JPH04335581A - Package for light-emitting element - Google Patents

Abstract

PURPOSE:To easily mount a light-emitting element on a substrate on which a circuit used to drive a light source has been formed in a state that its light- radiating direction is parallel to the face of the substrate and to maintain the positional accuracy of said light source with reference to an optical system which photodetects the radiated light of said light source in a package for the light-emitting element which has built the light source in a sealing body. CONSTITUTION:The bottom face 1b of a sealing body 1 is formed as a flat face; side faces 1s, 1s are constituted of parts of the outer circumference of a cylinder. A window 8 for light-radiating use is formed in the front edge 1f of the sealing body 1; lead pins 2 are passed and installed in the rear edge 1r of the sealing body 1.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for a light emitting device, and more particularly to a package containing a light source such as a semiconductor laser.

0002

2. Description of the Related Art Conventionally, there is a package containing a semiconductor laser as shown in FIG. This package includes a disc-shaped stem base 11 and this stem base 1.
a cylindrical cap 31 that covers one surface 11a of the stem base 11;
A lead pin 21 is provided which protrudes in a needle shape from 1b. A glass window 81 is provided at the center of the end surface 31a of the cap 31, and the cap 3 is inserted through the glass window 81.
Light from a semiconductor laser built into the device 1 is emitted. Also,
A slit 91 is provided in the outer peripheral end surface 11c of the stem base 31 for positioning the package in the circumferential direction.

[0003] The semiconductor laser is used as an optical system (lens, etc.)
When used in optical information processing in combination with the optical system, strict positional accuracy of the semiconductor laser (light source) with respect to the optical system is required in order to eliminate adjustment work on the optical system side as much as possible. Here, the semiconductor laser is mounted on the stem base 11 with high precision using an automatic machine. Further, the stem base 11 is positioned with high precision with respect to the optical system by press-fitting the outer periphery 11c into a hole provided in the optical system unit. Thereby, the semiconductor laser can be positioned with high precision with respect to the optical system.

0004

[Problems to be Solved by the Invention] Incidentally, in the package containing the semiconductor laser, the lead pin 21 is placed in contact with a substrate (hereinafter simply referred to as "substrate") on which a circuit for driving the semiconductor laser is built. Alternatively, it is preferable to directly mount it by plugging it in and soldering it. However, if the above conventional package is mounted as is on a board, the light emission direction is perpendicular to the board surface, so the optical system unit is placed perpendicular to the edge of the board (this arrangement is difficult due to spatial constraints). ) has the problem that light cannot be guided to the optical system. Note that it is extremely difficult to simply solder the lead pins 21 in a bent state because the package (stem base 11 and cap 31) is rounded and cannot be fixed to the substrate surface.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a light emitting element package in which a light source is built into a sealed body, which can be easily mounted on a substrate with the light emission direction parallel to the substrate surface. It is an object of the present invention to provide a light emitting element package that can maintain high positional accuracy of a light source with respect to an optical system that receives light emitted from the light source.

[0006]

[Means for Solving the Problems] In order to achieve the above object, a light emitting element package of the present invention is a light emitting element package in which a light source is built into a sealing body, and the outer periphery of the sealing body is flat. a bottom surface, a top surface opposite to the bottom surface, a side surface that is a part of a cylindrical surface and connects both sides of the bottom surface and the top surface, and a window for emitting light from the light source, and the front end of the bottom surface, side surfaces, and top surface. and a rear end surface through which a lead pin is inserted and which connects the rear ends of the bottom, side, and top surfaces.

[0007] Furthermore, it is preferable that the lead pin is shaped so that its tip is in contact with a plane including the bottom surface.

[0008] Furthermore, it is preferable that the lead pin is shaped so that its tip is perpendicular to a plane including the bottom surface.

[0009]

[Operation] Since the bottom surface of the sealing body is flat, the lead pin can be soldered while the bottom surface is in contact with and fixed on the substrate. Therefore, the light source built into the sealing body can be easily mounted in a state in which the light emitting direction is parallel to the substrate surface. Further, in an arrangement in which the optical system unit is provided perpendicularly to the edge of the substrate, the front end surface side of the sealing body is mounted so as to protrude from the edge of the substrate. In this case, since the side surface of the sealing body is a part of the cylindrical surface, the front end surface side of the sealing body can be easily press-fitted and fitted into the hole provided in the optical system unit. . Therefore, the light source built into the sealing body is positioned with high precision with respect to the optical system. Furthermore, since the bottom surface of the sealed body is flat, the contact area between the sealed body and the substrate is increased compared to the conventional case. Therefore, the heat generated by the light source built into the sealing body can be efficiently released to the substrate side.

[0010] Furthermore, when the tip of the lead pin is formed so as to be in contact with a plane including the bottom surface of the sealing body,
When the sealing body contacts the substrate, the tips of the lead pins also come into contact with the substrate (substrate surface). Therefore, the lead pins can be easily soldered.

Further, if the tip of the lead pin is formed so as to be perpendicular to a plane including the bottom surface of the sealing body, the tip of the lead pin will be aligned with the substrate ( (board surface). Therefore, the lead pins can be easily soldered.

0012

EXAMPLES Hereinafter, the light emitting device package of the present invention will be explained in detail by way of examples.

FIG. 1 shows a semiconductor laser package according to an embodiment of the present invention. Figures (a), (b), (
c) shows the package as seen from above, from the front, and from the side, respectively. This package includes a sealing body 1 made of metal or ceramic coated with metal, and four lead pins 2. Said sealing body 1
The outer periphery of is a flat bottom surface 1b and a top surface 1t that face each other, and side surfaces 1s and 1 that connect both sides of the bottom surface 1b and top surface 1t.
s, and a front end surface 1f and a rear end surface 1r connecting the front and rear ends of the bottom surface 1b, side surfaces 1s, 1s, and top surface 1t, respectively. The side surfaces 1s, 1s are the bottom surface 1b.
and a part of a cylindrical surface that intersects with the upper surface 1t. A glass window 8 for light emission is provided on the front end surface 1f, while a lead pin 2 is provided through the rear end surface 1r. The tip 2e of the lead pin 2 is shaped so as to be in contact with a plane including the bottom surface 1b. As shown in FIG. 3, the sealing body 1 includes a main portion 10 having a groove 10i having a U-shaped cross section, and a lid portion 3 that seals the main portion 10. As shown in FIG. 3, the sealed body 1 includes a semiconductor laser 5 and a photodiode 6 for monitoring the optical output of the semiconductor laser 5. The semiconductor laser 5 is mounted on the front end side of the groove 10i via a rectangular parallelepiped submount (made of metal or a semiconductor such as Si or the like). On the other hand, the photodiode 6 is mounted obliquely behind the semiconductor laser 5 using wax material or conductive paste. These semiconductor laser 5 and photodiode 6 are connected to the inner end 2i of the lead pin 2 by an Au wire 7. Then, the main part 10 and the lid part 3 of this sealing body 1 are attached with a wax material and sealed.

In this package, since the bottom surface 1b of the sealing body 1 is a flat surface, the lead pins 2 can be soldered while the bottom surface 1b is in contact with and fixed on a substrate (not shown). Therefore, the semiconductor laser 5 can be easily mounted in a state in which the light emission direction is parallel to the substrate surface. Moreover, since the bottom surface of the sealed body 1 is a flat surface 1b, the contact area between the sealed body 1 and the substrate can be increased compared to the conventional case. Therefore, the heat generated by the semiconductor laser 5 can be efficiently released to the substrate side. Further, in an arrangement in which the optical system unit is provided perpendicularly to the edge of the substrate, it is mounted with the front end surface 1f side of the sealing body 1 protruding from the edge of the substrate. If you do this,
Since the side surface 1s of the sealing body 1 is made up of a part of the outer periphery of the cylinder, the front end surface 1f side of the sealing body 1 can be easily press-fitted into a hole (not shown) provided in the optical system unit. Therefore, the semiconductor laser 5 can be positioned with high precision with respect to the optical system. Further, since the tip 2e of the lead pin 2 is shaped so as to be in contact with a plane including the bottom surface 1b of the sealing body 1, by bringing the sealing body 1 into contact with the substrate, the tip 2e of the lead pin 2 can be brought into contact with the plane including the bottom surface 1b of the sealing body 1. substrate(
(the surface of the board). Therefore, the lead pin 2 can be easily soldered.

Further, as shown in FIG. 2, the tip 2e of the lead pin 2 may be formed to be perpendicular to a plane containing the bottom surface 1b of the sealing body 1. In this case, by bringing the sealing body 1 into contact with the substrate, the tips 2e of the lead pins 2 are inserted into the substrate (substrate surface). Therefore, the lead pin 2 can be easily soldered.

[0016]

As is clear from the above, since the light emitting element package of the present invention has a flat bottom surface of the sealing body, the lead pins can be easily soldered by bringing the bottom surface into contact with the substrate. Thereby, the light source built into the sealing body can be easily mounted in a state in which the light emission direction is parallel to the substrate surface. Further, the contact area between the bottom surface of the sealing body and the substrate can be increased compared to the conventional method,
Heat can be dissipated efficiently. Moreover, since the side surface of the sealing body is formed of a part of the cylindrical surface, in an arrangement in which the optical system unit is provided perpendicularly to the edge of the substrate, the front end surface side of the sealing body is connected to the optical system unit. The light source can be easily press-fitted into the hole provided in the optical system, and therefore the light source can be positioned with high precision with respect to the optical system.

[0017] Further, when the tip of the lead pin is formed so as to be in contact with a plane including the bottom surface of the sealing body,
Since the tips of the lead pins also come into contact with the substrate (substrate surface) when the sealing body is brought into contact with the substrate, the lead pins can be easily soldered.

Further, if the tip of the lead pin is formed so as to be perpendicular to a plane including the bottom surface of the sealing body, the tip of the lead pin will be aligned with the substrate ( The lead pins can be easily soldered.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a semiconductor laser package according to an embodiment of the present invention.

FIG. 2 is a diagram showing a modification of the above package.

FIG. 3 is a diagram showing the inside of the package.

FIG. 4 is a diagram showing a conventional semiconductor laser package.

[Explanation of symbols]

1 sealing body,
1b bottom surface, 1f front end surface, 1
r rear end surface, 1s side surface,
1t top surface, 2 lead pin, 2e
Tip, 2i Inner end,
3 Lid part, 4 Submount,
5 semiconductor laser, 6 photodiode, 7 Au wire, 8 glass window,
10 main part, 10i groove.

Claims (3)

[Claims] 1. A light emitting element package in which a light source is built into a sealed body, wherein the outer periphery of the sealed body includes a flat bottom surface, an upper surface opposite to the bottom surface, and a part of a cylindrical surface. A side surface that connects both sides of the bottom surface and the top surface, a front end surface that has a window that emits the light from the light source and connects the front ends of the bottom surface, the side surfaces, and the top surface, and a lead pin that is penetrated through it, and a rear surface of the bottom surface, the side surface, and the top surface. A light emitting element package characterized by comprising a rear end surface connecting the ends. 2. The light emitting element package according to claim 1, wherein the lead pin is formed such that a tip thereof is in contact with a plane including the bottom surface. 3. The light emitting element package according to claim 1, wherein the lead pin is shaped such that a tip thereof is perpendicular to a plane including the bottom surface.