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DE69109464D1 - Verfahren und vorrichtung zur hermetischen verkapselung von elektronischen bauteilen. - Google Patents

Verfahren und vorrichtung zur hermetischen verkapselung von elektronischen bauteilen.

Info

Publication number
DE69109464D1
DE69109464D1 DE69109464T DE69109464T DE69109464D1 DE 69109464 D1 DE69109464 D1 DE 69109464D1 DE 69109464 T DE69109464 T DE 69109464T DE 69109464 T DE69109464 T DE 69109464T DE 69109464 D1 DE69109464 D1 DE 69109464D1
Authority
DE
Germany
Prior art keywords
electronic components
hermetic enclosure
hermetic
enclosure
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69109464T
Other languages
English (en)
Other versions
DE69109464T2 (de
Inventor
Michel Leroy
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE69109464D1 publication Critical patent/DE69109464D1/de
Application granted granted Critical
Publication of DE69109464T2 publication Critical patent/DE69109464T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
DE69109464T 1990-08-24 1991-08-23 Verfahren und vorrichtung zur hermetischen verkapselung von elektronischen bauteilen. Expired - Lifetime DE69109464T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9010631A FR2666190B1 (fr) 1990-08-24 1990-08-24 Procede et dispositif d'encapsulation hermetique de composants electroniques.
PCT/FR1991/000688 WO1992003902A1 (fr) 1990-08-24 1991-08-23 Procede et dispositif d'encapsulation hermetique de composants electroniques

Publications (2)

Publication Number Publication Date
DE69109464D1 true DE69109464D1 (de) 1995-06-08
DE69109464T2 DE69109464T2 (de) 1995-09-14

Family

ID=9399835

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69109464T Expired - Lifetime DE69109464T2 (de) 1990-08-24 1991-08-23 Verfahren und vorrichtung zur hermetischen verkapselung von elektronischen bauteilen.

Country Status (7)

Country Link
US (1) US5461545A (de)
EP (1) EP0497948B1 (de)
JP (1) JPH05502142A (de)
CA (1) CA2067784C (de)
DE (1) DE69109464T2 (de)
FR (1) FR2666190B1 (de)
WO (1) WO1992003902A1 (de)

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US6458512B1 (en) * 1998-10-13 2002-10-01 3M Innovative Properties Company Oxynitride encapsulated electroluminescent phosphor particles
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FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
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FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
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US20070235214A1 (en) * 2006-03-30 2007-10-11 Hall Stephen H Moisture resistant printed circuit board
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
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FR2911995B1 (fr) * 2007-01-30 2009-03-06 3D Plus Sa Sa Procede d'interconnexion de tranches electroniques
US7939932B2 (en) * 2007-06-20 2011-05-10 Analog Devices, Inc. Packaged chip devices with atomic layer deposition protective films
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
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JP5197175B2 (ja) * 2008-06-16 2013-05-15 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
EP2161974A1 (de) * 2008-09-09 2010-03-10 Hegutechnik v. Gutwald KG Bifunktionale EMV Beschichtung
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee
JP5252378B2 (ja) * 2009-03-26 2013-07-31 ヤマハ株式会社 ミキサ装置のウィンドウ制御方法、ミキサ装置、およびミキサ装置のウィンドウ制御プログラム
JP5501174B2 (ja) * 2009-09-17 2014-05-21 株式会社半導体エネルギー研究所 半導体装置
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US8654537B2 (en) * 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US8279625B2 (en) 2010-12-14 2012-10-02 Apple Inc. Printed circuit board radio-frequency shielding structures
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US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
JP5693515B2 (ja) * 2012-01-10 2015-04-01 エイチズィーオー・インコーポレーテッド 内部耐水性被覆を備える電子デバイス
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US10399256B1 (en) * 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly
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Also Published As

Publication number Publication date
FR2666190B1 (fr) 1996-07-12
EP0497948B1 (de) 1995-05-03
CA2067784C (fr) 2001-10-23
WO1992003902A1 (fr) 1992-03-05
FR2666190A1 (fr) 1992-02-28
CA2067784A1 (fr) 1992-02-25
JPH05502142A (ja) 1993-04-15
EP0497948A1 (de) 1992-08-12
US5461545A (en) 1995-10-24
DE69109464T2 (de) 1995-09-14

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