JPH10244388A - Laser beam machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device that reduces a part relying on a manual operation and that improves work efficiency. SOLUTION: A machining sheet A with an electric wire is delivered one by one from a package rack 26 on the supply side to a transporting device 35a, transported to a machining stage 6, 7 by a clamping unit 42, placed on the machining state 6, and irradiated with an excimer laser beam from the upper and lower direction of the wire, so that the surface coat of the wire is removed. Then, using a structure in which the sheet A with machining completed is transported to the package rack 26 on the storage side by means of a clamping unit 44 so as to be stored one by one in the package rack 26, the pack the relies on a manual operation is reduced as much as possible, thereby improving the work efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus such as a wire stripping apparatus for removing a surface coating (several microns) having a wire diameter (several tens of microns) by excimer laser light irradiation.

[0002]

2. Description of the Related Art As a laser processing apparatus, there is a wire stripping apparatus for removing the surface coating (thickness of several microns) of an electric wire having a fine wire diameter (diameter) of several tens of microns by irradiating a laser beam.

[0003] In this apparatus, a processing sheet on which a large number of electric wires are attached in a predetermined arrangement is set on a processing stage.
Processing is performed by irradiating an excimer laser beam to a portion of the electric wire from which the surface coating is to be removed.

Specifically, conventionally, as shown in FIG. 14, a wire stripping apparatus is provided with a processing stage b on the upper surface of an XY table a which can freely move in the X-axis direction and the Y-axis direction. An optical lens c for forming an image of an excimer laser beam is provided above the processing stage b, and a concave mirror d for irradiating the excimer laser light passing through the processing stage b to the back side of the processing stage is provided below the optical lens c. I have. In FIG. 14, the optical lens c and the concave mirror d are two in order to process two sheets for processing at the same time.
A pair is provided.

[0005] When the surface coating is removed by this apparatus, the operator is required to carry out the work required for the work from a rack or the like on which a large number of processing sheets f with the electric wires e are placed. After taking out two processing sheets f and placing them on predetermined portions of the processing stage f, excimer laser light is emitted from an excimer laser oscillator g, and the excimer laser light is applied to the beam splitter box h and each optical lens. c, each of the wires e is guided to a portion where the surface coating of the wire e is to be removed. As a result, an excimer laser beam is irradiated from above and below on the electric wire portion whose surface coating is to be removed, and the surface coating of the electric wire portion is instantaneously removed.

[0006]

However, such a process of removing the surface coating of the electric wire e includes an operation of fixing the processing sheet f to the processing stage b, and an operation of removing the processing sheet f from the processing stage b after the processing. Many tasks depend on human labor.

[0007] For this reason, the work efficiency is extremely low, and much time and labor is spent. In addition, since the worker is required to perform fine work on the restricted processing stage b, the workability is poor and a great improvement is demanded.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a laser processing apparatus in which a portion relying on manual work is reduced as much as possible to improve work efficiency. .

[0009]

According to a first aspect of the present invention, there is provided a laser processing apparatus which sequentially transports a processing sheet having a fine-diameter electric wire to a processing stage and moves the sheet to a predetermined position. A first handling device for positioning, and a laser oscillator for irradiating the electric wire positioned on the processing stage with excimer laser light to remove a surface coating of the electric wire,
A second handling device for sequentially transporting the processing sheet after the clothing removal processing to a predetermined position from the processing stage to a predetermined position, without relying on manual work, and for processing the processing sheet required for laser processing; Positioning work,
This is to automatically perform a series of flow operations such as an operation of taking out a processed sheet after processing.

A laser processing apparatus according to a second aspect of the present invention, in addition to the above object, has a first handling apparatus and a second handling apparatus that are integrated into one so that the handling apparatus can be configured as simply as possible. It consists in that.

According to a third aspect of the present invention, in addition to the above objects, the laser processing apparatus is provided with a housing unit for housing the processing sheets in a predetermined arrangement so that the handling system apparatus can be realized with a simple configuration. A sheet supply device for feeding out the processing sheets one by one from the storage section, and a storage section in which the processing sheets are sequentially stored in a predetermined arrangement, and one processing sheet having been subjected to coating removal processing. A sheet storage device for storing the sheet storage device, a rail portion connecting the sheet supply device and the sheet storage device via a processing stage, a platform moving the rail, a driving device for driving the platform, and supported by the platform. A sheet feeding device configured to include the selected sheet gripping device, and a control unit that controls each sheet feeding device, the sheet storage device, and the sheet feeding device. The sheet for processing sent out one by one from is gripped by a sheet gripping device, transported to a processing stage, placed on the same processing stage, and the processed sheet for coating removal is gripped by a sheet gripping device. Is transported to the sheet storage device and stored in the storage unit.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to FIGS.
A description will be given based on an embodiment shown in FIG. FIG. 1 shows a schematic configuration of an entire laser processing apparatus to which the present invention is applied, for example, a wire stripping apparatus. FIG. 2 is a plan view of the apparatus, and FIGS. 3 and 4 are cross-sectional views of respective parts of the apparatus. In the figure, reference numeral 1 denotes a processing stage device.

The processing stage device 1 has a motor driven XY table 2 which can be moved in the X-axis direction and the Y-axis direction, as shown in detail in FIGS. On the upper part of the work table 2, a work table 5 composed of upper and lower processing stage stands 3 and 4 is provided. As shown in FIG. 13, a plurality of, for example, a pair of left and right processing stages 6 and 7 are formed on the upper surface portions on both sides of the work table 5.

By driving the XY table 2,
The processing sheet A is placed on a predetermined position on the stage surface of each of the processing stages 6 and 7. Here, the processing sheet A is formed, for example, on the side surface of the substrate 10 as a plurality of insulating coating wires 1 having a wire diameter (diameter) of several tens of microns as an electric wire.
1 (e.g., a wire in which the entire circumference of a core wire is coated with a polyurethane insulating film having a thickness of several microns) (shown only in FIG. 13).

An optical lens 12 for image formation is disposed above each of the processing stages 6 and 7 for each stage, and a concave mirror 13 for illuminating the back surface of the processing stage, which is paired with the optical lens 12, is disposed below. It is set up.

Each of the processing stages 6 and 7 is provided with a sheet holding mechanism, for example, a rotary sheet holding mechanism 8 for rotating the sheet holding member 8b between a sheet holding position and a holding position by the high rotor 8a. The processing sheet A placed at a predetermined position on each of the processing stages 6 and 7 can be prevented from rising.

On the other hand, reference numeral 15 denotes a laser oscillator, specifically, an excimer laser oscillator for emitting excimer laser light. Excimer laser light emitted from the emission section 15a of the excimer laser oscillator 15 is guided by an optical path 16, divided into two systems by a beam splitter 17, and made incident on each optical lens 12 and concave mirror 13 from above. I have. That is, the two processing sheets A are simultaneously processed on the processing stages 6 and 7, that is, the processing for removing the entire coating of the insulating coating wire 11 is simultaneously performed.

A hood box 18 covers the periphery of the excimer laser oscillator 15 including the emission section 15a and the processing stage device 1. On the other hand, reference numeral 20 denotes a handling device (handling system) for supplying a processing sheet A to be processed to the processing stages 6 and 7 and for taking out and storing the processing sheet A after film removal processing from the processing stages 6 and 7. Device).

From the point X where a predetermined amount of the processing sheets A are stored in advance, the processing sheets A are sequentially sent out one by one to the handling device 20 and transported to the processing stage device 1 to be processed. , 7 and a point where the processing sheet A after the film removal processing is removed from the processing stages 6 and 7 and the processed processing sheets A are sequentially stored one by one. Y
And a second handling device 20b for transporting the wafer to a single system.

That is, the handling device 20 is provided with two pairs of feeds extending substantially parallel to the optical path 16 from above the processing stages 6 and 7, for example, in the left-right direction so as to sandwich the processing stages 6 and 7. It has a side rail 21a and a storage side rail 21b. A point X where the other end of each supply side rail 21a stores the processing sheet A.
₁ and X ₂ , respectively, and the other ends of the storage-side rails 21b are points Y ₁ and Y where the processed processing sheet A is stored.
₂ respectively. Each rail is supported by a rail base 20d.

As shown in FIGS. 5 and 6, a sheet feeder 22 is provided at each of the points X ₁ and X ₂ . Each of these sheet feeding devices 22 includes a sheet receiving table 23 disposed immediately below a rail end and a sheet receiving table 23.
And an elevating set table 24 arranged beside the.

The set table 24 is supported by a guide actuator 24a formed of, for example, a screw shaft extending in the vertical direction so as to be able to move up and down. Guide actuator 24
a is connected to, for example, a stepping motor 24b, and drives the guide actuator 24a with the stepping motor 24b so that the set table 24 is moved up and down with respect to the sheet receiving table 23.

That is, the set table 24 can be moved up and down by the elevating mechanism 25. On the set table 24, for example, a rectangular frame-shaped package rack 26 having a plurality of upper and lower shelves serving as a storage section is mounted so as to be exchangeable (detachable).

That is, inside the package rack 26, a processing sheet A to be processed in a previous process is provided.
A predetermined number of sheets (for example, several tens) are stored on the shelves one by one, and the package rack 26 is supplied, that is, changed to an empty package rack 26, and set on the set table 24. The supply system is in place.

On the opposite side of the sheet receiving table 23 between the set table 24 (package rack 26), the package rack 26
There is provided a pusher mechanism 27 for feeding out the processing sheets A inside one by one.

The pusher mechanism 27 is mounted on a cylinder mounting bracket 29 provided on a frame 28 supporting the sheet receiving table 23 and the setting table 24 and extending in a direction opposite to the sheet receiving table 23. And the pusher 31 is driven to advance the pusher 31 from the standby position to the pushing position, thereby receiving the processing sheet A from the package rack 26. It can be pushed out onto the table 23.

The operation of the lifting mechanism 25 and the pusher mechanism 27, that is, the lifting and lowering of the processing sheet A by the lifting mechanism 25 and the pushing out of the processing sheet A by the pusher mechanism 27 cause the processing sheet A of the package rack 26 to be moved from, for example, the lowest stage. The sheets are sequentially placed on the sheet receiving table 23 one by one.

In order to reduce the size of the wire stripping device, the two sheet feeding devices 22 are installed at positions shifted from each other. In the supply side rail 21a,
A drive source as shown in FIG. 7, for example, a lotless cylinder 35 (corresponding to a drive device), which constitutes the transport device 35a, is provided along the rail 21a.

A connection plate 36 (corresponding to a moving table) reciprocally driven by the cylinder 35 is suspended from the lotless cylinder 35. Below the connection plate 36, a plate-shaped base 38 is suspended via a jig cylinder 37 for elevating so as to be able to ascend and descend. Jig cylinder 37
A plurality of guide shafts 37a for guiding the base plate 38 up and down are provided between the base plate 38 and the base plate 38 so that the base plate 38 can be moved up and down while maintaining a predetermined posture.

On both left and right sides (both sides in the rail direction) of the base plate 38, gripping mechanisms 41 for opening and closing the gripping claws 40 by, for example, reciprocating movement of a pen cylinder 39 are provided.
Then, a gripping unit capable of gripping the processing sheet A and detaching the processing sheet A necessary for delivery of the processing sheet A by the raising and lowering operation of the jig cylinder 37 and the opening and closing operation of the gripping claw portion 40 by the pen cylinder 39. 42.

The grip unit 42 is connected to the supply rail 2.
By being driven by the lotless cylinder 35 forming a rail together with 1a, the sheet is conveyed between the points X ₁ and X ₂ and the processing stages 6 and 7 required for the transfer of the processing sheet A. It is.

The transporting device 43a and the holding unit 4 having the same structure as that shown in FIG.
4 is provided, the processing sheet A that has been processed at the processing stages 6 and 7 is taken out, transported to the points Y ₁ and Y _2, and delivered to the same points Y ₁ and Y _2. I have. In addition, since each part of the transport device 43a and the grip unit 44 is the same as the transport device 35a and the grip unit 42, the same reference numerals are given and the description is omitted.

FIGS. 11 and 12 show the points Y ₁ and Y ₂ , respectively.
Are provided with sheet storage devices 45, respectively. These sheet storage devices 45 are, like the sheet feeding device 22, a sheet receiving table 46 disposed immediately below the rail end, and a set table that is disposed on the side of the sheet receiving table 46 and is moved up and down by an elevating mechanism 47. 48.

In the sheet receiving table 46, the processed sheets A from the processing stages 6, 7 conveyed by the gripping unit 44 are sequentially received (placed). An empty package rack 26 serving as a storage section is attached to the set table 48 so as to be exchangeable (detachable).

A pusher mechanism 49 having the same structure as the pusher mechanism 27 is provided on the opposite side of the set table 48 (package rack 26) across the sheet receiving table 46. Then, in cooperation with the pushing operation of the pusher mechanism 49 and the elevating operation of the elevating mechanism 47, the processed sheet A placed on the sheet receiving table 46 is transferred to each shelf of the empty package rack 26. For example, sheets are stored one by one in order from the bottom.

The elevating mechanism 47 has the same structure as the elevating mechanism 25 of the sheet feeding device 22 described above. Further, each device constituting the handling device 20 and the excimer laser oscillator 15 are connected to a control device 51 (for example, composed of a microcomputer) provided below the disk 50 operated by an operator. The respective parts of the handling device 20 and the excimer laser oscillator 15 are controlled in accordance with a processing program preset in the control device 51. Specifically, the control device 51 causes the gripping unit 42 to grip the processing sheets A fed one by one from the package rack 26 by the sheet supply device 22 via the sheet receiving table 23, and this is processed by the processing stage 6. 7 and the processing stages 6 and 7
A function of positioning a portion of the processing sheet A where the film of the insulating film wire 11 is to be removed at a laser beam irradiation position; The function of irradiating excimer light at a constant shape and speed, the processing sheet A after the film removal processing is gripped by the gripping unit 46, and the processing sheet A is conveyed to the sheet receiving table 46. A function of storing the sheets one by one in each shelf of the rack 26 is set, and a series of flow operations from supply of the processing sheet A to storage of the processed sheet A can be smoothly and automatically performed by remote control. It is like that.

It should be noted that a personal computer 52 for processing control for setting and changing processing steps and a personal computer 53 for oscillator control for controlling the degree of laser beam irradiation of the excimer laser oscillator 15 are provided on the disk 50. Is provided.

Further, a processing monitor 54 for confirming the processing condition by the excimer laser beam is provided on the hood box 18.
Is provided so that the state of each part can be grasped through the processing monitor 54.

The operation of the wire stripping apparatus thus constructed will now be described.
As shown by the solid line in FIG. 3, a package rack 26 in which a processing sheet A to be processed is stored is set in each of the supply-side set tables 24, and a storage-side set table 48 is stored in each of the storage-side set tables 48. Empty package rack 26
Is set.

From this state, the wire stripping device is turned on. Then, according to a command from the control device 51,
For example, the lifting mechanisms 25 on the supply side move up and down to position the processing sheet A on the lowermost shelf of the package rack 26 at a position facing the pusher 31, for example.

Then, the pusher mechanism 27 is pushed, and the pusher 31 pushes out the processing sheet A on the lowermost shelf. As a result, the lowermost processing sheet A is placed on the sheet receiving table 2 in front of the package rack 26.
It is put on 3.

At this time, immediately above each sheet receiving table 23,
When the gripping unit 42 is on standby and, for example, the extrusion of the processing sheet A is completed, the jig cylinder 37 moves downward to lower the gripping claw portion 40 to a position facing the left and right ends of the processing sheet A.

Next, each pen cylinder 39 moves in the closing direction, and the processing sheet A on the sheet receiving table 23 is
At 0, grip from both sides. When the gripping is completed, the jig cylinder 37 moves upward, and the gripping unit 42 returns to the upper standby position.

Subsequently, the lotless cylinder 35 operates,
The grip unit 42 is transported from the sheet receiving table 23 to the processing stages 6 and 7. Thereby, the processing sheet A is
In two systems, it is conveyed to each processing stage 6,7.

When each gripping unit 42 reaches a position immediately above each of the processing stages 6 and 7, the jig cylinder 37 moves down and guides the processing sheet A onto each of the processing stages. Subsequently, each pen cylinder 39 operates in the opening direction, and the grip claw 4
Release the processing sheet A from 0. After separation, the grip unit 42 returns to the point X.

At this time, each of the processing stages 6 and 7 is
Since they are positioned at a predetermined position on the Y table 2, the processing sheet A is placed on the stage surface in a posture suitable for the laser processing position.

Next, the high rotor 8a of each of the processing stages 6 and 7 is operated, and the sheet pressing member 8b at the standby position is rotated in the direction of pressing the processing sheet A. Thus, each processing sheet A is positioned on each of the processing stages 6 and 7 so as not to float.

Next, excimer laser light is emitted from the output section 15a of the excimer laser oscillator 15. The excimer laser light is split into two beams by a beam splitter 17 and the optical lens 1 above the processing stages 6 and 7 respectively.
2 and 12 and irradiate the portion of the insulating film wire 11 of the processing sheet A to be removed from above with a predetermined shape and speed. Excimer laser light that has passed downward from the processing stages 6 and 7 is reflected by the concave mirror 13,
Irradiation is performed from below on the portion of the insulating film wire 11 to be removed.

As a result, an excimer laser beam is irradiated from above and below the insulating film wire 11, and the insulating film (several microns) in the same portion is removed all around. Here, the XY table 2 operates according to a command from the control device 51,
When excimer laser light is applied to a portion of the other insulating film wire 11 to be removed, the entire circumference of many wires is removed on the two processing stages 6 and 7.

When the irradiation of the excimer laser beam is stopped and the processing is completed, the sheet pressing member 8b returns to the standby position according to a command from the control device 51, and the restraint on the processing sheet A is released. Then, the holding unit 44 on the storage side waiting above the processing stages 6 and 7 descends, and the gripping claw portions 40 face the left and right ends of the processed processing sheet A.

Subsequently, each pen cylinder 39 operates in the closing direction to grip the processing sheet A on each of the processing stages 6 and 7 from both sides. Next, the gripping unit 44 returns to the upper standby position by the raising operation of the jig cylinder 37.

Subsequently, the lotless cylinder 35 operates to transfer the gripping unit 44 from the processing stages 6 and 7 to the sheet receiving table 46 on the storage side. Each gripping unit 44
However, when the jig cylinder 37 moves down just above each sheet receiving table 46, the jig cylinder 37 moves down and guides the processed processing sheet A onto each sheet receiving table 46.

Subsequently, each pen cylinder 39 is operated in the opening direction to release the processing sheet A from the gripping claw portion 40.
After the detachment, the grip unit 44 returns to the processing stage side. Then, the processed sheet A for processing is placed on each sheet receiving base 23.

Subsequently, the pusher mechanism 49 is pushed,
The processing sheet A on the sheet receiving table 46 by the pusher 31
Is pushed out toward the package rack 26 on the storage side.
At this time, assuming that, for example, the lowermost shelf is positioned at a position corresponding to the pusher 31 by the elevating operation of the elevating mechanism 47, the sent-out processing sheet A is moved to the lowermost stage. Are stored on the shelves.

A series of processes from the package rack 26 on the supply side to the package rack 26 on the storage side are sequentially and continuously performed, and all the processing sheets A on the shelf of the package rack 26 on the supply side are processed. Are laser-processed and then stored in the shelf of the package rack 26 on the storage side.

When the package rack 26 on the supply side becomes empty and the package rack 26 on the storage side is filled with the processing sheet A, the film removing operation for each package rack 26 is completed.

At this time, the operator replaces the package rack 26 on the supply side with the package rack 26 in which the processing sheet A is stored, and replaces the package rack 26 on the storage side.
Can be replaced with an empty package rack 26, and the wire stripping device can be operated again.

Thus, by the mechanical flow operation by the handling device 20, the film removal processing, that is, the surface coating (several microns) of the electric wire having a wire diameter of several tens of microns is reduced while reducing the part relying on the manual operation as much as possible. Processing to remove by excimer laser beam irradiation at the shape and speed can be performed, and the parts that rely on manual work can be reduced as much as possible.

Therefore, the working efficiency of the laser processing apparatus can be improved, and time and labor can be reduced. Moreover, since the work of the worker is simplified, the workability is improved and the work environment is improved.

In particular, since the first handling device 20a on the supply side and the second handling device 20b on the storage side with respect to the processing stages 6 and 7 are integrated into one handling system, the structure of the handling device 20 is simplified. Moreover, the handling device 20 has a rail structure, a rack structure on the supply side, a rack structure on the storage side, and a grip structure.
The adoption of a configuration in which control systems are combined reduces the size and installation area. In one embodiment, the present invention is applied to a wire stripping apparatus. However, the present invention may be applied to an apparatus for removing the surface coating (several microns) of a fine-diameter electric wire.

[0061]

As described above, according to the present invention, a series of flow operations from feeding a processing sheet to feeding it to a predetermined position through laser processing is automated. Therefore,
The process of removing the insulation coating of the electric wire can be performed while reducing the part relying on manual work and improving the working efficiency.

Therefore, the time and labor required for removing the insulating coating of the electric wire can be reduced. Moreover, since the work of the worker is simplified, the workability is improved, and
There is an advantage that the working environment is improved.

Further, according to the present invention, since the first handling device on the supply side and the second handling device on the storage side constitute one handling system, there is an advantage that the structure of the handling device is simplified.

In addition, according to the present invention, the handling system has a simple structure in which a control system is combined with a rail structure, a storage structure on the supply side, a storage structure on the storage side, and a gripping structure. The area is small.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an entire laser processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the laser processing apparatus.

FIG. 3 is a sectional view taken along the line DD in FIG. 2;

FIG. 4 is a sectional view taken along the line EE in FIG. 2;

FIG. 5 is a front view showing a sheet feeding device constituting the handling device.

FIG. 6 is a side view of the sheet feeding apparatus viewed from the arrow K in FIG. 5;

FIG. 7 is a side view for explaining a sheet conveying device that constitutes the handling device.

FIG. 8 is a plan view around a processing stage constituting the handling device.

FIG. 9 is a front view around the processing stage viewed from the arrow F in FIG. 8;

FIG. 10 is a side view around the processing stage as viewed from an arrow L in FIG. 8;

FIG. 11 is a front view showing a sheet storage device constituting the handling device.

FIG. 12 is a side view of the sheet storage device as viewed from an arrow N in FIG. 11;

FIG. 13 is a diagram schematically showing the operation of the handling device.

FIG. 14 is a perspective view showing a conventional laser device for removing a surface film of an electric wire.

[Description of Signs] 1 ... Processing stage device 2 ... XY table 6,7 ... Processing table 8 ... Sheet holding mechanism 10 ... Substrate) 11 ... Insulating film wire (electric wire) 15 ... Excimer laser oscillator 20 ... Handling device 20a ... First handling device 20b Second handling device 21a, 21b Supply rail, storage rail 22 Sheet feeding device 25 Elevating mechanism 26 Package rack (storage, storage) 27 Pusher mechanism 35 Lotless cylinder (Drive device) 35a Transport device (sheet transport device) 36 Connection plate (base) 37 Jig cylinder 38 Base plate 39 Pen cylinder 40 Gripping claw 42 Gripping unit (sheet gripping device) 45 Sheet storage device 47: elevating mechanism 49: pusher mechanism 51: control device (control unit).

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kimihiro Shimoyama 1-1-1 Wadazakicho, Hyogo-ku, Kobe-shi, Hyogo Mitsubishi Heavy Industries, Ltd. 1-1-1 Tazakicho Mitsubishi Heavy Industries, Ltd., Kobe Shipyard

Claims (3)

[Claims] 1. A first handling device for sequentially transporting a processing sheet provided with a fine-diameter electric wire to a processing stage and positioning the processing sheet at a predetermined position, and irradiating the electric wire positioned on the processing stage with excimer laser light. A laser that removes the surface coating of the electric wire, and a second handling device that sequentially transports the processed sheet after the clothing removal processing from the processing stage to a predetermined position. Processing equipment. 2. The laser processing apparatus according to claim 1, wherein the first handling device and the second handling device are configured as a single handling system device. 3. The handling system device has a storage section in which the processing sheets are stored in a predetermined arrangement, and a sheet supply device that feeds the processing sheets one by one from the storage section; Has a storage portion sequentially stored in a predetermined arrangement, a sheet storage device that stores one by one the processing sheets after the coating removal processing, and the processing between the sheet supply device and the sheet storage device A rail portion passing through a stage, a platform moving along the rail, a driving device for driving the platform, a sheet conveying device configured to include a sheet gripping device supported by the platform, and A control unit that controls the sheet supply device, the sheet storage device, and the sheet conveyance device, wherein the control unit is configured to hold a processing sheet sent one by one from the sheet supply device into a sheet gripping device. And transport it to the processing stage, place it on the same processing stage, hold the processing sheet after coating removal processing with the sheet gripping device, transport it to the sheet storage device, and store it in the storage section. The laser processing apparatus according to claim 2, wherein the laser processing is performed.