JPH0242382A - Moving stage structure - Google Patents

Abstract

PURPOSE:To enable fast, high-accuracy positioning by using a frame structure consisting of a hollow pipe which is provided with a node internally, charging a material for increasing attenuation in the hollow pipe, and providing high rigidity and high attenuation. CONSTITUTION:A moving stage 2 where a wafer 1 is fixed is moved in a perpendicular plane by two couples of guide bars 3 and 4 and two stage driving motors 5 and 6 and positioned so that the wafer 1 is set at a specific baking position. The guide bars 4 are accurately fitted to the main frame 7 consisting of the hollow pipe. The main frame 7 is structured by combining hollow prismatic pipes, which are provided nodes 8 inside to have sufficient rigidity. Further, materials 10 with a high attenuation factor such as sands are charged in small rooms 9 in the main frame 7 which are partitioned by the nodes 8, thereby attenuating speedily the elastic deformation vibration of the main frame 7 due to the movement and stop of the moving stage.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a movable stage structure, and more particularly to a main frame constituting a movable stage used in a semiconductor printing device, an electron beam processing device, or the like.

[Prior Art] FIG. 4 is a basic configuration diagram of the periphery of a wafer stage of a conventional semiconductor printing apparatus. As shown in the figure, in the conventional semiconductor printing apparatus, a circuit pattern drawn on a mask 11 is projected onto a resist layer on a wafer 1 by ultraviolet rays 13 through a reduction projection lens 12 and printed. The wafer 1 is placed on a moving stage 15 mounted on a surface plate 14 and positioned at a printing position. Therefore, the positioning accuracy of the wafer printing position is as follows:
It depends on the rigidity, vibration isolation, damping properties, etc. Also,
The limit of the degree of integration as a semiconductor integrated circuit depends on the optical performance of the reduction projection lens 12, the diffraction of ultraviolet rays, and the like.

[Problem to be solved by the invention] However, in recent years, semiconductors have been required to have a higher degree of integration, and the circuit dimensions have become smaller and are required to exceed the resolution limit due to the diffraction of ultraviolet rays. .

Therefore, semiconductor printing apparatuses have been devised that use X-rays or electron beams, which have higher resolution than ultraviolet rays. In particular, as an X-ray printing device, one using synchrotron radiation SOR, which has high intensity and good parallelism, is considered to be promising.

However, X-rays from SOR are emitted horizontally, and changing the optical path with a reflector causes a large loss in intensity.
It is disadvantageous to use a conventional printing device with a vertical stage structure in a horizontal plane. Therefore, a moving stage structure is required in which the printing device is vertical and can move vertically and horizontally in a vertical plane to perform high-speed and highly accurate positioning.

However, if the conventional movable stage structure was made vertical as it is, the surface plate that achieves high rigidity and high damping performance would be heavy, so the support structure for the entire printing apparatus would be significantly large.

On the other hand, in order to reduce size and weight, it is conceivable to use a frame structure as a movable stage structure to which a stage, a guide, and a drive mechanism are attached. However, when using a frame structure, the frame structure tends to deform and vibrate as the stage moves and stops, making it difficult to achieve a high-speed and high-precision semiconductor baking process. there were.

The purpose of the present invention is to solve the above-mentioned problems in the conventional type.
It is an object of the present invention to provide a moving stage structure that realizes a vertical plane moving stage having characteristics of high rigidity and high damping, and achieves high-speed and high-precision positioning.

[Means and effects for solving the problem] In order to achieve the above object, the present invention uses a frame structure composed of a hollow pipe with internal knots as the main frame on which the moving stage is attached, and furthermore, this invention It is characterized by a substance sealed inside the hollow pipe to increase damping properties.

Sufficient rigidity is obtained by constructing the frame from a hollow pipe with internal knots, and a material is sealed inside the hollow pipe to increase damping properties, so that it can be used easily even when the stage stops moving. The resulting vibrations are quickly damped.

[Example] Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 shows the external appearance of a moving stage structure according to an embodiment of the present invention. In the figure, 1 is a wafer, 2 is a moving stage, 3.4 is a guide bar 5.6 is a motor for driving the stage, and 7 is a main frame. The stage 2, which fixes the wafer 1, has two pairs of guide bars 3.4 and 2.
The wafer 1 is moved in a vertical plane by stage drive motors 5.6 and positioned so that the wafer 1 is placed at a predetermined printing position. Since the movable stage 2 has a large moving weight and a large moving distance, the guide bar 4 is particularly required to have high accuracy in terms of its parallelism and rigidity. Therefore, in the movable stage structure of this embodiment, the guide bar 4 is accurately attached to the main frame 7 made of a hollow pipe.

FIG. 2 is a detailed diagram of the main frame 7 of FIG.

In order to explain the inside of the hollow pipe, a part of the pipe is removed from the drawing. In the figure, the main frame 7 has a structure in which hollow prismatic pipes are combined, and each prismatic pipe is provided with nodes 8 inside to obtain sufficient rigidity. Further, a small chamber 9 inside the main frame 7 partitioned by the nodes 8 is filled with a substance 10 having a high attenuation rate such as sand, so that the elasticity of the main frame 7 as the moving stage moves and stops. This has the effect of quickly attenuating deformed imaging.

In the above embodiment, if it is necessary to reduce the weight of the main frame 7, or if it is necessary to provide a through hole in the prismatic pipe to add equipment, etc., the small room 9 partitioned by the joints 8 may be The highly attenuating substance 10 may be enclosed in a part of it.

Further, as the highly attenuating material 10, in addition to sand, metal particles, a highly viscous polymer compound, and the like can be used.

Furthermore, in the above embodiment, the hollow pipe constituting the main frame 7 may be a cylindrical pipe, a long cylindrical pipe, or the like instead of a prismatic pipe, and the same effect can be obtained. FIG. 3 shows the appearance of a moving stage structure according to an embodiment using a cylindrical pipe.

[Effects of the Invention] As explained above, according to the present invention, in the stage structure applied to the wafer moving stage of a semiconductor printing apparatus, the frame structure is composed of a hollow pipe, and a knot is formed in the hollow pipe. Since a highly attenuating substance is sealed in the small room partitioned by the space provided, it is possible to realize a vertically moving stage with high rigidity and high attenuation, realizing high-speed and high-precision positioning. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a wafer moving stage of a semiconductor printing apparatus according to an embodiment of the present invention, FIG. 2 is a detailed diagram of the main frame portion of FIG. 1, and FIG. FIG. 4 is an external view of the periphery of a wafer stage of a conventional semiconductor printing apparatus. 1: Wafer, 2: Moving stage, 3.4 = Guide bar 5.6: Stage drive motor, 7: Main frame, 8: Node, 9: Small room, 10: Highly attenuating material.

Claims (2)

[Claims] (1) A moving stage structure characterized in that a hollow pipe with internal knots is used as a frame structure constituting the moving stage, and a highly attenuating substance is sealed in the hollow pipe. (2) The movable stage structure according to claim 1, wherein the highly attenuating material is sand, metal grains, rubber, oil, or a combination thereof.