CN215797063U - Fully automatic IC burning and recording equipment - Google Patents
Fully automatic IC burning and recording equipment Download PDFInfo
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- CN215797063U CN215797063U CN202121974623.0U CN202121974623U CN215797063U CN 215797063 U CN215797063 U CN 215797063U CN 202121974623 U CN202121974623 U CN 202121974623U CN 215797063 U CN215797063 U CN 215797063U
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Abstract
The utility model discloses a full-automatic IC burning pick-and-place device, which comprises: module is got to material loading module, orientation module, a plurality of record module, a plurality of unloading module and chip, wherein: the number of the burning modules is the same as that of the blanking modules; the chip taking and placing module comprises a turntable and a plurality of manipulators; the first material port of the feeding module, the second material port of the positioning module, the third material ports of the plurality of burning modules and the fourth material ports of the plurality of discharging modules are uniformly distributed in the edge area of the rotary disc; the plurality of mechanical arms respectively correspond to the first material opening, the second material opening, the third material openings and the fourth material openings so as to respectively pick and place the IC chips respectively borne by the first material opening, the second material opening, the third material openings and the fourth material openings; the positioning module comprises a visual positioning device which is arranged corresponding to the second material opening. The utility model effectively improves the production efficiency and the qualification rate of IC burning.
Description
Technical Field
The utility model relates to the technical field of IC (Integrated Circuit) chips, in particular to a full-automatic IC burning pick-and-place device.
Background
An IC chip is a micro electronic device or component, which is a micro structure having a desired circuit function by integrating electronic components such as transistors, diodes, resistors, capacitors, and inductors, and wiring, and rapid development of the IC chip has made the electronic components advance toward miniaturization, low power consumption, and high reliability.
At present, the commonly adopted IC chip burning equipment has single function, most equipment not only needs manual operation, but also has the phenomenon of low chip taking and placing precision and the like. In addition, although the automatic programming device based on the three-axis robot exists in the prior art, the automatic programming device still has the phenomena of single operation mode and inaccurate positioning of the IC chip. Therefore, the existing commonly used manual-based burning equipment or automatic burning equipment easily causes the problems of low production efficiency and production qualified rate of the IC chip and the like.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a full-automatic IC burning pick-and-place device, aiming at improving the production efficiency and the qualification rate of IC burning.
In order to achieve the above object, the present invention provides a fully automatic IC burning pick-and-place device, which comprises:
module is got to material loading module, orientation module, a plurality of record module, a plurality of unloading module and chip, wherein:
the number of the burning modules is the same as that of the blanking modules;
the chip taking and placing module comprises a turntable and a plurality of manipulators;
the first material port of the loading module, the second material port of the positioning module, the third material ports of the plurality of burning modules and the fourth material ports of the plurality of blanking modules are uniformly distributed in the edge area of the turntable;
the plurality of manipulators correspond to the first material port, the second material port, the third material ports and the fourth material ports respectively so as to take and place IC chips carried by the first material port, the second material port, the third material ports and the fourth material ports respectively;
the positioning module comprises a visual positioning device which is correspondingly arranged with the second material port.
In an embodiment, the visual positioning device includes a visual positioning lens and a visual positioning light source, the visual positioning lens is installed right above the second material port, and the visual positioning light source is installed right below the second material port and is located on the same straight line perpendicular to the turntable with the visual positioning lens.
In an embodiment, the rotating disc rotates in a reciprocating manner or in a circulating manner according to a preset angle, and the preset angle is determined based on the number of the first material opening, the second material opening, each third material opening, and each fourth material opening.
In an embodiment, the burning module includes a rotary burning table, the rotary burning table is uniformly distributed with a plurality of burning stations, an IC chip carrying platform is arranged above the burning stations, and each IC chip carrying platform corresponds to the third material opening based on the driving of the rotary burning table.
In one embodiment, each of the plurality of manipulators comprises a swing arm, the swing arms are arranged along the radial direction of the turntable, and the tail ends of the swing arms are provided with clamping jaws or suction nozzles.
In one embodiment, the plurality of manipulators are angled at the same angle relative to each other.
In an embodiment, the blanking module further comprises a laser marker, and the laser marker is used for performing laser marking on the IC chip passing through the fourth material port.
In an embodiment, the blanking module further includes a braid coiling device, and the braid coiling device is used for braiding and sealing the IC chip passing through the fourth material port to form a finished material strap.
In an embodiment, the fully automatic IC burning pick-and-place apparatus further includes:
the device comprises a rack, wherein the rack is used for installing a feeding module, a positioning module, a plurality of burning modules, a plurality of discharging modules and a chip taking and placing module.
In an embodiment, the fully automatic IC burning pick-and-place apparatus further includes:
and the control module is in communication connection with the feeding module, the positioning module, the plurality of burning modules, the plurality of discharging modules and the chip taking and placing module respectively.
The technical scheme of the utility model provides a full-automatic IC burning pick-and-place device, which comprises: module is got to material loading module, orientation module, a plurality of record module, a plurality of unloading module and chip, wherein: the number of the burning modules is the same as that of the blanking modules; the chip taking and placing module comprises a turntable and a plurality of manipulators; the first material port of the loading module, the second material port of the positioning module, the third material ports of the plurality of burning modules and the fourth material ports of the plurality of blanking modules are uniformly distributed in the edge area of the turntable; the plurality of manipulators correspond to the first material port, the second material port, the third material ports and the fourth material ports respectively so as to take and place IC chips carried by the first material port, the second material port, the third material ports and the fourth material ports respectively; the positioning module comprises a visual positioning device which is correspondingly arranged with the second material port.
Compared with the existing manual burning equipment or automatic burning equipment, the visual positioning device based on the positioning module performs pre-positioning on the IC chip in the IC chip burning process, and then programs are burned on the IC chips subjected to the pre-positioning simultaneously based on the plurality of burning modules, so that the accurate positioning burning of the IC chips can be realized, the IC chips can be simultaneously burned, the next IC chip can be burned after the processes of feeding, burning and receiving one IC chip are completed one by one like the traditional equipment, and the production efficiency and the qualification rate of IC burning are effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a fully automatic IC burning pick-and-place device according to an embodiment of the present invention;
FIG. 2 is a view of a vision positioning lens of a vision positioning device in an embodiment of a fully automatic IC burning pick-and-place apparatus of the present invention;
fig. 3 is a view showing a visual positioning light source of a visual positioning device in an embodiment of the fully automatic IC burning pick-and-place apparatus of the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
It should be noted that if the description of "first", "second", etc. is provided in the embodiment of the present invention, the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
The utility model provides a full-automatic IC burning pick-and-place device.
In an embodiment of the present invention, in the fully automatic IC burning pick-and-place equipment, the setting modes of the plurality of burning modules and the plurality of blanking modules are the same, so that based on the simplicity of the lines of the drawings and the convenience of explanation and understanding, the embodiment only describes a scene in which the fully automatic IC burning pick-and-place equipment includes 1 burning module and 1 blanking module.
As shown in fig. 1, the structure of the fully automatic IC burning pick-and-place device includes: module 5 is got to material loading module 1, orientation module 2, a plurality of burning module 3, a plurality of unloading module 4 and chip, wherein:
the number of the burning modules 3 is the same as that of the blanking modules 4;
the chip taking and placing module 5 comprises a turntable and a plurality of manipulators 50;
the first material port 10 of the feeding module 1, the second material port 20 of the positioning module 2, the third material ports 30 of the plurality of burning modules 3 and the fourth material ports 40 of the plurality of discharging modules 4 are uniformly distributed in the edge area of the turntable;
the plurality of manipulators 50 correspond to the first material opening 10, the second material opening 20, each third material opening 30 and each fourth material opening 40 respectively, so as to pick and place the IC chips respectively carried by the first material opening 10, the second material opening 20, each third material opening 30 and each fourth material opening 40;
the positioning module 2 comprises a visual positioning device corresponding to the second material port 20.
In this embodiment, when the fully automatic IC burning pick-and-place device is used, an IC chip is loaded from the loading module 1, is pre-positioned by the positioning module 2, and then enters the burning module 3 to complete a burning procedure, and finally is discharged by the discharging module 4, and each manipulator 50 performs a pick-and-place operation (each manipulator 50 can perform a pick-and-place operation at the corresponding first material opening 10, second material opening 20, third material opening 30, and fourth material opening 40) respectively in the whole process.
It should be noted that, in this embodiment, the positioning module 2 may specifically perform the pre-positioning on the IC chip, where the positioning module 2 places the IC chip on the card seat located at the second material port 20 of the positioning module 2, and in this process, the visual positioning device is used to position the placement position of the IC chip in the card seat. Thus, after the positioning module 2 is positioned based on the visual positioning device to accurately place the IC chip in the card socket, the manipulator 50 corresponding to the second port 20 takes the IC chip together with the card socket and places the IC chip at the third port 30 corresponding to the burning module 3, so that the burning module 3 can perform the burning operation on the IC chip.
When the material taking machine is at the initial position, each mechanical arm 50 corresponds to the first material opening 10, the second material opening 20 and each third material opening 30 respectively, and each mechanical arm 50 takes materials simultaneously; after the turntable rotates a fixed angle, each manipulator 50 can respectively correspond to the second material opening 20, the third material opening 30 and the fourth material opening 40, and each manipulator 50 discharges materials simultaneously.
Further, referring to fig. 2 and fig. 3, in the fully automatic IC burning pick-and-place device of the present invention, the visual positioning device of the positioning module 2 includes a visual positioning lens 21 and a visual positioning light source 22, the visual positioning lens 21 is installed right above the second material opening 20, and the visual positioning light source 22 is installed right below the second material opening 20 and is located on the same straight line perpendicular to the turntable with the visual positioning lens 21.
Preferably, the vision positioning lens 21 may be a mature lower CCD vision alignment device, and the vision positioning light source 22 may be a lower CCD vision alignment circular light source.
In this embodiment, when the fully automatic IC burning pick-and-place device is used, the manipulator 50 adjusts the position of the IC chip carried on the second material opening 20 through the lower CCD vision alignment device and the lower CCD vision alignment circular light source, so as to realize accurate positioning of the IC chip.
Further, the rotating disc rotates in a reciprocating manner or in a circulating manner according to a preset angle, and the preset angle is determined based on the number of the first material opening 10, the second material opening 20, each third material opening 30, and each fourth material opening 40.
In this embodiment, when the number of the first material opening 10, the second material opening 20 and the third material opening 30 is 1, the preset angle of each rotation of the turntable in the counterclockwise or clockwise reciprocating manner is 90 °.
Further, each of the plurality of manipulators 50 includes a swing arm disposed along a radial direction of the turntable, and a clamping jaw or a suction nozzle is provided at a distal end of the swing arm.
In this embodiment, the end of swing arm sets up the suction nozzle and can pass through vacuum pump cooperation suction nozzle absorption IC chip, adopts the mode of vacuum absorption, is difficult to damage IC chip, has ensured the production qualification rate of burning record IC chip.
Further, the plurality of the manipulators 50 are arranged at the same angle with respect to each other.
In this embodiment, when the number of the first material opening 10, the second material opening 20, and the third material opening 30 is 1, the included angles between the manipulators 50 are 90 °, and 180 °, respectively, and the first material opening 10, the second material opening 20, the third material opening 30, and the fourth material opening 40 are located at six o 'clock, nine o' clock, twelve o 'clock, and three o' clock directions of the turntable, respectively.
In this embodiment, when the full-automatic IC burning pick-and-place device is in use and is in the initial position, each manipulator 50 is respectively corresponding to the first material opening 10 of the loading module 1, the second material opening 20 of the positioning module 2, and the third material opening 30 of the burning module 3 in position (i.e. is located right above the position), each manipulator 50 descends at the same time, the material taking is completed through the suction nozzle at the end of the swing arm, and each manipulator is lifted up again after the material taking. After the turntable of the chip pick-and-place module 5 rotates 90 degrees clockwise, at this time, each manipulator 50 becomes to form a position correspondence with the second material port 20 of the positioning module 2, the third material port 30 of the burning module 3 and the fourth material port 40 of the blanking module 4, then each manipulator 50 descends simultaneously, the suction nozzle finishes discharging, and after discharging, the three manipulators lift up again, and the IC chip finishes corresponding pre-positioning, burning and blanking processes at the positioning module 2, the burning module 3 and the blanking module 4 respectively. Finally, after the turntable rotates in the reverse direction by 90 degrees, each manipulator 50 returns to the initial position to wait for the next round of material taking and placing.
Further, when the number of the first material opening 10 and the second material opening 20 is 1, and there are a plurality of third material openings 30 and fourth material openings 40, the included angles between the initial positions and the manipulators 50 corresponding to the first material opening 10, the second material opening 20 and the third material opening 30 are also 90 °, 90 ° and 180 °, respectively, and one or more manipulators 50 corresponding to the third material opening 30 and the fourth material opening 40 at the same time need to be added, so as to take the burned IC chips from the third material opening 30 and place the burned IC chips in the fourth material opening 40 for feeding.
The independent manipulator 50 operates independently with respect to the manipulators 50 corresponding to the first material port 10, the second material port 20 and the third material port 30, respectively, so that the IC chips burned on the third material port 30 are taken and placed in the fourth material port 40 only between the third material port 30 and the fourth material port 40.
The number of the independent manipulators 50 is specifically determined according to the number of the third material opening 30 and the fourth material opening 40, for example, when the third material opening 30 and the fourth material opening 40 are both 2, the number of the independent manipulators 50 is 1, when the third material opening 30 and the fourth material opening 40 are both 3, the number of the independent manipulators 50 is 2, and so on.
By adopting the technical scheme of the utility model, the pre-positioning, burning and blanking actions of the IC chip can be simultaneously finished by rotating the turntable once, and the steps involved in each burning cycle process can be synchronously carried out without waiting, so that the high-efficiency production of IC burning can be realized.
Further, the burning module 3 includes a rotary burning table, a plurality of burning stations are uniformly distributed on the rotary burning table, an IC chip carrying platform 31 is arranged above the burning stations, and each IC chip carrying platform 31 corresponds to the third material port 30 based on the driving of the rotary burning table.
In this embodiment, the IC chip carrier 31 corresponds to the third material opening 30 based on the driving of the rotary burning table, so that the IC chip can fall into the IC chip carrier 31 through the third material opening 30 of the burning module, and rotate clockwise or counterclockwise along the rotary burning table for burning, and finally return to the third material opening 30 of the burning module, thereby completing the burning procedure.
When the fully automatic IC burning pick-and-place device is used, after the manipulator 50 puts the IC chip to be burned into the third material opening 30 of the burning module 3, the IC chip carrier 31 rotates by an angle, the IC chip to be burned continues to be burned on the IC chip carrier 31, and another blank IC chip carrier 31 can enter the third material opening 30 of the burning module 3 based on the rotation to wait for the new IC chip to be burned to be put in, so that the burning of a plurality of IC chips can be realized simultaneously. In addition, after the IC chip on the IC chip carrier 31 is completely burned, the IC chip carrier 31 returns to the material inlet/outlet 30 of the burning module 3 after rotating for one circle and is taken away by the manipulator 50, and the remaining blank IC chip carrier 31 continues to wait for the manipulator to put the next IC chip to be burned into the manipulator. The full-automatic IC burning pick-and-place equipment can burn a plurality of IC chips at the same time by the means, so that the integral burning production efficiency is improved.
Further, the blanking module 4 further comprises a laser marker 6, and the laser marker 6 is used for performing laser marking on the IC chip passing through the fourth material port 40.
In the present embodiment, the blanking module 4 further includes a laser marker 6, and the laser marker 6 is preferably disposed above a passing position of the IC chip at the fourth material port 40. After the IC chip completes program burning, the IC chip enters the laser marker 6 through the fourth material port 40 of the blanking module 4 to complete laser marking.
Further, the blanking module 4 further comprises a braid coiling device, and the braid coiling device is used for braiding and sealing the IC chip passing through the fourth material port to form a finished material belt.
In this embodiment, the blanking module 4 further includes a braid coiling device, as shown in fig. 1, the braid coiling device is specifically disposed behind the laser marker 6, the braid coiling device includes a tape sealer 7 and a tape coiler 8, after the program burning is completed, the IC chip enters the braid coiling device through a fourth material port 40 of the blanking module, and the braid and the tape are sealed by the tape sealer 7 (specifically, the carrier tape with the IC chip is sealed with the cover tape). After the IC chip is braided and sealed, the braid collecting device 8 is used for accurately positioning the braid discharging position to collect the sealed finished material strap.
In the embodiment, the full-automatic IC burning pick-and-place equipment can perform laser marking, tape weaving, tape sealing and tape winding on the IC chip, has more perfect functions, reduces the processing links of semi-finished products and shortens the overall processing time.
Further, the fully automatic IC burning pick-and-place device further comprises:
the device comprises a rack 9, wherein the rack 9 is used for installing a feeding module 1, a positioning module 2, a plurality of burning modules 3, a plurality of discharging modules 4 and a chip taking and placing module 5.
And the control module is in communication connection with the feeding module 1, the positioning module 2, the plurality of burning modules 3, the plurality of discharging modules 4 and the chip taking and placing module 5 respectively.
In this embodiment, the fully automatic IC burning pick-and-place device further includes a frame 9 for mounting the loading module 1, the positioning module 2, the burning modules 3, the blanking modules 4, and the chip pick-and-place module 5, and a control module respectively connected to the loading module 1, the positioning module 2, the burning modules 3, the blanking modules 4, and the chip pick-and-place module 5.
By adopting the means, the full-automatic IC burning pick-and-place equipment not only can realize full-automatic operation through an autonomous integrated control program, but also can finally realize full-automatic control on each module based on communication between the control module and each module.
Compared with the existing manual burning equipment or automatic burning equipment, the full-automatic IC burning taking and placing equipment has the advantages that in the process of burning the IC chips, the visual positioning device based on the positioning module performs pre-positioning on the IC chips, and then program burning is performed on the IC chips subjected to the pre-positioning simultaneously based on the burning modules, so that the IC chips can be accurately positioned and burnt, the IC chips can be burnt simultaneously, the burning of the next IC chip can be performed after the loading, burning and tape receiving processes of one IC chip are finished one by one like the traditional equipment, and the production efficiency and the qualified rate of IC burning are effectively improved.
It should be noted that the above mentioned embodiments are only preferred embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by the contents of the present specification and the drawings or other related technical fields directly/indirectly under the inventive concept of the present invention are included in the scope of the present invention.
Claims (10)
1. The utility model provides a full-automatic IC burns and burns record and gets equipment of putting which characterized in that, full-automatic IC burns record and gets equipment of putting includes: module is got to material loading module, orientation module, a plurality of record module, a plurality of unloading module and chip, wherein:
the number of the burning modules is the same as that of the blanking modules;
the chip taking and placing module comprises a turntable and a plurality of manipulators;
the first material port of the loading module, the second material port of the positioning module, the third material ports of the plurality of burning modules and the fourth material ports of the plurality of blanking modules are uniformly distributed in the edge area of the turntable;
the plurality of manipulators correspond to the first material port, the second material port, the third material ports and the fourth material ports respectively so as to take and place IC chips carried by the first material port, the second material port, the third material ports and the fourth material ports respectively;
the positioning module comprises a visual positioning device which is correspondingly arranged with the second material port.
2. The fully automatic IC burning pick-and-place device as claimed in claim 1, wherein the vision positioning device comprises a vision positioning lens and a vision positioning light source, the vision positioning lens is installed right above the second material port, and the vision positioning light source is installed right below the second material port and is on the same straight line perpendicular to the turntable with the vision positioning lens.
3. The fully automatic IC programming pick-and-place device of claim 1, wherein the turntable is rotated in a reciprocating manner or in a circulating manner according to a predetermined angle, and the predetermined angle is determined based on the number of the first material opening, the second material opening, each of the third material openings, and each of the fourth material openings.
4. The fully automatic IC burning pick-and-place device of claim 1, wherein the burning module comprises a rotary burning table, the rotary burning table is uniformly distributed with a plurality of burning stations, an IC chip carrying platform is arranged above the burning stations, and each IC chip carrying platform corresponds to the third material opening based on the driving of the rotary burning table.
5. The fully automatic IC burning pick-and-place device as claimed in claim 1, wherein each of the plurality of manipulators comprises a swing arm, the swing arm is arranged along the radial direction of the turntable, and a clamping jaw or a suction nozzle is arranged at the tail end of the swing arm.
6. The apparatus as claimed in claim 1 or 5, wherein the manipulators are arranged at the same angle.
7. The fully automatic IC burning pick-and-place device according to claim 1, wherein the blanking module further comprises a laser marker for laser marking the IC chip passing through the fourth material opening.
8. The fully automatic IC burning pick-and-place device according to claim 1 or 7, wherein the blanking module further comprises a taping and coiling device, and the taping and coiling device performs taping and sealing on the IC chips passing through the fourth material opening to form a finished material tape.
9. The fully automatic IC burn pick and place apparatus of claim 1, further comprising:
the device comprises a rack, wherein the rack is used for installing a feeding module, a positioning module, a plurality of burning modules, a plurality of discharging modules and a chip taking and placing module.
10. The fully automatic IC burn pick and place apparatus of claim 1, further comprising:
and the control module is in communication connection with the feeding module, the positioning module, the plurality of burning modules, the plurality of discharging modules and the chip taking and placing module respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121974623.0U CN215797063U (en) | 2021-08-20 | 2021-08-20 | Fully automatic IC burning and recording equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121974623.0U CN215797063U (en) | 2021-08-20 | 2021-08-20 | Fully automatic IC burning and recording equipment |
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| CN215797063U true CN215797063U (en) | 2022-02-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118618890A (en) * | 2024-08-09 | 2024-09-10 | 深圳市瑞芯辉科技有限公司 | Chip burning device |
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2021
- 2021-08-20 CN CN202121974623.0U patent/CN215797063U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118618890A (en) * | 2024-08-09 | 2024-09-10 | 深圳市瑞芯辉科技有限公司 | Chip burning device |
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