JP2636877B2 - Probe card and test method using this probe card - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a probe card and a test method using the probe card.

(Prior Art) Conventionally, in a probe card structure, a semiconductor wafer is tested using a probe card in a semiconductor wafer inspection apparatus.

In this case, both ends of the probe card are fixed by a probe card support called a head plate of the inspection apparatus. Therefore, the second wiring board on which the probe needles are formed is inserted into the first wiring board at substantially the center of the probe card and both ends of the first wiring board are supported. By applying vibration to the wiring board, resonance occurs because the first wiring board is an elastic body. Examples of such conventional examples include JP-A-59-138345, JP-A-59-143340, and JP-A-61-1822.
No. 37 and JP-A-53-102379.

(Problems to be Solved by the Invention) However, since the stage on which the semiconductor wafer (hereinafter, referred to as a wafer) is intermittently moved, vibration occurs in the entire wafer inspection apparatus.

In the above-described wafer inspection apparatus, although the contact pressure of the tip of the probe needle with respect to the wafer is extremely important, there has been a problem that an accurate test cannot be performed because the vibration makes the contact pressure unstable.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card in which a probe needle can be tested with an appropriate pressing force on an electrode of an object to be inspected in a vibrating wafer inspection apparatus. is there.

Another object of the present invention is to provide a test method capable of performing a test by replacing a test item or a first wiring board for selectively wiring for each device under test with the fixing member.

(Means for Solving the Problem) According to the present invention, there is provided a fixing member made of a rigid metal member fixed to a head plate of a probe device, the fixing member having an opening in a part thereof, A reinforcing member provided on an upper surface and having a convex portion fitted to the opening, a first wiring board detachably fixed to an upper surface of the fixing member from above by a screw member via the reinforcing member; A second wiring board having a probe needle detachably fixed to a lower surface of the member from below by a screw member, and a first wiring board which is reinforced and supported by a convex portion of the reinforcing member;
A probe card comprising: a contact pin for electrically connecting the wiring card to a wiring board.

According to a second aspect of the present invention, there is provided a fixing member made of a rigid metal member fixed to a head plate of the probe device and having an opening in a part thereof, and a projection provided on an upper surface of the fixing member and fitted to the opening. A first wiring board mounted on the upper surface of the fixed member via the reinforcing member, and a first wiring board mounted on the upper surface of the first wiring board so as to surround the opening of the fixed member, and From the first by the screw member
A second wiring board having a fixing ring for detachably fixing the wiring board and the reinforcing member to the fixing member, a second wiring board having a probe needle detachably fixed to a lower surface of the fixing member from below by a screw member, and the reinforcing member And a contact pin which is reinforced and supported by the convex portion and electrically connects the first wiring board and the second wiring board.

According to a third aspect of the present invention, a probe card is used in which the probe needle is removably attached to the electrical connection portion of the second wiring board on which the probe needle is electrically wired, on the electrical connection portion of the first wiring board provided with the electrical wiring. In the method of testing by bringing the probe needle into contact with the electrode portion of the device under test, a plurality of types of first wiring boards different for each test item or device under test are formed from a metal member having rigidity by a screw member from above. A test method wherein the first wiring board is selectively replaced with the fixing member for each test item or test object, and the test is performed.

(Operation) In the probe card of the present invention, a connection portion is provided on the periphery of an opening formed substantially at the center of the first wiring board. A fixing member made of a rigid member is detachably provided on the outer periphery of the connection portion insulated from the first wiring board surface. A side end of the fixing member can be provided on a tester main body using the probe card.

That is, since the connection portion of the first wiring board with a small deflection is detachably provided on the tester main body side by a rigid member, the probe card does not resonate due to vibrations vibrated from the tester main body. The effect of the test method using the probe card is that the first wiring board and the second wiring board are provided on the fixing member, and the fixing member can be used by fixing it to the tester main body. Depending on the type, the first wiring board can be removed from the fixing member and replaced.

(Example) Hereinafter, an example in which the probe card of the present invention is applied to a probe device will be described with reference to the drawings. First, the appearance of the probe device of the present embodiment will be described with reference to FIG. This probe device is roughly divided into a loader unit 1, an inspection unit 2, and a probe card fixing unit 3.

The loader unit 1 takes out wafers from a cassette, for example, a cassette containing a plurality of semiconductor wafers having a 5-inch outer shape (hereinafter, referred to as wafers). The taken-out wafer is floated to the inspection unit 2 after pre-alignment. Further, the inspection-completed wafer is transported back into the cassette.

The inspection unit 2 places the wafer conveyed via the loader unit 1 on a stage. The placed wafer is temporarily fixed, for example, suction-fixed by vacuum pressure. The wafer fixed by suction is aligned by driving the stage in the X and Y axis directions and the θ direction. The aligned wafer is configured to be arranged below the probe card fixing unit 3.

The probe card fixing section 3 is configured so that probe needles are brought into contact with the wafer on the stage described above, and the wafer is determined by a tester connected to the probe needles.
The inspection unit 2 is provided with a scope 4 for visually observing the alignment between the probe needle and the wafer.

The probe card fixing section 3 will be further described with reference to FIG. The probe card fixing part 3 is a head plate 5 implanted on the top surface of a column that stands from a base on which the above-mentioned stage is moved in two directions of X axis and Y axis.
And an opening provided at the center of the head plate 5
The probe card 6 is provided so as to be hung on 5a.

The head plate 5 is constituted by a rectangular base,
At the center of this table, a step 5b is provided on the periphery of the hollow part where the step is opened. A fixing member 6a of the probe card 6, which will be described later, is provided to be suspended from the step 5b. Further, after the fixing member 6a is placed on the step portion 5b, the fixing member 6a is provided so as to be fixedly screwed together with a stopper member, for example, a screw member.

The probe card 6 will be specifically described with reference to FIG.

The configuration of the probe card 6 includes a first wiring board, for example, a printed board 7, a fixing member 6a for fixing the vicinity of the opening 7a of the printed board 7, and a fixing such that the printed board 7 is pushed into the fixing member 6a. Fixing ring 8 to be
It is composed of a second wiring board on which probe needles are formed, for example, a probe needle board 9 so as to be electrically connected to the contact portion of the printed board 7.

The printed board 7 is constituted by a printed board which is printed and wired on an insulating member such as a glass epoxy resin.

A contact pin, for example, a pogo pin (trade name) 10, which is planted around the periphery of the opening 7a of the printed circuit board 7, is arranged so as to face the DUT. When the pogo pins (trade name) 10 are fixed to the printed circuit board 7 by soldering or the like, the mounting is weak.
It is provided in a ring shape to prevent the 10 from falling. The reinforcing member 11 is formed of a non-plastic laminate,
6a has a projection 11a fitted into the opening 6b. The projection 11a is provided with a hole through which the pogo pin 10 can penetrate, and is concentric with the center of the opening 7a of the printed circuit board 7. It is stuck to. A connection terminal is provided at one end of the outer shape of the printed circuit board 7, and a tester and a connection connector 12 are detachably provided at this terminal. Then, the tester signal is conducted to the connection portion 7b of the printed circuit board 7 which is electrically wired. The connection portion 7b is provided along the periphery of an opening 7a formed substantially at the center of the printed circuit board 7.

A contact mechanism is implanted in the connection portion 7b in a direction perpendicular to the printed circuit board 7. The reinforcing member 11 is fixed concentrically, and at the same time, the printed board 7 and the reinforcing member 11 are integrally formed. The printed board 7 having this integral shape will be described as a printed board member 13. The reinforcing member 11 of this printed circuit board member 13
Is provided with a step 11a, and the step 11a has an opening of the fixing member 6a.
6b is formed to be fittable. Further, four holes 7c are provided so that the printed circuit board member 13 is fixed to the fixed member 6a fitted.

The fixing member 6a is a rigid member formed to be slightly larger than the printed board member 13, for example, a width of 250 mm and a length of 200 mm.
A metal member such as aluminum having a height of 20 mm, a height of 4 mm, and a thickness of 4 mm is provided with an opening 6b at the approximate center thereof, into which the protrusion 11a of the reinforcing member 11 can be fitted. The printed circuit board member 13 fitted in the opening 6b is provided so as to be detachable in parallel with the aluminum member.

Further, the outer periphery of the fixing member 6a is configured to be attached to the head plate 5 of the probe device.

The fixing ring 8 is arranged so as to sandwich the printed circuit board member 13 placed on the fixing member 6a, and is fixed from above the fixing ring 8 with screws or the like. That is, the fixing ring 8 is formed in a ring shape, and holes through which the screw members penetrate in the direction in which the bottom surface of the ring shape sandwiches the printed board member 13 are provided at equal intervals.

As shown in FIG. 1, the probe needle substrate 9 has an outer shape that is slightly larger than the circumference of the pogo pin 10 provided on the periphery of the opening 7a opened substantially at the center of the printed circuit board member 13. . The fixing member 6a
The screw grooves for removably fixing are arranged evenly.

An opening 9a is formed concentrically with the outer shape, and a plurality of probe needles 14 are provided so as to gather at the center. On the bottom surface, the probe needle substrate 9 extends from the lower surface direction to the upper surface direction.
The thread groove is threaded so that the can be attached by the screw member 15. Here, when the probe needle substrate 9 is attached, the contact surface 9a of the probe needle substrate 9 presses and contacts the tip of the pogo pin 10.

The operation of the probe card 6 will be described. The above-described printed circuit board member 13 is fitted into an opening 6b opened substantially at the center of the above-described fixing member 6a. The fixing ring 8 is placed from the upper surface direction to the lower surface direction of the fitted printed circuit board member 13, and the printed circuit board member 13 is detachably fixed to the fixing member 6 a with the screw member 15. In the fixed printed circuit board member 13, the pogo pins 10 are arranged on the bottom surface of the fixed member 6a.

Next, the operation will be described. The loader unit 1 takes out and transports one wafer from the cassette, pre-aligns the wafer, and transfers it to the inspection unit 2. In the inspection section 2, the wafer is transferred to the probe card fixing section 3 after the alignment. In the probe card 6 of the probe card fixing section 3, the probe needles 14 are brought into contact with the chip electrodes of the wafer to set the overdrive amount, and the electrical characteristics of the wafer are tested by energization. here,
It is essential that the probe card 6 does not transmit to the probe needle by resonating with the vibration generated by the probe device itself.

In the probe device of the present embodiment, the vibration generated by the probe device itself is not resonated. That is, since the printed board 7 and the probe needle board 9 are fixed to the fixing member 6b, which is a rigid member, resonance of vibration generated by the probe device itself is drastically reduced.

(Effects of the Invention) As described above, according to the first aspect, the first wiring board is arranged via the reinforcing member on the upper surface of the fixing member made of a rigid metal member fixed to the head plate, and fixed. A second wiring board having a probe needle is disposed on the lower surface of the member, and the first wiring board is detachably fixed to the fixing member by a screw member from above, and the second wiring board is detachably mounted to the fixing member by a screw member from below. The fixing member is fixed as possible and has a sandwich structure with respect to the fixing member from above and below.

Therefore, there is an effect that stable measurement can be performed without being transmitted to the probe needle by resonating with vibration generated by the probe device itself, and the first and second wiring boards can be easily attached to and detached from the fixed member. In addition, by reinforcing and supporting the contact pin on the convex portion of the reinforcing member, the contact pin can be prevented from falling down and deformed, and the reliability of electrical conduction can be improved.

According to the second aspect, in addition to the first aspect, the first wiring board can be prevented from being deformed by pressing and fixing the first wiring board from above with the fixing ring.

According to the third aspect, by providing a plurality of types of first wiring boards, which are different for each test item or test object, detachably with respect to a fixed member made of a rigid metal member,
The test can be performed by selectively and easily replacing the first wiring board for each test item or test object, and the working time can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view for explaining a characteristic probe card of this embodiment, FIG. 2 is an explanatory view for explaining the configuration of a printed circuit board and a fixing member of FIG. 1, and FIG. 3 is a probe card of FIG. FIG. 4 is an explanatory view for explaining a head plate fixing part provided on a head plate, and FIG. 4 is an external view explanatory view of one embodiment in which the present embodiment is applied to a probe device. 1 Loader part 2, inspection part 3, probe card fixing part 6, probe card 6a fixing member 6b
... Opening, 7 ... Printed circuit board, 7a ... Opening, 7b ...
Connection part, 8 ... fixed ring, 9 ... probe needle board, 10
...... Pogo pins, 11 ... Reinforcing members, 11a ... Protrusions.

Claims (3)

(57) [Claims] 1. A fixing member made of a rigid metal member fixed to a head plate of a probe device and having an opening in a part thereof, and a projection provided on an upper surface of the fixing member and fitted to the opening. A first wiring board which is detachably fixed to the upper surface of the fixing member from above by a screw member via the reinforcing member, and which is detachably fixed to the lower surface of the fixing member by a screw member from below. A probe, comprising: a second wiring board having a set probe needle; and a contact pin reinforced and supported by a convex portion of the reinforcing member to electrically connect the first wiring board and the second wiring board. card. 2. A fixing member comprising a rigid metal member fixed to a head plate of a probe device and having an opening in a part thereof, and a projection provided on an upper surface of the fixing member and fitted in the opening. A first wiring board mounted on the upper surface of the fixed member via the reinforcing member, and a first wiring board mounted on the upper surface of the first wiring board so as to surround the opening of the fixed member, and From the first by the screw member
A second wiring board having a fixing ring for detachably fixing the wiring board and the reinforcing member to the fixing member, a second wiring board having a probe needle detachably fixed to a lower surface of the fixing member from below with a screw member, and the reinforcing member And a contact pin which is reinforced and supported by the convex portion and electrically connects the first wiring board and the second wiring board. 3. A probe card in which a probe needle is removably mounted on an electrical connection portion of a first wiring board provided with electrical wiring, and an electrical connection portion of a second wiring board electrically connected with a probe needle. In the method of testing by bringing the probe needle into contact with the electrode portion of the device under test, a plurality of types of first wiring boards different for each test item or device under test are formed from a metal member having rigidity by a screw member from above. A test method, wherein the test is performed by selectively replacing the first wiring board with the fixing member for each test item or test object.