JPH06188161A - Coating jig for chip component and coating method using same - Google Patents
Coating jig for chip component and coating method using sameInfo
- Publication number
- JPH06188161A JPH06188161A JP4355676A JP35567692A JPH06188161A JP H06188161 A JPH06188161 A JP H06188161A JP 4355676 A JP4355676 A JP 4355676A JP 35567692 A JP35567692 A JP 35567692A JP H06188161 A JPH06188161 A JP H06188161A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- paint
- chip
- holes
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000576 coating method Methods 0.000 title claims description 47
- 239000011248 coating agent Substances 0.000 title claims description 40
- 239000003973 paint Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000011800 void material Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 12
- 238000007747 plating Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、チップ状の部品の表
面、特にその中央部と両端部とに各々塗料を塗布するの
に好適なコーティング治具と、それを用いてチップ部品
の中央部に塗料を塗布するコーティング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating jig suitable for applying paint to the surface of a chip-shaped component, particularly to the central portion and both end portions thereof, and the central portion of the chip component using the coating jig. The present invention relates to a coating method for applying a paint to a substrate.
【０００２】[0002]
【従来の技術】チップ形コンデンサやチップ形抵抗器等
のチップ形電子部品は、円柱形、円筒形或は角柱形の素
体の両端に端子電極を形成する。この端子電極は、セラ
ミック等からなる素体の両端部に導電ペーストを塗布
し、乾燥した後、これを焼付け、さらにメッキ等を施す
ことにより形成される。また例えば、チップ部品の両端
にメッキを施す場合、素体のメッキ液による浸食や延び
等を防止するため、素体の露出している中央部分に予め
ガラスコートまたは樹脂コートを施した後、メッキする
ことが行われている。2. Description of the Related Art In a chip type electronic component such as a chip type capacitor or a chip type resistor, terminal electrodes are formed at both ends of a cylindrical, cylindrical or prismatic element body. This terminal electrode is formed by applying a conductive paste to both ends of a body made of ceramic or the like, drying it, baking it, and then plating it. In addition, for example, when plating both ends of a chip component, in order to prevent erosion or extension of the element body by the plating solution, after plating the exposed central part of the element body with glass or resin in advance, plating Is being done.
【０００３】図４に、チップ部品８の両端部９、９に導
電ペースト等の塗料を塗布するための治具を示す。同図
に示す様に、この治具１は、複数の貫通孔５、５…を有
するシリコンゴム等の弾性体３、３を、アルミ製等の枠
体２に取り付けたものである。図４に示すように、チッ
プ部品８は、前記弾性体３の複数の貫通孔５、５…に嵌
合され、さらに導電ペーストを塗布しようとする一方の
端部９を所定の突出高さに揃える。そして、これら挿入
固定されたチップ部品８の端部９を、ペースト槽１２の
導電ペースト１３に浸漬することで、同端部９に導電ペ
ーストを塗布する。その後、塗布された導電ペースト１
３を乾燥する。さらに、チップ部品８の他方の端部にも
導電ペーストを塗布する場合は、チップ部品８を前記貫
通孔５の反対側に押し出し、チップ部品８の他端部９を
突出させる。その後、同様にしてこの他端部９に導電ペ
ースト１３を塗布し、乾燥させる。そして、これら塗布
された導電ペーストを焼き付けることにより、外部電極
が形成される。FIG. 4 shows a jig for applying a paint such as a conductive paste to both ends 9 of the chip component 8. As shown in the figure, this jig 1 is one in which elastic bodies 3, 3 such as silicon rubber having a plurality of through holes 5, 5, ... Are attached to a frame body 2 made of aluminum or the like. As shown in FIG. 4, the chip component 8 is fitted in the plurality of through holes 5, 5, ... Of the elastic body 3, and one end portion 9 to which the conductive paste is applied is set to a predetermined protruding height. Align. Then, the end portion 9 of the inserted and fixed chip component 8 is dipped in the conductive paste 13 of the paste tank 12 to apply the conductive paste to the end portion 9. After that, the applied conductive paste 1
Dry 3. Further, when the conductive paste is applied to the other end of the chip component 8, the chip component 8 is pushed out to the opposite side of the through hole 5 and the other end 9 of the chip component 8 is projected. Then, in the same manner, the conductive paste 13 is applied to the other end portion 9 and dried. Then, an external electrode is formed by baking the applied conductive paste.
【０００４】一方、チップ部品８の中央部１０について
は、このような治具では塗料を塗布することができない
ので、一般にはローラによる転写が行われる。すなわ
ち、ガイドの間にチップ部品を保持した状態で、塗料が
塗布された転写ローラの周面を、チップ部品８の中央部
１０に当てて、チップ部品８の中央部１０に塗料を塗布
する。On the other hand, since the paint cannot be applied to the central portion 10 of the chip component 8 by such a jig, transfer by a roller is generally performed. That is, with the chip component held between the guides, the peripheral surface of the transfer roller coated with the coating is applied to the central portion 10 of the chip component 8 and the coating is applied to the central portion 10 of the chip component 8.
【０００５】[0005]
【発明が解決しようとしている課題】しかしながら、前
記の従来技術によるチップ部品コーティング治具では、
チップ部品８の両端に塗料を塗布することができても、
チップ部品８の中央部には塗料を塗布することができな
い。そのため、チップ部品の両端と中央部とに塗料を塗
布するには、前記治具を用いた塗料の塗布と、ローラを
用いた塗料の塗布とを各々別々に行わなければならず、
手数がかかるという課題があった。さらに、チップ部品
の中央部に塗料を塗布するためのローラによる転写は、
単位時間当りの処理個数に限度があり、生産性が低いと
いう課題があった。However, in the above-mentioned conventional chip component coating jig,
Even if paint can be applied to both ends of the chip component 8,
Paint cannot be applied to the central portion of the chip component 8. Therefore, in order to apply the paint to both ends and the central portion of the chip component, the application of the paint using the jig and the application of the paint using the roller must be performed separately.
There was a problem that it took time. Furthermore, the transfer by the roller for applying the paint to the central part of the chip component,
There is a problem that productivity is low because there is a limit to the number of units that can be processed per unit time.
【０００６】そこで本発明は、前記従来技術の課題に鑑
み、チップ部品の両端と中央部とに塗料を塗布できるチ
ップ部品コーティング治具と、この治具を用いて同時に
多数のチップ部品の中央部に塗料を塗布することができ
るチップ部品コーティング方法を提供することを目的と
する。In view of the above-mentioned problems of the prior art, the present invention provides a chip part coating jig capable of applying a coating material to both ends and the central part of the chip part, and a central part of many chip parts simultaneously using this jig. It is an object of the present invention to provide a chip component coating method capable of applying a paint to a chip.
【０００７】[0007]
【課題を解決するための手段】すなわち、本発明では、
前記の目的を達成するため、両面に開口する複数の貫通
孔２４、２５を有する枠体２２と、チップ部品８の端部
寸法より径が細い貫通孔２４、２５を残して前記枠体２
２を覆うように設けられた弾性体２３とを有するチップ
部品コーティング治具において、枠体２２がその全面に
わたって両面の中間部に空隙２６を有し、前記弾性体２
３がチップ部品８の長さより狭い幅の空隙２６を残し
て、その両側に分離して設けられ、この空隙２６の両側
に前記弾性体２３で囲まれた前記貫通孔２４、２５が各
々開口していることを特徴とするチップ部品コーティン
グ治具を提供する。That is, according to the present invention,
In order to achieve the above-mentioned object, the frame body 2 having a plurality of through holes 24 and 25 open on both sides and the through holes 24 and 25 having a diameter smaller than the end dimension of the chip component 8 are left.
In the chip component coating jig having the elastic body 23 provided so as to cover the elastic body 23, the frame body 22 has a void 26 in the intermediate portion of both surfaces over the entire surface thereof.
3 are provided separately on both sides of the space 26, leaving a space 26 having a width narrower than the length of the chip component 8, and the through holes 24 and 25 surrounded by the elastic body 23 are opened on both sides of the space 26, respectively. A chip component coating jig is provided.
【０００８】さらに、本発明では、チップ部品８の両端
部９、９を除く中央部１０に塗料をコーティングする方
法において、枠体２２がその全面にわたって両面の中間
部に空隙２６を有し、前記弾性体２３がチップ部品８の
長さより狭い幅の空隙２６を残して、その両側に分離し
て設けられ、この空隙２６の両側に前記弾性体２３で囲
まれた前記貫通孔２４、２５が各々開口しているチップ
部品コーティング治具を用い、前記空隙２６の部分にチ
ップ部品８の中央部が位置するように、同チップ部品８
の両端部９、９を空隙２６の両側の貫通孔２４、２５に
各々嵌合し、この状態で空隙２６内に塗料を導入し、排
出した後、チップ部品８に付着した塗料を乾燥すること
を特徴とするチップ部品コーティング方法を提供する。Furthermore, according to the present invention, in the method of coating the central portion 10 of the chip component 8 excluding both end portions 9 and 9 with a coating material, the frame body 22 has a void 26 in the middle portion of both sides over its entire surface, The elastic body 23 is separately provided on both sides of the space 26, leaving a space 26 having a width narrower than the length of the chip component 8, and the through holes 24 and 25 surrounded by the elastic body 23 are provided on both sides of the space 26, respectively. Using a chip component coating jig that is open, the chip component 8 is placed so that the center of the chip component 8 is located in the space 26.
Both end portions 9 and 9 of the above are fitted into the through holes 24 and 25 on both sides of the void 26, and in this state, the paint is introduced into the void 26 and discharged, and then the paint attached to the chip component 8 is dried. There is provided a chip part coating method characterized by the above.
【０００９】[0009]
【作用】前記チップ部品コーティング治具では、弾性体
２３がチップ部品８の長さより狭い幅の空隙２６を残し
て、その両側に分離して設けられ、この空隙２６の両側
に前記弾性体２３で囲まれた貫通孔２４、２５が各々開
口していることから、これを用いた前記チップ部品コー
ティング方法のようにして、前記チップ部品８の両端部
９、９を空隙２６の両側の貫通孔２４、２５に各々嵌合
し、チップ部品８の中央部１０を空隙２６に位置させ、
この状態で空隙２６内に塗料を導入することで、チップ
部品８の中央部にのみ塗料を塗布することができる。In the chip component coating jig, the elastic body 23 is separately provided on both sides of the cavity 26, leaving a cavity 26 having a width narrower than the length of the chip component 8, and the elastic body 23 is provided on both sides of the cavity 26. Since the enclosed through holes 24 and 25 are respectively opened, the both end portions 9 and 9 of the chip component 8 are connected to the through holes 24 on both sides of the gap 26 in the same manner as in the chip component coating method using this. , 25 respectively, and the central portion 10 of the chip component 8 is positioned in the gap 26,
By introducing the paint into the void 26 in this state, the paint can be applied only to the central portion of the chip component 8.
【００１０】また、この治具を用い、その一方の貫通孔
４、５からチップ部品の端部９を突出させて、前記従来
の治具と同様にして突出した端部９を塗料に浸漬するこ
とで、チップ部品９の端部にも塗料を塗布することがで
きる。従って、一つの治具でチップ部品の中央部と両端
部とに各々塗料を塗布することが可能である。Further, using this jig, the end portion 9 of the chip component is projected from one of the through holes 4 and 5, and the projected end portion 9 is immersed in the coating material in the same manner as the conventional jig. As a result, the paint can be applied to the end portion of the chip component 9. Therefore, it is possible to apply the coating material to the central portion and both end portions of the chip component with one jig.
【００１１】[0011]
【実施例】次に、本発明の実施例について、図面を参照
しながら、詳細に説明する。まず、本発明によるチップ
部品８に塗料を塗布するための治具について説明する。
図１及び図２に示すように、このチップ部品コーティン
グ治具は、基本的には従来の治具と同様に、多数の貫通
孔２４、２５を有する枠体２２とこの枠体２２を覆う弾
性体２３とを有する。Embodiments of the present invention will now be described in detail with reference to the drawings. First, a jig for applying paint to the chip component 8 according to the present invention will be described.
As shown in FIGS. 1 and 2, this chip component coating jig is basically similar to a conventional jig in that a frame body 22 having a large number of through holes 24 and 25 and an elastic body covering the frame body 22 are provided. And a body 23.
【００１２】枠体２２は、アルミニウム等からなる矩形
の板状のもので、それに多数の貫通孔２４、２５が縦横
に並んで形成されている。この枠体２２の貫通孔２４、
２５を有する部分は、上下に２つに分かれており、その
間の中央部に間隙２６を有している。前記貫通孔２４、
２５は、この間隙の両側に各々開口している。The frame 22 is a rectangular plate made of aluminum or the like, and a large number of through holes 24 and 25 are formed side by side in the vertical and horizontal directions. The through hole 24 of the frame body 22,
The part having 25 is divided into two parts, an upper part and a lower part, and a gap 26 is provided in the center part between them. The through hole 24,
The openings 25 are open on both sides of this gap.
【００１３】弾性体２３は、シリコンゴム等からなり、
チップ部品８の端部寸法より径が細い貫通孔２４、２５
を残して、前記枠体２２の貫通孔２４、２５を囲む部分
を覆うように設けられている。さらに、この弾性体２３
は、前記空隙２６の両側に分離して設けられており、２
つの弾性体２３の間にチップ部品８の長さより狭い空隙
２６を残している。さらに、枠体２２の側面には、この
空隙２６に通じる塗料出入口２７が設けられている。こ
のチップ部品コーティング治具の外観を図３に示す。The elastic body 23 is made of silicon rubber or the like,
Through holes 24, 25 having a diameter smaller than the end dimension of the chip component 8
Is provided so as to cover the portions surrounding the through holes 24 and 25 of the frame body 22. Furthermore, this elastic body 23
Are provided separately on both sides of the gap 26, and
A space 26 narrower than the length of the chip component 8 is left between the two elastic bodies 23. Further, a paint inlet / outlet 27 communicating with the space 26 is provided on the side surface of the frame body 22. The appearance of this chip component coating jig is shown in FIG.
【００１４】次に、このチップ部品コーティング治具を
用いたチップ部品８のコーティング方法の例について説
明する。まず、図１（ａ）は、チップ部品８の中央部１
０にガラスペーストや樹脂塗料等を塗布する場合の例で
ある。すなわち、チップ部品８を貫通孔４または貫通孔
５の何れか一方から嵌合し、これをピン１１（図１
（ｂ）参照）で押し込んで、チップ部品８の中央部１０
が両側の弾性体２３の間の空隙部２６に位置するように
する。ここで、空隙部２６は、チップ部品８の長さより
間隔が狭いため、チップ部品８の両端部９、９は、各々
貫通孔２４、２５に嵌合され、弾性体２３に保持され
る。この状態で、塗料出入口２７から前記空隙部２６に
塗料を導入することにより、チップ部品９の中央部１０
にのみ塗料が塗布される。その後、塗料出入口２７から
空隙部２６内の塗料を排出させ、さらにこの空隙部２６
に高温の空気を送り込むことで、塗布された塗料を乾燥
させる。Next, an example of a method of coating the chip component 8 using this chip component coating jig will be described. First, FIG. 1A shows the central portion 1 of the chip component 8.
This is an example of applying glass paste, resin paint, or the like to No. 0. That is, the chip component 8 is fitted from either the through hole 4 or the through hole 5, and the pin 11 (see FIG.
(See (b)), and push in the central part 10 of the chip component 8.
Are located in the gap 26 between the elastic bodies 23 on both sides. Here, since the gap portion 26 has a narrower interval than the length of the chip component 8, both end portions 9, 9 of the chip component 8 are fitted into the through holes 24, 25, respectively, and are retained by the elastic body 23. In this state, by introducing the paint from the paint inlet / outlet 27 into the space 26, the central portion 10 of the chip component 9 is
Only the paint is applied to. After that, the paint in the void portion 26 is discharged from the paint inlet / outlet 27, and the void portion 26 is further discharged.
By blowing hot air into, the applied paint is dried.
【００１５】一方、図１（ｂ）は、チップ部品８の端部
９に導電ペースト等の塗料を塗布する場合の例である。
すなわち、チップ部品８を貫通孔４または貫通孔５の何
れか一方から嵌合し、これをピン１１で押し込み、チッ
プ部品８の一方の端部９が一方の貫通孔５から突出する
ようにする。さらに、このチップ部品８の端部９の貫通
孔５から突出した端部９の高さを揃えた後、塗料槽１２
内の塗料１３にこの突出した端部９を浸漬することで、
その端部９に塗料１３を塗布することができる。さら
に、このチップ部品８の端部９を塗料１３から引き上げ
て乾燥する。つまり、図４に示す従来の治具と同様にし
て、チップ部品８の端部９に塗料１３を塗布することが
可能である。On the other hand, FIG. 1B shows an example in which a coating material such as a conductive paste is applied to the end portion 9 of the chip component 8.
That is, the chip component 8 is fitted from either the through hole 4 or the through hole 5 and is pushed by the pin 11 so that one end 9 of the chip component 8 projects from the one through hole 5. . Furthermore, after the heights of the ends 9 protruding from the through holes 5 of the ends 9 of the chip component 8 are made uniform, the paint tank 12
By immersing the protruding end 9 in the paint 13 inside,
A paint 13 can be applied to the end portion 9. Further, the end portion 9 of the chip component 8 is pulled up from the paint 13 and dried. That is, it is possible to apply the paint 13 to the end portion 9 of the chip component 8 in the same manner as the conventional jig shown in FIG.
【００１６】また、チップ部品８の他方の端部９に塗料
１３を塗布するときは、治具を上下反転させて、チップ
部品８をピン１１で貫通孔５から貫通孔４側に押し込
み、さらに、同貫通孔４からチップ部品８の他方の端部
９を押し出し、そこに同様にして塗料を塗布し、乾燥す
る。これにより、チップ部品８の他方の端部９にも塗料
が塗布される。When the coating material 13 is applied to the other end 9 of the chip component 8, the jig is turned upside down to push the chip component 8 with the pin 11 from the through hole 5 to the through hole 4 side. The other end 9 of the chip component 8 is extruded from the through hole 4, and the coating material is similarly applied thereto and dried. As a result, the coating material is also applied to the other end portion 9 of the chip component 8.
【００１７】このようにして、前記のチップ部品コーテ
ィング治具を用い、前述の方法により、チップ部品８の
中央部１０に塗料を塗布することができる。さらに、こ
のチップ部品コーティング治具を用い、チップ部品８を
一方の貫通孔４または５に押し込むだけで、チップ部品
８の端部９にも塗料を塗布することができる。従って、
同じ治具を用い、その貫通孔４、５にチップ部品８を嵌
合した状態で、その中央部１０と両端部９、９とに順次
塗料を塗布することができる。In this way, the coating can be applied to the central portion 10 of the chip component 8 by the above-mentioned method using the above-mentioned chip component coating jig. Furthermore, by using this chip component coating jig, the chip component 8 can be applied to the end portion 9 of the chip component 8 simply by pushing the chip component 8 into one of the through holes 4 or 5. Therefore,
The same jig can be used to sequentially apply the coating material to the central portion 10 and both end portions 9 and 9 of the through hole 4 and 5 with the chip component 8 fitted thereto.
【００１８】なお、この塗料を塗布する順序は任意であ
り、また、チップ部品８の中央部１０と両端部９、９と
に順次連続して塗料を塗布する必要もないことは言うま
でもない。例えば、例えば、チップ部品８の中央部１０
に塗料を塗布し、乾燥した後、一旦治具からチップ部品
８を取り外し、その後別の工程を経てから再びチップ部
品を治具の貫通孔４、５に嵌合して、その両端部９、９
に塗料を塗布する場合もある。It is needless to say that the order of applying the paint is arbitrary, and it is not necessary to apply the paint successively to the central portion 10 and both end portions 9, 9 of the chip part 8. For example, for example, the central portion 10 of the chip component 8
After the coating material is applied and dried, the chip component 8 is once removed from the jig, and after another step, the chip component is fitted again into the through holes 4 and 5 of the jig, and both ends 9 thereof are 9
In some cases, paint is applied.
【００１９】[0019]
【発明の効果】以上説明した通り、本発明のチップ部品
コーティング治具によれば、チップ部品８の両端部９、
９だけでなく、その中央部１０にも塗料を塗布すること
ができるため、チップ部品８の両端部９、９と中央部１
０とに塗料を各々塗布する場合に、塗布工程の簡略化が
図れる。また、本発明のチップ部品コーティング方法に
よれば、多数のチップ部品８の中央部１０に、同時に塗
料を塗布することが可能となり、その工程の生産性の向
上を図ることができる。As described above, according to the chip component coating jig of the present invention, both end portions 9 of the chip component 8 are
Since the paint can be applied not only to the central part 10 but also to the central part 10, both end parts 9 and 9 of the chip part 8 and the central part 1
When the paint is applied to each of 0 and 0, the application process can be simplified. Further, according to the chip component coating method of the present invention, it becomes possible to simultaneously apply the coating material to the central portion 10 of a large number of chip components 8, and the productivity of the process can be improved.
【図１】本発明の実施例によるチップ部品コーティング
治具を使用して、チップ部品の中央部に塗料を塗布する
工程（ａ）とチップ部品の端部に塗料を塗布する工程
（ｂ）とを示す要部断面図である。FIG. 1 includes a step (a) of applying a paint to a central part of a chip part and a step (b) of applying a paint to an end part of the chip part using a chip part coating jig according to an embodiment of the present invention. FIG.
【図２】同実施例によるチップ部品コーティング治具の
要部断面斜視図である。FIG. 2 is a cross-sectional perspective view of essential parts of a chip component coating jig according to the embodiment.
【図３】同実施例によるチップ部品コーティング治具の
全体外観斜視図である。FIG. 3 is an overall external perspective view of a chip component coating jig according to the embodiment.
【図４】従来例によるチップ部品コーティング治具を使
用して、チップ部品の端部に塗料を塗布する工程を示す
要部断面図である。FIG. 4 is a cross-sectional view of relevant parts showing a process of applying a coating material to an end portion of a chip component using a chip component coating jig according to a conventional example.
８ チップ部品 ９ チップ部品の端部 １０ チップ部品の中央部 １３ 塗料 ２６ 空隙 ２２ 枠体 ２３ 弾性体 ２４ 貫通孔 ２５ 貫通孔 8 Chip Parts 9 Edges of Chip Parts 10 Central Part of Chip Parts 13 Paint 26 Gap 22 Frame 23 Elastic Body 24 Through Hole 25 Through Hole
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ０５Ｄ 7/00 Ｈ 8720−4Ｄ Ｈ０１Ｆ 17/00 Ｚ 8123−5Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location B05D 7/00 H 8720-4D H01F 17/00 Z 8123-5E
Claims (2)
（２５）を有する枠体（２２）と、チップ部品（８）の
端部寸法より径が細い貫通孔（２４）、（２５）を残し
て前記枠体（２２）を覆うように設けられた弾性体（２
３）とを有するチップ部品コーティング治具において、
枠体（２２）がその全面にわたって両面の中間部に空隙
（２６）を有し、前記弾性体（２３）がチップ部品
（８）の長さより狭い幅の空隙（２６）を残して、その
両側に分離して設けられ、この空隙（２６）の両側に前
記弾性体（２３）で囲まれた前記貫通孔（２４）、（２
５）が各々開口していることを特徴とするチップ部品コ
ーティング治具。1. A plurality of through holes (24) opening on both sides,
A frame body (22) having (25) and through holes (24) and (25) having a diameter smaller than the end dimension of the chip component (8) are provided so as to cover the frame body (22). Elastic body (2
3) In a chip component coating jig having
The frame body (22) has a void (26) in the middle of both sides over the entire surface thereof, and the elastic body (23) leaves a void (26) having a width narrower than the length of the chip part (8), and both sides thereof. And the through holes (24) and (2) surrounded by the elastic body (23) on both sides of the space (26).
5) A chip component coating jig, each of which is open.
（９）を除く中央部（１０）に塗料をコーティングする
方法において、枠体（２２）がその全面にわたって両面
の中間部に空隙（２６）を有し、前記弾性体（２３）が
チップ部品（８）の長さより狭い幅の空隙（２６）を残
して、その両側に分離して設けられ、この空隙（２６）
の両側に前記弾性体（２３）で囲まれた前記貫通孔（２
４）、（２５）が各々開口しているチップ部品コーティ
ング治具を用い、前記空隙（２６）の部分にチップ部品
（８）の中央部が位置するように、同チップ部品（８）
の両端部（９）、（９）を空隙（２６）の両側の貫通孔
（２４）、（２５）に各々嵌合し、この状態で空隙（２
６）内に塗料を導入し、排出した後、チップ部品（８）
に付着した塗料を乾燥することを特徴とするチップ部品
コーティング方法。2. Both ends (9) of the chip part (8),
In the method of coating the central portion (10) except for (9) with a paint, the frame body (22) has a void (26) over the entire surface in the middle portion of both sides, and the elastic body (23) is a chip component ( 8) A space (26) having a width narrower than the length of 8) is left, and the space (26) is separately provided on both sides of the space (26).
The through hole (2) surrounded by the elastic body (23) on both sides of
4), using a chip part coating jig in which (25) is opened, so that the central part of the chip part (8) is located in the space (26).
Both ends (9) and (9) of the space are fitted into the through holes (24) and (25) on both sides of the space (26), respectively.
6) After the paint is introduced and discharged into the chip part (8)
A coating method for chip parts, which comprises drying the paint adhered to the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4355676A JPH06188161A (en) | 1992-12-19 | 1992-12-19 | Coating jig for chip component and coating method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4355676A JPH06188161A (en) | 1992-12-19 | 1992-12-19 | Coating jig for chip component and coating method using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06188161A true JPH06188161A (en) | 1994-07-08 |
Family
ID=18445204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4355676A Withdrawn JPH06188161A (en) | 1992-12-19 | 1992-12-19 | Coating jig for chip component and coating method using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06188161A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056323A1 (en) * | 2001-01-11 | 2002-07-18 | Vishay Sprague, Inc. | Method of forming termination of chip components |
| JP2005144355A (en) * | 2003-11-17 | 2005-06-09 | Murata Mfg Co Ltd | Gravure roll, method for confirming extent of wear of gravure roll and method for manufacturing electronic component |
| KR100922571B1 (en) * | 2007-12-06 | 2009-10-21 | 비나텍주식회사 | Battery element jig |
| KR101229980B1 (en) * | 2011-09-09 | 2013-02-05 | (주)코맥 | Apparatus for coating silicon on the injection needle |
| CN104759391A (en) * | 2015-04-20 | 2015-07-08 | 豪威半导体（上海）有限责任公司 | Chip dispensing jig |
| JP6398029B1 (en) * | 2018-03-16 | 2018-09-26 | 株式会社イワタ | Adhesive application jig |
-
1992
- 1992-12-19 JP JP4355676A patent/JPH06188161A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056323A1 (en) * | 2001-01-11 | 2002-07-18 | Vishay Sprague, Inc. | Method of forming termination of chip components |
| JP2005144355A (en) * | 2003-11-17 | 2005-06-09 | Murata Mfg Co Ltd | Gravure roll, method for confirming extent of wear of gravure roll and method for manufacturing electronic component |
| KR100922571B1 (en) * | 2007-12-06 | 2009-10-21 | 비나텍주식회사 | Battery element jig |
| KR101229980B1 (en) * | 2011-09-09 | 2013-02-05 | (주)코맥 | Apparatus for coating silicon on the injection needle |
| CN104759391A (en) * | 2015-04-20 | 2015-07-08 | 豪威半导体（上海）有限责任公司 | Chip dispensing jig |
| JP6398029B1 (en) * | 2018-03-16 | 2018-09-26 | 株式会社イワタ | Adhesive application jig |
| CN110270481A (en) * | 2018-03-16 | 2019-09-24 | 株式会社岩田 | Adhesive applicating fixture |
| CN110270481B (en) * | 2018-03-16 | 2020-12-01 | 株式会社岩田 | Adhesive coating jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0470761B2 (en) | ||
| US20010013602A1 (en) | Apparatus for forming electrode of chip-like electronic part | |
| JP2665900B2 (en) | Method of forming multiple terminals on electronic monolithic chip device | |
| US4859498A (en) | Chip component holding plate | |
| JPH06188161A (en) | Coating jig for chip component and coating method using same | |
| US4598821A (en) | Holder assembly for miniature electronic components and method of fabrication | |
| US5364014A (en) | Method of and apparatus for manufacturing electronic component | |
| US4390101A (en) | Article mounting rack | |
| JPH0542126B2 (en) | ||
| JPH0741149Y2 (en) | Small electronic parts holder for edge coating | |
| JPH0810180Y2 (en) | Electronic parts holder for end uting | |
| JPH03250726A (en) | Coating method of end parts of small electronic components | |
| JPH0810181Y2 (en) | Electronic parts holder for edge coating | |
| JP3262931B2 (en) | Chip-shaped electronic component holding plate | |
| US6322855B1 (en) | Method and apparatus for coating conductive metal onto an electrode for surface mounting chip components | |
| JPH0214510A (en) | Holding plate for chip component | |
| JPS61268003A (en) | Chip part holding plate | |
| US5894033A (en) | Method of profiling the termination paste for chip capacitor electrodes | |
| JPH04167802A (en) | Electrode forming method for strip line filter | |
| JP2564675Y2 (en) | Electronic component rotation jig | |
| JPH0542123B2 (en) | ||
| JPH04120715A (en) | Electrode paste coating of chip component | |
| JPS63257211A (en) | Method of forming external electrode of chip type electronic component | |
| JPH07183363A (en) | Holder for chip parts | |
| JPH04269817A (en) | Manufacture of chip type solid electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000307 |