CN222485155U - Heat exchange devices and electrical equipment - Google Patents

Abstract

The utility model relates to the technical field of electrical engineering and discloses a heat exchange device and electrical equipment, wherein the heat exchange device comprises a refrigeration piece, a first heat dissipation piece, a second heat dissipation piece and a second heat dissipation piece, wherein the refrigeration piece comprises a cold end, a hot end and a side wall, the side wall is arranged between the cold end and the hot end, the first heat dissipation piece is arranged on one side close to the cold end and comprises a first substrate, a first tooth sheet is arranged on one side, far away from the cold end, of the first substrate, the second heat dissipation piece is arranged on one side, close to the hot end, of the second substrate, a second tooth sheet is arranged on one side, far away from the hot end, of the second substrate, a containing space is arranged on the other side of the first substrate and/or the other side of the second substrate, and at least part of the side wall of the refrigeration piece is contained in the containing space. The cold end of the refrigerating piece can quickly absorb heat by adopting the refrigerating piece to exchange heat, and the contact area between the refrigerating piece and the first heat dissipation piece and the contact area between the refrigerating piece and the second heat dissipation piece can be further increased by at least accommodating part of the side wall of the refrigerating piece in the accommodating space, so that the heat transfer efficiency and the heat dissipation effect are improved.

Description

Heat exchange device and electrical equipment

Technical Field

The utility model relates to the technical field of electrical engineering, in particular to a heat exchange device and electrical equipment.

Background

When the traditional heat exchanger, such as a heat radiation structure, is installed on the existing electrical equipment, an opening needs to be formed in a box body of the electrical equipment, and then the heat exchanger is placed in the opening, so that two opposite sides of the heat exchanger are respectively arranged in the box body and outside the box body. The heat exchanger is usually formed by extrusion of aluminum alloy, and tooth plates are arranged on two opposite sides of the heat exchanger. When the heat exchanger is used, the fan is used in the box body to blow heat to the tooth plates in the box body, the heat is transferred to the tooth plates outside the box body through the heat conductivity of the material of the heat exchanger, and the heat on the tooth plates is taken away through the fan outside the box body. By adopting the mode, the environment temperature inside the box body can be effectively reduced, and the service life of the electric element inside the box body is further prolonged. However, when the temperature inside the box body is too high, the temperature cannot be quickly transferred out due to the fact that the temperature can be reduced only through heat transfer of the material of the heat exchanger, and therefore the electric elements can be damaged or the service life of the electric elements can be reduced.

The prior art discloses a semiconductor refrigerator with a hydrophilic coating, as shown in fig. 1, the semiconductor refrigerator consists of a refrigerating block 01, a semiconductor refrigerating sheet 02 and a radiating block 03, wherein the refrigerating block 01 is arranged at the cold end of the semiconductor refrigerating sheet 02, and the radiating block 03 is arranged at the hot end of the semiconductor refrigerating sheet 02. The refrigerating block 01 is arranged in the box body 04, the radiating block 03 is arranged outside the box body 04, cold air can be generated at the cold end of the semiconductor refrigerating sheet 02, the cold air is transmitted through the refrigerating block 01, the temperature inside the box body 04 is further reduced, hot air is generated at the hot end of the semiconductor refrigerating sheet 02 at the same time, and the hot air is discharged through the radiating block 03. However, since the two sides of the semiconductor cooling fin 02 are only in contact with the surfaces of the cooling block 01 and the heat dissipation block 03, the contact area is small, resulting in poor heat dissipation effect.

Disclosure of utility model

In view of the above, the present utility model provides a heat exchange device and an electrical apparatus, so as to solve the problem of poor heat dissipation effect of the heat exchange device.

In a first aspect, the present utility model provides a heat exchange device comprising:

the refrigerating piece comprises a cold end, a hot end and a side wall, wherein the side wall is arranged between the cold end and the hot end;

The first heat dissipation piece is arranged on one side close to the cold end and comprises a first base plate, and a first tooth sheet is arranged on one side, far away from the cold end, of the first base plate;

The second heat dissipation piece is arranged on one side close to the hot end and comprises a second substrate, and a second tooth piece is arranged on one side, far away from the hot end, of the second substrate;

The other side of the first substrate and/or the other side of the second substrate is provided with a containing space, and the containing space is used for containing at least part of the side wall of the refrigerating piece.

The heat exchange device has the advantages that the cold end of the refrigerating piece can quickly absorb heat on one side of the first radiating piece so as to reduce the ambient temperature on one side of the first radiating piece, the hot end of the refrigerating piece can quickly release the heat absorbed by the cold end, the heat exchange efficiency is high, the contact area between the first radiating piece and the second radiating piece and the air can be increased by arranging the first tooth piece and the second tooth piece so as to quickly exchange heat, and the contact area between the refrigerating piece and the first radiating piece and the contact area between the refrigerating piece and the second radiating piece can be further increased by accommodating at least part of the side wall of the refrigerating piece in the accommodating space so as to improve the heat transfer efficiency and the heat dissipation effect.

In an alternative embodiment, a first accommodating space is formed on the other side of the first substrate, and the cold end is arranged in the first accommodating space;

The other side of the second substrate is provided with a second accommodating space, the hot end is arranged in the second accommodating space, and the second accommodating space and the first accommodating space are oppositely arranged and jointly enclose the accommodating space.

The refrigerator has the beneficial effects that the first accommodating space and the second accommodating space can be used for positioning and placing the refrigerating piece.

In an alternative embodiment, the accommodating space accommodates all side walls of the refrigerating element.

The heat exchange device has the beneficial effects that through the fact that all side walls of the refrigerating piece are contained in the containing space, heat can be transferred to the greatest extent through the first heat dissipation piece and the second heat dissipation piece, and then the heat exchange effect is improved.

In an alternative embodiment, the heat exchange device comprises:

and the separation piece is arranged between the first heat dissipation piece and the second heat dissipation piece.

The heat exchange device has the beneficial effects that the first heat dissipation part and the second heat dissipation part can be isolated by arranging the partition part, heat transfer between the first heat dissipation part and the second heat dissipation part through contact is prevented, heat transfer can be guaranteed to be realized through the refrigerating part, and the heat exchange effect is further improved.

In an alternative embodiment, the separator is a thermal insulator.

In an alternative embodiment, a third accommodating space is formed on the partition member, and the refrigerating member penetrates through the third accommodating space;

And/or at least two of the first heat dissipation piece, the separation piece and the second heat dissipation piece are detachably connected.

In an alternative embodiment, a heat conducting member is arranged between the first heat dissipation member and the refrigerating member and/or between the second heat dissipation member and the refrigerating member;

And/or the refrigerating piece is suitable for being connected with a power supply through a connecting wire;

the first substrate and/or the second substrate are/is provided with an avoidance space communicated with the outside, and the avoidance space is suitable for being penetrated by the connecting wire.

The heat-conducting piece has the advantages that heat transfer between the first heat-radiating piece and the refrigerating piece and heat transfer between the second heat-radiating piece and the refrigerating piece can be further accelerated, heat-conducting efficiency is higher, the refrigerating piece is connected with a power supply through a connecting wire, starting and closing of the refrigerating piece can be controlled, energy is saved, and the heat-conducting piece is safer to use.

In a second aspect, the present utility model also provides an electrical apparatus comprising:

The box body is provided with an opening;

the heat exchange device is fixed at the opening.

The beneficial effects are that the electric equipment comprises the heat exchange device, so that the electric equipment has the same effect as the heat exchange device and is not repeated here.

In an alternative embodiment, the first heat dissipation element is disposed inside the case, and the second heat dissipation element is disposed outside the case;

And/or the first heat dissipation piece or the second heat dissipation piece is fixed at the opening;

And/or a fan is arranged outside the box body, and the fan is arranged close to the second tooth plate.

The refrigerator has the advantages that the first radiating piece is arranged in the refrigerator body, the refrigerating piece can rapidly cool the first radiating piece, the ambient temperature in the refrigerator body is further rapidly reduced, the service life of electric elements in the refrigerator body is prolonged, and heat dissipation can be further accelerated through the arrangement of the fan.

In an alternative embodiment, the first substrate has a cross-sectional dimension that is the same as the dimension of the opening;

And/or the cross-sectional dimension of the divider is the same as the dimension of the opening;

and/or, the cross-sectional dimension of the second substrate is greater than the dimension of the opening.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view showing a structure of a semiconductor refrigerator having a hydrophilic coating in a use state according to the prior art;

FIG. 2 is a schematic view of a heat exchange device according to an embodiment of the present utility model;

FIG. 3 is an exploded view of the heat exchange device shown in FIG. 2;

FIG. 4 is a cross-sectional view of the heat exchange device shown in FIG. 2;

FIG. 5 is a schematic view of a cooling member of the heat exchange device shown in FIG. 3;

FIG. 6 is a schematic view of a first heat dissipation element of the heat exchange device shown in FIG. 3;

FIG. 7 is a schematic view of a second heat dissipating member of the heat exchange device shown in FIG. 3;

Fig. 8 is a schematic view of the structure of the separator of the heat exchange device shown in fig. 3.

Reference numerals illustrate:

01. A refrigeration block; 02, semiconductor refrigerating sheets, 03, radiating blocks, 04, a box body;

1. The cooling part comprises a cooling part, 11, a cold end, 12, a hot end, 13, a connecting wire, 2, a first heat dissipation part, 21, a first base plate, 211, a positioning part, 22, a first tooth plate, 3, a second heat dissipation part, 31, a second base plate, 311, a second accommodating space, 312, a mounting hole, 32, a second tooth plate, 33, a second connecting hole, 4, a partition part, 41 and a third accommodating space.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiments of the present utility model are described below with reference to fig. 2 to 8.

According to an embodiment of the utility model, in one aspect, a heat exchange device is provided, which comprises a refrigerating element 1, a first heat dissipation element 2, a second heat dissipation element 3 and a second substrate 31, wherein the refrigerating element 1 comprises a cold end 11, a hot end 12 and side walls, the side walls are arranged between the cold end 11 and the hot end 12, the first heat dissipation element 2 is arranged on one side close to the cold end 11, the first heat dissipation element 2 comprises a first substrate 21, a first tooth piece 22 is arranged on one side, far from the cold end 11, of the first substrate 21, the second heat dissipation element 3 is arranged on one side, near to the hot end 12, of the second substrate 31, a second tooth piece 32 is arranged on one side, far from the hot end 12, of the second substrate 31, and a containing space is arranged on the other side of the first substrate 21 and/or the other side of the second substrate 31, and at least one part of the side walls of the refrigerating element 1 is contained in the containing space.

The cold end 11 of the refrigerating piece 1 can quickly absorb heat on one side of the first radiating piece 2 by adopting the refrigerating piece 1 to exchange heat, so that the ambient temperature on one side of the first radiating piece 2 is reduced, the hot end 12 of the refrigerating piece 1 can quickly release the heat absorbed by the cold end 11, the heat exchange efficiency is high, the contact area between the first radiating piece 2 and the second radiating piece 3 and air can be increased by arranging the first tooth piece 22 and the second tooth piece 32, so that the heat can be quickly exchanged, and the contact area between the refrigerating piece 1 and the first radiating piece 2 and the second radiating piece 3 can be further increased by accommodating at least part of side walls of the refrigerating piece 1 in the accommodating space, so that the heat transfer efficiency is improved, and the heat dissipation effect is improved.

The cooling element 1 in this embodiment is a semiconductor cooler (TEC). After the TEC is powered on, the temperature of the cold end 11 is reduced, the ambient air is cooled, the temperature of the hot end 12 is increased, and heat is dissipated to the outside. As an alternative embodiment, the refrigerating element 1 may be another heat exchange structure capable of refrigerating, without being limited thereto.

Specifically, a first accommodating space is arranged at the other side of the first substrate 21, a cold end 11 is arranged in the first accommodating space, a second accommodating space 311 is arranged at the other side of the second substrate 31, a hot end 12 is arranged in the second accommodating space 311, and the second accommodating space 311 and the first accommodating space are arranged oppositely and jointly enclose an accommodating space. The first and second receiving spaces 311 can be used to locate and place TECs. As an alternative embodiment, the first accommodation space may be provided only on the first substrate 21 as the accommodation space, or the second accommodation space 311 may be provided only on the second substrate 31 as the accommodation space, and the limitation is not made here.

In this embodiment, heat conducting members are disposed between the first heat dissipation member 2 and the TEC and between the second heat dissipation member 3 and the TEC. Wherein, the heat conduction piece is heat conduction silicone grease. Through setting up the heat conduction spare, can further accelerate the heat transfer between first radiating member 2 and the TEC and between second radiating member 3 and the TEC, heat conduction efficiency is higher. As an alternative embodiment, a heat conducting member may be provided only between the first heat sink 2 and the TEC, or only between the second heat sink 3 and the TEC, or no heat conducting member may be provided between the first heat sink 2 and the TEC and between the second heat sink 3 and the TEC. In the alternative embodiment, the heat conductive member may be made of a metal material having a good heat conductive property such as copper or aluminum, or may be made of another material having a good heat conductive property, and the present invention is not limited thereto.

As shown in fig. 5, the TEC in this embodiment is adapted to be connected to a power supply through a connection wire 13, and the second substrate 31 is provided with an avoidance space communicating with the outside, where the avoidance space is adapted to be penetrated by the connection wire 13. Specifically, the avoidance space is a connection hole, as shown in fig. 7, and the second substrate 31 is provided with a second connection hole 33, where the second connection hole 33 is adapted to pass through the connection wire 13. The TEC is connected with a power supply through the connecting wire 13, so that the starting and closing of the TEC can be controlled, the energy is saved, and the TEC is safer in use. As an alternative embodiment, the first substrate 21 may be provided with a space for avoiding communication with the outside, that is, a first connection hole, where the first connection hole is adapted to pass through the connection line 13, or the first substrate 21 may be provided with a first connection hole, the second substrate 31 may be provided with a second connection hole 33, where the first connection hole and the second connection hole 33 enclose together to form a space for avoiding communication with the outside, and the connection line 13 may be adapted to pass through. As an alternative embodiment, the escape space may be an escape groove.

As shown in fig. 4, the second accommodating space 311 and the first accommodating space enclose together to form an accommodating space in which all side walls of the TEC are accommodated. Through holding the whole lateral wall of TEC in the accommodation space, can transmit the heat through first radiating member 2 and second radiating member 3 furthest, and then improve the heat transfer effect. As an alternative embodiment, only a part of the side wall of the TEC may be accommodated in the accommodating space.

In order to prevent the first heat sink 2 and the second heat sink 3 from contacting to cause heat exchange, the heat exchanging apparatus in the present embodiment includes a partition member 4 provided between the first heat sink 2 and the second heat sink 3 as shown in fig. 2 to 3. Wherein the partition 4 is a heat insulator. Through setting up the separator 4, can keep apart first radiating member 2 and second radiating member 3, prevent to carry out heat transfer through the contact between first radiating member 2 and the second radiating member 3, and can guarantee that heat transfer is whole to be realized through TEC, and then improve the heat transfer effect. As an alternative embodiment, the partition 4 may not be provided when only a portion of the side wall of the TEC is accommodated in the accommodating space.

As shown in fig. 8, the partition 4 is provided with a third accommodating space 41, and the tec is disposed in the third accommodating space 41. The size of the third accommodating space 41 is adapted to the size of the TEC, and specifically, the size of the third accommodating space 41 may be set to be the same as the size of the TEC, so as to prevent heat exchange between the first heat sink 2 and the second heat sink 3.

The first heat sink 2, the partition 4 and the second heat sink 3 in this embodiment are all detachably connected. As an alternative embodiment, the first heat dissipation element 2 and the partition element 4, or the second heat dissipation element 3 and the partition element 4, or the first heat dissipation element 2 and the second heat dissipation element 3 may be fixedly connected, and the specific connection manner is determined according to the actual situation, which is not limited in any way.

Specifically, as shown in fig. 6 to 8, two mounting positions are provided on the first substrate 21, the second substrate 31 and the partition 4, and the first substrate 21, the second substrate 31 and the partition 4 are connected and fixed by pins. Further, the first substrate 21 is provided with a positioning member 211, specifically, the positioning member 211 may be a positioning protrusion, the spacer 4 and the second substrate 31 are provided with positioning holes, and the positioning member 211 is inserted into the positioning holes of the spacer 4 and the second substrate 31 for pre-positioning installation. As an alternative embodiment, the first substrate 21, the second substrate 31, and the spacer 4 may be connected and fixed by bolts. As an alternative embodiment, the installation site can also be provided with only one or three, the specific number of the installation sites being determined according to the actual situation, without any excessive limitation.

According to the embodiment of the utility model, on the other hand, the electric equipment comprises a box body provided with an opening, and the heat exchange device is fixed at the opening.

Specifically, the heat exchange device is used for cooling the capacitor, the diode and the inductor in the box body. As an alternative embodiment, the heat exchange device may also be used to cool down heating elements such as circuit boards, power supplies, etc., without any limitation.

The first heat sink 2 in this embodiment is disposed inside the case, and the second heat sink 3 is disposed outside the case. Through set up first radiating part 2 in the inside of box, TEC can cool off first radiating part 2 fast, and then reduces the inside ambient temperature of box fast to improve the life of box internal electric element.

The second heat sink 3 in this embodiment is fixed at the opening. Specifically, as shown in fig. 2, the first substrate 21 has the same cross-sectional size as the opening, the separator 4 has the same cross-sectional size as the opening, and the second substrate 31 has a cross-sectional size larger than the opening. Wherein, the position on the second substrate 31 near the end is provided with a mounting hole 312, the opening of the box is correspondingly provided with a mounting position, and the second substrate 31 and the box are fixed by bolting. As an alternative embodiment, the first heat sink 2 may be fixed to the opening.

The outside of the case in this embodiment is provided with a fan, which is disposed close to the second tooth sheet 32. By providing a fan, heat dissipation can be further accelerated. As an alternative embodiment, a fan may be provided inside the case to accelerate the cooling.

Although embodiments of the present utility model have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations fall within the scope of the utility model as defined by the appended claims.

Claims (10)

1. A heat exchange device, comprising:

the refrigerating piece (1) comprises a cold end (11), a hot end (12) and a side wall, wherein the side wall is arranged between the cold end (11) and the hot end (12);

The first heat dissipation piece (2) is arranged on one side close to the cold end (11), the first heat dissipation piece (2) comprises a first base plate (21), and a first tooth piece (22) is arranged on one side, far away from the cold end (11), of the first base plate (21);

The second heat dissipation part (3) is arranged on one side close to the hot end (12), the second heat dissipation part (3) comprises a second substrate (31), and a second tooth sheet (32) is arranged on one side, far away from the hot end (12), of the second substrate (31);

The other side of the first base plate (21) and/or the other side of the second base plate (31) is/are provided with a containing space, and the containing space is used for containing at least part of the side wall of the refrigerating piece (1).

2. Heat exchange device according to claim 1, wherein the other side of the first base plate (21) is provided with a first accommodation space, the cold end (11) being provided in the first accommodation space;

The other side of the second substrate (31) is provided with a second accommodating space (311), the hot end (12) is arranged in the second accommodating space (311), and the second accommodating space (311) and the first accommodating space are oppositely arranged and jointly enclose to form the accommodating space.

3. Heat exchange device according to claim 1, wherein the receiving space accommodates all side walls of the cooling element (1).

4. A heat exchange device according to claim 3, wherein the heat exchange device comprises:

And the separation piece (4) is arranged between the first heat dissipation piece (2) and the second heat dissipation piece (3).

5. Heat exchange device according to claim 4, wherein the partition (4) is a heat insulation.

6. Heat exchange device according to claim 4, wherein the partition (4) is provided with a third accommodation space (41), and the refrigerating element (1) is arranged in the third accommodation space (41) in a penetrating manner;

And/or at least two of the first heat dissipation piece (2), the separation piece (4) and the second heat dissipation piece (3) are detachably connected.

7. Heat exchange device according to any one of claims 1-6, wherein a heat conducting element is provided between the first heat sink (2) and the cooling element (1) and/or between the second heat sink (3) and the cooling element (1);

And/or the refrigerating element (1) is adapted to be connected to a power source by means of a connection line (13);

And the first substrate (21) and/or the second substrate (31) are/is provided with an avoidance space communicated with the outside, and the avoidance space is suitable for being penetrated by the connecting wire (13).

8. An electrical device, comprising:

The box body is provided with an opening;

the heat exchange device of any one of claims 1-7, secured at the opening.

9. The electrical device according to claim 8, wherein the first heat sink (2) is provided inside the housing and the second heat sink (3) is provided outside the housing;

And/or the first heat dissipation piece (2) or the second heat dissipation piece (3) is fixed at the opening;

And/or a fan is arranged outside the box body and is close to the second tooth plate (32).

10. The electrical device according to claim 9, characterized in that the first substrate (21) has a cross-sectional dimension identical to the dimension of the opening;

And/or the cross-sectional dimension of the partition (4) is the same as the dimension of the opening;

And/or the cross-sectional dimension of the second substrate (31) is larger than the dimension of the opening.