JPS57135401A - Parts block molding method to substrate - Google Patents
Parts block molding method to substrateInfo
- Publication number
- JPS57135401A JPS57135401A JP2165681A JP2165681A JPS57135401A JP S57135401 A JPS57135401 A JP S57135401A JP 2165681 A JP2165681 A JP 2165681A JP 2165681 A JP2165681 A JP 2165681A JP S57135401 A JPS57135401 A JP S57135401A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- hollowed
- molding
- metallic mold
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE: To easily manufacture the first substrate device which has coupled a parts block, and the second substrate device which has coupled another parts block in one body by making said parts block common, by using one metallic mold by a specific means.
CONSTITUTION: This device is provided with an upper metallic mold which is formed by parts molding hollowed parts 11a, 11b connected by a runner molding hollowed groove 10, also an independent parts molding hollowed part 11c, and runner molding hollowed grooves 12, 13 which are separated and opposed to each other between 11b and 11c. A metallic mold is formed by said upper metallic mold and a lower metallic mold which has formed hollowed parts 15a, 15b and 15c for molding boss to prevent slipping of parts so as to be opposed to the upper metallic mold, and is constitued by use of through-holes 17a, 17b and 17c, and a substrate 19 on which a slit 18 having the same width as the hollowed grooves 12, 13 has been formed. When resin is injected from said hollowed groove 10, the resin flows into the parts molding hollowed parts 11a, 11b and 11c through the hollowed grooves 10, 12, 13 and 18, and is molded and coupled. When the slit 18 is removed, only the parts of 11a and 11b can be molded and coupled.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165681A JPS57135401A (en) | 1981-02-16 | 1981-02-16 | Parts block molding method to substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165681A JPS57135401A (en) | 1981-02-16 | 1981-02-16 | Parts block molding method to substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57135401A true JPS57135401A (en) | 1982-08-21 |
| JPS6238795B2 JPS6238795B2 (en) | 1987-08-19 |
Family
ID=12061085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2165681A Granted JPS57135401A (en) | 1981-02-16 | 1981-02-16 | Parts block molding method to substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57135401A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01157593A (en) * | 1987-11-10 | 1989-06-20 | Tokyo Tatsuno Co Ltd | Stopper structure |
| JPH05220760A (en) * | 1992-02-13 | 1993-08-31 | Nec Gumma Ltd | Substrate device for electric machinery |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335667Y2 (en) * | 1985-10-26 | 1991-07-29 |
-
1981
- 1981-02-16 JP JP2165681A patent/JPS57135401A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01157593A (en) * | 1987-11-10 | 1989-06-20 | Tokyo Tatsuno Co Ltd | Stopper structure |
| JPH05220760A (en) * | 1992-02-13 | 1993-08-31 | Nec Gumma Ltd | Substrate device for electric machinery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238795B2 (en) | 1987-08-19 |
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