IN2014DN08606A - - Google Patents
Info
- Publication number
- IN2014DN08606A IN2014DN08606A IN8606DEN2014A IN2014DN08606A IN 2014DN08606 A IN2014DN08606 A IN 2014DN08606A IN 8606DEN2014 A IN8606DEN2014 A IN 8606DEN2014A IN 2014DN08606 A IN2014DN08606 A IN 2014DN08606A
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
- H04N25/533—Control of the integration time by using differing integration times for different sensor regions
- H04N25/535—Control of the integration time by using differing integration times for different sensor regions by dynamic region selection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/58—Control of the dynamic range involving two or more exposures
- H04N25/581—Control of the dynamic range involving two or more exposures acquired simultaneously
- H04N25/585—Control of the dynamic range involving two or more exposures acquired simultaneously with pixels having different sensitivities within the sensor, e.g. fast or slow pixels or pixels having different sizes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012082312 | 2012-03-30 | ||
| JP2012128092 | 2012-06-05 | ||
| PCT/JP2013/002148 WO2013145765A1 (ja) | 2012-03-30 | 2013-03-28 | 撮像ユニット、撮像装置および撮像制御プログラム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014DN08606A true IN2014DN08606A (ru) | 2015-05-22 |
Family
ID=49259058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN8606DEN2014 IN2014DN08606A (ru) | 2012-03-30 | 2014-10-14 |
Country Status (7)
| Country | Link |
|---|---|
| US (6) | US9571767B2 (ru) |
| EP (2) | EP2833620B1 (ru) |
| JP (7) | JP6277954B2 (ru) |
| CN (6) | CN110299373B (ru) |
| IN (1) | IN2014DN08606A (ru) |
| RU (2) | RU2018130065A (ru) |
| WO (1) | WO2013145765A1 (ru) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1104381B (de) * | 1959-10-03 | 1961-04-06 | Karrenberg Fa Wilhelm | Tuerschloss |
| CN110299373B (zh) * | 2012-03-30 | 2024-10-01 | 株式会社尼康 | 拍摄装置 |
| WO2013164915A1 (ja) * | 2012-05-02 | 2013-11-07 | 株式会社ニコン | 撮像装置 |
| EP2975839B1 (en) | 2013-03-14 | 2020-11-25 | Nikon Corporation | Image-capturing unit, image-capturing device, and image-capture control program |
| EP3018893A4 (en) | 2013-07-04 | 2016-11-30 | Nikon Corp | ELECTRONIC DEVICE, CONTROL METHOD FOR ELECTRONIC DEVICE AND CONTROL PROGRAM |
| TWI539584B (zh) * | 2014-05-12 | 2016-06-21 | 原相科技股份有限公司 | 具增進的收光效率的前感光式半導體結構及其製作方法 |
| JP6380986B2 (ja) * | 2015-03-12 | 2018-08-29 | 富士フイルム株式会社 | 撮影装置および方法 |
| CN113099136A (zh) | 2015-09-30 | 2021-07-09 | 株式会社尼康 | 拍摄元件 |
| WO2017104765A1 (ja) | 2015-12-16 | 2017-06-22 | 株式会社ニコン | 撮像装置および動き検出方法 |
| JP2018019335A (ja) * | 2016-07-29 | 2018-02-01 | ソニー株式会社 | 撮像素子および撮像装置 |
| KR102477352B1 (ko) * | 2017-09-29 | 2022-12-15 | 삼성전자주식회사 | 반도체 패키지 및 이미지 센서 |
| KR102430496B1 (ko) | 2017-09-29 | 2022-08-08 | 삼성전자주식회사 | 이미지 센싱 장치 및 그 제조 방법 |
| EP3720116A4 (en) * | 2017-11-30 | 2020-10-07 | Sony Corporation | IMAGING DEVICE, IMAGING PROCESS, AND IMAGING ELEMENT |
| JP6610648B2 (ja) * | 2017-12-26 | 2019-11-27 | 株式会社ニコン | 撮像装置 |
| KR102499033B1 (ko) * | 2018-01-31 | 2023-02-13 | 삼성전자주식회사 | 스택형 이미지 센서 및 스택형 이미지 센서를 포함하는 전자 장치 |
| JP2018157602A (ja) * | 2018-06-14 | 2018-10-04 | 株式会社ニコン | 撮像装置 |
| JP6954391B2 (ja) * | 2018-06-14 | 2021-10-27 | 株式会社ニコン | 電子機器 |
| JP2020014110A (ja) * | 2018-07-18 | 2020-01-23 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、撮像装置、および、固体撮像素子の制御方法 |
| JP7245016B2 (ja) | 2018-09-21 | 2023-03-23 | キヤノン株式会社 | 光電変換装置および撮像システム |
| JP7250555B2 (ja) * | 2019-02-18 | 2023-04-03 | キヤノン株式会社 | 撮像素子、および撮像装置 |
| US11336854B2 (en) | 2019-03-01 | 2022-05-17 | Brookman Technology, Inc. | Distance image capturing apparatus and distance image capturing method using distance image capturing apparatus |
| CN119629448A (zh) | 2019-07-26 | 2025-03-14 | 富士胶片株式会社 | 成像元件、摄像装置、成像元件的工作方法及计算机程序产品 |
| JP7516031B2 (ja) * | 2019-11-19 | 2024-07-16 | キヤノン株式会社 | 撮像装置及び撮像システム |
| EP4102910A4 (en) | 2020-02-05 | 2023-05-10 | Panasonic Intellectual Property Corporation of America | COMMUNICATION TERMINAL AND METHOD |
| JP7660551B2 (ja) * | 2020-02-18 | 2025-04-11 | ヌヴォトンテクノロジージャパン株式会社 | 固体撮像装置、及びそれを用いる撮像装置 |
| US12349495B2 (en) * | 2020-02-21 | 2025-07-01 | Canon Kabushiki Kaisha | Semiconductor device and method for manufacturing semiconductor device |
| KR20220022019A (ko) * | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 입력 감지 방법 및 이를 포함하는 입력 감지 장치 |
| JP7099560B2 (ja) * | 2021-01-19 | 2022-07-12 | 株式会社ニコン | 撮像素子及び撮像装置 |
Family Cites Families (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626410B2 (ja) * | 1986-04-14 | 1994-04-06 | 富士写真フイルム株式会社 | カラ−イメ−ジセンサ− |
| JPS6489720A (en) * | 1987-09-30 | 1989-04-04 | Toshiba Corp | Line switching device |
| US5262871A (en) * | 1989-11-13 | 1993-11-16 | Rutgers, The State University | Multiple resolution image sensor |
| JPH06113195A (ja) * | 1992-09-29 | 1994-04-22 | Canon Inc | ビデオカメラ装置 |
| US5452004A (en) * | 1993-06-17 | 1995-09-19 | Litton Systems, Inc. | Focal plane array imaging device with random access architecture |
| JP2541470B2 (ja) * | 1993-08-26 | 1996-10-09 | 日本電気株式会社 | 固体撮像素子 |
| US5543838A (en) * | 1993-08-31 | 1996-08-06 | Xerox Corporation | Signal multiplexing system for an image sensor array |
| JP3397469B2 (ja) * | 1994-10-20 | 2003-04-14 | キヤノン株式会社 | 固体撮像装置 |
| US6977684B1 (en) * | 1998-04-30 | 2005-12-20 | Canon Kabushiki Kaisha | Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus |
| US6693670B1 (en) * | 1999-07-29 | 2004-02-17 | Vision - Sciences, Inc. | Multi-photodetector unit cell |
| JP2001103379A (ja) * | 1999-09-28 | 2001-04-13 | Minolta Co Ltd | 固体撮像装置 |
| JP3713418B2 (ja) * | 2000-05-30 | 2005-11-09 | 光正 小柳 | ３次元画像処理装置の製造方法 |
| US20030049925A1 (en) | 2001-09-10 | 2003-03-13 | Layman Paul Arthur | High-density inter-die interconnect structure |
| CN1234234C (zh) * | 2002-09-30 | 2005-12-28 | 松下电器产业株式会社 | 固体摄像器件及使用该固体摄像器件的设备 |
| DE602004021985D1 (de) * | 2003-03-25 | 2009-08-27 | Panasonic Corp | Bildaufnahmevorrichtung, die Detailverlust schattiger Bereiche vermeidet |
| US20050212936A1 (en) * | 2004-03-25 | 2005-09-29 | Eastman Kodak Company | Extended dynamic range image sensor with fixed pattern noise reduction |
| JP4349232B2 (ja) | 2004-07-30 | 2009-10-21 | ソニー株式会社 | 半導体モジュール及びｍｏｓ型固体撮像装置 |
| JP4277216B2 (ja) | 2005-01-13 | 2009-06-10 | ソニー株式会社 | 撮像装置及び撮像結果の処理方法 |
| TW201101476A (en) * | 2005-06-02 | 2011-01-01 | Sony Corp | Semiconductor image sensor module and method of manufacturing the same |
| JP4792976B2 (ja) * | 2006-01-10 | 2011-10-12 | セイコーエプソン株式会社 | 撮像装置 |
| JP4649623B2 (ja) | 2006-01-18 | 2011-03-16 | 国立大学法人静岡大学 | 固体撮像装置及びその画素信号の読みだし方法 |
| JP4487944B2 (ja) * | 2006-02-09 | 2010-06-23 | ソニー株式会社 | 固体撮像装置 |
| JP2007220866A (ja) * | 2006-02-16 | 2007-08-30 | Sony Corp | 半導体装置 |
| JP2007228019A (ja) * | 2006-02-21 | 2007-09-06 | Olympus Corp | 撮像装置 |
| JP2007228460A (ja) | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
| JP5043448B2 (ja) * | 2006-03-10 | 2012-10-10 | キヤノン株式会社 | 放射線撮像装置及び放射線撮像システム |
| JP3996618B1 (ja) * | 2006-05-11 | 2007-10-24 | 総吉 廣津 | 半導体撮像素子 |
| WO2007134473A1 (de) * | 2006-05-22 | 2007-11-29 | Waeny Martin | Bildaufnehmer mit lokaler adaptiver belichtungsregelung |
| US7714903B2 (en) * | 2006-08-29 | 2010-05-11 | Zoran Corporation | Wide dynamic range image capturing system method and apparatus |
| CN101174645A (zh) * | 2006-11-03 | 2008-05-07 | 台湾积体电路制造股份有限公司 | 图像感测装置及其形成方法 |
| JP4843461B2 (ja) * | 2006-11-13 | 2011-12-21 | 株式会社東芝 | 固体撮像装置 |
| US8102436B2 (en) * | 2006-12-18 | 2012-01-24 | Sony Corporation | Image-capturing apparatus and method, recording apparatus and method, and reproducing apparatus and method |
| US8144214B2 (en) | 2007-04-18 | 2012-03-27 | Panasonic Corporation | Imaging apparatus, imaging method, integrated circuit, and storage medium |
| JP5133085B2 (ja) * | 2007-04-18 | 2013-01-30 | パナソニック株式会社 | 撮像装置および撮像方法 |
| JP4337911B2 (ja) * | 2007-05-24 | 2009-09-30 | ソニー株式会社 | 撮像装置、撮像回路、および撮像方法 |
| WO2009020031A1 (en) * | 2007-08-06 | 2009-02-12 | Canon Kabushiki Kaisha | Image sensing apparatus |
| US7969492B2 (en) | 2007-08-28 | 2011-06-28 | Sanyo Electric Co., Ltd. | Image pickup apparatus |
| JP2009055540A (ja) * | 2007-08-29 | 2009-03-12 | Sanyo Electric Co Ltd | 撮像装置 |
| JP2009055433A (ja) * | 2007-08-28 | 2009-03-12 | Sanyo Electric Co Ltd | 撮像装置 |
| JP4693822B2 (ja) | 2007-08-29 | 2011-06-01 | キヤノン株式会社 | 固体撮像装置、カメラ及び情報処理装置 |
| JP5223343B2 (ja) * | 2008-01-10 | 2013-06-26 | 株式会社ニコン | 固体撮像素子 |
| TWI444040B (zh) * | 2008-06-10 | 2014-07-01 | Univ Tohoku | Solid-state imaging element |
| JP5266916B2 (ja) * | 2008-07-09 | 2013-08-21 | ソニー株式会社 | 撮像素子、カメラ、撮像素子の制御方法、並びにプログラム |
| JP5132497B2 (ja) * | 2008-09-16 | 2013-01-30 | キヤノン株式会社 | 撮像装置および撮像装置の制御方法 |
| JP2010093549A (ja) * | 2008-10-08 | 2010-04-22 | Fujifilm Corp | 撮像装置及び固体撮像素子の駆動方法 |
| JP5247397B2 (ja) * | 2008-12-05 | 2013-07-24 | キヤノン株式会社 | 撮像装置及び撮像方法 |
| JP2010166304A (ja) * | 2009-01-15 | 2010-07-29 | Fujifilm Corp | 撮影装置および撮影装置の制御方法並びにプログラム |
| JP5524495B2 (ja) * | 2009-03-10 | 2014-06-18 | 富士機械製造株式会社 | 撮像システムおよび電子回路部品装着機 |
| JP4835710B2 (ja) | 2009-03-17 | 2011-12-14 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器 |
| JP4941490B2 (ja) * | 2009-03-24 | 2012-05-30 | ソニー株式会社 | 固体撮像装置、及び電子機器 |
| JP2010283787A (ja) * | 2009-06-08 | 2010-12-16 | Panasonic Corp | 撮像装置 |
| CN101931756B (zh) * | 2009-06-19 | 2012-03-21 | 比亚迪股份有限公司 | 一种提高cmos图像传感器动态范围的装置和方法 |
| JP5482025B2 (ja) * | 2009-08-28 | 2014-04-23 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP5521721B2 (ja) * | 2009-08-28 | 2014-06-18 | ソニー株式会社 | 撮像素子およびカメラシステム |
| JP5342969B2 (ja) * | 2009-09-10 | 2013-11-13 | 富士フイルム株式会社 | 撮像装置及び撮像方法 |
| JP2011091561A (ja) * | 2009-10-21 | 2011-05-06 | Panasonic Corp | 固体撮像素子、その駆動方法及びカメラ |
| JP5721994B2 (ja) * | 2009-11-27 | 2015-05-20 | 株式会社ジャパンディスプレイ | 放射線撮像装置 |
| KR101133733B1 (ko) * | 2009-12-10 | 2012-04-09 | 삼성전자주식회사 | 전자 셔터를 이용한 다단계 노출 방법 및 이를 이용한 촬영 장치 |
| KR20110076729A (ko) * | 2009-12-18 | 2011-07-06 | 삼성전자주식회사 | 전자 셔터를 이용한 다단계 노출 이미지 획득 방법 및 이를 이용한 촬영 장치 |
| JP2011243704A (ja) * | 2010-05-17 | 2011-12-01 | Panasonic Corp | 固体撮像装置 |
| JP2011244309A (ja) * | 2010-05-20 | 2011-12-01 | Sony Corp | 画像処理装置、画像処理方法及びプログラム |
| JP5631643B2 (ja) | 2010-06-24 | 2014-11-26 | オリンパス株式会社 | 読出制御装置、読出制御方法、撮像装置、固体撮像装置およびプログラム |
| JP2012010104A (ja) * | 2010-06-24 | 2012-01-12 | Sony Corp | 画像処理装置、撮像装置、画像処理方法、およびプログラム |
| JP4657379B1 (ja) * | 2010-09-01 | 2011-03-23 | 株式会社ナックイメージテクノロジー | 高速度ビデオカメラ |
| JP5500007B2 (ja) * | 2010-09-03 | 2014-05-21 | ソニー株式会社 | 固体撮像素子およびカメラシステム |
| CN102096273B (zh) * | 2010-12-29 | 2012-08-22 | 北京空间机电研究所 | 一种基于目标特性的空间相机自动曝光方法 |
| JP2012235332A (ja) * | 2011-05-02 | 2012-11-29 | Sony Corp | 撮像装置、および撮像装置制御方法、並びにプログラム |
| CN110299373B (zh) * | 2012-03-30 | 2024-10-01 | 株式会社尼康 | 拍摄装置 |
-
2013
- 2013-03-28 CN CN201910490100.XA patent/CN110299373B/zh active Active
- 2013-03-28 WO PCT/JP2013/002148 patent/WO2013145765A1/ja active Application Filing
- 2013-03-28 RU RU2018130065A patent/RU2018130065A/ru not_active Application Discontinuation
- 2013-03-28 CN CN201910490111.8A patent/CN110148605A/zh active Pending
- 2013-03-28 CN CN201910490680.2A patent/CN110177227B/zh active Active
- 2013-03-28 CN CN201910490295.8A patent/CN110149485B/zh active Active
- 2013-03-28 EP EP13768038.5A patent/EP2833620B1/en active Active
- 2013-03-28 EP EP19151551.9A patent/EP3490247B1/en active Active
- 2013-03-28 CN CN201380018222.XA patent/CN104247401B/zh active Active
- 2013-03-28 RU RU2014143824A patent/RU2666761C2/ru active
- 2013-03-28 JP JP2014507447A patent/JP6277954B2/ja active Active
- 2013-03-28 CN CN201910490685.5A patent/CN110265415A/zh active Pending
-
2014
- 2014-09-29 US US14/500,030 patent/US9571767B2/en active Active
- 2014-10-14 IN IN8606DEN2014 patent/IN2014DN08606A/en unknown
-
2017
- 2017-01-09 US US15/401,683 patent/US9967480B2/en active Active
-
2018
- 2018-01-18 JP JP2018006808A patent/JP6593470B2/ja active Active
- 2018-01-18 JP JP2018006805A patent/JP6593468B2/ja active Active
- 2018-01-18 JP JP2018006807A patent/JP6593469B2/ja active Active
- 2018-04-05 US US15/946,168 patent/US10652485B2/en active Active
-
2019
- 2019-09-26 JP JP2019175860A patent/JP2020017987A/ja active Pending
-
2020
- 2020-04-09 US US16/844,231 patent/US11082646B2/en active Active
-
2021
- 2021-07-09 US US17/371,751 patent/US11743608B2/en active Active
- 2021-11-17 JP JP2021186944A patent/JP7283520B2/ja active Active
-
2023
- 2023-05-16 JP JP2023080583A patent/JP2023103373A/ja active Pending
- 2023-07-18 US US18/223,262 patent/US20230362504A1/en active Pending