JPH0236281Y2 - - Google Patents
Info
- Publication number
- JPH0236281Y2 JPH0236281Y2 JP9664683U JP9664683U JPH0236281Y2 JP H0236281 Y2 JPH0236281 Y2 JP H0236281Y2 JP 9664683 U JP9664683 U JP 9664683U JP 9664683 U JP9664683 U JP 9664683U JP H0236281 Y2 JPH0236281 Y2 JP H0236281Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- holding plate
- terminal holding
- resin
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9664683U JPS605152U (ja) | 1983-06-24 | 1983-06-24 | 半導体モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9664683U JPS605152U (ja) | 1983-06-24 | 1983-06-24 | 半導体モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS605152U JPS605152U (ja) | 1985-01-14 |
| JPH0236281Y2 true JPH0236281Y2 (zh) | 1990-10-03 |
Family
ID=30230239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9664683U Granted JPS605152U (ja) | 1983-06-24 | 1983-06-24 | 半導体モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS605152U (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611536Y2 (ja) * | 1989-03-03 | 1994-03-23 | 新電元工業株式会社 | 樹脂封止型電子回路装置 |
-
1983
- 1983-06-24 JP JP9664683U patent/JPS605152U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS605152U (ja) | 1985-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4829403A (en) | Packaging arrangement for energy dissipating devices | |
| US4855868A (en) | Preformed packaging arrangement for energy dissipating devices | |
| CN101675520B (zh) | 电力用半导体模块 | |
| KR980006193A (ko) | 열적 개량된 플립 칩 패키지 및 그 제조 방법 | |
| US4712127A (en) | High reliability metal and resin container for a semiconductor device | |
| US4012768A (en) | Semiconductor package | |
| JPH0236281Y2 (zh) | ||
| US6541856B2 (en) | Thermally enhanced high density semiconductor package | |
| JPH06151657A (ja) | 半導体装置及びその製造方法 | |
| JPS62104145A (ja) | 半導体装置 | |
| JP2577639Y2 (ja) | 回路基板を有する半導体装置 | |
| JP2593867Y2 (ja) | 複合半導体装置 | |
| JPH0338837Y2 (zh) | ||
| JPH09275155A (ja) | 半導体装置 | |
| JPH06188335A (ja) | 樹脂封止形半導体装置 | |
| JPS58121652A (ja) | 混成集積回路装置 | |
| JPH05267503A (ja) | 半導体装置 | |
| JPS6185828A (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPS622702B2 (zh) | ||
| JPS62202544A (ja) | 半導体装置 | |
| JPS61148845A (ja) | 半導体装置 | |
| JPS6361779B2 (zh) | ||
| JP2605434Y2 (ja) | 複合半導体装置 | |
| JPS63110645A (ja) | 半導体装置の製造方法 | |
| JPH0423330Y2 (zh) |