DE102014217573A1 - Vibration-proof electronic component assembly - Google Patents

Abstract

An electronic component arrangement (10) is proposed, which has an electronic component (12) with a component body (14) and at least one connection wire (32) which protrudes from one side (23) of the component body (14). Next, the electronic component assembly (10) has a contact fork (36) for electrically contacting the connecting wire (32) on a support plate (16) and a sleeve (38) having a through hole (40) in which the connecting wire (32) is accommodated on , The electronic component arrangement (10) is characterized in particular in that the sleeve (38) is arranged between the contact fork (36) and the component body (16) such that an outer circumference of the connection wire (32) is substantially smaller than a circumference of the through opening (40) and that the connecting wire (32) in the through-hole (40) by means of a fixing (42) is fixed positionally secure. As a result, it can be ensured in an advantageous manner that the connection wire (32) can be held in an interior of the component (12) without static mechanical stress, as a result of which an overall vibration resistance of the component (12) can be increased.

Description

Field of the invention

The invention relates to an electronic component arrangement for the vibration-proof mounting of an electronic component, in particular an electrolytic capacitor.

Background of the invention

Frequently, electronic components are subject to increased mechanical stresses, for example due to vibrations and / or vibrations in a motor vehicle or in other electromechanical devices. As a result, a lifetime of the component may be impaired.

In particular, this relates to electrolytic capacitors, which are often electrically contacted to baffles, printed circuit boards and / or lead frames, and e.g. be used as suppression capacitors in suppression assemblies, such as brushless DC motors (BLDC motors), in a transmission control, in an electric steering of a motor vehicle or in other electronics.

In principle, many electronic components can be cast and / or glued at least partially in a potting compound to ensure sufficient vibration resistance. However, this can be associated with increased production costs for the potting compound, an adhesive and / or a corresponding curing process.

In particular, electrolytic capacitors often can not be completely potted, as such components can produce a gas during operation, such as hydrogen gas, which should escape from the component, as an otherwise potentially occurring overpressure components of the component can damage.

From the DE 10 2011 004 142 A1 is a seal for a device from which gas can escape known. The seal has a gasket with a thin-walled, gas diffusion permitting area.

Disclosure of the invention

Embodiments of the present invention may advantageously make it possible to provide a reliable, robust and mechanically loadable electronic component arrangement with an electronic component, in particular an electrolytic capacitor.

According to a first aspect of the invention, an electronic component arrangement is proposed, which has an electronic component with a component body and at least one connecting wire, which protrudes from one side of the component body. Furthermore, the electronic component arrangement has a contact fork for electrical contacting of the connection wire on a carrier plate and a sleeve with a passage opening in which the connection wire is received. The component arrangement according to the invention is characterized in particular by the fact that the collar is arranged between the contact fork and the component body and that an outer circumference of the connection wire is substantially smaller than a circumference of the through opening. Furthermore, the connection wire is fixed in the passage opening by means of a fixation positionally secure.

The inventive arrangement of the sleeve between the contact fork and the component body and by the fixation of the lead wire in the through hole can be ensured that the lead wire can be guided from the component body at least from the component body to the cuff without mechanical bias, also called medium voltage. As a result, an electrical contact between the connecting wire and components in an interior of the component body can be provided without mechanical pretension, so that the electrical contact can reliably withstand dynamic loads, such as vibrations and / or vibrations. Thus, an oscillation resistance of the component can be maximally utilized and / or increased in an advantageous manner. Furthermore, compared to electronic component assemblies in which the component is at least partially encapsulated and / or glued for protection against dynamic loads, production costs can be reduced.

Also, the electronic component assembly according to the invention can be easily implemented in the design and simply integrated as an additional process step in a production. The cuff and the fixation of the connecting wire in the passage opening can already be fully integrated and / or grown by a component manufacturer. These components can also be mounted by a customer of the component manufacturer himself, without any changes to a design of the component and / or a tool would be necessary. Also, the cuff and the fixation can be subsequently integrated in an electronic component arrangement or from the beginning as a design element.

Ideas for embodiments of the present invention may be considered, inter alia, as being based on the thoughts and findings described below. Electrolytic capacitors are usually in an adhesive bed and / or a potting compound on a Fixed support plate and electrically contacted to contact forks of a stamped grid, for example, by hot stacking or resistance welding. Electrolytic capacitors usually have a arranged in the component body and impregnated with an electrolyte winding and a film which is electrically contacted with so-called paddle tabs, such as by riveting or latching. Due to possible assembly and / or component tolerances, the connection wire sometimes does not align exactly with the contact fork of the stamped grid. If the contact fork is now contacted by hot-stacking and / or resistance welding and thus the connection wire firmly clamped and / or welded and electrically connected, it can be forced by the mechanically stiffer contact fork in a new position. Since this is a partial elastic deformation of the lead wire, a mechanical pre- or medium voltage can act on the lead wire. If the electrolytic capacitor is exposed to vibrations and / or vibrations during operation, a dynamic vibration load can act on them. Mechanical failure of an electrical contact or electronic component upon vibrational loading can be severely caused by existing static mechanical biases in a material and / or electrical junctions or contacts. For example, an unloaded component can survive a vibration load of 200 m / s ² without damage. However, if the component is already under a static preload, the dynamic load may add up to the static load and the component may fail. These relationships can be shown in the strength theory in a so-called haigh diagram. Thus, vibration resistance of a system having a medium voltage level greater than zero can rapidly drop when a vibratory load is applied to the system. The vibration resistance can thus be maximized when the system is in a mechanical stress-free state, ie, the mechanical mean voltage is zero.

The inventive leadership of the lead wire through the passage opening of the sleeve and its fixation in the passage opening can be achieved for example in an electrolytic capacitor, that a possible deformation of the lead wire by contacting with the contact fork is not passed to the paddle tabs, which is why this in a mechanically stress-free state can be and so in particular the riveting or latching of the paddle tabs with the film of the coil can be protected against failure, because a dynamic vibration load on the winding can be done without medium voltage load.

According to one embodiment of the invention, the component has a plug, which is accommodated at least partially in an opening of the component body and which has a guide opening through which the connecting wire is guided. At this time, a circumference of the guide hole in the plug is smaller than a circumference of the through hole in the sleeve. In particular, a relatively large circumference of the lead-through opening can simplify production since the connecting wire can be guided through the sleeve easily and without additional tools.

According to one embodiment of the invention, the cuff is made of an elastic material. For example, the cuff may be made of cork and / or an elastomer. Thus, advantageously, a contour of the sleeve can be adapted flexibly to an available installation space in the electronic component arrangement.

According to one embodiment of the invention, the electronic component has at least two connecting wires, which respectively protrude from the same side of the component body, the sleeve having two passage openings, in each of which a connecting wire is accommodated. By receiving in each case one connection wire, for example, a short circuit between the two connection wires can be avoided.

According to a further embodiment of the invention, the sleeve has a plug region which is accommodated at least partially in an opening of the component body, wherein the connection wire is guided through a guide opening of the plug region. Furthermore, the sleeve has a fixing region in which the passage opening is arranged and the connecting wire is fixed in a positionally secure manner by means of the fixing. The plug region and the fixing region can be made in one or more parts. Such a construction of the sleeve can be advantageous, for example, with regard to retrofitting because, for example, a plug arranged in the component body can be removed and replaced by the cuff according to the invention with plug region and the additional function of the fixing region on the component body. This also eliminates the need for an additional support for the sleeve, since it can be attached to the component body via the plug region.

According to one embodiment of the invention, a longitudinal extension of the fixing region is greater than a longitudinal extent of the plug region. This can be ensured in an advantageous manner that an acting on the connecting wire bending moment or a bending stress, which can occur by contacting the same with the contact fork, from the entrance of the lead wire in the Fixierbereich can be completely degraded to the transition into the plug area. The longitudinal extension of the fixing region can have, for example, at least twice the value of the diameter of the connecting wire, wherein the longitudinal extension can be dimensioned parallel to a course of the connecting wire.

According to one embodiment of the invention, the fixing of the connecting wire is provided by a forming device, which is designed to reshape the sleeve and / or a cross section of the through opening by squeezing the sleeve such that the connecting wire is fixed in a positionally secure manner in the through opening. By reshaping the entire sleeve, as compared to forming only the through hole, a manufacturing process of the electronic component assembly can be simplified.

According to one embodiment of the invention, the sleeve is cylindrical, wherein the sleeve is deformable in a radial direction through the forming device. Also, a rotationally symmetrical cuff can simplify a manufacturing process, since the cuff can be mounted in several directions.

According to one embodiment of the invention, the sleeve is cylindrical, wherein the forming device is designed as a squeezing ring and the sleeve rotates along an outer circumference. An embodiment of the forming device as a squeezing ring can simplify a production and / or retrofitting, for example, as an assembly can be carried out with commercially available tools.

According to one embodiment of the invention, the fixing of the connecting wire is provided by an ejection of the passage opening with a fixing compound, so that the connecting wire is firmly bonded in the passage opening. The fixing compound may be, for example, an adhesive, a lacquer or a potting compound.

According to one embodiment of the invention, the fixing of the connecting wire is provided by a pin element, which is slidable into the passage opening, so that the connecting wire is fixed non-positively in the passage opening. The pin member may be conical, for example, so that a thin end can be pushed into the through hole and the lead wire can be fixed by clamping in the passage opening by a thicker compared to the thin end end of the pin member. The pin member may have any cross-section, such as round, oval, polygonal or another cross-section.

According to one embodiment of the invention, the electronic component is an electrolytic capacitor. The electrolytic capacitor may have, for example, a component body and a winding arranged in the component body and provided with a foil. The electrolytic capacitor may further comprise an at least partially gas-permeable plug, which may be accommodated in the front side in an opening of the component body, wherein the connecting wire may be electrically connected at one end to the film of the coil.

It should be understood that some of the possible features and advantages of the invention are described herein with reference to different embodiments. A person skilled in the art will recognize that the features can be suitably combined, adapted or replaced in order to arrive at further embodiments of the invention.

Brief description of the drawings

Embodiments of the invention will now be described with reference to the accompanying drawings, in which neither the drawings nor the description are to be construed as limiting the invention.

1A . 1B and 1C show a side view, a plan view of a sectional view and a front view of an electronic component assembly according to an embodiment of the invention.

1D and 1E show a cuff and a forming device of the electronic component assembly of the 1A to 1C ,

2 shows an electronic component assembly according to another embodiment of the invention.

3A and 3B each show a part of an electronic component arrangement according to further embodiments of the invention.

The figures are only schematic and not to scale. Like reference numerals designate the same or equivalent features in the figures.

Embodiments of the invention

1A . 1B and 1C each show an electronic component assembly 10 according to an embodiment of the invention. In 1A is a side view, in 1B a plan view of a sectional view and in 1C a front view shown. 1D and 1E show a cuff 38 and a forming device 44 the electronic component assembly 10 from the 1A to 1C ,

The electronic component arrangement 10 has an electronic component 12 with a substantially cylindrical component body 14 on. The component 12 may be about an electrolytic capacitor.

The component body 14 is on a backing plate 16 arranged on which a holding device 18 for fixing the component body 14 is arranged. The holding device 18 has two opposing Klemmabagungen 20 on, between which the component body 14 is arranged and which the component body 14 on two opposite partial surfaces of a lateral surface of the component body 14 clasp-like at least partially embrace. The clamping rips 20 can each have a snap hook and a voltage applied to the lateral surface of the component body abutment surface, so that the component body 14 in the holding device 18 can be clipped and can be mechanically fixed in all three directions. In addition, the component body 14 with a bond 22 on the carrier plate 16 be fixed.

The electronic component 12 also has an end face 23 a stopper 24 on, which at least partially in an opening 26 of the component body 14 is absorbed and which at least partially by a rejuvenation 27 of the component body 14 can be held clamped.

In an interior of the component body 14 is a coil provided with an electrolyte and a conductive foil 28 arranged. The wrap 28 can in the component body 14 be fixed or be exposed without fixation in this.

The wrap 28 and / or the film of the roll 28 is with two terminals 30 electrically contacted. The terminals 30 are often referred to as "paddle tabs" and can with the wrap 28 for example, riveted, latched and / or otherwise electrically contacted, such as soldered, welded, glued.

At one end of the terminals 30 is in each case a connecting wire 32 arranged, which in each case by one in the plug 24 trained guide opening 34 is guided. The connecting wires 32 thus protrude at the front 23 the component body 14 the same from a longitudinal direction of the same from this.

Next, the electronic component assembly 10 two contact forks 36 on which parallel to each other substantially orthogonal to the carrier plate 16 protrude. The contact forks 36 may be about part of a conductor plate and / or a punched grid. At the contact forks 36 is in each case a connecting wire 32 electrically contacted. This can ever a connection wire 32 in a recording between two tines each of the contact forks 36 be included and electrically connected to them, for example, by hot stacking, welding, soldering and / or gluing.

In the longitudinal direction of the component body 14 is between the front side 23 of the component body 14 or an outer surface of the plug 24 and the contact forks 36 a cuff 38 arranged. The cuff 38 may be cylindrical, wherein a base of the sleeve 38 smaller or larger than a base of the component body 14 and / or the plug 24 can be. The cuff 38 may be made of an elastic material, such as cork, an elastomer, and / or a foam.

The cuff 38 is substantially cylindrical and has two through holes 40 on which parallel to each other and parallel to the longitudinal direction of the component body 14 can be arranged. Through the passage openings 40 is in each case a connecting wire 32 guided and recorded. The passage openings 40 the cuff 38 can each be aligned with the guide holes 34 of the plug 24 be arranged so that the connecting wires 32 curvature or bend-free and / or straight through the cuff 38 be guided. The passage openings 40 may have an arbitrarily shaped cross section, for example, a round, a square, a triangular, a trapezoidal or a polygonal.

A circumference of the passage openings 40 is larger than a circumference of the guide openings 34 , Also, the circumference of a through hole 40 much larger than an outer circumference of a lead wire 32 , like in 1D good to see. This allows the connection wires 32 stable through the guide openings 34 of the plug 24 be guided and / or held and the cuff 38 can without the connecting wires 32 damage, for example, to bend and / or kink, during assembly of the electronic component assembly 10 on the connecting wires 32 be pushed. The circumference and / or a diameter and / or a cross section of the passage openings 40 can be dimensioned or dimensioned such that the connecting wires 32 touch and / or frictionless through the through holes 40 can be pushed. For example, the scope of a through hole 40 be at least 5%, preferably at least 15% larger than an outer circumference of a lead wire 32 ,

Next, the electronic component assembly 10 a fixation 42 on, by means of which the connecting wires 32 each positionally secure in the through holes 40 are fixed. The fixation 42 in the in the 1A to 1E shown embodiment is characterized by a forming device 44 provided, which is executed, the cuff 38 and / or the cross section of the passage openings 40 by squeezing the cuff 38 to transform so that the connecting wires 32 positionally secure in the through holes 40 clamped and / or non-positively and / or at least partially positively fixed. For this purpose, the forming device 44 a squeeze ring 46 on which the cuff 38 along an outer periphery of a lateral surface of the sleeve 38 revolves, as in the 1D and 1E recognizable. In 1D is the squeeze ring 46 and the cuff 38 before a squeezing of the squeezing ring 46 for fixing the connecting wires 32 and in 1E shown after a corresponding squeezing. From the figures it is clear that by squeezing the squeezing ring 46 in a radial direction orthogonal to the lateral surface of the sleeve 38 and orthogonal to the longitudinal direction of the lead wires 32 the cross section of the passage openings 40 is changed so that the connecting wires 32 can be fixed non-positively.

An assembly of the electronic component assembly 10 can be performed as described below. The cuff 38 with squeezing ring 46 can in a first step on the connecting wires 32 be threaded and the squeeze ring 46 can be deformed. In a further step, the component 12 in the holding device 18 inserted and / or clipped. Optionally, before the bonding 22 on the carrier plate 16 be applied to the component 12 optionally additionally mechanically in the holding device 18 to fix. An adhesive mass of the bond 22 can also be the cuff 38 with fix, thereby advantageously slipping the cuff 38 can be prevented. Is that part 12 on the carrier plate 16 mounted, so in an additional step, an electrical connection between the contact forks 36 and the connecting wires 32 respectively. The contact forks 36 or their tines can be compressed, for example, and by means of hotstacking and / or resistance welding with the connecting wires 32 be contacted firmly. Here, the relatively soft connection wires 32 a position of the contact variable 36 add, so they can be loaded laterally and / or bent. A thereby on the connecting wires 32 acting bending moment can produce a mechanical average voltage, as explained in detail above. By the inventive arrangement of the sleeve 38 as well as the fixation 42 the connecting wires 32 However, this medium voltage can only up to an entry of the connecting wires 32 in the cuff 38 at the contact forks 36 facing side of the cuff 38 act and will no longer be in the interior of the component 12 , about the terminals 30 , transfer. This allows in particular the terminals 30 be mechanically stress-free, so that a vibration resistance of the electronic component assembly 10 can be increased.

2 shows an electronic component assembly 10 according to a further embodiment of the invention. Unless otherwise described, the electronic component assembly 10 have the same features as the electronic component assembly of 1A to 1C ,

At the in 2 embodiment shown, the sleeve 38 a plug area 24a and a fixing area 25 on. The stopper area 24a and the fixation area 25 can be made in one piece. The stopper area 24a is at least partially in the opening 26 of the component body 14 picked up, leaving the stopper 24 as in the 1A to 1C shown, can be omitted.

In the plug area 24a are guide holes 34 formed, which in the fixation 25 trained through holes 40 aligned. A scope of guide openings 34 can be larger than a circumference of the through holes 40 be. Through the guide openings 34 and the passage openings 40 is in each case a connecting wire 32 of the component 12 guided. If the connecting wires 32 are sufficiently stable, the circumference of the through holes 40 in the fixation area 25 also identical to the scope of the guide openings 34 be educated.

A longitudinal extent or length L1 of the stopper area 24a , which is parallel to a longitudinal direction of the component body 14 and parallel to an extension direction of the lead wires 32 may be smaller than a longitudinal extent or length L2 of the fixing region 25 be. For example, the length L2 may be at least 10%, preferably at least 30%, greater than the length L1. Further, L2 may be at least twice the value of a diameter of a lead wire 32 exhibit. This can ensure that one on a connecting wire 32 acting bending moment when entering the plug area 24a can be degraded.

3A and 3B each show a part of an electronic component assembly 10 according to further embodiments of the invention.

In the embodiments shown therein, the fixation 42 by an injection 48 of the Through opening 40 in the fixation area 25 the cuff 38 provided with a fixing compound. The fixing compound may be, for example, an adhesive, a lacquer or a potting compound, so that the connecting wires 32 cohesively in the through holes 32 can be fixed.

At the in 3A As shown embodiment, the fixing compound may be approximately by spraying one around the connecting wires 32 through the passage openings 40 formed annular gap from an outside end face of the sleeve 38 forth in the through holes 40 be introduced. Alternatively or additionally, it is conceivable, a pin element in the through holes 40 insert so that the connecting wires 32 positionally secure clamping in the through holes 40 are fixed.

In contrast, in the in 3B shown embodiment adjacent to the plug region 24a in the fixation area 25 an ejection channel 50 provided, which is substantially orthogonal to the longitudinal direction of the connecting wires 32 can extend and which with the through holes 40 can be connected. So can the passage openings 40 complete and reliable by injecting the fixative via the ejection channel 50 be sprayed or filled. There may also be several such ejection channels in the fixation region and / or in the plug region 24a be provided.

Finally, it should be noted that terms such as "comprising," "comprising," etc., do not exclude other elements, and terms such as "a" or "an" do not exclude a multitude. It should also be appreciated that features described with reference to any of the above embodiments may also be used in combination with other features of other embodiments described above. Reference signs in the claims are not to be considered as limiting.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102011004142 A1 [0006]

Claims (12)

Electronic component arrangement ( 10 ), comprising: an electronic component ( 12 ) with a component body ( 14 ) and at least one connecting wire ( 32 ), which from one side ( 23 ) of the component body ( 14 ) protrudes; a contact fork ( 36 ) for electrical contacting of the connecting wire ( 32 ) on a carrier plate ( 16 ); and a cuff ( 38 ) with a passage opening ( 40 ), in which the connecting wire ( 32 ), characterized in that the cuff ( 38 ) between the contact fork ( 36 ) and the component body ( 16 ) is arranged such that an outer circumference of the connecting wire ( 32 ) substantially smaller than a circumference of the passage opening ( 40 ) and that the connecting wire ( 32 ) in the passage opening ( 40 ) by means of a fixation ( 42 ) is fixed positionally secure. Electronic component arrangement ( 10 ) according to claim 1, wherein the electronic component ( 12 ) a stopper ( 24 ), which at least partially in an opening ( 26 ) of the component body ( 14 ) and which has a guide opening ( 34 ), through which the connecting wire ( 32 ), wherein an extent of the guide opening ( 34 ) in the plug ( 24 ) smaller than a circumference of the passage opening ( 40 ) in the cuff ( 38 ). Electronic component arrangement ( 10 ) according to claim 1 or 2, wherein the cuff ( 38 ) is made of an elastic material. Electronic component arrangement ( 10 ) according to one of the preceding claims, wherein the electronic component ( 12 ) at least two connecting wires ( 32 ), each from the same side ( 23 ) of the component body ( 14 protrude, and where the cuff ( 38 ) two passage openings ( 40 ), in each of which a connecting wire ( 32 ) is recorded. Electronic component arrangement ( 10 ) according to any one of the preceding claims, wherein the cuff ( 38 ) a plug region ( 24a ), which at least partially in an opening ( 26 ) of the component body ( 14 ), wherein the connecting wire ( 32 ) through a guide opening ( 34 ) of the plug region ( 24a ) and the cuff ( 38 ) a fixing area ( 25 ), in which the passage opening ( 40 ) and the connecting wire ( 32 ) by means of fixation ( 42 ) is fixed positionally secure. Electronic component arrangement ( 10 ) according to claim 5, wherein a longitudinal extension of the fixing region ( 25 ) is greater than a longitudinal extension of the plug region ( 24a ). Electronic component arrangement ( 10 ) according to any one of the preceding claims, wherein the fixation ( 42 ) of the connecting wire ( 32 ) by a forming device ( 44 ), which is adapted to the cuff ( 38 ) and / or a cross section of the passage opening ( 40 ) by squeezing the cuff ( 38 ) in such a way that the connection wire ( 32 ) positionally secure in the passage opening ( 40 ) is clamped fixed. Electronic component arrangement ( 10 ) according to claim 7, wherein the cuff ( 38 ) is cylindrical, and wherein the cuff ( 38 ) in a radial direction through the forming device ( 44 ) is deformable. Electronic component arrangement ( 10 ) according to one of claims 7 or 8, wherein the cuff ( 38 ) is cylindrical, and wherein the forming device ( 44 ) as a squeezing ring ( 46 ) is formed and the cuff ( 38 ) circulates along an outer circumference. Electronic component arrangement ( 10 ) according to any one of the preceding claims, wherein the fixation ( 42 ) of the connecting wire ( 32 ) by an injection ( 48 ) of the passage opening ( 40 ) is provided with a fixing compound, so that the connecting wire ( 32 ) cohesively in the passage opening ( 40 ) is fixed. Electronic component arrangement ( 10 ) according to any one of the preceding claims, wherein the fixation ( 42 ) of the connecting wire ( 32 ) is provided by a pin member which in the through hole ( 40 ) is slidable, so that the connecting wire ( 32 ) positively in the passage opening ( 40 ) is fixed. Electronic component arrangement ( 10 ) according to one of the preceding claims, wherein the electronic component ( 12 ) is an electrolytic capacitor.

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