JPH06238643A - Flat package and its manufacture - Google Patents

Abstract

PURPOSE:To make smaller projections and cutouts of a flat package and reduce the defective appearance of the package. CONSTITUTION:A number of package parts 28 are formed vertically and horizontally on the face of a ceramic sheet 30, and small holes 29 are perforated continuously on boundaries of respective package parts 28 and burnt at high temperature, and then the sheet is broken along the small holes 29 to separate respective package parts 28. Projections and cutouts formed on the broken faces can be made smaller by setting the sizes and arranging pitches of small holes 29 within the given range of the sheet thickness, and the outer appearance dimension accuracy of the package can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat package using a ceramic material or a mixed material of a ceramic material and a glass material and a method for manufacturing the flat package.

[0002]

2. Description of the Related Art A ceramic material or a mixed material of a ceramic material and a glass material has excellent heat resistance and airtightness, and a thick film sheet member is formed from these powders by a doctor blade method or an extrusion molding method. However, by performing a series of processes such as printed wiring, press molding, and heat treatment on this sheet member, a large number of package parts can be produced at one time, which is suitable for mass production. It is used as a container for small electronic devices such as filters that require heat resistance and airtightness.

7 and 8 show this type of crystal oscillator and SAW.
1 is a storage container for an element 1 such as a filter, showing an example of the structure of a flat package using a ceramic material. That is, the flat package 2 of FIG. 7 has a rectangular flat plate-shaped cap member 3 and the same outer shape as the cap member 3.
It is composed of a flat base member 5 having a two-stage recess 4 formed therein. Then, the element 1 is attached to the base member 5
After being fixed to the step portion 6 in the concave portion 4, the cap member 3 is sealed and closed at the open end thereof. The element 1 is connected to an electrode terminal 8 printed on the lower surface of the base member 5 through a conductive paste in a through hole 7 penetrating below the step portion 6. The electrodes are led out.

The flat package 9 shown in FIG. 8 has a rectangular flat cap member 11 having a recess 10 formed therein.
And a base member 13 having the same outer shape as that of the cap member 11 and having a rectangular flat shape and having a recess 12 formed therein. Then, after the element 1 is fixed to the holding plate 14 planted on the bottom surface of the base member 13, the cap member 11 is sealed and closed at the opening end thereof. The element 1 is connected to an electrode terminal 8 printed on the lower surface of the base member 13 through a conductive paste in a through hole 7 penetrating below the holding plate 14. Is
The electrodes are led out.

The flat packages 2 and 9 having such a structure are box-shaped with a flat outer shape, can be easily chucked by an automatic machine, and the electrode terminals 8 on the lower surface can be placed and fixed on the printed wiring board as they are. It is suitable for automatic assembly of electronic devices. Further, the cap members 3 and 11 and the base members 5 and 13 constituting the flat packages 2 and 9 are flat members, and the following ceramic sheet members are used for their manufacture. To be

That is, FIG. 9 shows a film forming apparatus 1 for manufacturing the above-mentioned ceramic sheet member by a doctor blade method.
5, the ceramic powder, the binder, and the solvent are mixed in a predetermined amount, and the slurry 16 adjusted into a slurry is poured into the slurry container 17 having the blade-shaped opening 17a at the lower end. . A pair of supply drum 18 and take-up drum 19 are arranged below the sludge container 17, and a long carrier tape 20 is sequentially delivered to the lower surface of the blade-shaped opening 17a. And it is configured to be wound up. Further, a drying furnace 21 is arranged downstream of the carrier tape 20 at a predetermined distance from the sludge container 17.

In the above structure, the carrier tape 20
Are sequentially sent in the direction of the arrow, the slurry 1 in the slurry container 17
6 is supplied from the blade-shaped opening 17a, and is coated on the carrier tape 20 in a cut-off shape, and a ceramic green sheet 22A having a constant thickness is formed on the tape 20. This ceramic raw sheet 22A is passed through the drying oven 21 and the solvent is dried in a semi-dry state.
22A is obtained. Then, the flexible ceramic green sheet 22A is laminated and hot pressed as appropriate to form a ceramic sheet, which is then manufactured into each ceramic package element as follows.

For example, the case of manufacturing the cap member 3 of the flat package 2 shown in FIG. 7 will be described with reference to FIG.
As shown in FIG. 0, first, the doctor blade is used as a base material.
A wide ceramic green sheet 22A manufactured by the method of Do. is appropriately laminated, fitted in a mold, and molded by a hot press heated to about 100 ° C. to prepare a ceramic sheet 22. And
In the next half cut process, the ceramic sheet 22
The surface is cut with a diamond blade to form vertical and horizontal grooves 23 according to the outer dimensions of the cap member 3.
Then, on the surface of the ceramic sheet 22, a large number of rectangular flat plate-shaped cap members 3 partitioned by the grooves 23 are formed in a grid pattern in vertical and horizontal patterns. Next, a ceramic sheet 2 having a large number of cap members 3 formed in a vertical and horizontal pattern.
Although not shown in FIG.
Each cap member 3 has a thickness of 0.
A degreased and fired ceramic sheet 24 having a predetermined size of about 2 to 1.0 mm is obtained. After that, in the break process,
When the fired ceramic sheet 24 is bent along the vertical and horizontal grooves 23 and broken, a large number of cap members 3 are obtained.

Further, package parts having recesses for accommodating elements such as the base member 5 of the flat package 2, the cap member 11 of the flat package 9 and the base member 13 are manufactured. Also in the case of performing, it is manufactured basically in the same manner as the cap member 3. That is, these package parts have a two-step recess 4 and a one-step recess 1 inside.
Although 0 and 12 are provided, this is greatly different from the case of the cap member 3 described above. This is, for example, when laminating and hot pressing, the same member as the cap member 3 is hollowed out to form a frame-shaped member. The cap member 3 may be formed, and the cap member 3 and the cap member 3 may be appropriately stacked and integrated. Therefore, FIG.
In the same manner as in the production of the cap member 3 of No. 0, half cut, high temperature firing, and break treatment are performed to produce individual package parts.

[0010]

By the way, the ceramic sheet having the package parts formed on a large number of surfaces as described above has a cut surface when it is broken into individual parts after high temperature firing. However, it often protruded from the cut of the half cut and caused a flash or a chip. As a result, the product dimensions of the flat package, especially the external dimensions, are defective,
At the time of mounting on electronic equipment, it was a cause of failure of assembly equipment due to chuck error and cracking of flash. The inventors of the present invention have made extensive studies on the cause of the flash and the chipping, and have found that this is due to the depth of the cut groove formed on the ceramic sheet surface in the half cut process.

That is, FIG. 11 is a partially enlarged view of the ceramic sheet 22 after the cut groove 23 is formed in the half cut step. The groove 23 in the figure is a diamond point or the like, and the ceramic sheet 22 is formed. The surface is cut into an acute angle with a depth of about 1/2 to 1/4 of the sheet thickness. For this reason, a portion of about 1/2 or less of the sheet thickness below the cut groove 23 is not cut, and is connected as a hard ceramic after firing. When the ceramic sheet 24 is bent and broken along the cut groove 23 in the breaking step after firing, the fired ceramic sheet 24 projects on one side of the fracture surface 25 as shown in an enlarged view in FIG. Then, the flash 26 is generated. At the same time, on the other side, a chip 27 corresponding to the projecting burr 26 occurs.

It is desirable that the depth of the cut groove 23 in the half-cutting step be made as deep as possible with respect to the sheet thickness without eliminating the flash 26 and the chip 27. However, if the groove depth is set to about ½ or more of the sheet thickness as described above, problems such as separation in the half cut process and cracking during the subsequent process steps occur, and the solution thereof is solved. A measure was requested.

Therefore, the present invention has been made in view of the above, and the packaged parts can be broken without cracking the fired ceramic sheet during the processing step, and the fracture surface of the packaged parts can be obtained. It is an object of the present invention to provide a flat package and a method for manufacturing the flat package that are less likely to cause flash or chipping.

[0014]

Therefore, according to the present invention, the powder of ceramic powder or a mixture of ceramic powder and glass powder prepared in the form of a slurry is prepared by a doctor blade method or an extrusion molding method. A sheet is prepared, and the surface of the sheet obtained by appropriately laminating and hot pressing the raw sheet is divided into squares, and a large number of round or long sections are formed along the boundary line. The small holes are continuously pierced at a predetermined pitch in a perforated shape in the thickness direction, baked at a high temperature, and then fractured and separated along the small holes to produce a large number of package parts. It is characterized by that. Further, instead of the small hole, a small groove is formed halfway in the thickness direction from one side of the sheet. Further, the small groove is characterized in that the hand is formed from the upper and lower surfaces of the sheet halfway in the thickness direction. Further, it is characterized in that the small groove is formed leaving a thickness smaller than ¼ of the sheet thickness. Also, the hole diameter is smaller than the sheet thickness, and the pitch interval is
It is characterized in that a small hole having a round cross section, which is smaller than ½ of the plate thickness, is formed. Further, the flat package of the present invention has a large number of packages on a sheet surface obtained by appropriately laminating and hot pressing a thick film raw sheet formed of ceramic powder or a mixture of ceramic powder and glass powder. The package parts are formed vertically and horizontally, and after high temperature firing, they are composed of package parts that are fractured and separated between the parts, and the separation wall surface of the package parts is continuously bored between the package parts. It is characterized in that it is formed by an uneven wall surface obtained by breaking the wall surface of the small hole or the wall surface of the small groove.

[0015]

Since a large number of small holes or small grooves are continuously formed between the package parts of the ceramic sheet, the processing steps can be performed like the blade-shaped cut grooves in the conventional half cut step. Inconvenience such as breaking on the way is eliminated. Further, the separation wall surface of the package part has a small vertical stripe-shaped fracture surface formed between each small hole or small groove, so that a flash or a chip can be made extremely small. Therefore, the outer dimensions of the package component can be manufactured accurately. Further, the separation wall surface of the package part is formed in an uneven shape by breaking the small hole walls or the small groove walls, and is not a flat blade-like surface as in the conventional case, so that the mountability of the chuck of the automatic machine is improved. .

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. Here, the steps until the ceramic sheet is produced and the ceramic sheet is appropriately laminated and hot pressed to obtain the ceramic sheet are as described in the conventional example, and the description thereof is omitted. FIG. 1 is a first embodiment of the present invention, which is a ceramic sheet in which a large number of package parts 28 are vertically and horizontally formed on a surface and continuous small holes 29 are formed between the package parts 28. 30 is shown. The package parts 28 are cap members 3 and 11 or base members 5 and 13 which are the components of the flat packages 2 and 9 described above, respectively, which are not shown in the drawings but are predetermined by electrode printing or press punching. The pattern is formed vertically and horizontally.

FIG. 2 shows the small holes 2 of the ceramic sheet 30.
FIG. 9 is an enlarged view of a 9-drilled portion. This small hole 29 is formed by an extremely thin round hole whose diameter φ is set to φ <t with respect to the plate thickness t of the sheet 30, and the pitch p thereof is set to the sheet 30.
Set p <1 / 2t for the plate thickness t of
The component parts 28, 28 are perforated in a substantially continuous state on the boundary line.

FIG. 3 is an enlarged view of a package component 28 obtained by breaking and separating the ceramic sheet 30 at a high temperature and then breaking it along the boundary line. A large number of fracture surfaces 32 bridging 31 are formed in vertical stripes.

The vertical stripe-shaped fracture surface 32 is such that the hole diameter φ of the small holes 29 is φ <t with respect to the sheet thickness t of the sheet and the pitch p.
Is set to p <1 / 2t with respect to the sheet thickness t of the sheet, the area of each fracture surface 32 is extremely small.
The protruding burr 26 and the chip 27 formed on each fracture surface 32 can be suppressed to be extremely small.

What is particularly noteworthy here is that the separation wall surface of the package component 28 is formed on the uneven surface of the arc wall surface 31 of the small hole 29 and the fracture surface 32. In this uneven surface, the hole diameter φ is set to be smaller than φ <t with respect to the sheet thickness t of the sheet, and the depression of the arc wall surface 31 is at most 1 of the sheet thickness t.
/ 2, and the convex surface of the fracture surface 32 is also as small as the above, so even if it is a microscopically uneven surface, it becomes a substantially linear shape, and external dimension accuracy is obtained, and the appearance is also a particular problem. It does not happen. Further, since such a fine uneven surface is not flat like a conventional package, it is rather easy to chuck a component in an automatic machine and the automatic mounting property is improved.

FIG. 4 is a second embodiment of the present invention, and is an enlarged view of a package component 34 in which the small hole 29 of the above embodiment is formed by a long hole 33, and corresponds to FIG. 3 of the above embodiment. It was done. The small hole 29 is bored with the long diameter y side facing in the continuous direction, and the width x of the short diameter is x <t with respect to the sheet thickness t of the sheet.
And the pitch p is set to p <t / 2 with respect to the sheet thickness t of the sheet, and the sheet is bored through the sheet in a continuous state.

Since the area of each fracture surface 35 of the package component 34 having such a structure is set to be small like the package component 28, the projecting burr 26 and the chip 27 can be held extremely small. In this case, the package
The separation wall surface of the di-component 34 is formed in an uneven shape as in the above-described embodiment, but can be formed more linearly than the arc-shaped wall surface.

FIG. 5 shows a third embodiment of the present invention. In the first embodiment, the small hole 29 formed between the package parts is formed as a small groove 29a so as not to penetrate the sheet. It was set up. This package component 36 is also the first
In the same manner as in the embodiment described above, the hole diameter φ and the pitch p of the small groove 29a are set to φ <t, p <t / 2 with respect to the sheet thickness t of the sheet, but the depth d is set to the sheet thickness. The sheet is set so as not to penetrate the sheet at 3 / 4t or more with respect to t. A vertical stripe-shaped fracture surface 37a between the small grooves 29a and a fracture surface 37b along the surface direction below the small groove 29a are formed on the separation wall surface of the package component 36.

In the package component 36 having such a construction, the upper striped fracture surface 37a has small burrs 26 and chips 27, and the lower fracture surface 37b has a thickness of 1 / th of the plate thickness t. Since the thickness is set as thin as about 4 or less, the flash 26 and the chip 27 can be suppressed sufficiently small. In this case, even if the small groove 29a is formed by the long hole 33 of the second embodiment and the small hole 29a is formed so as not to penetrate by 3/4 or more of the sheet thickness t of the sheet, the same effect is obtained. .

FIG. 6 shows a fourth embodiment of the present invention. In the above embodiment, the small groove 29a is formed from the upper and lower surfaces of the seat, and the non-penetrating portion is formed in the middle of the seat. It is a thing. The package component 38 having such a structure has the same effects as those of the embodiment shown in FIG. 5, and the fracture surface 39 along the plane direction of the sheet can be set at the central portion of the sheet thickness.
At the time of breakage, damage to the front surface side of the package component 38 is unlikely to occur, and flash or chip can be suppressed to a small extent.

[0026]

As described in detail above, according to the present invention, small holes or small grooves are continuously formed in the boundary line between the package parts formed on the ceramic sheet, and each package is formed along the boundary line. -Since the parts are configured to be broken, it is possible to suppress the occurrence of burrs and chips on the fracture surface as small as possible, and it is possible to provide a flat package with good external dimension accuracy. Therefore,
It is also possible to reduce chucking mistakes when mounting on electronic devices and breakdowns of assembling devices due to cracking of burrs. Although the present invention uses the ceramic powder as the base material, the same raw sheet can be obtained by using the mixture of the ceramic powder and the glass powder, and the sheet obtained by appropriately laminating and hot pressing these sheets is used. The same effect can be obtained when applied to

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention in which a package component is formed on a surface.

FIG. 2 is an enlarged perspective view of a main part of FIG.

3 is a partially cutaway perspective view of the package component of FIG.

FIG. 4 is a partially cutaway perspective view of a package component according to the second embodiment of the present invention.

FIG. 5 is a partially cutaway perspective view of a package component according to the third embodiment of the present invention.

FIG. 6 is a partially cutaway perspective view of a package component according to the fourth embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a structural example of a flat package.

FIG. 8 is a sectional view showing an example of the structure of a flat package.

FIG. 9 is a side view of a film forming apparatus for a ceramic raw sheet.

FIG. 10 is a manufacturing process diagram of the package component.

11 is a perspective view of the ceramic sheet after the half cut process of FIG.

12 is a perspective view of the package component after the breaking process of FIG.

[Explanation of symbols]

 28, 34, 36, 38 Package parts 29 Small hole 29a Small groove 30 Ceramic sheet 33 Long hole 32, 35, 37a, 37b, 39 Broken cross section

Claims (5)

[Claims] 1. A raw sheet of ceramic powder or a mixture of ceramic powder and glass powder prepared from a slurry prepared by a doctor blade method or an extrusion molding method.
Sheet is prepared and the raw sheet is appropriately laminated and hot-pressed to divide the sheet surface into squares, and a number of small holes with a round or elongated cross section are formed along the boundary line. Perforated continuously at a predetermined pitch in a perforated manner in the thickness direction, baked at a high temperature, and then fracture-separated along the small holes to produce a large number of package parts. And a method of manufacturing a flat package. 2. A raw sheet of the powder is prepared by a doctor blade method or an extrusion molding method from slurry prepared by preparing a slurry of ceramic powder or a mixture of ceramic powder and glass powder. -The sheet surface obtained by appropriately laminating and hot pressing the sheets is divided into squares, and a number of small grooves with a round or elongated cross section are formed along the boundary line of the sheet. A method for producing a flat package, characterized in that a plurality of package parts are produced by piercing the upper and lower surfaces partway in the thickness direction, firing at high temperature, and then breaking and separating along the small grooves. . 3. The method of manufacturing a flat package according to claim 2, wherein the small groove is formed while leaving a thickness smaller than ¼ of the sheet thickness. 4. The hole diameter is smaller than the sheet thickness, and
3. Small holes or grooves having a circular cross section with a pitch interval smaller than ½ of the sheet thickness are formed.
A method for producing the flat package described. 5. A large number of package parts are vertically and horizontally arranged on a sheet surface obtained by appropriately laminating and hot pressing a thick film green sheet formed of ceramic powder or a mixture of ceramic powder and glass powder. After being formed and fired at a high temperature, the package is composed of package parts that are fractured and separated between the parts.
A flat package characterized in that the separation wall surface of each of the package parts is formed by a wall surface of a small hole or a wall surface of a groove formed by breaking a groove wall formed continuously between the package parts.