DE112017002058A5 - Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement - Google Patents
Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement Download PDFInfo
- Publication number
- DE112017002058A5 DE112017002058A5 DE112017002058.1T DE112017002058T DE112017002058A5 DE 112017002058 A5 DE112017002058 A5 DE 112017002058A5 DE 112017002058 T DE112017002058 T DE 112017002058T DE 112017002058 A5 DE112017002058 A5 DE 112017002058A5
- Authority
- DE
- Germany
- Prior art keywords
- optoelectronic component
- producing
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662324028P | 2016-04-18 | 2016-04-18 | |
US62/324,028 | 2016-04-18 | ||
PCT/EP2017/058984 WO2017182390A1 (de) | 2016-04-18 | 2017-04-13 | Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112017002058A5 true DE112017002058A5 (de) | 2019-01-03 |
DE112017002058B4 DE112017002058B4 (de) | 2023-10-05 |
Family
ID=58547540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112017002058.1T Active DE112017002058B4 (de) | 2016-04-18 | 2017-04-13 | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US10833231B2 (de) |
JP (2) | JP2019514201A (de) |
CN (1) | CN109075238B (de) |
DE (1) | DE112017002058B4 (de) |
WO (1) | WO2017182390A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112017003257T5 (de) | 2016-06-30 | 2019-04-18 | Osram Opto Semiconductors Gmbh | Wellenlängenkonverter mit einem polysiloxanmaterial, herstellungsverfahren und ihn enthaltende festkörperbeleuchtungsvorrichtung |
US10570333B2 (en) | 2017-05-23 | 2020-02-25 | Osram Opto Semiconductors Gmbh | Wavelength conversion element, light emitting device and method for producing a wavelength conversion element |
US10727379B2 (en) | 2018-02-16 | 2020-07-28 | Osram Opto Semiconductors Gmbh | Methods for producing a conversion element and an optoelectronic component |
US10590339B2 (en) | 2018-05-16 | 2020-03-17 | Osram Opto Semiconductors Gmbh | Method for producing a converter element, converter element and light emitting device |
US11552228B2 (en) | 2018-08-17 | 2023-01-10 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
US11349051B2 (en) | 2019-05-10 | 2022-05-31 | Osram Opto Semiconductors Gmbh | Optoelectronic device and method of producing an optoelectronic device |
DE102020206897A1 (de) | 2020-06-03 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
DE102021131112A1 (de) * | 2021-11-26 | 2023-06-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes bauelement und verfahren zur herstellung eines strahlungsemittierenden bauelements |
DE102023134624A1 (de) * | 2023-12-11 | 2025-06-12 | Ams-Osram International Gmbh | Filterelement, optoelektronisches bauelement, verfahren zur herstellung eines filterelements und verfahren zur herstellung eines optoelektronischen bauelements |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5472488A (en) * | 1990-09-14 | 1995-12-05 | Hyundai Electronics America | Coating solution for forming glassy layers |
US5152834A (en) * | 1990-09-14 | 1992-10-06 | Ncr Corporation | Spin-on glass composition |
JP4748845B2 (ja) * | 2000-03-10 | 2011-08-17 | 新日鉄マテリアルズ株式会社 | 電気泳動法による粒子含有無機・有機ハイブリッド被膜形成方法 |
FR2856690B1 (fr) * | 2003-06-30 | 2005-09-16 | Rhodia Chimie Sa | Composition silicone reticulable par desydrogenocondensation en presence d'un catalyseur metallique |
JP2006077234A (ja) | 2004-08-10 | 2006-03-23 | Shin Etsu Chem Co Ltd | Led素子封止用樹脂組成物および該組成物を硬化してなる硬化物 |
US20060035092A1 (en) * | 2004-08-10 | 2006-02-16 | Shin-Etsu Chemical Co., Ltd. | Resin composition for sealing LED elements and cured product generated by curing the composition |
JP4409397B2 (ja) * | 2004-09-27 | 2010-02-03 | 新日鐵化学株式会社 | シリコーン樹脂組成物及び成形体 |
KR101523482B1 (ko) | 2006-08-22 | 2015-05-28 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 부재, 그리고 반도체 디바이스용 부재 형성액 및 반도체 디바이스용 부재의 제조 방법, 그리고 그것을 이용한 반도체 디바이스용 부재 형성액, 형광체 조성물, 반도체 발광 디바이스, 조명 장치, 및 화상 표시 장치 |
JP5286969B2 (ja) | 2007-06-22 | 2013-09-11 | 三菱化学株式会社 | 半導体発光デバイス用部材形成液、半導体発光デバイス用部材、航空宇宙産業用部材、半導体発光デバイス、及び蛍光体組成物 |
WO2009025017A1 (ja) * | 2007-08-17 | 2009-02-26 | Panasonic Electric Works Co., Ltd. | 半導体光装置及び透明光学部材 |
WO2009119841A1 (ja) * | 2008-03-28 | 2009-10-01 | 三菱化学株式会社 | 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置 |
JP2010106243A (ja) * | 2008-09-30 | 2010-05-13 | Shin-Etsu Chemical Co Ltd | 光半導体装置用シリコーン樹脂組成物 |
TWI488891B (zh) | 2009-12-22 | 2015-06-21 | Mitsubishi Chem Corp | And a material for a resin molded body for a semiconductor light emitting device |
WO2011136302A1 (ja) * | 2010-04-28 | 2011-11-03 | 三菱化学株式会社 | 半導体発光装置用パッケージ及び発光装置 |
JP6400904B2 (ja) | 2012-08-03 | 2018-10-03 | 横浜ゴム株式会社 | 硬化性樹脂組成物 |
CN103214855A (zh) * | 2013-04-10 | 2013-07-24 | 3M材料技术(广州)有限公司 | 可固化的硅氧烷组合物、固化产品和半导体器件 |
SG10201800517XA (en) | 2013-07-19 | 2018-02-27 | Az Electronic Mat Luxembourg Sarl | Encapsulation material for light emitting diodes |
WO2015034073A1 (en) * | 2013-09-05 | 2015-03-12 | Dow Corning Toray Co., Ltd. | Method of manufacturing optical semiconductor device and optical semiconductor device |
JP2015073084A (ja) | 2013-09-06 | 2015-04-16 | 日東電工株式会社 | 波長変換シート、封止光半導体素子および光半導体素子装置 |
TWI633157B (zh) * | 2013-10-18 | 2018-08-21 | Shin-Etsu Chemical Co., Ltd. | 紫外線硬化性有機聚矽氧烷組成物及版材之製造方法 |
US9935246B2 (en) * | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
SG11201607136VA (en) | 2014-02-28 | 2016-09-29 | Az Electronic Materials Luxembourg S À R L | Hybrid material for optoelectronic applications |
JP6655785B2 (ja) | 2014-04-17 | 2020-02-26 | パナソニックIpマネジメント株式会社 | 樹脂組成物およびその製造方法並びに半導体装置 |
-
2017
- 2017-04-13 US US16/094,870 patent/US10833231B2/en active Active
- 2017-04-13 JP JP2018550352A patent/JP2019514201A/ja active Pending
- 2017-04-13 CN CN201780024117.5A patent/CN109075238B/zh active Active
- 2017-04-13 DE DE112017002058.1T patent/DE112017002058B4/de active Active
- 2017-04-13 WO PCT/EP2017/058984 patent/WO2017182390A1/de active Application Filing
-
2020
- 2020-07-13 JP JP2020120126A patent/JP7168615B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7168615B2 (ja) | 2022-11-09 |
US20190123248A1 (en) | 2019-04-25 |
JP2020184641A (ja) | 2020-11-12 |
JP2019514201A (ja) | 2019-05-30 |
US10833231B2 (en) | 2020-11-10 |
CN109075238B (zh) | 2021-10-12 |
DE112017002058B4 (de) | 2023-10-05 |
CN109075238A (zh) | 2018-12-21 |
WO2017182390A1 (de) | 2017-10-26 |
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R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033560000 Ipc: H10H0020854000 |