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HK1204089A1 - Movable body drive system and method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method - Google Patents

Movable body drive system and method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method Download PDF

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Publication number
HK1204089A1
HK1204089A1 HK15104424.1A HK15104424A HK1204089A1 HK 1204089 A1 HK1204089 A1 HK 1204089A1 HK 15104424 A HK15104424 A HK 15104424A HK 1204089 A1 HK1204089 A1 HK 1204089A1
Authority
HK
Hong Kong
Prior art keywords
heads
measurement
stage
head
wafer
Prior art date
Application number
HK15104424.1A
Other languages
English (en)
Chinese (zh)
Other versions
HK1204089B (en
Inventor
柴崎祐
柴崎佑一
Original Assignee
株式会社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社尼康 filed Critical 株式会社尼康
Publication of HK1204089A1 publication Critical patent/HK1204089A1/xx
Publication of HK1204089B publication Critical patent/HK1204089B/xx

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70758Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Transform (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
HK15104424.1A 2006-08-31 2015-05-11 Movable body drive system and method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method HK1204089B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006236783 2006-08-31
JP2006-236783 2006-08-31

Publications (2)

Publication Number Publication Date
HK1204089A1 true HK1204089A1 (en) 2015-11-06
HK1204089B HK1204089B (en) 2018-03-02

Family

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Also Published As

Publication number Publication date
JP2016197244A (ja) 2016-11-24
CN104375390A (zh) 2015-02-25
KR101477465B1 (ko) 2014-12-29
TW201633016A (zh) 2016-09-16
JP2015212834A (ja) 2015-11-26
JP2017062502A (ja) 2017-03-30
US20140146300A1 (en) 2014-05-29
KR20150015008A (ko) 2015-02-09
WO2008026732A1 (fr) 2008-03-06
HK1192949A1 (zh) 2014-09-05
KR101669785B1 (ko) 2016-10-27
TWI609252B (zh) 2017-12-21
EP2071611A4 (en) 2011-04-20
US10067428B2 (en) 2018-09-04
US20170102625A1 (en) 2017-04-13
US20170097577A1 (en) 2017-04-06
JP2015005761A (ja) 2015-01-08
JP6172547B2 (ja) 2017-08-02
CN104375390B (zh) 2017-10-13
JP2015232731A (ja) 2015-12-24
CN103645608B (zh) 2016-04-20
JP2014078754A (ja) 2014-05-01
EP2988320A1 (en) 2016-02-24
KR20170076802A (ko) 2017-07-04
TW201418908A (zh) 2014-05-16
JP2016027412A (ja) 2016-02-18
JP6536861B2 (ja) 2019-07-03
SG10201407478PA (en) 2015-01-29
TW200832084A (en) 2008-08-01
CN104460241A (zh) 2015-03-25
TW201809914A (zh) 2018-03-16
TWI655517B (zh) 2019-04-01
JPWO2008026732A1 (ja) 2010-01-21
US20180373169A1 (en) 2018-12-27
KR101585359B1 (ko) 2016-01-14
HK1218186A1 (en) 2017-02-03
JP6160934B2 (ja) 2017-07-12
EP2071611A1 (en) 2009-06-17
KR20140010469A (ko) 2014-01-24
JP2012147012A (ja) 2012-08-02
KR20150013908A (ko) 2015-02-05
KR20160006803A (ko) 2016-01-19
KR20090069256A (ko) 2009-06-30
KR101648289B1 (ko) 2016-08-12
CN104460241B (zh) 2017-04-05
US8675171B2 (en) 2014-03-18
JP6016203B2 (ja) 2016-10-26
JP2018124570A (ja) 2018-08-09
US20080106722A1 (en) 2008-05-08
TW201633015A (zh) 2016-09-16
KR101780614B1 (ko) 2017-09-21
HK1202932A1 (en) 2015-10-09
KR20150013836A (ko) 2015-02-05
TWI610149B (zh) 2018-01-01
KR20150145267A (ko) 2015-12-29
KR20160042165A (ko) 2016-04-18
KR20150066606A (ko) 2015-06-16
CN101405839B (zh) 2014-12-24
TWI442191B (zh) 2014-06-21
JP5545314B2 (ja) 2014-07-09
JP6218126B2 (ja) 2017-10-25
KR101479347B1 (ko) 2015-01-05
KR101556493B1 (ko) 2015-10-01
KR101706027B1 (ko) 2017-02-10
JP2016027413A (ja) 2016-02-18
SG174744A1 (en) 2011-10-28
TW201418907A (zh) 2014-05-16
KR101638306B1 (ko) 2016-07-08
JP2013048288A (ja) 2013-03-07
JP2015111696A (ja) 2015-06-18
CN104656377B (zh) 2017-07-07
JP5700365B2 (ja) 2015-04-15
KR101604246B1 (ko) 2016-03-17
KR20150103310A (ko) 2015-09-09
JP6041112B2 (ja) 2016-12-07
EP2071611B1 (en) 2019-05-01
EP2988320B1 (en) 2019-04-10
CN103645608A (zh) 2014-03-19
US9568844B2 (en) 2017-02-14
KR101612685B1 (ko) 2016-04-26
US20180341187A1 (en) 2018-11-29
JP2016114950A (ja) 2016-06-23
CN104656377A (zh) 2015-05-27
TWI547771B (zh) 2016-09-01
JP5850108B2 (ja) 2016-02-03
KR101555793B1 (ko) 2015-09-24
US10073359B2 (en) 2018-09-11
KR101669788B1 (ko) 2016-10-27
KR20180056819A (ko) 2018-05-29
TWI534561B (zh) 2016-05-21
JP6331235B2 (ja) 2018-05-30
HK1207160A1 (en) 2016-01-22
JP5907397B2 (ja) 2016-04-26
JP6164504B2 (ja) 2017-07-19
CN101405839A (zh) 2009-04-08
KR101862528B1 (ko) 2018-05-29
KR20140081901A (ko) 2014-07-01
KR20140010470A (ko) 2014-01-24
JP5582368B2 (ja) 2014-09-03
KR20160043123A (ko) 2016-04-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210826