CN118841490A - Mip packaging method - Google Patents

Abstract

The present invention discloses a Mip packaging method, and the discrete device detection and packaging process includes the following steps: hot pressing after bonding the discrete device to UV tape; separating the discrete device from the first high-temperature tape; debonding the UV tape; hot pressing after bonding the discrete device to the first blue film; separating the discrete device from the UV tape; spot testing the pin surface of the discrete device to detect qualified devices and unqualified devices; removing unqualified devices from the discrete device; hot pressing after bonding the qualified device to the second blue film; separating the qualified device from the first blue film; and pasting release paper on the side of the qualified device away from the second blue film. The present invention has a simplified process flow, more guaranteed reliability, less heavy asset investment and low auxiliary material cost, simplifies the Mip packaging process, reduces the Mip packaging cost, and improves the Mip packaging reliability.

Description

A Mip encapsulation method

Technical Field

The present invention relates to the field of semiconductor technology, and in particular to a Mip packaging method.

Background Art

In MLED display applications, the birth time of COB and Mip technologies differs by about 10 years. However, since 2023, Mip has formed a three-way competition with COB. From the perspective of the underlying technical framework, COB is a chip-level packaging technology, in which LED crystals are packaged into a cell structure with hundreds or even more pixels. Mip technology is more inclined to independent RGB pixel packaging, or an independent packaging structure with only single-digit RGB pixels.

At present, Mip products have outstanding performance in display effect, but have no obvious advantages over COB in terms of cost and process flow. The Mip packaging method in the existing technology mainly includes the following steps: tin brushing (brushing solder paste on the pad position of the PCB substrate) → SPI inspection (solder paste printing inspection) → solid crystal (light-emitting chip is mounted on the PCB substrate) → reflow soldering (light-emitting chip is welded to the PCB substrate) → AOI inspection (automatic optical inspection) → crystal removal (removing unqualified chips) → cleaning (removing flux) → dehumidification → PLSMA cleaning (plasma cleaning) → molding (encapsulating the transparent layer on the light-emitting side of the light-emitting chip to form a packaging module) → laminating and cutting (attaching the first high-temperature tape to the light-emitting surface of the packaging module and hot pressing, and then using a utility knife to cut the good material into pieces )→board pasting (making enamel disc, attach the non-adhesive surface of the first high-temperature tape to the second high-temperature tape of the enamel disc, turn the enamel disc over, and use a rubber soft board to scrape it on the anti-static workbench)→cutting (divide the package module into multiple discrete devices)→separate the first high-temperature tape from the second high-temperature tape→dehumidification→appearance inspection→stripping (separate the discrete devices from the first high-temperature tape)→cleaning (mix the discrete devices with alcohol and anti-static liquid)→air drying (use an ion machine to air dry the discrete devices)→dehumidification→spectroscopy (rapidly test the optoelectronic parameters of the discrete devices, spectroscopic separation)→mixing→dehumidification→taping (encapsulate the discrete devices on a strip carrier)→dehumidification→packaging (put the reel carrier encapsulated with discrete devices into an aluminum foil bag, and vacuum seal two reels in one bag). Among them, the steps from tinning to molding belong to the packaging process, the steps from laminating to appearance inspection belong to the cutting process, and the steps from stripping to packaging belong to the inspection and packaging process.

The above-mentioned inspection and packaging process has the following defects: ① Complex process flow: too many processes, long circulation time and difficulty in implementing automation; ② High risk of airtightness: The process is immersed in liquid many times, dehumidification is not thorough or process control is insufficient, which easily causes the material to absorb moisture and lead to airtightness problems; in addition, too many dehumidification times affect the reliability and brightness of the material; ③ Low efficiency of sorting and weaving and heavy asset investment: a set of equipment for spectrometry and taping is about 20W, the spectrometry UPH is about 20K/H, and the taping UPH is about 30K/H. Basically, 3 spectrometers are equipped with 2 taping machines. A monthly production capacity of 1000KK requires about 77 spectrometers and about 50 taping machines, and the cost of investing in the back-end equipment is about 1200W. ④ High cost of auxiliary materials: cover film, carrier tape, turntable, aluminum foil bag, etc., the average cost of materials is about 0.5 yuan/K.

How to simplify the Mip packaging process, reduce the Mip packaging cost and improve the Mip packaging reliability are problems that technical personnel in this field need to solve urgently.

Summary of the invention

Therefore, the technical problem to be solved by the present invention is to provide a Mip packaging method, simplify the Mip packaging process, reduce the Mip packaging cost and improve the Mip packaging reliability.

In order to solve the above technical problems, the present invention provides a Mip packaging method, comprising the following steps performed in sequence:

The first step is to manufacture a packaging module, wherein the packaging module comprises a PCB substrate, a plurality of light-emitting chips and a packaging layer, wherein the light-emitting chips are mounted on the front side of the PCB substrate, the packaging layer is arranged on a side of the light-emitting chips away from the PCB substrate, the back side of the PCB substrate is a pin surface, and a side of the packaging layer away from the light-emitting chips is a light-emitting surface;

The second step is to cut the packaging module into a plurality of discrete devices, and to bond the light-emitting surfaces of the discrete devices formed by the same packaging module to the bonding surface of the first high-temperature adhesive tape;

The third process is to test and package the discrete devices, and the third process includes the following steps:

(303) bonding the discrete device to the UV tape and then performing heat pressing, so that the pin surface of the discrete device is in contact with the bonding surface of the UV tape;

(304) separating the discrete device from the first high temperature tape;

(303) debonding the UV tape;

(304) bonding the discrete device to the first blue film and then performing heat pressing, so that the light emitting surface of the discrete device is in contact with the bonding surface of the first blue film;

(305) separating the discrete device from the UV tape;

(306) performing spot testing on the pin surface of the discrete device to detect qualified devices and unqualified devices;

(307) removing defective devices from the discrete device;

(308) bonding the qualified device to the second blue film and then performing heat pressing, so that the pin surface of the qualified device is in contact with the bonding surface of the second blue film;

(309) separating qualified devices from the first blue film;

(310) A release paper is pasted on the side of the qualified device facing away from the second blue film, and the adhesive surface of the second blue film is in contact with the edge of the release paper.

Furthermore, in step (301), the UV tape is first placed on the carrier with the adhesive surface facing upward, and then the pin surface of the discrete device is attached to the adhesive surface of the UV tape with the pin surface facing downward, and then the discrete device and the UV tape are heat-pressed together by a laminator.

Furthermore, in step (303), the UV tape is debonded by a UV debonding machine, and during the debonding process, a light-transmitting pressing plate is pressed on the non-adhesive surface of the UV tape.

Furthermore, in step (304), the first blue film is first placed on a carrier plate with the adhesive surface facing upward, and then the discrete device is attached to the adhesive surface of the first blue film, and then the discrete device and the first blue film are heat-pressed together by a film turning machine.

Furthermore, in step (306), the pin surface of the discrete device is automatically positioned and scanned by a point measuring device, and then the photoelectric parameters are tested to mark qualified devices and unqualified devices, and the coordinates of the qualified devices and unqualified devices are output.

Furthermore, in step (307), the discrete device is first automatically positioned and scanned by a glue coating device, UV glue is applied to the unqualified device according to the coordinates of the unqualified device, and then the carrier plate is placed on a light-transmitting carrier. After that, the light-transmitting upper carrier is pressed onto the pin surface of the discrete device, and then the UV glue is cured by ultraviolet light by a UV glue dissolving machine. Then, the light-transmitting upper carrier is removed and the unqualified device bonded to the light-transmitting upper carrier is taken away, and finally, the unqualified device on the light-transmitting upper carrier is removed.

Furthermore, in step (308), the second blue film is first placed on the carrier plate with the adhesive surface facing upward, and then the qualified device is attached to the adhesive surface of the second blue film with the pin surface facing downward, and then the discrete device and the second blue film are heat-pressed together by a film turning machine.

Furthermore, the first process comprises the following steps:

(101) printing solder paste at the pad position on the front side of the PCB substrate;

(102) Detecting the solder paste on the PCB substrate;

(103) transferring the light emitting chip to the corresponding pad to form a substrate chip assembly;

(104) welding the substrate chip assembly;

(105) Testing the welding quality of the substrate chip assembly to detect qualified chips and unqualified chips;

(106) removing unqualified chips from the substrate chip assembly;

(107) cleaning the substrate chip assembly with a flux cleaning agent to remove the flux, and then rinsing the cleaning agent with deionized water;

(108) drying the substrate chip assembly;

(109) dehumidifying the substrate chip assembly;

(110) performing plasma cleaning on the substrate chip assembly;

(111) The substrate chip assembly is molded to form a packaging layer to obtain the packaging module.

Furthermore, the second process comprises the following steps:

(201) bonding a plurality of the packaging modules to the same first high-temperature adhesive tape, wherein the light-emitting surface of the packaging module is bonded to the adhesive surface of the first high-temperature adhesive tape;

(202) cutting the first high temperature adhesive tape between different packaging modules to form a plurality of adhesive components;

(203) bonding the plurality of adhesive components to the second high temperature tape on the enamel disk, wherein the non-adhesive surface of the first high temperature tape is in contact with the adhesive surface of the second high temperature tape on the enamel disk;

(204) dividing each of the packaging modules into a plurality of discrete devices, while the first high temperature tape is not cut;

(205) separating the first high temperature tape from the second high temperature tape;

(206) dehumidifying the discrete device;

(207) Performing appearance inspection on the discrete device.

Furthermore, in step (201), the packaging module is first adhered to the first high-temperature tape in sequence along the length direction of the first high-temperature tape, and then the packaging module and the edge of the first high-temperature tape are hot-pressed together by a laminator; in step (203), an enamel disk is first made, and then a plurality of adhesive component arrays are adhered to the adhesive surface of the second high-temperature tape of the enamel disk, and then the enamel disk is turned over and scraped with a rubber soft board on an anti-static workbench to make it adhere to the second high-temperature tape.

The above technical solution of the present invention has the following advantages over the prior art: The detection and packaging process of discrete devices in the present invention has the following advantages: (1) Simplified process flow: The number of processes is reduced, and the turnover time is fast, which is also conducive to automated implementation; (2) Reliability is more guaranteed: The number of times of material immersion and dehumidification is reduced, which reduces the impact on material properties and reduces the risk of material failure and service life; (3) Less heavy asset investment: The efficiency of point measuring equipment is about 80K/H, and the efficiency of single-head dispensing equipment is about 40K/H (defective products are about 1%-3%). A monthly production capacity of 1000KK requires 20 point measuring machines and 2 dispensing machines, and the cost of investing in the back-end equipment is about 370W; (4) The cost of auxiliary materials is low: UV film, blue film, release paper, etc., the average cost of materials is about 0.2 yuan/K.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

FIG1 is a schematic diagram of a packaging module in step (11) of the present invention;

FIG2 is a schematic diagram of the connection between a plurality of packaging modules and a first high temperature tape in step (12) of the present invention;

FIG3 is a schematic diagram of the connection between multiple adhesive components and the second high-temperature tape in step (14) of the present invention;

FIG4 is a schematic diagram of the packaging module after cutting in step (15) of the present invention;

FIG5 is a schematic diagram of the connection between multiple discrete devices and UV tape in step (19) of the present invention;

FIG6 is a schematic diagram of the connection between a plurality of discrete devices and the first blue film in step (22) of the present invention;

FIG7 is a schematic diagram of the connection between a plurality of discrete devices and a second blue film in step (26) of the present invention;

FIG8 is a schematic diagram of the connection between multiple discrete components, the second blue film and the release paper in step (28) of the present invention.

Explanation of the reference numerals in the specification: A. packaging module; B. discrete device; 1. PCB substrate; 2. light-emitting chip; 3. packaging layer; 4. first high-temperature tape; 5. second high-temperature tape; 6. UV tape; 7. first blue film; 8. second blue film; 9. release paper.

DETAILED DESCRIPTION

The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

Embodiment 1

Referring to FIG. 1 to FIG. 8 , an embodiment of the Mip packaging method of the present invention is shown.

The above Mip encapsulation method includes the following steps performed in sequence:

(1) Print solder paste on the pad position on the front of the PCB substrate 1; specifically, print the solder paste evenly on the PCB substrate 1 to provide a basis for soldering for subsequent assembly processes. The quality of solder paste printing directly affects the soldering quality of subsequent components. Poor solder paste printing may lead to serious problems such as poor solder joints and short circuits;

(2) Detecting the solder paste on the PCB substrate 1; specifically, through the detection of the SPI system, key parameters such as the amount, shape, and position of the solder paste printed on the PCB substrate 1 (printed circuit board) can be accurately measured and analyzed;

(3) Transferring the light-emitting chip 2 to the corresponding pad to obtain a substrate chip assembly; specifically, fixing the RGB chips on the corresponding pads according to polarity;

(4) performing overflow soldering on the substrate chip assembly; specifically, placing the substrate chip assembly into a reflow soldering device for soldering. The reflow soldering device has a heating circuit inside, which heats air or nitrogen to a sufficiently high temperature and blows it onto the chip assembly that has been crystal-bonded, so that the solder on both sides of the chip corresponding to the polarity melts and then bonds with the mainboard;

(5) Inspect the welding quality of the above-mentioned substrate chip assembly to detect qualified chips and unqualified chips; specifically, the substrate chip assembly is inspected by automatic optical inspection, which is a device that detects common defects encountered in welding production based on optical principles. During automatic inspection, the machine automatically scans and collects images through a camera, compares the tested solder joints with qualified parameters in the database, and checks the defects on the PCB through image processing, and displays/marks the defects through a display or automatic marking, so that the crystal removal machine can remove them or the laser spot can burn them;

(6) removing unqualified chips from the substrate chip assembly;

(7) cleaning the substrate chip assembly with a flux cleaning agent to remove the flux, and then rinsing the cleaning agent with deionized water;

(8) drying the substrate chip assembly by using a drying machine to dry the substrate chip assembly so that moisture on the surface of the substrate chip assembly is dried;

(9) drying the substrate chip assembly and dehumidifying the substrate chip assembly in an oven so that moisture in the substrate chip assembly is completely removed;

(10) Plasma cleaning the substrate chip assembly; specifically, plasma cleaning the substrate chip assembly by a plasma cleaning machine; the principle of a plasma cleaning machine is to ionize gas molecules through a high-frequency electromagnetic field in a vacuum or specific gas environment to form plasma. These plasmas react with the surface of the material to remove surface pollutants and introduce active groups on the surface to improve the adhesion of the material and the adhesion of the coating;

(11) Molding the substrate chip assembly, encapsulating the light-emitting chip 2 between the PCB substrate 1 and the encapsulation layer 3, and obtaining an encapsulation module A, wherein the back surface of the PCB substrate is the pin surface 11, and the outer surface of the encapsulation layer 3 is the light-emitting surface 31; specifically, a layer of epoxy resin is molded on the side of the light-emitting chip 2 facing away from the PCB substrate, and the epoxy resin becomes the encapsulation layer 3 after curing;

(12) The plurality of packaging modules A are bonded to the same first high-temperature adhesive tape 4 and then hot-pressed, so that the light-emitting surface of the packaging module A is in contact with the adhesive surface of the first high-temperature adhesive tape 4; the plurality of packaging modules A are arranged in sequence along the length direction of the first high-temperature adhesive tape 4, and then the packaging module A is placed on a laminator (temperature 110° C.) and rolled to automatically laminat e the material so that the material is in close contact with the high-temperature adhesive. The first high-temperature adhesive tape has a relatively high viscosity and toughness, so that the plurality of packaging modules are connected as a whole, which is convenient for subsequent hot pressing, and can ensure that the packaging module is positioned during subsequent cutting and that the first high-temperature adhesive tape is not easily cut;

(13) Cutting the first high temperature tapes 4 between different packaging modules A to form a plurality of bonding components; specifically, cutting the first high temperature tapes 4 between two adjacent packaging modules A by a cutting tool;

(14) Adhere the above-mentioned multiple adhesive components to the second high-temperature tape 5 of the enamel disk, and the non-adhesive surface of the above-mentioned first high-temperature tape 4 is in contact with the adhesive surface of the second high-temperature tape 5 on the enamel disk; specifically, first make an enamel disk, fix the enamel disk rack on the film laminating machine, pull the second high-temperature tape to pull the second high-temperature tape over the edge of the enamel disk and stick it tightly, press the cutter to cut the second high-temperature tape, and then drag the roller 2-3 times to make the second high-temperature tape and the enamel disk stick tightly) array the above-mentioned adhesive components on the second high-temperature tape 5 of the enamel disk; the second high-temperature tape of the enamel disk has a large viscosity and a large toughness, so that multiple adhesive components are connected as a whole, and then turn the enamel disk over, and use a rubber soft board to scrape it on an anti-static workbench, so that the adhesive component is flat and fixed on the enamel disk, and it can ensure that the welding component is positioned during subsequent cutting and that the second high-temperature tape is not easily cut, so as to avoid material flying or cutting off or jumping the knife during cutting;

(15) Each of the above-mentioned packaging modules A is divided into a plurality of discrete devices B, and the first high-temperature tape 4 is not cut; specifically, the packaging module A is cut, and each discrete device includes a substrate portion formed by dividing the PCB substrate, a packaging portion formed by dividing the packaging layer, and a light-emitting portion that is encapsulated between the substrate portion and the packaging portion and includes at least one group of light-emitting chips;

(16) Separating the first high temperature tape 4 from the second high temperature tape 5 on the enamel plate;

(17) Dehumidifying the discrete device; specifically, placing the discrete device in an oven for dehumidification at a temperature of 110° C. for 0.5 hours to remove moisture on the surface of the material;

(18) Performing appearance inspection on the above discrete devices; specifically, checking whether the position and shape of the cutting meet the requirements;

(19) After the discrete device is bonded to the UV tape 6, hot pressing is performed, so that the pin surface of the discrete device B is bonded to the bonding surface of the UV tape 6; specifically, the UV tape 6 is first placed on the carrier with the bonding surface facing upward, and then the pin surface of the discrete device B is bonded to the bonding surface of the UV tape 6 with the pin surface facing downward, and then the discrete device and the UV tape 6 are hot pressed together by a laminator; after the UV tape 6 is hot pressed, its viscosity increases, ensuring that the subsequent discrete device can be separated from the first high-temperature tape, and the hot pressing temperature is 80°C-100°C;

(20) separating the discrete device from the first high-temperature tape 4;

(21) Debonding the UV tape 6; specifically, debonding the UV tape 6 by a UV debonding machine. The viscosity of the UV tape is reduced after debonding, which is convenient for the subsequent separation of the UV tape from the discrete device. During debonding, a transparent glass pressing plate is pressed on the non-adhesive surface of the UV tape 6 to prevent the UV tape from shrinking and deforming. The UV light is irradiated for 1-2 min/1 A (the time and current are adjusted according to the characteristics of the UV film);

(22) After the discrete device is bonded to the first blue film 7, hot pressing is performed so that the light emitting surface of the discrete device B is in contact with the bonding surface of the first blue film 7; specifically, the first blue film 7 is first placed on a carrier plate with the bonding surface facing upward, and then the discrete device B is bonded to the bonding surface of the first blue film 7, and then the discrete device and the first blue film 7 are hot pressed together by a film turning machine.

The central area of the carrier plate is hollowed out to facilitate hot pressing of the discrete device and the first blue film. The common pole of the debonded material is attached to the center position in the direction of the notch. The hollow hole is provided with a notch as an anti-fool mark. The viscosity of the first blue film is relatively low, which is convenient for subsequent separation of the discrete device from the first blue film. The hot pressing temperature is 50°C-65°C, the hot pressing time is 30s, and the hot pressing pressure is 300Kg.

(23) Separating the discrete device from the UV tape 6;

(24) performing point measurement on the pin surface of the discrete device B to detect qualified devices and unqualified devices; automatically positioning and scanning the pin surface of the discrete device B by using a point measurement device, then testing the photoelectric parameters to mark qualified devices and unqualified devices, and outputting the coordinates of the qualified devices and unqualified devices

(25) Remove the unqualified device from the discrete device; first, automatically position and scan the discrete device B through the glue coating equipment, apply UV glue on the unqualified device according to the coordinates of the unqualified device, then place the carrier plate on the light-transmitting carrier, and then press the light-transmitting pressing plate on the pin surface of the discrete device, and then use the UV glue dissolving machine to cure the UV glue with ultraviolet light, the light exposure time is 30S-1min/100-500mA, then remove the light-transmitting upper carrier and take away the unqualified device bonded to the light-transmitting upper carrier, and finally remove the unqualified device on the light-transmitting upper carrier; it can be wiped directly or wiped with alcohol;

(26) After the qualified device is bonded to the second blue film 8, hot pressing is performed, and the pin surface of the qualified device is bonded to the bonding surface of the second blue film 8; first, the bonding surface of the second blue film 8 is placed on the carrier plate, and then the pin surface of the qualified device is bonded to the bonding surface of the second blue film 8 with the pin surface facing downward. Then, the discrete device and the second blue film 8 are hot pressed together by a film turning machine, and finally the first blue film 7 is torn off.

(27) Separating the qualified devices from the first blue film 7;

(28) A release paper 9 is pasted on the side of the qualified device that is away from the second blue film 8, and the adhesive surface of the second blue film 8 is in contact with the edge of the release paper 9.

Among them, the length and width of the PCB substrate 1 are designed to be 40-100mm*40-100mm (it can be designed according to the wafer worktable stroke of the terminal customer's trial crystal bonding equipment. Generally, the wafer uses a 6-inch ring with a maximum stroke of 120mm). As in the above example, the design size is 50mm*92mm, and the arrangement is 75*79*2=11850pcs. The width of the UV tape is 52mm. The first blue film is an SPV-224 film (0.8N/20mm) with a diameter of 185mm and a thickness of 0.08mm. The carrier plate is a stainless steel carrier with a diameter of 200mm, a thickness of 10mm, and a hollow center (100mm diameter round and notched) edge. The lower light-transmitting glass carrier is a cylinder with a diameter of 100mmm and a height of 100mm, and the upper light-transmitting carrier is a T-shaped body (including an upper cylinder and a lower cylinder, the upper cylinder has a diameter of 150mm and a height of 30mm, and the lower cylinder has a diameter of 100mm and a height of 70mm). The second blue film is an SPV-225 film (0.95N/20mm) with a diameter of 185mm and a thickness of 0.08mm, and the diameter of the release paper is 200mm.

Embodiment 2

The rest is the same as Example 1, except that it also includes a sorting device (which must be able to recognize the coordinate data output by the point measurement device). The material after point measurement is directly transferred and laid out on another blue film according to a certain spacing and pattern using a sorting machine. The good product is then reversed for a second time so that the colloid side faces up, and finally bonded with the release paper to form a finished product. The point measurement efficiency is about 80K/H, and the sorting efficiency is about 35K/H. That is, according to a monthly production capacity of 1000KK, about 20 point measurement devices and about 44 sorting devices need to be purchased, and the overall equipment cost is about 600W, but the solution is not optimal.

Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the protection scope of the invention.

Claims (10)

1. The Mic packaging method is characterized by comprising the following steps of:

The method comprises the steps of firstly, manufacturing a packaging module, wherein the packaging module comprises a PCB substrate, a plurality of groups of light-emitting chips and a packaging layer, the light-emitting chips are arranged on the front surface of the PCB substrate, the packaging layer is arranged on one side, away from the PCB substrate, of the light-emitting chips, the back surface of the PCB substrate is a pin surface, and one surface, away from the light-emitting chips, of the packaging layer is a light-emitting surface;

A second step of cutting the packaging module into a plurality of discrete devices, wherein the light emitting surface of the discrete devices formed by the same packaging module is in fit connection with the bonding surface of the first high-temperature adhesive tape;

and a third process for inspecting and packaging the discrete devices, the third process comprising the steps of:

(301) Bonding the discrete device on a UV adhesive tape, and then performing hot pressing, wherein the pin surface of the discrete device is bonded with the bonding surface of the UV adhesive tape;

(302) Separating the discrete device from the first high temperature tape;

(303) Debonding the UV adhesive tape;

(304) Bonding the discrete device on a first blue film, and then performing hot pressing, wherein the light emitting surface of the discrete device is bonded with the bonding surface of the first blue film;

(305) Separating the discrete device from the UV tape;

(306) Performing point measurement on the pin surface of the discrete device to detect out qualified devices and unqualified devices;

(307) Removing the rejected device from the discrete device;

(308) Bonding the qualified device on the second blue film, and then performing hot pressing, wherein the pin surface of the qualified device is bonded with the bonding surface of the second blue film;

(309) Separating the qualified device from the first blue film;

(310) And attaching release paper on one side of the qualified device, which is away from the second blue film, and attaching the bonding surface of the second blue film to the edge of the release paper.

2. The method of packaging as claimed in claim 1, wherein in step (301), the UV tape is placed with its bonding surface facing up on the carrier, and then the pins of the discrete device are attached with their bonding surface facing down, and then the discrete device and the UV tape are thermally pressed together by a laminator.

3. The method according to claim 1, wherein in step (303), the UV tape is unbuckled by a UV-unbuckling machine, and a light-transmitting pressing plate is pressed against the non-adhesive surface of the UV tape during unbuckling.

4. The method of claim 1, wherein in step (304), the adhesive surface of the first blue film is placed on a carrier tray, the discrete device is attached to the adhesive surface of the first blue film, and then the discrete device and the first blue film are thermally pressed together by a film turnover machine.

5. The method according to claim 4, wherein in step (306), the pin surface of the discrete device is automatically positioned and scanned by a spot measurement device, and then the qualified device and the unqualified device are marked by the test photoelectric parameter, and coordinates of the qualified device and the unqualified device are output.

6. The method according to claim 5, wherein in step (307), the discrete device is automatically positioned and scanned by a glue spreading device, UV glue is applied to the point of the discrete device according to the coordinates of the defective device, the carrier is placed on the light-transmitting carrier, the light-transmitting carrier is pressed on the lead surface of the discrete device, UV light is irradiated and cured by a UV glue remover, the light-transmitting carrier is removed, the defective device adhered to the light-transmitting carrier is carried away, and finally the defective device on the light-transmitting carrier is removed.

7. The method of claim 1, wherein in step (308), the bonding surface of the second blue film is placed on the carrier tray with the bonding surface of the second blue film facing upwards, then the pins of the qualified device are attached to the bonding surface of the second blue film with the bonding surface facing downwards, and then the discrete device and the second blue film are thermally pressed together by a film turnover machine.

8. The Mip encapsulation method according to claim 1, wherein said first process comprises the steps of:

(101) Printing solder paste on the bonding pad position on the front surface of the PCB substrate;

(102) Detecting the solder paste on the PCB substrate;

(103) Transferring the light emitting chip to a corresponding bonding pad to form a substrate chip assembly;

(104) Welding the substrate chip assembly;

(105) Detecting the welding quality of the substrate chip assembly, and detecting qualified chips and unqualified chips;

(106) Rejecting the failed chip from the substrate chip assembly;

(107) Cleaning the substrate chip assembly through a scaling powder cleaning agent, removing the scaling powder, and rinsing the cleaning agent with deionized water;

(108) Drying the substrate chip assembly;

(109) Dehumidifying the substrate chip assembly;

(110) Plasma cleaning is carried out on the substrate chip assembly;

(111) And molding the substrate chip assembly to form a packaging layer to obtain the packaging module.

9. The Mip packaging method according to claim 1, wherein said second process comprises the steps of:

(201) Bonding a plurality of packaging modules on the same first high-temperature adhesive tape, wherein the light emitting surface of each packaging module is bonded with the bonding surface of the first high-temperature adhesive tape;

(202) Cutting off the first high-temperature adhesive tapes among different packaging modules to form a plurality of bonding assemblies;

(203) Bonding the plurality of bonding assemblies on a second high-temperature adhesive tape of the enamel tray, wherein the non-bonding surface of the first high-temperature adhesive tape is bonded with the bonding surface of the second high-temperature adhesive tape on the enamel tray;

(204) Dividing each packaging module into a plurality of discrete devices, wherein the first high-temperature adhesive tape is not cut off;

(205) Separating the first high temperature tape from the second high temperature tape;

(206) Dehumidifying the discrete devices;

(207) And performing appearance detection on the discrete device.

10. The method according to claim 9, wherein in the step (201), the packaging module is sequentially adhered to the first high-temperature adhesive tape along the length direction of the first high-temperature adhesive tape, and then the packaging module and the edge of the first high-temperature adhesive tape are hot-pressed together by a laminator; in the step (203), firstly, an enamel plate is manufactured, then a plurality of bonding component arrays are bonded on the adhesive surface of a second high-temperature adhesive tape of the enamel plate, and then the enamel plate is overturned and then scraped on an antistatic workbench by a rubber soft plate so as to be bonded on the second high-temperature adhesive tape.