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JPS54152469A - Manufacturing device for semiconductor device - Google Patents

Manufacturing device for semiconductor device

Info

Publication number
JPS54152469A
JPS54152469A JP5998378A JP5998378A JPS54152469A JP S54152469 A JPS54152469 A JP S54152469A JP 5998378 A JP5998378 A JP 5998378A JP 5998378 A JP5998378 A JP 5998378A JP S54152469 A JPS54152469 A JP S54152469A
Authority
JP
Japan
Prior art keywords
bonding
semiconductor element
lead
base body
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5998378A
Other languages
Japanese (ja)
Inventor
Takashi Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5998378A priority Critical patent/JPS54152469A/en
Publication of JPS54152469A publication Critical patent/JPS54152469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent a bonding wire from deforming and breaking due to curvature, by pressure-welding a semiconductor element lead after bonding onto a base body by a support frame together with another semiconductor lead at an adjacent bonding position.
CONSTITUTION: Bonding base body 10 should be large enough to have at least two mounted semiconductor element leads. On this base body 10, semiconductor element leads are arranged at bonding positions where bonding tool 30' is provided and adjacent semiconductor element lead 12 is also mounted which has been bonded and sent to the next position. By lead-frame support frame 20', both semiconductor element leads 12 and 12' are pressure-welded to base body 10'. Consequently, bonded semiconductor element lead 12 will never curve, and bonding wire 7 of lead 12 therefore deforms, so that a break of the wire will never be caused.
COPYRIGHT: (C)1979,JPO&Japio
JP5998378A 1978-05-22 1978-05-22 Manufacturing device for semiconductor device Pending JPS54152469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5998378A JPS54152469A (en) 1978-05-22 1978-05-22 Manufacturing device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5998378A JPS54152469A (en) 1978-05-22 1978-05-22 Manufacturing device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54152469A true JPS54152469A (en) 1979-11-30

Family

ID=13128906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5998378A Pending JPS54152469A (en) 1978-05-22 1978-05-22 Manufacturing device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54152469A (en)

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