JPS5630129A - Manufacture of photomask - Google Patents
Manufacture of photomaskInfo
- Publication number
- JPS5630129A JPS5630129A JP10547479A JP10547479A JPS5630129A JP S5630129 A JPS5630129 A JP S5630129A JP 10547479 A JP10547479 A JP 10547479A JP 10547479 A JP10547479 A JP 10547479A JP S5630129 A JPS5630129 A JP S5630129A
- Authority
- JP
- Japan
- Prior art keywords
- ultraviolet rays
- film
- photomask
- resist film
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/56—Organic absorbers, e.g. of photo-resists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To simplify a photomask manufacturing process and increase the accuracy of the photomask by exposing a radiation sensitive org. resist film, to electron beams, which is opaque to ultraviolet rays or far ultraviolet rays. CONSTITUTION:Radiation sensitive org. resist film 3A which is opaque to ultraviolet rays or far ultraviolet rays is directly formed on substrate 1, and a desired pattern is formed in film 3A by exposure to electron beams, development and post- baking. Using the residual portion of film 3A as a light shielding portion, pattern printing is carried out with ultraviolet rays or far ultraviolet rays. Thus, the formation of a light shielding film, the etching of the film and the removal of the residual resist film are made unnecessary as compared to a conventional method, resulting in a simplified process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10547479A JPS5630129A (en) | 1979-08-21 | 1979-08-21 | Manufacture of photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10547479A JPS5630129A (en) | 1979-08-21 | 1979-08-21 | Manufacture of photomask |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5630129A true JPS5630129A (en) | 1981-03-26 |
Family
ID=14408585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10547479A Pending JPS5630129A (en) | 1979-08-21 | 1979-08-21 | Manufacture of photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5630129A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002196483A (en) * | 2000-12-25 | 2002-07-12 | Hitachi Ltd | Photomask and manufacturing method of electronic device using it |
US6656644B2 (en) | 2000-07-07 | 2003-12-02 | Hitachi Ltd. | Manufacturing method of photomask and photomask |
US6656646B2 (en) | 2001-08-31 | 2003-12-02 | Hitachi, Ltd. | Fabrication method of semiconductor integrated circuit device |
US6677107B1 (en) | 1999-06-30 | 2004-01-13 | Hitacji, Ltd. | Method for manufacturing semiconductor integrated circuit device, optical mask used therefor, method for manufacturing the same, and mask blanks used therefor |
US6686108B2 (en) | 2000-10-13 | 2004-02-03 | Renesas Technology Corporation | Fabrication method of semiconductor integrated circuit device |
US6706452B2 (en) | 2000-12-27 | 2004-03-16 | Hitachi, Ltd. | Method of manufacturing photomask and method of manufacturing semiconductor integrated circuit device |
US6794207B2 (en) | 2000-07-07 | 2004-09-21 | Renesas Technology Corp. | Method of manufacturing integrated circuit |
US6824958B2 (en) | 2000-12-26 | 2004-11-30 | Renesas Technology Corp. | Method of manufacturing photomask and method of manufacturing semiconductor integrated circuit device |
US6927002B2 (en) | 2000-12-28 | 2005-08-09 | Renesas Technology Corp. | Photomask, the manufacturing method, a patterning method, and a semiconductor device manufacturing method |
US6939649B2 (en) | 2001-10-12 | 2005-09-06 | Renesas Technology Corp. | Fabrication method of semiconductor integrated circuit device and mask |
US6979525B2 (en) * | 2002-03-01 | 2005-12-27 | Renesas Technology Corp. | Method of manufacturing electronic device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262427A (en) * | 1975-11-17 | 1977-05-23 | Du Pont | Photopolymer element and method of duplicating image |
JPS5480083A (en) * | 1977-12-02 | 1979-06-26 | Iisuto Imuperiaru Intern Corp | High resolution mask |
-
1979
- 1979-08-21 JP JP10547479A patent/JPS5630129A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262427A (en) * | 1975-11-17 | 1977-05-23 | Du Pont | Photopolymer element and method of duplicating image |
JPS5480083A (en) * | 1977-12-02 | 1979-06-26 | Iisuto Imuperiaru Intern Corp | High resolution mask |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6677107B1 (en) | 1999-06-30 | 2004-01-13 | Hitacji, Ltd. | Method for manufacturing semiconductor integrated circuit device, optical mask used therefor, method for manufacturing the same, and mask blanks used therefor |
US7125651B2 (en) | 1999-06-30 | 2006-10-24 | Renesas Technology Corp. | Method of manufacturing semiconductor integrated circuit device optical mask therefor, its manufacturing method, and mask blanks |
US6936406B2 (en) | 2000-07-07 | 2005-08-30 | Renesas Technology Corp. | Method of manufacturing integrated circuit |
US6846598B2 (en) | 2000-07-07 | 2005-01-25 | Hitachi, Ltd. | Manufacturing method of photomask and photomask |
US6656644B2 (en) | 2000-07-07 | 2003-12-02 | Hitachi Ltd. | Manufacturing method of photomask and photomask |
US6958292B2 (en) | 2000-07-07 | 2005-10-25 | Renesas Technology Corp. | Method of manufacturing integrated circuit |
US6794207B2 (en) | 2000-07-07 | 2004-09-21 | Renesas Technology Corp. | Method of manufacturing integrated circuit |
US6902868B2 (en) | 2000-07-07 | 2005-06-07 | Renesas Technology Corp. | Method of manufacturing integrated circuit |
US6893801B2 (en) | 2000-10-13 | 2005-05-17 | Renesas Technology Corp. | Fabrication method of semiconductor integrated circuit device |
US6686108B2 (en) | 2000-10-13 | 2004-02-03 | Renesas Technology Corporation | Fabrication method of semiconductor integrated circuit device |
JP2002196483A (en) * | 2000-12-25 | 2002-07-12 | Hitachi Ltd | Photomask and manufacturing method of electronic device using it |
US6824958B2 (en) | 2000-12-26 | 2004-11-30 | Renesas Technology Corp. | Method of manufacturing photomask and method of manufacturing semiconductor integrated circuit device |
US6706452B2 (en) | 2000-12-27 | 2004-03-16 | Hitachi, Ltd. | Method of manufacturing photomask and method of manufacturing semiconductor integrated circuit device |
US6927002B2 (en) | 2000-12-28 | 2005-08-09 | Renesas Technology Corp. | Photomask, the manufacturing method, a patterning method, and a semiconductor device manufacturing method |
US6656646B2 (en) | 2001-08-31 | 2003-12-02 | Hitachi, Ltd. | Fabrication method of semiconductor integrated circuit device |
US6939649B2 (en) | 2001-10-12 | 2005-09-06 | Renesas Technology Corp. | Fabrication method of semiconductor integrated circuit device and mask |
US6979525B2 (en) * | 2002-03-01 | 2005-12-27 | Renesas Technology Corp. | Method of manufacturing electronic device |
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