JPS61110402A - Thick film resistor - Google Patents
Thick film resistorInfo
- Publication number
- JPS61110402A JPS61110402A JP59230151A JP23015184A JPS61110402A JP S61110402 A JPS61110402 A JP S61110402A JP 59230151 A JP59230151 A JP 59230151A JP 23015184 A JP23015184 A JP 23015184A JP S61110402 A JPS61110402 A JP S61110402A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- resistor
- film resistor
- pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の剰用分野）
本発明は絶縁基板上に一対の導体パターン及び抵抗体パ
ターンを印刷・焼成し形成後、レーザービーム照射手段
によシトリミングして抵抗値を調整する厚膜抵抗体の構
造に関する。[Detailed Description of the Invention] [Required Field of the Invention] The present invention involves printing and firing a pair of conductor patterns and a resistor pattern on an insulating substrate, and then trimming them with a laser beam irradiation means to adjust the resistance value. This invention relates to the structure of a thick film resistor to be adjusted.
〔発明の背景） 従来技術による厚膜抵抗体の平面図を第」図に示す。[Background of the invention] A plan view of a conventional thick film resistor is shown in FIG.
この様な、厚膜抵抗体の製造に際しては、まず絶縁基板
１の平面上に１導体パターン２ａ、２ｂと抵抗体パター
ン３を順次、印刷・焼成〈より形成後、目標とする抵抗
値〈合せるためにレーザービームの照射手段によシ、抵
抗体パターン３をトリミングして抵抗値を調整して形成
する。ここで、抵抗体パターン３のトリミングは、第１
図に示す様に、ト’ｊミ／グ起点４から直線状にカット
するのが一般的である。When manufacturing such a thick film resistor, first, one conductor pattern 2a, 2b and a resistor pattern 3 are sequentially printed and fired on a flat surface of an insulating substrate 1, and then the target resistance value is adjusted. Therefore, the resistor pattern 3 is trimmed using a laser beam irradiation means to adjust the resistance value. Here, the trimming of the resistor pattern 3 is performed in the first
As shown in the figure, it is common to cut in a straight line from the starting point 4.
しかし、このトリミングのカット形状では抵抗体の浮遊
容量が０．１ｐＦ程度と大きいために１高周波帯域の回
路に前記厚膜抵抗体を接続した場合忙、厚膜抵抗体の浮
遊容量の影響を受けて該回路か正常に動作しないことが
発生し易い欠点があった。However, with this trimming cut shape, the stray capacitance of the resistor is as large as about 0.1 pF, so if the thick film resistor is connected to a circuit for one high frequency band, it will be difficult to connect it to the circuit of one high frequency band. However, there is a drawback that the circuit is likely to malfunction.
本発明の目的は、前述した従来技術の欠点を除き、浮遊
容量が低減できて高周波帯域の回路に接続した場合でも
、回路が正常に動作する厚膜抵抗体を提供するＫある。An object of the present invention is to eliminate the drawbacks of the prior art described above, and to provide a thick film resistor that can reduce stray capacitance and allow the circuit to operate normally even when connected to a circuit in a high frequency band.
この目的を達成するために１本発明は抵抗体パターンの
一部分を抵抗体パターンの生な部分から完全に９１１１
する様にトリミングして、抵抗体として電気的ＫＭａ能
する部分と機能しない部分とく分けた点に特徴がある。In order to achieve this object, one aspect of the present invention is to completely remove a portion of the resistor pattern from the raw portion of the resistor pattern.
It is characterized in that it is trimmed so as to separate the part that functions as an electrical resistor and the part that does not.
以下、本発明の実施例を図面について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
本発明による厚膜抵抗体の一実施例の平面図を第２図に
示す。A plan view of an embodiment of the thick film resistor according to the present invention is shown in FIG.
図に於いて、第１図と同一符号は同一部分を示してお夛
、５は抵抗体パターン３の一部分をトリミングにより、
完全に分離させた島状部分でらる。In the figure, the same symbols as in Figure 1 indicate the same parts, and 5 is a part of the resistor pattern 3 trimmed.
It is a completely separated island-like part.
第２図の厚膜抵抗体の形成忙際しては、導体パターン２
ａ、２ｂ及び抵抗体パターン３は第１図で示した従来技
術と同様に形成した後に１ 目標とする抵抗値ｌＣ調整
するためのレーザー照射手段によるトリミングを行なう
際に、トリミングの起点４から直叡状〈−足距離カクト
した後、９０°屈曲させて一定距離そのまま延長しカッ
ト後、さらに１トリミング起点４と平行する方向へ向け
て９０６屈曲させ延長してカットし、抵抗パターン３の
一部分を近似Ｕ字形の島状部分５と残す様に抵抗パター
ン３から完全に分離して形成する。When forming the thick film resistor shown in FIG.
a, 2b and the resistor pattern 3 are formed in the same manner as in the prior art shown in FIG. After cutting the length, bend it 90 degrees, extend it a certain distance, cut it, and then bend it 906 in the direction parallel to the trimming starting point 4, extend it, and cut it, cutting a part of the resistance pattern 3. It is formed completely separated from the resistor pattern 3 so as to leave an approximately U-shaped island portion 5.
この様にして形成した本発明の厚膜抵抗体と従来技術に
よる厚膜抵抗体との浮遊容量の比較データが第５図に示
す特性図であり、Ａは従来技術による厚膜抵抗体、Ｂは
本発明釦よる淳ｐａ抵抗体である。図で明らかな様に１
本考案の厚膜抵抗体の浮遊容量は０．０５ｐＦ程度とな
り、従来技術の半分程度に浮遊容量が減小する。The comparative data of stray capacitance between the thick film resistor of the present invention formed in this way and the thick film resistor according to the prior art is shown in the characteristic diagram shown in FIG. is a Junpa resistor based on the button of the present invention. As shown in the figure, 1
The stray capacitance of the thick film resistor of the present invention is about 0.05 pF, which is about half that of the conventional technology.
上記した実施例は、トリミングの軌跡を近似Ｕ字形とし
たが、抵抗体パターンの一部分を島状に残す様くカット
すれば艮（、’ｌ／字形、半円形等の軌跡を示すトリミ
ングくしても同様釦浮遊容′ｓｔが減小することは言う
までもない。In the above embodiment, the trimming locus was approximately U-shaped, but if a part of the resistor pattern is cut so as to leave an island shape, the trimming locus may be trimmed to have an approximate U-shaped locus. It goes without saying that the button floating capacity 'st is similarly reduced.
〔発明の作用効果ｊ
以上説明したよう釦、本発ＢＡＫよれば浮遊容量を０．
０５ ｐＦ程度に減小させることが可能となったＣとく
よシ、高周波帯域の回路に接続しても、その回路の性能
等を乱すこと無く、電気的に動作きせることが可能とな
り、上記従来技術の欠点を除いて優れた機能の厚膜抵抗
体を提供するＣとが出来る。[Operations and Effects of the Invention j As explained above, according to the button and the BAK of this invention, the stray capacitance can be reduced to 0.
C and Kuyoshi, which can now be reduced to about 0.05 pF, can be electrically operated without disturbing the performance of the circuit even when connected to a circuit in a high frequency band, making it possible to operate electrically without disturbing the performance of the circuit. It is possible to provide a thick film resistor with excellent functionality except for the drawbacks of C.
第１図は従来例に係る厚膜抵抗体の平面図、第２図は本
発明の一実施例に係る厚膜抵抗体の平面図、第３図はそ
の浮遊容量の比較特性図である。FIG. 1 is a plan view of a thick film resistor according to a conventional example, FIG. 2 is a plan view of a thick film resistor according to an embodiment of the present invention, and FIG. 3 is a comparative characteristic diagram of the stray capacitance thereof.
Claims (1)
印刷・焼成し形成後、レーザービーム照射手段によりト
リミングして抵抗値を調整する厚膜抵抗体に於いて、ト
リミングにより該導体パターン間の抵抗パターンを電気
的に機能する部分と電気的に機能しない部分との２つに
分離してなることを特徴とする厚膜抵抗体。In thick film resistors, a pair of conductor patterns and a resistor pattern are printed and fired on an insulating substrate, and then trimmed by a laser beam irradiation means to adjust the resistance value. What is claimed is: 1. A thick film resistor, characterized in that the resistor is separated into two parts, an electrically functional part and an electrically non-functional part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59230151A JPS61110402A (en) | 1984-11-02 | 1984-11-02 | Thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59230151A JPS61110402A (en) | 1984-11-02 | 1984-11-02 | Thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61110402A true JPS61110402A (en) | 1986-05-28 |
Family
ID=16903390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59230151A Pending JPS61110402A (en) | 1984-11-02 | 1984-11-02 | Thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61110402A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0417308A (en) * | 1990-05-11 | 1992-01-22 | Rohm Co Ltd | Manufacture of network-type resistor |
| JP2002178075A (en) * | 2000-12-20 | 2002-06-25 | Chuo Motor Wheel Co Ltd | Method of manufacturing rim for automobile |
-
1984
- 1984-11-02 JP JP59230151A patent/JPS61110402A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0417308A (en) * | 1990-05-11 | 1992-01-22 | Rohm Co Ltd | Manufacture of network-type resistor |
| JP2635799B2 (en) * | 1990-05-11 | 1997-07-30 | ローム 株式会社 | Method of manufacturing network type resistor |
| JP2002178075A (en) * | 2000-12-20 | 2002-06-25 | Chuo Motor Wheel Co Ltd | Method of manufacturing rim for automobile |
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