[go: up one dir, main page]

JPS56137645A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56137645A
JPS56137645A JP4050480A JP4050480A JPS56137645A JP S56137645 A JPS56137645 A JP S56137645A JP 4050480 A JP4050480 A JP 4050480A JP 4050480 A JP4050480 A JP 4050480A JP S56137645 A JPS56137645 A JP S56137645A
Authority
JP
Japan
Prior art keywords
solder
melting point
base
lead pin
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4050480A
Other languages
Japanese (ja)
Inventor
Michiaki Furukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP4050480A priority Critical patent/JPS56137645A/en
Publication of JPS56137645A publication Critical patent/JPS56137645A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To provide a mounting of high reliability by using a solder with high melting point for a base and a solder with low melting point of high wettability for a lead pin. CONSTITUTION:A base 20 is formed by using a solder with high melting point (e.g. tin: lead=1:9, melting point 301 deg.C) for a base part 19 of W group metallized layer 11 on a ceramic base 10. In the meantime, a solder film 21 is formed by using a solder with low melting point of high wettability with a lead pin 17 (e.g. tin: lead= 16.9:38.1, eutectic solder with a melting point at 183.3 deg.C) on the surface of the lead pin 17 of kovar 42 alloy, etc. Under this constitution, a semiconductor element 12 is fixed on the base part 19 to be covered with a cap and sealed with a resin 23. Because of the high wettability with the lead pin 17, the solder coat on the lead pin won't collapse, even if the heat of the element 12 were transmitted. Besides, the surface won't be oxidized, thus assuring a mounting of high reliability on the substrate. Further, a solder on the base 20 won't be softened at time of mounting.
JP4050480A 1980-03-31 1980-03-31 Semiconductor device Pending JPS56137645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4050480A JPS56137645A (en) 1980-03-31 1980-03-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4050480A JPS56137645A (en) 1980-03-31 1980-03-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56137645A true JPS56137645A (en) 1981-10-27

Family

ID=12582376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4050480A Pending JPS56137645A (en) 1980-03-31 1980-03-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56137645A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958851A (en) * 1982-09-28 1984-04-04 Fujitsu Ltd semiconductor equipment
JPH04184281A (en) * 1990-11-19 1992-07-01 Sankyo Seiki Mfg Co Ltd Magnetic sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958851A (en) * 1982-09-28 1984-04-04 Fujitsu Ltd semiconductor equipment
JPS638620B2 (en) * 1982-09-28 1988-02-23 Fujitsu Ltd
JPH04184281A (en) * 1990-11-19 1992-07-01 Sankyo Seiki Mfg Co Ltd Magnetic sensor

Similar Documents

Publication Publication Date Title
US3716907A (en) Method of fabrication of semiconductor device package
JPS5762539A (en) Mounting method for semiconductor element
JPS57197838A (en) Semiconductor flip chip element
JPS55163850A (en) Semiconductor device
JPS56137645A (en) Semiconductor device
GB2036794A (en) Solder Preform
JPS6473753A (en) Semiconductor integrated circuit device
JPS5745262A (en) Sealing and fitting structure of semiconductor device
JPS6444051A (en) Semiconductor device
JPS554904A (en) Semi-conductor device
JPS5754336A (en) Preparation of semiconductor device
JPS56105656A (en) Semiconductor device
JPS644053A (en) Semiconductor device
JPS6489546A (en) Semiconductor device
JPS556862A (en) Mounting structure of ic for electronic timepiece
JPS57154844A (en) Semiconductor element
JPS54102969A (en) Semiconductor device
JPS57145335A (en) Semiconductor device
JPS56140637A (en) Semiconductor device
JPS6436055A (en) Method of sealing electronic component
JPS5662342A (en) Semiconductor device
JPS5484477A (en) Semiconductor device
JPS5591133A (en) Semiconductor device
JPS6489347A (en) Semiconductor device
JPS54123873A (en) Package construction for semiconductor device