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JPS59218262A - Solder dipping device - Google Patents

Solder dipping device

Info

Publication number
JPS59218262A
JPS59218262A JP9341183A JP9341183A JPS59218262A JP S59218262 A JPS59218262 A JP S59218262A JP 9341183 A JP9341183 A JP 9341183A JP 9341183 A JP9341183 A JP 9341183A JP S59218262 A JPS59218262 A JP S59218262A
Authority
JP
Japan
Prior art keywords
solder
tank
goods
inert gas
fluidity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9341183A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yamamichi
山道　信行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9341183A priority Critical patent/JPS59218262A/en
Publication of JPS59218262A publication Critical patent/JPS59218262A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To prevent contamination of a molten solder and solder goods, and to prevent a drop of fluidity of a solder by formong an inert gas atmosphere on a liquid surface of a solder tank. CONSTITUTION:A liquid surface of a solder tank 4 becomes a non-oxidizing atmosphere by jetting an inert gas from nozzles 8, 9. In this state, goods to be soldered are carried by a belt conveyor 1 and heated by a heater 3 after applying a flux. Subsequently, this heated goods are dipped in a molten solder 11 of the solder tank 4, cooled by a fan 5, and thereafter, carried. By this device, contamination of the molten solder and the goods is prevented, and it is prevented, that drop of fluidity of a solder.

Description

【発明の詳細な説明】 る。[Detailed description of the invention] Ru.

従来の半田デイツプ装置は、半田槽内で溶融している半
田が、空気に触れて酸化するのを防止するため、溶融半
田表面上に半田酸化防止オイルを浮かせるか、あるいは
機械的に酸化した半田を除去する機構を取りけけである
のが一般的であった。Conventional solder dip devices either float solder oxidation prevention oil on the surface of the molten solder or mechanically oxidize solder to prevent the solder melting in the solder tank from oxidizing when exposed to air. It was common to have a mechanism to remove the

しかしながら、半田酸化防止オイルを使用した場合、該
オイルが炭化し、溶融半田内部に汚れとなって堆積し、
半田の流動性を悪くしたり、半田ディツプする物体に汚
れとなってけ着するという不都合を生ずることがあった
。However, when solder oxidation prevention oil is used, the oil carbonizes and accumulates as dirt inside the molten solder.
This has the disadvantage of impairing the fluidity of the solder or causing dirt to stick to the object into which the solder is dipped.

又酸化半田除去機構のけいた装置の場合は、時間ととも
に半田が減少し、常に半田を追加する必要があった。In addition, in the case of a device with a sophisticated oxidation solder removal mechanism, the amount of solder decreases over time, and it is necessary to constantly add more solder.

本発明は前述した従来の半田デイツプ装置の欠点を改善
したものである。The present invention improves the drawbacks of the conventional solder dip device described above.

すなわち本発明の半田デイツプ装置は、非酸化性雰囲気
中に半田槽内の液面をさらして液の酸化を防止するよう
にしたことを特徴ともるものである。That is, the solder dip device of the present invention is characterized in that the liquid level in the solder tank is exposed to a non-oxidizing atmosphere to prevent oxidation of the liquid.

以下、本発明の一実施例を図により説明する。Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

図に示すように、装置本体Ｍには半田デイツプする物品
をホルダーに取付け、これを水平方向に搬送するベルト
コンベア１が設置されており、該ベルトコンベア１に沿
い、その搬入口から搬出口に向けて物品にブランクスを
塗布する発泡式のフラクサ２、物品を加熱するヒーター
３、半田槽４、冷却ファン５が順次設置される。まだ、
搬出口側にはベルトコンベア駆動機構６及びモーター７
が設置される。As shown in the figure, a belt conveyor 1 is installed in the main body M of the device to attach items to be soldered to a holder and convey them in a horizontal direction. A foaming fluxer 2 for applying a blank to the article, a heater 3 for heating the article, a solder bath 4, and a cooling fan 5 are installed in this order. still,
A belt conveyor drive mechanism 6 and a motor 7 are installed on the exit side.
will be installed.

さらに前記半田槽４の上方に窒素ガス等の不活性ガスを
半田槽の液面に下向きに噴射するノズル８を設置すると
共に、半田槽４の上縁の周囲に窒素ガス等の不活性ガス
を半田槽の液面に横向きに噴射するノズル９を設置する
。また、ノズル８の周囲には半田槽の液面に向けて筒体
１０を設置し、該筒体１０によシノズル８からのガスを
半田槽の液面に誘導する。Further, a nozzle 8 for spraying an inert gas such as nitrogen gas downward onto the liquid level of the solder tank is installed above the solder tank 4, and an inert gas such as nitrogen gas is installed around the upper edge of the solder tank 4. A nozzle 9 that sprays horizontally is installed on the liquid surface of the solder tank. Further, a cylinder 10 is installed around the nozzle 8 so as to face the liquid level of the solder tank, and the cylinder 10 guides the gas from the nozzle 8 to the liquid level of the solder tank.

実施例において、物品を半田ディツプするには、まずノ
ズル８，９から窒素ガスを噴射し、半田槽４の液面を不
活性ガス（非酸化性）雰囲気にする。In the embodiment, in order to solder dip an article, nitrogen gas is first injected from the nozzles 8 and 9 to create an inert gas (non-oxidizing) atmosphere at the liquid level in the solder bath 4.

この状態において、ベルトコンベア１によシ物品を搬送
し、最初にフラクサ２によりフシックスを塗布し、次に
ヒーター７で加熱し、該物品を半田槽４内の溶解半田１
１中にディップし、冷却ファン５で冷却し搬出口に向け
て搬送する。In this state, the article is conveyed by the belt conveyor 1, first coated with flux by the fluxer 2, then heated by the heater 7, and the article is soldered to the melted solder 1 in the solder tank 4.
1, cooled by a cooling fan 5, and transported toward an exit.

以上のように本発明は、半田槽の液面を不活性ガス雰囲
気中にして物品の半田ディツプを行なうようにしたため
、半田酸化防止オイルを使用する必要がなく、溶解半田
及び物品を汚染したシ半田の流動性を低下させることを
防止でき、しかも機械的に酸化した半田を除去する必要
がなく、溶融半田を有効に使用できる効果を有するもの
である。As described above, in the present invention, since the solder dip of the article is carried out with the liquid level of the solder tank in an inert gas atmosphere, there is no need to use solder oxidation prevention oil, and there is no need to use oil to prevent oxidation of the solder. It is possible to prevent a decrease in the fluidity of the solder, and there is no need to mechanically remove oxidized solder, so that the molten solder can be used effectively.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の実施例を示す断面図である。 ４・・・半田槽、８，９・・・ノズル 特許出願人　　日本電気株式会社 The figure is a sectional view showing an embodiment of the present invention. 4... Solder tank, 8, 9... Nozzle Patent applicant: NEC Corporation

Claims (1)

【特許請求の範囲】[Claims] （１）非酸化性雰囲気を少くとも半田デイツプ槽の液面
上に形成するガス噴出装置を備えだことを特徴とする半
田デイツプ装置。(1) A solder dip device characterized by comprising a gas blowing device that forms a non-oxidizing atmosphere on at least the liquid surface of a solder dip tank.
JP9341183A 1983-05-27 1983-05-27 Solder dipping device Pending JPS59218262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9341183A JPS59218262A (en) 1983-05-27 1983-05-27 Solder dipping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9341183A JPS59218262A (en) 1983-05-27 1983-05-27 Solder dipping device

Publications (1)

Publication Number Publication Date
JPS59218262A true JPS59218262A (en) 1984-12-08

Family

ID=14081552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9341183A Pending JPS59218262A (en) 1983-05-27 1983-05-27 Solder dipping device

Country Status (1)

Country Link
JP (1) JPS59218262A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182965A (en) * 1984-09-28 1986-04-26 Ginya Ishii Solder oxidation preventing method of jet soldering device
JPH07135063A (en) * 1993-11-09 1995-05-23 Kuroda Denki Kk Soldering method of connecting terminal for resin coating wire
US5803852A (en) * 1997-04-03 1998-09-08 Eastman Kodak Company Ceramic drive system
EP0869296A2 (en) 1997-04-03 1998-10-07 Eastman Kodak Company Apparatus and method for spooling strips of web
US5884387A (en) * 1997-04-03 1999-03-23 Eastman Kodak Company Method of forming self-lubricating, ceramic elements for a drive system or similar apparatus
US8850715B2 (en) * 2006-09-07 2014-10-07 Eisenmann Ag Process and installation for drying articles
CN110328119A (en) * 2019-08-05 2019-10-15 山东泰开高压开关有限公司 A kind of workpiece processing recipe and system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182965A (en) * 1984-09-28 1986-04-26 Ginya Ishii Solder oxidation preventing method of jet soldering device
JPH07135063A (en) * 1993-11-09 1995-05-23 Kuroda Denki Kk Soldering method of connecting terminal for resin coating wire
US5803852A (en) * 1997-04-03 1998-09-08 Eastman Kodak Company Ceramic drive system
EP0869296A2 (en) 1997-04-03 1998-10-07 Eastman Kodak Company Apparatus and method for spooling strips of web
EP0869297A2 (en) 1997-04-03 1998-10-07 Eastman Kodak Company Ceramic chain drive system
US5884387A (en) * 1997-04-03 1999-03-23 Eastman Kodak Company Method of forming self-lubricating, ceramic elements for a drive system or similar apparatus
US8850715B2 (en) * 2006-09-07 2014-10-07 Eisenmann Ag Process and installation for drying articles
CN110328119A (en) * 2019-08-05 2019-10-15 山东泰开高压开关有限公司 A kind of workpiece processing recipe and system

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