphragm of the present invention, Figure 1B is a diagram of the diaphragm of the present invention installed in equipment, and Figure 2A is the shape of the bead of a conventional diaphragm. cross-sectional view, second
Figure B is a diagram of a conventional diaphragm installed in a device. 1...Diaphragm membrane part, 2, 2'...Bead, 3
...Bead notch, 4...Protrusion, 5...Inner wall of equipment, 6...Flange, 7...Flange fastener (bolt,
Natsu).
Claims (1)
おいて、該ビード部の内径側に切欠部を周設した
ことを特徴とするダイヤフラム。 A diaphragm characterized in that a bead portion provided at an outer peripheral end of the elastic diaphragm has a cutout portion provided around the inner diameter side of the bead portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16081884U JPS6175554U (en) | 1984-10-24 | 1984-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16081884U JPS6175554U (en) | 1984-10-24 | 1984-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6175554U true JPS6175554U (en) | 1986-05-21 |
Family
ID=30718732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16081884U Pending JPS6175554U (en) | 1984-10-24 | 1984-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6175554U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7142000B2 (en) | 1993-11-16 | 2006-11-28 | Formfactor, Inc. | Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
-
1984
- 1984-10-24 JP JP16081884U patent/JPS6175554U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7142000B2 (en) | 1993-11-16 | 2006-11-28 | Formfactor, Inc. | Mounting spring elements on semiconductor devices, and wafer-level testing methodology |