EP1002644A2 - Production of support for lithographic printing plate. - Google Patents
Production of support for lithographic printing plate. Download PDFInfo
- Publication number
- EP1002644A2 EP1002644A2 EP99203617A EP99203617A EP1002644A2 EP 1002644 A2 EP1002644 A2 EP 1002644A2 EP 99203617 A EP99203617 A EP 99203617A EP 99203617 A EP99203617 A EP 99203617A EP 1002644 A2 EP1002644 A2 EP 1002644A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- salt
- substrate
- treatment
- aluminium
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000000034 method Methods 0.000 claims abstract description 47
- 150000003839 salts Chemical class 0.000 claims abstract description 27
- 239000007864 aqueous solution Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000002243 precursor Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 230000000737 periodic effect Effects 0.000 claims abstract description 8
- 238000011282 treatment Methods 0.000 claims description 46
- 239000004411 aluminium Substances 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 40
- -1 poly(acrylic acid) Polymers 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 238000007743 anodising Methods 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 7
- 150000007524 organic acids Chemical class 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- VVXLFFIFNVKFBD-UHFFFAOYSA-N 4,4,4-trifluoro-1-phenylbutane-1,3-dione Chemical compound FC(F)(F)C(=O)CC(=O)C1=CC=CC=C1 VVXLFFIFNVKFBD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 238000005238 degreasing Methods 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920002125 Sokalan® Polymers 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 3
- 239000011707 mineral Substances 0.000 claims description 3
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910021653 sulphate ion Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- 229910002651 NO3 Inorganic materials 0.000 claims 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 150000003841 chloride salts Chemical class 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005299 abrasion Methods 0.000 abstract description 6
- 238000010186 staining Methods 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 235000005985 organic acids Nutrition 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 150000001243 acetic acids Chemical class 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 235000011167 hydrochloric acid Nutrition 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- QDZRBIRIPNZRSG-UHFFFAOYSA-N titanium nitrate Chemical compound [O-][N+](=O)O[Ti](O[N+]([O-])=O)(O[N+]([O-])=O)O[N+]([O-])=O QDZRBIRIPNZRSG-UHFFFAOYSA-N 0.000 description 2
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 159000000013 aluminium salts Chemical class 0.000 description 1
- 229910000329 aluminium sulfate Inorganic materials 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Chemical class O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- NXKAMHRHVYEHER-UHFFFAOYSA-J hafnium(4+);disulfate Chemical compound [Hf+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O NXKAMHRHVYEHER-UHFFFAOYSA-J 0.000 description 1
- ZFMIEZYJPABXSU-UHFFFAOYSA-J hafnium(4+);tetraacetate Chemical compound [Hf+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O ZFMIEZYJPABXSU-UHFFFAOYSA-J 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000002889 oleic acids Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
- ZXAUZSQITFJWPS-UHFFFAOYSA-J zirconium(4+);disulfate Chemical compound [Zr+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZXAUZSQITFJWPS-UHFFFAOYSA-J 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/12—Anodising more than once, e.g. in different baths
Definitions
- This invention relates to a method for the production of a metallic support for use as a substrate for a lithographic printing plate. More specifically, the invention provides a method for the surface treatment of a metallic sheet, most particularly an aluminium sheet, whereby a substrate having particularly favourable lithographic properties may be obtained.
- aluminium substrates intended for use as support materials for lithographic printing plates and their precursors have generally been subjected to surface treatments prior to application of a light sensitive coating material. These treatments serve to improve the lithographic properties of the aluminium, in particular, its hydrophilicity. This is important during printing operations, since the basis of lithography is the ability of the lithographic plate to accept ink in image areas whilst rejecting ink and accepting water in background (non-image) areas, so that the printed image remains free from dirt and other contamination in said background areas.
- the light-sensitive coating of a lithographic printing plate precursor is imagewise exposed to radiation in order to change the solubility characteristics of the coating in the radiation-struck areas. The soluble areas are subsequently dissolved away by treatment with a developing solution, to expose the aluminium surface which must be capable of rejecting ink and accepting water.
- a typical surface treatment comprises an initial graining treatment, wherein the aluminium surface is roughened by either mechanical or electrochemical means, and a subsequent anodising treatment, by means of which a layer of aluminium oxide is formed on the surface of the aluminium.
- Anodising treatments may, for example, be carried out by passing a grained aluminium web through a bath of a suitable anodising acid, such as sulphuric or phosphoric acid, or a mixture thereof, whilst an electric current flows through the anodising bath and the web serves as the anode.
- post-anodic dip - is generally applied in order to improve specific lithographic printing properties of the substrate, such as clean up of background areas, coating adhesion or corrosion resistance, and will typically involve passing the aluminium through a solution, often an aqueous solution, of the chosen reagent.
- aqueous solutions containing, for example, sodium carbonate or bicarbonate, poly(acrylic acid) or various aqueous-soluble copolymers.
- the present invention seeks to provide a means whereby the costly and time-consuming substrate treatment steps involved in the preparation of suitable aluminium support materials for use in the preparation of lithographic printing plate precursors may be reduced in number and simplified, thereby facilitating substantial cost savings.
- a process for the manufacture of a support for a lithographic printing plate precursor comprising at least the steps of:
- Said metallic substrate may comprise any conducting metallic substrate but, most preferably, it comprises aluminium or an aluminium alloy containing small amounts of, for example, manganese, nickel, cobalt, zinc, iron, silicon or zirconium.
- Said substrate is generally provided in the form of a continuous web or roll of metal or metal alloy.
- said substrate is subjected to a degreasing treatment prior to said treatment with an aqueous solution of a salt of a metal.
- Said degreasing treatment is most conveniently carried out by means of an aqueous alkaline solution.
- said treatment involves passing said substrate through a bath containing a 5-20% w/v solution of, for example, sodium or potassium hydroxide.
- said substrate is rinsed with water prior to further treatment.
- Said treatment of said surface or surfaces with an aqueous solution comprising a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table is preferably carried out by immersing said substrate in an aqueous solution, preferably containing from 0.001% to 5.0% (w/w) (more preferably from 0.01% to 1.0%) of said salt at a preferred temperature of from 5° to 80°C (more preferably from 15° to 40°C) for a preferred dwell time of from 1 second to 60 minutes (more preferably from 15 seconds to 5 minutes) at a pH of between 0 and 13 (preferably from 1 to 5, and most preferably in the region of 3).
- Said aqueous solution also preferably contains aluminium ions in an amount of from 0.1 to 50,000 ppm; said aluminium ions may be added to said aqueous solution in the form of any convenient aluminium salt or, in the case of an aluminium substrate, may be present as a result of dissolution from said substrate.
- Suitable salts which may be used for the said treatment include, for example, salts of titanium, zirconium, hafnium, molybdenum, tungsten, vanadium, manganese, nickel, copper, zinc, tin, niobium, tantalum, cerium, selenium, silicon, cobalt or iron.
- Said salts my include the metal either as the cation, for example in halide, sulphate or nitrate salts, or as part of a complexed anion.
- the hafnium, zirconium or titanium salt comprises a salt wherein the metal is present in a metal-complex anion, such as a chlorotitanate or fluorozirconate anion.
- a metal-complex anion such as a chlorotitanate or fluorozirconate anion.
- alkali metal fluorozirconates particularly potassium hexafluorozirconate.
- aqueous solution containing a metal salt may be incorporated in said aqueous solution containing a metal salt.
- polymers or copolymers of organic acids may be employed for this purpose, with particularly favourable results being achieved with poly(acrylic acid) or the copolymer of acrylic acid with vinyl phosphonic acid.
- Said materials my be added in an amount of from 0.001% to 5.0% (w/w) (preferably from 0.01% to 1.0%) to the treatment bath.
- the application of the constant voltage or constant current is preferably realised by applying a constant d.c., pulsed d.c., a.c. (sine and square waveforms), biased a.c. or half wave 1-6 phases rectified a.c. voltage of from 0.1 to 1000 V (preferably from 1 V to 100 V) across the treatment bath, using the substrate as one electrode and another electrical conductor, such as platinum, aluminium, carbon, stainless steel or mild steel as the other electrode.
- the aluminium substrate may form the cathode and the other electrical conductor may provide the anode; preferably, however, the aluminium substrate forms the anode, with the other electrical conductor providing the cathode.
- a surface film develops on said substrate, said film having a thickness of from 0.001 to 100 ⁇ m.
- said surface film may be produced with a textured surface finish.
- said substrate may be subjected to a graining treatment prior to said treatment with an aqueous solution of a salt of a metal.
- Said graining treatment may involve mechanical graining, wherein the surface of the substrate is subjected to mechanical forces which may, for example, be achieved by the use of a slurry of very small metal balls or via brush graining techniques.
- electrochemical graining may be employed; said technique comprises passing a substrate through a solution of a mineral or organic acid, or a mixture thereof, such as a mixture of hydrochloric and acetic acids, whilst applying an electric current to the acid solution.
- Typical graining conditions would involve the use of a bath of aqueous hydrochloric acid at a concentration of from 1-10 g/l and a temperature of 5-50°C, with a dwell time of from 1-60 seconds and an applied potential of from 1-40 V. The grained substrate is then rinsed with water prior to further processing.
- said grained substrate Following electrochemical graining, said grained substrate would be subjected to a desmutting treatment in order to remove by-products formed during the course of said electrograining treatment, and deposited on the surface of the substrate.
- a desmutting treatment in order to remove by-products formed during the course of said electrograining treatment, and deposited on the surface of the substrate.
- the process involves treatment of the grained substrate with an aqueous acid or alkali according to the methods well known in the art.
- the substrate is rinsed with water following desmutting.
- the support provided by the method of the present invention may subsequently be coated with a light-sensitive coating to give a lithographic printing plate precursor.
- coatings of the types well known to those skilled in the art may be applied for this purpose, for example, positive-working coatings incorporating quinone diazide derivatives, negative-working coatings incorporating diazo or azide resins or photocrosslinkable resins or silver halide based coatings.
- the coatings may be applied by any of the standard coating techniques known to the skilled person, such as curtain coating, dip coating, meniscus coating, reverse roll coating, and the like.
- the thus-obtained lithographic printing plate precursor may then be imagewise exposed and the non-image areas can be developed away to provide a lithographic printing plate which is subsequently used on a printing press to produce copies.
- Lithographic printing plates produced from aluminium supports obtained by the method of the present invention show good abrasion resistance, corrosion resistance, staining resistance and scumming resistance, both on plate development and on press.
- the surface film produced by the treatment according to the method of the present invention shows excellent coating adhesion in the image areas. Additionally, the plate exhibits very good exposure latitude and solvent resistance.
- a salt of this type may be incorporated in an anodising bath typically containing mineral acids such as sulphuric, phosphoric, nitric, hydrofluoric or chromic acids, or organic acids such as oxalic, tartaric, citric, acetic or oleic acids, or mixtures of these acids, thereby providing a support material which shows the advantageous properties previously discussed when incorporated in a lithographic printing plate.
- mineral acids such as sulphuric, phosphoric, nitric, hydrofluoric or chromic acids
- organic acids such as oxalic, tartaric, citric, acetic or oleic acids, or mixtures of these acids, thereby providing a support material which shows the advantageous properties previously discussed when incorporated in a lithographic printing plate.
- further additions of materials such as polymers or copolymers of organic acids, typically poly(acrylic acid) or the copolymer of acrylic acid with vinylphosphonic acid, may also be incorporated in the said ano
- the inventors have found that the same advantageous properties are also evident when conventionally grained and anodised aluminium substrate is subjected to the said electrochemical treatment in a solution incorporating a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table, optionally in the presence of further additives, such as polymers or copolymers of organic acids, as previously exemplified.
- Such a process does not, however, provide all the benefits of reduced processing as previously described, although dwell time is substantially reduced when compared with a standard immersion treatment.
- the resulting substrate shows improved properties when compared with a conventionally grained and anodised substrate which has been subjected to a prior art post-anodic dip treatment.
- a conventionally degreased, grained and desmutted aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature.
- a constant d.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was rinsed with water and coated with a solution of a naphthoquinone diazide photosensitive resin and a cresol novolak support resin in 2-methoxypropanol to produce a light-sensitive coating layer, and the coated substrate was baked at 130°C for 5 minutes.
- the resulting lithographic printing plate precursor was imagewise exposed to UV light at 100-300 mJ/cm 2 and the non-image areas were developed away with an aqueous alkaline developer solution by immersion for 30 seconds at 20°C.
- the resulting lithographic printing plate was rinsed with water and dried in a stream of cool air and subsequently produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- a conventionally degreased aluminium substrate was immersed for 10 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature.
- a constant d.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press.
- the plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- a conventionally degreased, grained, desmutted and anodised aluminium substrate was immersed for 5 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature.
- An a.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press.
- the plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- a conventionally degreased, grained and desmutted aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of zirconium sulphate (5 g/l) at room temperature.
- a rectified a.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press.
- the plate showed excellent resistance to abrasion, corrosion, and staining/scumming, both during development and on press.
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Abstract
Description
- This invention relates to a method for the production of a metallic support for use as a substrate for a lithographic printing plate. More specifically, the invention provides a method for the surface treatment of a metallic sheet, most particularly an aluminium sheet, whereby a substrate having particularly favourable lithographic properties may be obtained.
- Conventionally, aluminium substrates intended for use as support materials for lithographic printing plates and their precursors have generally been subjected to surface treatments prior to application of a light sensitive coating material. These treatments serve to improve the lithographic properties of the aluminium, in particular, its hydrophilicity. This is important during printing operations, since the basis of lithography is the ability of the lithographic plate to accept ink in image areas whilst rejecting ink and accepting water in background (non-image) areas, so that the printed image remains free from dirt and other contamination in said background areas. Thus, the light-sensitive coating of a lithographic printing plate precursor is imagewise exposed to radiation in order to change the solubility characteristics of the coating in the radiation-struck areas. The soluble areas are subsequently dissolved away by treatment with a developing solution, to expose the aluminium surface which must be capable of rejecting ink and accepting water.
- A typical surface treatment comprises an initial graining treatment, wherein the aluminium surface is roughened by either mechanical or electrochemical means, and a subsequent anodising treatment, by means of which a layer of aluminium oxide is formed on the surface of the aluminium. Anodising treatments may, for example, be carried out by passing a grained aluminium web through a bath of a suitable anodising acid, such as sulphuric or phosphoric acid, or a mixture thereof, whilst an electric current flows through the anodising bath and the web serves as the anode.
- The presence of a surface anodic layer greatly enhances the hydrophilicity of the aluminium surface, and the adhesion of the subsequently formed image layer is found to be much improved when the surface of the aluminium is subjected to a graining treatment prior to anodising.
- Additionally, there is frequently a requirement for a further surface treatment following the anodising process. Such a treatment - referred to as a post-anodic dip - is generally applied in order to improve specific lithographic printing properties of the substrate, such as clean up of background areas, coating adhesion or corrosion resistance, and will typically involve passing the aluminium through a solution, often an aqueous solution, of the chosen reagent. Commonly used post-anodic dips include aqueous solutions containing, for example, sodium carbonate or bicarbonate, poly(acrylic acid) or various aqueous-soluble copolymers.
- However, whilst conventional anodising and post-anodic dip treatments following graining allow for the production of high quality lithographic substrates, there are clear disadvantages associated with the incorporation of these processes prior to the application of a coating. Both anodising and post-anodic dip solutions are produced in large volumes at elevated temperatures, and this has clear implications in terms of cost, utilisation of space, and subsequent disposal of effluent. In addition to the thermal considerations, the requirement for the passage of an electric current during anodising results in a process requiring a high consumption of energy. Clearly, it would be desirable to provide means whereby this complex series of treatments could be simplified in order to improve the efficiency, and reduce the expense, associated with the preparation of the aluminium substrate. In essence, therefore, it is desirable that the number of substrate treatments required prior to application of the coating should be reduced as far as possible.
- Thus, the present invention seeks to provide a means whereby the costly and time-consuming substrate treatment steps involved in the preparation of suitable aluminium support materials for use in the preparation of lithographic printing plate precursors may be reduced in number and simplified, thereby facilitating substantial cost savings.
- According to the present invention there is provided a process for the manufacture of a support for a lithographic printing plate precursor, said process comprising at least the steps of:
- (a) providing a metallic substrate;
- (b) treating at least one surface of said substrate with an aqueous solution comprising a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table whilst applying a constant voltage or constant current.
-
- Said metallic substrate may comprise any conducting metallic substrate but, most preferably, it comprises aluminium or an aluminium alloy containing small amounts of, for example, manganese, nickel, cobalt, zinc, iron, silicon or zirconium. Said substrate is generally provided in the form of a continuous web or roll of metal or metal alloy.
- Preferably, said substrate is subjected to a degreasing treatment prior to said treatment with an aqueous solution of a salt of a metal. Said degreasing treatment is most conveniently carried out by means of an aqueous alkaline solution. Typically, said treatment involves passing said substrate through a bath containing a 5-20% w/v solution of, for example, sodium or potassium hydroxide. Following said degreasing treatment, said substrate is rinsed with water prior to further treatment.
- Said treatment of said surface or surfaces with an aqueous solution comprising a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table is preferably carried out by immersing said substrate in an aqueous solution, preferably containing from 0.001% to 5.0% (w/w) (more preferably from 0.01% to 1.0%) of said salt at a preferred temperature of from 5° to 80°C (more preferably from 15° to 40°C) for a preferred dwell time of from 1 second to 60 minutes (more preferably from 15 seconds to 5 minutes) at a pH of between 0 and 13 (preferably from 1 to 5, and most preferably in the region of 3). Said aqueous solution also preferably contains aluminium ions in an amount of from 0.1 to 50,000 ppm; said aluminium ions may be added to said aqueous solution in the form of any convenient aluminium salt or, in the case of an aluminium substrate, may be present as a result of dissolution from said substrate.
- Suitable salts which may be used for the said treatment include, for example, salts of titanium, zirconium, hafnium, molybdenum, tungsten, vanadium, manganese, nickel, copper, zinc, tin, niobium, tantalum, cerium, selenium, silicon, cobalt or iron. Said salts my include the metal either as the cation, for example in halide, sulphate or nitrate salts, or as part of a complexed anion. Particularly favourable results are achieved with salts of titanium, zirconium or hafnium, such as hafnium sulphate, zirconium phosphate, titanium nitrate, hafnium acetate, zirconium fluoride and titanium chloride. Most preferably, however, the hafnium, zirconium or titanium salt comprises a salt wherein the metal is present in a metal-complex anion, such as a chlorotitanate or fluorozirconate anion. Especially preferred in this regard are the alkali metal fluorozirconates, particularly potassium hexafluorozirconate.
- Optionally, further additives may be incorporated in said aqueous solution containing a metal salt. Preferably, polymers or copolymers of organic acids may be employed for this purpose, with particularly favourable results being achieved with poly(acrylic acid) or the copolymer of acrylic acid with vinyl phosphonic acid. Said materials my be added in an amount of from 0.001% to 5.0% (w/w) (preferably from 0.01% to 1.0%) to the treatment bath.
- The application of the constant voltage or constant current is preferably realised by applying a constant d.c., pulsed d.c., a.c. (sine and square waveforms), biased a.c. or half wave 1-6 phases rectified a.c. voltage of from 0.1 to 1000 V (preferably from 1 V to 100 V) across the treatment bath, using the substrate as one electrode and another electrical conductor, such as platinum, aluminium, carbon, stainless steel or mild steel as the other electrode. Thus, for example, the aluminium substrate may form the cathode and the other electrical conductor may provide the anode; preferably, however, the aluminium substrate forms the anode, with the other electrical conductor providing the cathode. Typically, a.c. current would be supplied at a frequency of from 1-5000 Hz, preferably from 30-70 Hz. The power may be fully applied at the commencement of the electrochemical treatment or, alternatively, can be applied at a progressively increasing rate during the treatment. Following said treatment, a surface film develops on said substrate, said film having a thickness of from 0.001 to 100 µm. Optionally, said surface film may be produced with a textured surface finish.
- Optionally, said substrate may be subjected to a graining treatment prior to said treatment with an aqueous solution of a salt of a metal. Said graining treatment may involve mechanical graining, wherein the surface of the substrate is subjected to mechanical forces which may, for example, be achieved by the use of a slurry of very small metal balls or via brush graining techniques. Alternatively, and most preferably, electrochemical graining may be employed; said technique comprises passing a substrate through a solution of a mineral or organic acid, or a mixture thereof, such as a mixture of hydrochloric and acetic acids, whilst applying an electric current to the acid solution. Typical graining conditions would involve the use of a bath of aqueous hydrochloric acid at a concentration of from 1-10 g/l and a temperature of 5-50°C, with a dwell time of from 1-60 seconds and an applied potential of from 1-40 V. The grained substrate is then rinsed with water prior to further processing.
- Following electrochemical graining, said grained substrate would be subjected to a desmutting treatment in order to remove by-products formed during the course of said electrograining treatment, and deposited on the surface of the substrate. Typically, the process involves treatment of the grained substrate with an aqueous acid or alkali according to the methods well known in the art. The substrate is rinsed with water following desmutting.
- The support provided by the method of the present invention may subsequently be coated with a light-sensitive coating to give a lithographic printing plate precursor.
- Various coatings of the types well known to those skilled in the art may be applied for this purpose, for example, positive-working coatings incorporating quinone diazide derivatives, negative-working coatings incorporating diazo or azide resins or photocrosslinkable resins or silver halide based coatings. The coatings may be applied by any of the standard coating techniques known to the skilled person, such
as curtain coating, dip coating, meniscus coating, reverse roll coating, and the like. - The thus-obtained lithographic printing plate precursor may then be imagewise exposed and the non-image areas can be developed away to provide a lithographic printing plate which is subsequently used on a printing press to produce copies.
- Lithographic printing plates produced from aluminium supports obtained by the method of the present invention show good abrasion resistance, corrosion resistance, staining resistance and scumming resistance, both on plate development and on press. The surface film produced by the treatment according to the method of the present invention shows excellent coating adhesion in the image areas. Additionally, the plate exhibits very good exposure latitude and solvent resistance.
- The inventors have also observed that successful results, in terms of lithographic plate properties, may be achieved by incorporating a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table in a conventional anodising bath, thereby eliminating the requirement for a post-anodic dip treatment. Thus, a salt of this type may be incorporated in an anodising bath typically containing mineral acids such as sulphuric, phosphoric, nitric, hydrofluoric or chromic acids, or organic acids such as oxalic, tartaric, citric, acetic or oleic acids, or mixtures of these acids, thereby providing a support material which shows the advantageous properties previously discussed when incorporated in a lithographic printing plate. Optionally, further additions of materials such as polymers or copolymers of organic acids, typically poly(acrylic acid) or the copolymer of acrylic acid with vinylphosphonic acid, may also be incorporated in the said anodising bath.
- Additionally, the inventors have found that the same advantageous properties are also evident when conventionally grained and anodised aluminium substrate is subjected to the said electrochemical treatment in a solution incorporating a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table, optionally in the presence of further additives, such as polymers or copolymers of organic acids, as previously exemplified. Such a process does not, however, provide all the benefits of reduced processing as previously described, although dwell time is substantially reduced when compared with a standard immersion treatment. Additionally, the resulting substrate shows improved properties when compared with a conventionally grained and anodised substrate which has been subjected to a prior art post-anodic dip treatment.
- The invention will now be illustrated, though without limitation, by reference to the following examples:
- A conventionally degreased, grained and desmutted aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature. A constant d.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- The resulting substrate was rinsed with water and coated with a solution of a naphthoquinone diazide photosensitive resin and a cresol novolak support resin in 2-methoxypropanol to produce a light-sensitive coating layer, and the coated substrate was baked at 130°C for 5 minutes. The resulting lithographic printing plate precursor was imagewise exposed to UV light at 100-300 mJ/cm2 and the non-image areas were developed away with an aqueous alkaline developer solution by immersion for 30 seconds at 20°C. The resulting lithographic printing plate was rinsed with water and dried in a stream of cool air and subsequently produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- A conventionally degreased aluminium substrate was immersed for 10 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature. A constant d.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- The resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- A conventionally degreased, grained, desmutted and anodised aluminium substrate was immersed for 5 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of potassium hexafluorozirconate (5 g/l) at room temperature. An a.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- The resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- A conventionally degreased, grained and desmutted aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of zirconium sulphate (5 g/l) at room temperature. A rectified a.c. voltage of 15 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- The resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion, and staining/scumming, both during development and on press.
Claims (26)
- A process for the manufacture of a support for a lithographic printing plate precursor, said process comprising at least the steps of:(a) providing a metallic substrate;(b) treating at least one surface of said substrate with an aqueous solution comprising a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table whilst applying a constant voltage or constant current.
- A process as defined in claim 1 wherein said metallic substrate comprises aluminium or an aluminium alloy containing small amounts of at least one of manganese, nickel, cobalt, zinc, iron, silicon or zirconium.
- A process as defined in claim 1 or 2 wherein said salt comprises a salt of titanium, zirconium, hafnium, molybdenum, tungsten, vanadium, manganese, nickel, copper, zinc, tin, niobium, tantalum, cerium, selenium, silicon, cobalt or iron.
- A process as defined in any of claims 1-3 wherein said salt includes the metal as the cation.
- A process as defined in claim 4 wherein said salt comprises the sulphate, phosphate, nitrate, acetate, fluoride or chloride salt of titanium, zirconium or hafnium.
- A process as defined in any of claims 1-3 wherein said salt includes the metal as part of a complexed anion.
- A process as defined in claim 6 wherein said salt comprises an alkali metal fluorozirconate.
- A process as defined in claim 7 wherein said alkali metal fluorozirconate comprises potassium hexafluorozirconate.
- A process as defined in any preceding claim wherein said aqueous solution additionally includes a polymer or copolymer of an organic acid.
- A process as defined in claim 9 wherein said polymer or copolymer comprises poly(acrylic acid) or the copolymer of acrylic acid with vinylphosphonic acid.
- A process as defined in any preceding claim wherein said aqueous solution aluminium ions in an amount of from 0.1 to 50,000 ppm.
- A process as defined in any preceding claim wherein said aqueous solution contains from 0.001% to 5.0% (w/w) of said salt.
- A process as defined in any preceding claim wherein said treatment is carried out at a temperature of from 5° to 80°C.
- A process as defined in any preceding claim wherein said treatment is carried out for a dwell time of from 15 seconds to 5 minutes.
- A process as defined in any preceding claim wherein said treatment is carried out at a pH of from 1 to 5.
- A process as defined in any preceding claim wherein said application of constant voltage or constant current is realised by applying a constant d.c., pulsed d.c., a.c. (sine or square waveform), biased a.c. or half wave 1-6 phases rectified a.c. voltage of from 0.1 to 1000V across the treatment bath.
- A process as defined in claim 16 wherein said a.c. current is applied at a frequency of from 30-70 Hz.
- A process as defined in claim 16 or 17 wherein the substrate comprises one electrode and platinum, aluminium, carbon, stainless steel or mild steel comprises the other electrode.
- A process as defined in claim 18 wherein said substrate comprises aluminium and forms the anode.
- A process as defined in any preceding claim wherein said substrate is subjected to a degreasing treatment prior to said treatment with an aqueous solution of a salt of a metal.
- A process as defined in claim 20 wherein said degreasing treatment is carried out by means of an aqueous alkaline solution.
- A process as defined in any preceding claim wherein said substrate is subjected to a graining treatment prior to said treatment with an aqueous solution of a salt of a metal.
- A process as defined in claim 22 wherein said substrate is subjected to a desmutting treatment following said graining treatment.
- A method for the manufacture of a lithographic printing plate precursor which comprises the steps of:(a) providing a support for said precursor according to a process as defined in any preceding claim;(b) applying a light sensitive coating to the treated surface or surfaces of said support.
- A method for the manufacture of a lithographic printing plate precursor which includes the step of treating a substrate comprising aluminium or its alloy in an anodising bath comprising:(a) a mineral acid or an organic acid or a mixture thereof; and(b) a salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table.
- A method for the manufacture of a lithographic printing plate precursor which includes the step of treating a grained and anodised substrate comprising aluminium or its alloy in an aqueous solution comprising a salt of a metal front Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table whilst applying a constant voltage or a constant current.
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GBGB9825043.4A GB9825043D0 (en) | 1998-11-16 | 1998-11-16 | Production of support for lithographic printing plate |
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EP1002644A3 EP1002644A3 (en) | 2004-01-14 |
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WO1992022688A1 (en) * | 1991-06-19 | 1992-12-23 | Alcan International Limited | TREATING Al SHEET |
US5275713A (en) * | 1990-07-31 | 1994-01-04 | Rudolf Hradcovsky | Method of coating aluminum with alkali metal molybdenate-alkali metal silicate or alkali metal tungstenate-alkali metal silicate and electroyltic solutions therefor |
US5587063A (en) * | 1992-12-24 | 1996-12-24 | Henkel Kommanditgesellschaft Auf Aktien | Method for electrolytic coloring of aluminum surfaces using alternating current |
US5607521A (en) * | 1991-11-15 | 1997-03-04 | Ipu Instituttet For Produktudvikling | Method for post-treatment of an article with a metallic surface as well as a treatment solution to be used in the method |
US5772865A (en) * | 1995-10-04 | 1998-06-30 | Dipsol Chemicals Co., Ltd. | Electrolytic conversion solution for treating metal surface and method for electrolytic conversion |
US5834129A (en) * | 1995-12-04 | 1998-11-10 | Bayer Corporation | Grained and anodized aluminum substrate for lithographic printing plates |
GB2325891A (en) * | 1997-06-03 | 1998-12-09 | Agfa Gevaert Nv | Preparing printing plates |
-
1998
- 1998-11-16 GB GBGB9825043.4A patent/GB9825043D0/en not_active Ceased
-
1999
- 1999-10-29 GB GB9925555A patent/GB2343681A/en not_active Withdrawn
- 1999-11-01 EP EP19990203617 patent/EP1002644B1/en not_active Expired - Lifetime
- 1999-11-01 DE DE1999635488 patent/DE69935488T2/en not_active Expired - Lifetime
- 1999-11-11 JP JP32138899A patent/JP2000147751A/en active Pending
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US5275713A (en) * | 1990-07-31 | 1994-01-04 | Rudolf Hradcovsky | Method of coating aluminum with alkali metal molybdenate-alkali metal silicate or alkali metal tungstenate-alkali metal silicate and electroyltic solutions therefor |
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US5607521A (en) * | 1991-11-15 | 1997-03-04 | Ipu Instituttet For Produktudvikling | Method for post-treatment of an article with a metallic surface as well as a treatment solution to be used in the method |
US5587063A (en) * | 1992-12-24 | 1996-12-24 | Henkel Kommanditgesellschaft Auf Aktien | Method for electrolytic coloring of aluminum surfaces using alternating current |
US5772865A (en) * | 1995-10-04 | 1998-06-30 | Dipsol Chemicals Co., Ltd. | Electrolytic conversion solution for treating metal surface and method for electrolytic conversion |
US5834129A (en) * | 1995-12-04 | 1998-11-10 | Bayer Corporation | Grained and anodized aluminum substrate for lithographic printing plates |
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Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1207220B1 (en) * | 2000-10-25 | 2008-01-16 | GHA Corporation | Method for surface treatment of aluminum or aluminum alloy |
US8361630B2 (en) | 2001-10-02 | 2013-01-29 | Henkel Ag & Co. Kgaa | Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to polytetrafluoroethylene or silicone coating |
US6797147B2 (en) | 2001-10-02 | 2004-09-28 | Henkel Kommanditgesellschaft Auf Aktien | Light metal anodization |
US9023481B2 (en) | 2001-10-02 | 2015-05-05 | Henkel Ag & Co. Kgaa | Anodized coating over aluminum and aluminum alloy coated substrates and coated articles |
WO2003029529A1 (en) * | 2001-10-02 | 2003-04-10 | Henkel Kommanditgesellschaft Auf Aktien | Light metal anodization |
US7452454B2 (en) | 2001-10-02 | 2008-11-18 | Henkel Kgaa | Anodized coating over aluminum and aluminum alloy coated substrates |
US7569132B2 (en) | 2001-10-02 | 2009-08-04 | Henkel Kgaa | Process for anodically coating an aluminum substrate with ceramic oxides prior to polytetrafluoroethylene or silicone coating |
US7578921B2 (en) | 2001-10-02 | 2009-08-25 | Henkel Kgaa | Process for anodically coating aluminum and/or titanium with ceramic oxides |
US7820300B2 (en) | 2001-10-02 | 2010-10-26 | Henkel Ag & Co. Kgaa | Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
US8663807B2 (en) | 2001-10-02 | 2014-03-04 | Henkel Ag & Co. Kgaa | Article of manufacture and process for anodically coating aluminum and/or titanium with ceramic oxides |
EP1348570A3 (en) * | 2002-03-26 | 2005-08-24 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
US7063935B2 (en) | 2002-03-26 | 2006-06-20 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
WO2006047526A3 (en) * | 2004-10-25 | 2007-06-07 | Henkel Kgaa | Article of manufacturing and process for anodically coating aluminum and/or titanium with ceramic oxides |
EP2604429A1 (en) * | 2004-10-25 | 2013-06-19 | Henkel AG&Co. KGAA | Process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
CN101048538B (en) * | 2004-10-25 | 2011-09-28 | 亨克尔两合股份公司 | Article of manufacture and process for anodically coating aluminum and/or titanium with ceramic oxides |
WO2006047526A2 (en) * | 2004-10-25 | 2006-05-04 | Henkel Kommanditgesellschaft Auf Aktien | Article of manufacturing and process for anodically coating aluminum and/or titanium with ceramic oxides |
US9701177B2 (en) | 2009-04-02 | 2017-07-11 | Henkel Ag & Co. Kgaa | Ceramic coated automotive heat exchanger components |
CN104060314A (en) * | 2014-06-18 | 2014-09-24 | 沈阳理工大学 | Method for performing low-voltage electrolytic black coloring on 2024 aluminum alloy by means of nickel-tungsten mixed salt |
US10435806B2 (en) | 2015-10-12 | 2019-10-08 | Prc-Desoto International, Inc. | Methods for electrolytically depositing pretreatment compositions |
US11591707B2 (en) | 2015-10-12 | 2023-02-28 | Ppg Industries Ohio, Inc. | Methods for electrolytically depositing pretreatment compositions |
US12104272B2 (en) | 2015-10-12 | 2024-10-01 | Prc-Desoto International, Inc. | Treated substrates |
Also Published As
Publication number | Publication date |
---|---|
GB2343681A (en) | 2000-05-17 |
DE69935488D1 (en) | 2007-04-26 |
EP1002644B1 (en) | 2007-03-14 |
DE69935488T2 (en) | 2007-11-29 |
JP2000147751A (en) | 2000-05-26 |
GB9825043D0 (en) | 1999-01-13 |
EP1002644A3 (en) | 2004-01-14 |
GB9925555D0 (en) | 1999-12-29 |
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