JPS61112610A - Release agent - Google Patents

Abstract

PURPOSE:To contrive to improve mold release function by making a mold release agent with polyether containing halogen having a repeated unit. CONSTITUTION:A mold release agent is made, as a main component, of halogen polyether containing the units repeated in specified manner. In a formula (I), the arrangement in the molecular of repeated unit in each parenthesis is arbitrary, and it does not mean that the arrangement is always in said order. Each of X, Y and Z may also have different means in the different repeated unit of a same molecure. For instance, in one repeated unit, Z is fluorine, but in other repeated unit, Z may be chlorine. The polyester containing halogen has reduced vapor pressure and surface tension, as it is straight chain polyether, and it is stable for heat owing to its high thermal decomposition beginning temperature. In the formula, each of (a), (b), (c), (d), (e), (f) is zero or positive integer and satisfies following formulas 2>=a+b+c+d+e+f<=200 and a+c+d+f>=1.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mold release agent, and more specifically to synthetic resins or rubbers (hereinafter simply referred to as "synthetic resins"; foams thereof are also included). This invention relates to a mold release agent whose main component is a halogen-containing polyether, which is used in the production of molded products of polymeric substances such as polyethers.

[Prior art] Conventionally, natural or synthetic compounds such as Noricon oil, mineral oil, paraffin wax, fatty acid derivatives, and glycol, as well as inorganic substances such as talc and mica, have been used as mold release agents when molding polymeric materials. has been done.

Generally, these mold release agents are applied to the mold before the molded article is introduced, and if the mold release life is short, it is customary to apply them before each introduction. Noricon oil is the most commonly used mold release agent due to its good mold release properties, but when used for materials with strong adhesive properties such as urethane and epochino resin, it is necessary to use silicon oxide. It is necessary to improve the strength of the release agent film by adding fine powder or the like, and to apply it in large quantities. Applying such a large amount causes the release agent to migrate to the molded object, which not only makes it impossible to perform post-treatments on the surface of the molded object, such as painting or adhesive treatment, but also makes it undesirable from a cost perspective. do not have. Furthermore, Norikonura has a phenomenon in which it fills on the surface of plastics, and when used in the molding process of electrical parts, it often causes poor conduction at the contact portion.

Furthermore, if molding is continued in one mold by applying a large amount of mold release agent, mold release agent residue and molded product debris will accumulate on the mold surface, making it necessary to wash the mold frequently. This caused a decrease in the efficiency of the molding process.

Fluorine compounds have low surface energy and are known to have mold releasability by themselves, and mold release methods have already been developed by combining phosphoric acid esters of alcohols containing perfluoroalkyl groups with Noricon oil, etc. A mold release agent with good properties has been obtained (see Japanese Patent Publication No. 53-23271).

However, mold release agents containing phosphate esters of alcohols having perfluoroalkyl groups are used for molding resins with a reactive range, such as foamed polyurethane, because the phosphate esters have reactive functional groups. There is a drawback that during processing, a part of the resin may react with the surface of the resin, causing the surface to become rough. In addition, these phosphoric acid esters containing perfluoroalkyl groups do not have sufficient heat resistance, and when molding is performed at high temperatures for a long period of time, carbonization decomposition occurs and scum often accumulates on the mold. Ta.

[Object of the invention] The object of the present invention is to provide a mold release agent that has low vapor pressure, low surface tension, high thermal decomposition initiation temperature, good thermal stability, excellent mold releasability, and little mold staining. It's about doing.

[Configuration of the Invention] The gist of the present invention is the formula: %Formula%) [In the formula, a, b, c, dSe and " are each 0 or a positive integer, and 2≦a+b+c+d+e+
The number satisfies f≦200 and a+c+d+f≧1. The release agent consists of a halogen-containing polyether having a repeating unit represented by the following formula.

In formula (r), the arrangement of the repeating units in each parenthesis in the molecule is arbitrary, and it is not mandatory to arrange them in the above order. Furthermore, each of X, Y and Z may have different meanings in different repeating units within the same molecule. For example, in some repeating units Z may be fluorine, while in the pond repeating unit Z may be chlorine.

The halogen-containing polyether used in the present invention is a new compound. Among these, polyethers in which q and r are 0 and their manufacturing method are described in Japanese Patent Application No. 58-251069, and polyethers in which XSY and Z are fluorine and their manufacturing method are described in Japanese Patent Application No. 59-58877. Further, the polyether in which at least one of X1Y and Z is chlorine and the method for producing the same are described in November 1982.
It is described in a patent application filed on May 7th (title of invention: "Novel halogen-containing polyether and its manufacturing method and uses").

The manufacturing method of these polyethers will be briefly explained.

The polyether in which q and r are 0 is 2.2.3°3
-Tetrafluorooxecune can be prepared by ring-opening polymerization, generally in the presence of an initiator (for example, an alkali metal halide or a compound exhibiting strong Lewis acidity).

A polyether in which at least one of q and r is not 0 can be easily produced by fluorinating and/or chlorinating the previously obtained polyether in which q and r are 0.

Since the halogen-containing polyether used in the present invention is a linear polyether, it is a known branched halogen-containing polyether, for example, the formula.

Compounds having a repeating unit represented by F i -(CF CP to) n- (CF to) m- or F3 ■ - (CFCF, 0) n- and formula: C
Compared to the compound represented by e(CF rc F Cl2) IIC+2, when comparing compounds with the same viscosity, the halogen-containing polyether of the present invention has a lower vapor pressure, less viscosity change due to temperature change, It also has excellent chemical resistance and heat resistance.

[Effects of the Invention] The mold release agent of the present invention has low vapor pressure and surface tension, and has a high thermal decomposition initiation temperature, so it has excellent thermal stability.

When used in the molding process of polyurethane, the surface will not become rough and will not cause poor conductivity at the contact points when molding electrical parts.

[Example] Next, Examples and Comparative Examples will be shown to specifically explain the present invention.

Examples 1 to 4 and Comparative Examples 1 to 3 [Test method] (A composition containing the mold release agent shown in the table on an aluminum mold of 1,4 c x φ Solution) was applied with a brush and air-dried.Then, the following solutions A and B were mixed with a hand mixer for 15 minutes.
The mixture was stirred and mixed at 00 rpm, immediately poured into the aluminum mold, and foamed and cured at 25° C. for 5 minutes. The adhesive strength was determined using a tensile tester (tensile speed 25 H/win) and the mold release performance was measured.

Part A - Polyol POP31-28 100 parts by weight "Nippon Urethane Co., Ltd." - Polyol EG/DIEP I 2 No! [Nippon Urethane Co., Ltd. Tonorikonoshi 5302 1,0 No'5 Nippon Unicar (Merger)] - Polyamino Dabco O, 8〃・
Bo'J7 Min DBTDL O,01! / Trichloromonofluoroethane DF-II lol/[Daikin Industries, Ltd.] B liquid isonoane) MDi-CL 44.711 [Nippon Urethane Co., Ltd.] The results are shown in the following table.

The surface of the polyurethane molded product used in the examples was very clean.

Claims (1)

[Claims] (1) Formula: -(CH_2CF_2CF_2O)a-(CHClCF
_2CF_2O)b-(CCl_2CF_2CF_2O
)c-(CHFCF_2CF_2O)d-(CFClC
F_2CF_2O)e-(CF_2CF_2CF_2O
)f- [where a, b, c, d, e and f are each 0 or a positive integer, and 2≦a+b+c+d+e+
The number satisfies f≦200 and a+c+d+f≧1. ] A mold release agent whose main component is a halogen-containing polyether having a repeating unit.