CN117711675A - Conductive foam and production method thereof, electronic equipment - Google Patents

Abstract

The application provides a conductive foam, a manufacturing method thereof and electronic equipment, and relates to the technical field of electronic communication, wherein the conductive foam is applied to the electronic equipment and comprises: a foam substrate; the conductive layer is used for wrapping at least the first surface of the foam substrate, and the first surface is used for being electrically connected with a first structure in the electronic equipment through the conductive layer; the conductive layer at least comprises a conductive slurry layer, and the conductive slurry layer is used for deforming under the action of external pressure. Thus, it is possible to provide a conductive foam having conductivity, a low working height in a first direction, a low PIM, and a small stress, which can reduce the thickness of an electronic device and reduce PIM of a contact interface between the conductive foam and a structure in the electronic device when applied to the electronic device, and which can reduce or eliminate radiation stray interference, and the like.

Description

Conductive foam and production method thereof, electronic equipment

Technical field

The present application relates to the field of electronic communication technology, and in particular to a conductive foam, its production method, and electronic equipment.

Background technique

With the continuous development of mobile communication technology, the internal structure of electronic devices is becoming more and more complex, and the degree of integration is getting higher and higher. For example, taking the electronic device as a mobile phone as an example, the high degree of integration of the included components makes the thickness of the mobile phone Thinner and thinner; in this way, the distance between adjacent components along the thickness direction of the mobile phone will become smaller and smaller. In this case, how to reduce radiated spurious emission (RSE) and how to avoid signal interference between adjacent components is particularly important.

In related technologies, foam is often installed in electronic equipment to reduce stray radiation, conduct electricity, and prevent static electricity. However, the current foam cannot achieve low working height and low passive intermodulation (PIM), which results in the electronic device being unable to be ultra-thin and have better performance when used in electronic devices.

Therefore, a new solution is urgently needed to solve the above problems.

Contents of the invention

Embodiments of the present application provide a conductive foam, a manufacturing method thereof, and electronic equipment. By disposing a conductive layer on at least the first surface of the foam matrix, the conductive foam can be made conductive and can be compressed or compressed well. Stretching, thereby enabling a lower working height in the first direction, smaller PIM, smaller stress, and a larger contact area with structures in electronic devices.

In order to achieve the above purpose, this application adopts the following technical solutions:

In a first aspect, a conductive foam is provided for use in electronic equipment. The conductive foam includes:

foam matrix;

A conductive layer covering at least the first surface of the foam matrix, the first surface being used to electrically connect with the first structure in the electronic device through the conductive layer; the conductive layer at least includes conductive slurry layer, the conductive slurry layer is used to deform under external pressure.

Embodiments of the present application provide a conductive foam. By arranging a conductive slurry layer covering at least the first surface of the foam matrix, the conductive slurry in the conductive slurry layer has certain ductility and good Conductivity, large resistivity and other properties, and the conductive slurry is in liquid state before film formation, and the volume will shrink during the curing process, so that the conductive foam can not only show good conductivity, but also be deformed under pressure. , combined with the elasticity of the foam matrix, can make the conductive foam work at a lower height in the first direction; at the same time, the conductive slurry is sintered into layers and the volume is reduced to ensure the contact force between multiple conductive particles, thereby making the conductive slurry The PIM inside the material is very small; and when the conductive slurry solidifies into a conductive slurry layer, the conductive particles in the conductive slurry spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

Therefore, the present application provides a conductive foam with lower working height in the first direction, smaller PIM, and lower stress. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

In a possible implementation manner of the first aspect, the conductive slurry layer includes a slurry body and a plurality of connected conductive particles, and the conductive particles are doped in the slurry body.

In this implementation, multiple connected conductive particles in the conductive slurry layer can generate multiple current paths, thereby making the conductive slurry layer conductive; at the same time, the main body of the slurry in the conductive slurry layer is soft, making the conductive slurry The material layer can deform under external pressure.

Optionally, the conductive layer is a first conductive slurry layer, and the first conductive slurry layer is used to deform under external pressure.

In this implementation, by providing a first conductive slurry layer covering at least the first surface of the foam matrix, the first conductive slurry has certain ductility, good conductivity, large resistivity and other properties. , and the first conductive slurry is in a liquid state before film formation, and the volume will shrink during the curing process, so that the conductive foam shows good conductivity and can also deform under pressure. Combined with the elasticity of the foam matrix, The working height of the conductive foam can be lowered in the first direction; at the same time, the first conductive slurry is sintered into layers and the volume is reduced to ensure the contact force between multiple conductive particles, thereby making the PIM inside the first conductive slurry Very small; and when the first conductive slurry is cured into a conductive slurry layer, the first conductive particles in the first conductive slurry spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

Optionally, the conductive layer is a second conductive slurry layer, and the second conductive slurry layer is used to deform under external pressure.

In this implementation, by providing a second conductive slurry layer covering at least the first surface of the foam matrix, the second conductive slurry has certain ductility, good conductivity, large resistivity and other properties. , and the second conductive slurry is in a liquid state before film formation, and the volume will shrink during the curing process, so that the conductive foam shows good conductivity and can also deform under pressure. Combined with the elasticity of the foam matrix, It can make the working height of the conductive foam in the first direction lower; at the same time, the second conductive slurry is sintered into layers and the volume is reduced to ensure the contact force between multiple conductive particles, thereby making the PIM inside the second conductive slurry Very small; and when the second conductive slurry is cured into a conductive slurry layer, the second conductive particles in the second conductive slurry spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

In a possible implementation of the first aspect, the conductive layer further includes a first base material layer, and the first base material layer is used to deform under the external pressure;

The orthographic projection of the conductive slurry layer on the foam matrix at least partially coincides with the orthographic projection of the first base material layer on the foam matrix.

In this implementation, by arranging the first base material layer and the conductive slurry layer, on the one hand, the first base material layer has elasticity and can be compressed or stretched well; on the other hand, the conductive slurry layer in the conductive slurry layer The slurry has certain ductility, good conductivity, large resistivity and other properties, and the volume of the conductive slurry will shrink during the curing process, so that the conductive foam can not only show good conductivity, but also be able to withstand pressure. Deformation occurs under the pressure, combined with the elasticity of the foam matrix, which can make the working height of the conductive foam lower in the first direction; at the same time, the conductive slurry is sintered into layers and the volume is reduced, which can make the PIM inside the conductive slurry very small; and , when the conductive slurry is cured and spread into a conductive slurry layer, the contact area between the conductive foam and the structure in the electronic device can be larger.

In a possible implementation of the first aspect, the conductive slurry layer is a first conductive slurry layer, and the first conductive slurry layer is disposed on the first base material layer away from the foam matrix. one side;

The conductive layer also includes a first adhesive layer, the first adhesive layer is disposed between the first base material layer and the foam matrix, and the first adhesive layer is used to bond the The first base material layer and the foam matrix are deformed under the action of the external pressure.

In this implementation, the first adhesive layer can achieve better bonding between the first base material layer and the foam matrix; at the same time, the first adhesive layer can be compressed or stretched, and the first adhesive layer can be vertically The thickness in the direction of the foam base is smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam base is smaller, which in turn enables the conductive foam to have a lower working height in the first direction. Thus, a kind of Conductive foam with low working height in the first direction, small PIM, and low stress.

When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

In a possible implementation of the first aspect, the conductive slurry layer is a first conductive slurry layer, and the first conductive slurry layer at least wraps the first base material layer close to the foam matrix. The surface of the side, and the surface of the side wrapping the first base material layer away from the foam base;

The conductive layer also includes a first adhesive layer, the first adhesive layer is disposed between the first conductive slurry layer and the foam matrix, and the first adhesive layer is used to bond the The first conductive slurry layer and the foam matrix are deformed under the action of the external pressure.

In this implementation, the first conductive slurry layer and the foam matrix can be well bonded through the first adhesive layer; at the same time, the first adhesive layer can be compressed or stretched, and the first adhesive layer can be compressed or stretched along the The thickness perpendicular to the direction of the foam base is smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam base is smaller, which in turn enables the conductive foam to have a lower working height in the first direction; and, the first adhesive layer It will not affect the PIM and other properties of the first conductive slurry in the first conductive slurry layer. Therefore, a conductive foam with lower working height in the first direction, small PIM and low stress can be obtained.

When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment while also making the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, it can be achieved through the conductive foam The directional electrical connection of structures in electronic equipment and the reduction or elimination of radiation spurious interference effectively improve the performance of electronic equipment.

In a possible implementation of the first aspect, the first adhesive layer is a glue layer.

In this implementation, the first base material layer/first conductive slurry layer and the foam matrix can be well bonded through the glue layer; at the same time, the glue layer can be compressed or stretched, and the glue layer is perpendicular to the foam. The thickness in the direction of the cotton base is smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam base is smaller, which in turn enables the conductive foam to have a lower working height in the first direction. Thus, a method in the first direction can be obtained. Conductive foam with low working height in the direction, small PIM, and low stress; moreover, the adhesive layer is simple and easy to implement, and the cost is low.

In a possible implementation of the first aspect, the first adhesive layer is a second conductive slurry layer.

In this implementation, the second conductive slurry layer can achieve better bonding between the first base material layer/first conductive slurry layer and the foam matrix; at the same time, the second conductive slurry layer can be compressed or stretched. , and the thickness of the second conductive slurry layer in the direction perpendicular to the foam base can be smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam base can be smaller, thereby enabling the conductive foam to work in the first direction. The height is low, thus a conductive foam with a low working height in the first direction, small PIM, and low stress can be obtained.

In a possible implementation of the first aspect, the first surface of the foam base is divided into at least a first area and a second area, and the conductive layer is located in a direction perpendicular to the foam base. The height of the portion of the first region is smaller than the height of the portion of the conductive layer located in the second region.

In this implementation, by arranging the conductive foam in the first area and the second area in a direction perpendicular to the foam base, the heights are different. In this way, when used in electronic equipment, the conductive foam can at least have the same height. Two different structures are electrically connected, enriching the application of conductive foam in electronic equipment.

In a possible implementation of the first aspect, the structure of the portion of the conductive layer located in the first region is the same as the structure of the portion of the conductive layer located in the second region;

Along the direction perpendicular to the foam matrix, the height of the portion of at least one layer of the conductive layer located in the first region is smaller than the height of the portion located in the second region.

In this implementation, the height of the conductive layer in the first region can be smaller than the height in the second region, and the height difference should not be too large, which is simple and easy to implement.

In a possible implementation of the first aspect, the conductive layer further includes a second base material layer, and the second base material layer is disposed in the second area and is located away from the conductive slurry layer. One side of the foam base.

In this implementation, by disposing the second base material layer in the second area, it is possible to make the height of the conductive layer in the first area smaller than the height in the second area along the direction perpendicular to the foam matrix, and the height difference Can be larger, simple and easy to implement.

In a possible implementation of the first aspect, the shape of the foam matrix is a polyhedron, and the polyhedron at least includes the connected first surface, second surface and third surface;

The conductive layer covers at least the first surface, the second surface and the third surface.

In this implementation, the foam matrix at least includes a connected first surface, a second surface and a third surface, and the conductive layer at least covers the first surface, the second surface and the third surface of the foam matrix, thereby providing multiple Conductive foam with lower working height in the first direction, smaller PIM, and lower stress enriches the application of conductive foam in electronic equipment.

In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface and the third surface, the first surface is arranged opposite to the second surface, And the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the polyhedron. Three surfaces.

In this implementation, the first surface and the second surface of the foam matrix are arranged opposite each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is provided to cover at least part of the first surface and all of the polyhedron. The third surface and at least part of the second surface can form a "C"-like conductive layer. When the conductive foam is used in electronic equipment, the directionality of the conductive foam can be ensured to prevent fooling.

In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface, the third surface and a fourth surface, the first surface and the second surface The surfaces are arranged oppositely, and the third surface and the fourth surface are arranged oppositely, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers covering all of the first surface, at least part of the second surface, all of the third surface and all of the fourth surface.

In this implementation, the first surface is opposite to the second surface, and the third surface is opposite to the fourth surface. The first surface is connected to the second surface through the third surface and the fourth surface respectively, and a conductive layer package is provided. All the first surface, at least part of the second surface, all the third surface and all the fourth surface of the foam-covered matrix can form a similar Type conductive layer, when the conductive foam is used in electronic equipment, it can ensure the directionality of the conductive foam, so as to prevent fooling.

Optionally, when the polyhedron includes a first surface, a second surface and a third surface, the first surface is opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers the polyhedron. at least part of the first surface, at least part of the second surface and all of the third surface;

The conductive foam also includes a second adhesive layer, and the second adhesive layer is disposed on part of the second surface.

In this implementation, by disposing the second adhesive layer on part of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.

Optionally, when the polyhedron includes a first surface, a second surface, a third surface and a fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, and the first surface passes through respectively The third surface and the fourth surface are connected to the second surface, and the conductive layer covers all of the first surface, at least part of the second surface, all of the third surface and all of the fourth surface;

The conductive foam also includes a second adhesive layer, and the second adhesive layer is disposed on part of the second surface.

In this implementation, by disposing the second adhesive layer on part of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.

In a possible implementation of the first aspect, the second surface of the polyhedron is used to be electrically connected to a second structure in the electronic device through the conductive layer.

In this implementation, the first surface of the conductive foam can be electrically connected to the first structure in the electronic device through the conductive layer, and the second surface can be electrically connected to the second structure in the electronic device through the conductive layer, so that at least Implementing electrical connection between the first structure and the second structure in the electronic device.

In a possible implementation of the first aspect, the first structure in the electronic device is a display screen, a camera component, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative part. any of them.

In this implementation, the conductive foam can be connected to at least one of the display screens, camera components, antennas, metal middle frames, circuit boards, reeds, shielding covers, battery covers, decorative parts, etc. in electronic equipment through the conductive layer. kind of electrical connection.

In a possible implementation of the first aspect, the second structure in the electronic device is a display screen, a camera component, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative part. any of them.

In this implementation, the conductive foam can be connected to at least one of the display screens, camera components, antennas, metal middle frames, circuit boards, reeds, shielding covers, battery covers, decorative parts, etc. in electronic equipment through the conductive layer. kind of electrical connection.

A second aspect provides an electronic device, including the conductive foam as in the first aspect or any possible implementation of the first aspect.

The electronic device provided by the embodiments of the present application uses conductive foam as in the first aspect or any possible implementation of the first aspect, so that the thickness of the electronic device can be reduced while the structure in the electronic device is consistent with the The PIM between the contact interfaces of the conductive foam can be smaller; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

In a possible implementation of the second aspect, the first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

In this implementation, the first surface of the conductive foam can be electrically connected to the display screen through the conductive layer, and the second surface of the conductive foam can be electrically connected to the metal middle frame through the conductive layer; at the same time, because the conductive foam can be easily Good compression or stretching can not only achieve a lower working height in the first direction, but also avoid damage to the display screen, ensuring excellent performance of electronic equipment.

In a possible implementation of the second aspect, the first structure at least includes a camera component, and the camera component is used to maintain electrical connection with the conductive foam when rotating.

In this implementation, the camera component such as the camera is electrically connected to the conductive foam. Since the conductive foam has a low working height in the first direction, it can be placed between the camera and other structures; when the camera rotates in any direction During the process, because the conductive foam can be compressed or stretched very well, the camera can always maintain an electrical connection with the conductive foam, ensuring the performance of the electronic device; at the same time, because the conductive foam is an independent structure and can be separated, Then, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic equipment, causing the entire electronic equipment to be scrapped; moreover, the conductive foam can effectively absorb the tolerances that exist in the electrical connection with the structure of the electronic equipment, thereby avoiding poor contact; and, Conductive foam can make the ground (GND) path shorter; at the same time, if problems such as glue overflow occur, conductive foam can also be improved through strain. As a result, the performance of the electronic device according to the embodiment of the present application is greatly improved.

In a third aspect, a method for making conductive foam is provided. The making method includes:

A conductive layer is formed on at least a first surface of the foam matrix; wherein the first surface is used for electrical connection with the first structure in the electronic device through the conductive layer, the conductive layer at least includes a conductive slurry layer, and the conductive slurry layer is used for Deformation occurs under external pressure.

The method for making conductive foam provided in the embodiments of this application is to form conductive slurry through spraying, printing, spray plating, vacuum plating, dipping, etc., and bake/heat to solidify to form a conductive slurry layer, which is simple and easy to implement; at the same time, The conductive slurry in the conductive slurry layer has certain ductility, good conductivity, large resistivity and other properties, and the conductive slurry is in a liquid state before film formation, and the volume will shrink during the solidification process, thus making the conductive bubbles Cotton shows good conductivity and can deform under pressure. Combined with the elasticity of the foam matrix, it can make the conductive foam work at a lower height in the first direction; moreover, the conductive slurry is sintered into layers and the volume is reduced. Ensure the contact force between multiple conductive particles, thereby making the PIM inside the conductive slurry very small; in addition, when the conductive slurry solidifies into a conductive slurry layer, the conductive particles in the conductive slurry spread out, thus making the conductive foam The contact area with structures in electronic devices can be large.

Embodiments of the present application provide a conductive foam, a manufacturing method thereof, and electronic equipment. Since the conductive slurry layer in the conductive layer covering at least the first surface of the foam matrix has certain ductility, good conductivity, and large The resistivity, etc., and because the foam matrix is elastic, the conductive foam has a lower working height in the first direction, smaller PIM, and smaller stress; the conductive foam is used in electronic equipment and can be used with electronic equipment The structure has a large contact surface, and the PIM of the contact surface is small. It can also make the electronic device thinner and reduce or eliminate radiation spurious interference, etc., thus effectively improving the performance of the electronic device. , good user experience.

Description of the drawings

Figure 1 is a schematic structural diagram of a first electronic device provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of an all-round drawing foam in the related art;

Figure 3 is a schematic three-dimensional structural diagram with a cross section of the first conductive foam provided by the embodiment of the present application;

Figure 4 is a schematic cross-sectional view of the conductive foam shown in Figure 3;

Figure 5 is a schematic three-dimensional structural diagram with a cross section of the second conductive foam provided by the embodiment of the present application;

Figure 6 is a schematic cross-sectional view of the conductive foam shown in Figure 5;

Figure 7 is a schematic structural diagram of the conductive slurry layer of the conductive foam provided by the embodiment of the present application before it is cured;

Figure 8 is a schematic structural diagram of the conductive slurry layer of the conductive foam provided by the embodiment of the present application after curing;

Figure 9 is a schematic three-dimensional structural diagram with a cross-section of the third conductive foam provided by the embodiment of the present application;

Figure 10 is a schematic cross-sectional view of the conductive foam shown in Figure 9;

Figure 11 is a schematic structural diagram of the fourth conductive foam provided by the embodiment of the present application;

Figure 12 is a schematic diagram of the microstructure of the non-woven fabric provided by the embodiment of the present application;

Figure 13 is a schematic structural diagram of the fifth conductive foam provided by the embodiment of the present application;

Figure 14 is a schematic structural diagram of the sixth conductive foam provided by the embodiment of the present application;

Figure 15 is a schematic structural diagram of the seventh conductive foam provided by the embodiment of the present application;

Figure 16 is a schematic structural diagram of the eighth conductive foam provided by the embodiment of the present application;

Figure 17 is a schematic structural diagram of the ninth conductive foam provided by the embodiment of the present application;

Figure 18 is a schematic structural diagram of the tenth conductive foam provided by the embodiment of the present application;

Figure 19 is a schematic structural diagram of the eleventh conductive foam provided by the embodiment of the present application;

Figure 20 is a schematic structural diagram of a second electronic device provided by an embodiment of the present application;

Figure 21 is a schematic structural diagram of a third electronic device provided by an embodiment of the present application;

Figure 22 is a schematic structural diagram of the first electronic device in the related art;

Figure 23 is a schematic structural diagram of a second electronic device in the related art;

Figure 24 is a schematic structural diagram of a fourth electronic device provided by an embodiment of the present application;

Figure 25 is a schematic structural diagram of a fifth electronic device provided by an embodiment of the present application;

Figure 26 is a schematic structural diagram of a sixth electronic device provided by an embodiment of the present application;

Figure 27 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Figure 28 is a schematic structural diagram of a seventh electronic device provided by an embodiment of the present application;

Figure 29 is a schematic structural diagram of an eighth electronic device provided by an embodiment of the present application;

Figure 30 is a flow chart of the first manufacturing method of conductive foam provided by the embodiment of the present application;

Figure 31 is a flow chart of the second manufacturing method of conductive foam provided by the embodiment of the present application;

Figure 32 is a flow chart of the third manufacturing method of conductive foam provided by the embodiment of the present application;

Figure 33 is a flow chart of the first production method of conductive foam for practical application provided by the embodiment of the present application.

Reference signs:

01-electronic equipment; 101-display module; 1011-display; 1012-touch panel; 1013-metal frame; 102-middle frame; 1021-frame; 1022-carrying plate; 103-rear shell; 501-front Camera; 502-shielding cover; 503-conductive cloth; 504-PCB; 505-bracket steel sheet; 506-screws; 507-front camera substrate; 508-rear camera; 509-rear camera substrate; 102- Middle frame; 105-antenna; 106-insulating material layer; 107-plastic; 108-reed; 109-radium carving; 110-anti-oxidation layer; OZ-first direction (thickness direction of mobile phone); OX-second Direction (width direction of mobile phone); OY-third direction (length direction of mobile phone); 111-display screen;

03-All-round brushed foam; 121-All-round brushed foam adhesive; 122-Metal wire;

05-Conductive foam; 1-Foam matrix; 10-First foam matrix; 11-The first surface of the foam matrix; 12-The second surface of the foam matrix; 13-The third surface of the foam matrix; 14-The fourth surface of the foam matrix; 2-Conductive layer; 21-First conductive slurry layer; 211-First slurry body; 212-First conductive particles; 22-Second conductive slurry layer; 221- The second slurry body; 222-the second conductive particle; D1-the conductive path; Q1-the first region; Q12-the second region; 5-adhesive layer; 6-the first base material layer; 7-the second adhesive layer ; 8-different-color PET layer; 9-second base material layer.

Detailed ways

The technical solutions in the embodiments of the present application will be described clearly and in detail below with reference to the accompanying drawings. Among them, in the description of the embodiments of this application, unless otherwise stated, "/" means or, for example, A/B can mean A or B; "and/or" in the text is only a way to describe related objects. The association relationship means that there can be three relationships. For example, A and/or B can mean: A alone exists, A and B exist simultaneously, and B alone exists.

Hereinafter, the terms “first” and “second” are used for descriptive purposes only and shall not be understood as implying or implying relative importance or implicitly specifying the quantity of indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, “plurality” The meaning is two or more. "At least one" means one or more than one.

First, some terms used in the embodiments of this application are explained to facilitate understanding by those skilled in the art.

1. Foam

Foam refers to foamed materials such as polyurethane and plastic particles, referred to as foam. Foam has the characteristics of light weight, elasticity, fast pressure-sensitive fixation, easy to use, flexible bending, ultra-thin volume, and reliable performance.

2. Conductive foam

Conductive foam refers to wrapping conductive cloth on the foam core. After treatment, it has good surface conductivity, etc., and can be easily fixed on the structure that needs shielding with adhesive tape.

3. Passive intermodulation

Passive intermodulation is when two or more frequencies are mixed together in a nonlinear device, resulting in spurious signals.

4. Radiation spurious

Radiated spurs refer to radiation at discrete frequencies other than the carrier frequency and sidebands and adjacent channels caused by normal modulation and switching transients when modulated with a standard signal; radiated spurs may be harmonics generated by some nonlinear structures components, intermodulation signals, etc.

5. Percolation theory of conductive paste

When the content of conductive particles in the conductive slurry is high, the conductive network is mainly formed by direct overlapping of conductive particles.

6. Tunnel effect theory or field emission theory of conductive paste

When the content of conductive particles in the conductive slurry is low, the conductive particles are not enough to make direct contact. At this time, an external electric field is imposed from the outside, and the electrons penetrate the organic matter through the tunnel effect and jump to nearby conductive particles to make the conductive network unblocked. . When the tunnel effect theory or field emission theory is dominant in the conductive slurry, the PIM performance of the conductive slurry is poor.

7. Non-woven fabrics

Non-woven fabrics, also known as non-woven fabrics, needle-punched cotton, needle-punched non-woven fabrics, etc., are produced from polyester fiber, polyester fiber and other materials and are made through acupuncture technology. Non-woven fabrics have no warp and weft lines. They are a kind of fabric that does not require spinning or weaving. It just orients or randomly arranges short textile fibers or filaments to form a fiber mesh structure, and then uses mechanical, thermal bonding or chemical methods. Reinforced. Non-woven fabrics are moisture-proof, breathable, flexible, lightweight, flame-retardant, non-toxic and odorless, low-priced, and recyclable.

The above is a brief introduction to the terms involved in the embodiments of this application, and will not be described in detail below.

Illustratively, FIG. 1 shows an electronic device 01 to which embodiments of the present application are applicable.

As shown in Figure 1, taking the electronic device 01 as a mobile phone as an example, the mobile phone may include a display module 101, a middle frame 102, a back shell 103, etc. The middle frame 102 is disposed between the display module 101 and the back shell 103. The frame 102 includes a frame 1021 and a load-bearing plate 1022 surrounded by the frame. Internal structures, such as components, are installed on one side of the load-bearing plate 1022 . The internal structure of mobile phones can realize functions through electrical connections. This electrical connection is usually a weak contact, which causes the contact interface of the internal structure to easily produce nonlinear products such as harmonics and passive intermodulation. Nonlinear products are the main source of radiation spurious by mobile phones. Source, and radiation spurious interference is an important indicator for mobile phone acceptance.

In order to reduce or eliminate stray radiation interference, the internal structure of the mobile phone can be electrically connected through foam. Related technologies provide many types of foam, such as all-round brushed foam, etc. These foams are widely used due to their low PIM and other characteristics.

Illustratively, Figure 2 shows an omnidirectional brushed foam 03 in related technology. As shown in Figure 2, the all-round brushed foam 03 includes a back glue 121 and a metal wire 122. The back glue 121 may include any one of conductive glue, insulating glue, etc., and the metal wire 122 may include copper wire, etc. However, when the all-around brushed foam 03 is compressed, the metal wire 122 may break, or the metal wire 122 may not rebound and become permanently deformed, causing it to deform in the first direction. The working height is difficult to compress. It should be noted that the first direction is the OZ direction shown in Figure 2, and the OZ direction corresponds to the thickness direction of the mobile phone.

Then, based on the above examples, it can be seen that the foam provided in the related art cannot achieve a lower working height in the first direction, nor can it further reduce the PIM.

In view of this, the present application provides a conductive foam. The conductive foam is provided with a conductive layer covering at least the first surface of the foam matrix. The conductive layer at least includes a conductive slurry layer, and the conductive slurry layer has ductility. It has the advantages of good conductivity, very small internal PIM, etc.; at the same time, the conductive slurry is liquid before film formation, and the volume will shrink during the curing process, so that the conductive foam can not only show good conductivity, but also be able to withstand pressure. deforms under the pressure and rebounds after the pressure disappears, thereby effectively reducing the working height of the conductive foam in the first direction and achieving very small PIM, and the conductive foam itself will not break or permanently deform. And other issues.

When the conductive foam of the present application is used in electronic equipment, the contact area between the conductive foam and the structure in the electronic equipment is large, and can effectively reduce the thickness of the electronic equipment and achieve ultra-thinness; at the same time, it can also reduce the thickness of the electronic equipment. The interface PIM between the structure and the conductive foam contact surface reduces or eliminates radiation spurious interference, etc.

The embodiments of the present application do not place any restrictions on the specific types of electronic devices. In some embodiments, the electronic devices of the present application may include mobile phones, wearable devices (such as smart bracelets, smart watches, headphones, etc.), tablet computers, laptops, etc. Laptop, handheld computer, notebook computer, ultra-mobile personal computer (UMPC), cellular phone, personal digital assistant (PDA), augmented reality (AR)\virtual Internet of things (IOT) devices such as virtual reality (VR) devices, vehicle-mounted electronic devices, and can also be devices such as TVs, large screens, printers, projectors, etc.

In the application, taking the electronic device as a mobile phone as an example, as shown in Figure 1, the mobile phone may include a display module 101, a middle frame 102, a back shell 103, etc. Among them, the display module 101 includes a display screen 1011 and a touch panel 1012 provided on the light-emitting side of the display screen 1011; the display module 101 is installed on one side of the carrier plate 1022, and the camera component, antenna, and circuit board are installed on the other side. , batteries and other internal structures, the frame 1021 and the load-bearing plate 1022 used to form the middle frame 102 can be an integrated structure; the back shell 103 is installed on the middle frame 102 and is used to protect the above-mentioned internal structures. As shown in Figure 1, the mobile phone can also include a metal frame 1013 installed on the non-light-emitting side of the display screen 1011. The side of the metal frame 1013 away from the display screen 1011 can be pasted on the side of the middle frame 102 through an adhesive layer, thereby achieving The display module 101 is installed on one side of the middle frame 102 .

In some embodiments, in the electronic device of the present application, the first structure may be any one of a display screen, a camera component, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative piece, etc. ; The second structure may be any one of a display screen, a camera component, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative piece, etc.; The first structure and the second structure may be the same, or may be different, depending on the actual application. For example, the camera component may include a camera; the circuit board may include printed circuit boards (PCB), flexible printed circuit (FPC), etc.

It should be noted that the above-mentioned display screen may include a liquid crystal display (Liquid Crystal Display, LCD), an organic light emitting diode (Organic Light Emitting Diode, OLED) display, etc.

The above-mentioned touch panel may include a cover plate made of glass or transparent resin material, and a touch electrode pattern located on a side of the cover plate close to the display screen.

Only the content related to the invention point is introduced here. The rest of the structure can be obtained by referring to related technologies and will not be explained in detail here.

Based on the above structure, when the conductive foam provided by the present application is used in electronic equipment, it can be electrically connected to any first structure in the electronic equipment and/or other structures other than the first structure, thereby realizing electronics through the conductive foam. While electrically connecting the structures in the device, it can also thin the thickness of the electronic device and reduce the PIM of the contact surface between the structure in the electronic device and the conductive foam. In addition, it can also reduce or eliminate radiation stray interference, etc. Users Great experience.

In application, at least one surface of the conductive foam provided by the embodiment of the present application is used to electrically connect with at least one structure in the electronic device through the conductive slurry layer. In this case, the structure in the electronic device may include a display screen, a camera component, At least one of the antenna, metal middle frame, circuit board, reed, shielding cover, battery cover, decorative parts, etc.

As an example, when the conductive foam includes a first surface, the first surface may be used to electrically connect to a first structure through the conductive slurry layer, or the first surface may be used to connect to a plurality of first structures through the conductive slurry layer. The first structure is electrically connected and is not specifically limited here.

As an example, when the conductive foam includes a first surface and other surfaces, for example, when the conductive foam includes a first surface and a second surface, the first surface may be electrically connected to the first structure through the conductive slurry layer, and the second surface may be electrically connected to the first structure through the conductive slurry layer. The surface is electrically connected to the second structure through a layer of conductive paste. The second structure may refer to the first structure and will not be described again here. The number of the first structure and the second structure can also be determined according to actual needs.

The conductive foam 05 provided in the embodiment of the present application will be introduced in detail below with reference to Figures 3 to 19 .

As shown in Figures 3 to 6, Figures 9 to 11, and Figures 13 to 19, the conductive foam 05 provided by this application includes:

Foam matrix 1.

The conductive layer 2 covers at least the first surface 11 of the foam matrix 1, and the first surface 11 is used to electrically connect with the first structure in the electronic device through the conductive layer 2; the conductive layer 2 at least includes a conductive slurry layer, the conductive slurry The material layer is used to deform under external pressure.

The conductive slurry layer includes a slurry body and a plurality of connected conductive particles, and the conductive particles are doped in the slurry body.

This application does not specifically limit the material, manufacturing process, etc. of the above-mentioned foam matrix. For example, the material of the foam matrix may include polyurethane, silicon dioxide-based resin, etc. For example, a foaming process can be used to form the above-mentioned foam matrix as the foam core of conductive foam. The surface of the foamed foam matrix has multiple micropores, and the foam matrix is elastic and can be compressed and compressed well. Stretching and other deformations.

This application does not specifically limit the shape of the foam matrix. For example, the shape of the foam matrix may include polyhedron, sphere, cylinder, etc. When the shape of the foam matrix is a polyhedron, the polyhedron may include a regular polyhedron or an irregular polyhedron. When the shape of the foam matrix is a regular polyhedron, the regular polyhedron may include a cube, a hexahedron, an octahedron, etc. In Figures 3 to 6, Figures 9 to 11, and Figures 12 to 19, the shape of the foam base 1 is a hexahedron.

The polyhedron has multiple surfaces, and the multiple surfaces include at least a first surface, which is a surface that needs to be electrically connected to the first structure in the electronic device; of course, at least one other surface in the polyhedron other than the first surface can also be used. To be electrically connected to other structures in the electronic device except the first structure. For example, the polyhedron may also be provided with a second surface to be electrically connected to the second structure in the electronic device. Among all the surfaces of the polyhedron, the number of surfaces that need to be electrically connected to the structure of the electronic device can be determined according to the actual application of the conductive foam. At this time, the electrical connection can be an indirect electrical connection, that is, the surface of the polyhedron is electrically connected to the structure in the electronic device through the conductive layer; of course, the surface of the polyhedron can also be connected to the electronic device through the first adhesive layer, the conductive layer, etc. The structural electrical connection in is not specifically limited here.

The volume of the foam matrix mentioned above in this application can be determined according to actual needs.

It should be understood that the above-mentioned conductive layer covering at least the first surface of the foam base means: the conductive layer can only cover the first surface of the foam base; or, in addition to covering the first surface of the foam base, the conductive layer also Other surfaces of the foam matrix can be covered, where the other surfaces refer to any surface except the first surface, which is not specifically limited here. Taking the shape of the foam matrix as a hexahedron as an example, the conductive layer can cover one surface (the first surface) of the foam matrix; or, the conductive layer can cover both surfaces (the first surface and the second surface) of the foam matrix. ); Alternatively, the conductive layer can cover more than three surfaces of the foam matrix, depending on the actual application.

The following is a specific example of the case where the conductive layer covers the foam matrix, taking the shape of the foam matrix as a hexahedron:

As an example, in Figures 3 to 6 and 9 to 11, the conductive layer 2 covers all the first surface 11 (upper surface), all the second surface 12 (lower surface), and all the third surface of the foam base 1 Surface 13 (left surface) and all fourth surface 14 (right surface).

As another example, in Figures 13 and 14, the conductive layer covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the foam base 1 .

As another example, in Figures 15 to 18, the conductive layer covers all the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the foam base 1 .

As another example, in Figure 19, the conductive layer covers all the first surface 11 (upper surface), part of the second surface 12 (lower surface), all the third surface 13 (left surface) and all the third surface of the foam base 1 Four surfaces 14 (right surface).

It should be noted that at least one of the first surface, the second surface, the third surface and the fourth surface is used to electrically connect with the structure in the electronic device based on the conductive layer. For example, it can be the first surface, the third surface The second surface, the third surface and the fourth surface are all electrically connected to the structure in the electronic device based on the conductive layer. Specifically, the first surface is used to electrically connect to the first structure in the electronic device based on the conductive layer, and the second surface is used to electrically connect to the first structure in the electronic device based on the conductive layer. The conductive layer is electrically connected to the second structure in the electronic device. The third surface is used to electrically connect the conductive layer to the third structure in the electronic device. The fourth surface is used to electrically connect the conductive layer to the fourth structure in the electronic device. connection; or, it can be that only one surface is used for electrical connection with the structure in the electronic device based on the conductive layer, specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, and the second surface, Neither the third surface nor the fourth surface is used for electrical connection with the structure in the electronic device based on the conductive layer; of course, other situations are possible and are not specifically limited here. Among them, the first structure, the second structure, the third structure and the fourth structure can be any of the display screen, camera component, antenna, metal middle frame, circuit board, reed, shielding cover, battery cover, decorative parts, etc. One, determined based on actual needs.

It should be understood that the above-mentioned conductive layer at least includes a conductive slurry layer means: the conductive layer may only include a conductive slurry layer, for example, the conductive layer is a first conductive slurry layer/a second conductive slurry layer; or the conductive layer may include in addition to In addition to the conductive paste layer, other film layers may also be included. For example, it may also include a first adhesive layer, a first base material layer, etc., which are not specifically limited here.

This application does not specifically limit the conductive slurry of the above-mentioned conductive slurry layer. For example, the conductive slurry may include polymer conductive slurry (baked or heated to solidify into a film, with organic polymer as the adhesive phase), Sintered conductive paste (sintered into film, sintering temperature >500℃, glass powder or oxide as bonding phase), etc. The following embodiments of the present application take the conductive paste as a polymer conductive paste as an example for explanation.

In application, the conductive slurry can include a slurry body and a plurality of conductive particles. The plurality of conductive particles are doped in the slurry body. The plurality of conductive particles are not connected before curing and are connected after curing, so that the conductive particles formed after curing Multiple current paths are generated in the slurry layer to conduct electricity, and after curing, the conductive particles shrink in size to ensure contact between adjacent particles, so that the PIM inside the conductive slurry is effectively reduced; at the same time, after curing, the conductive particles spread out Opening can increase the contact area between the conductive paste layer and the structure in the electronic device.

This application does not specifically limit the slurry body. For example, the slurry body may include resin. Specifically, the resin may be any one of silicone resin, silane modified resin, epoxy resin, silicon dioxide resin, etc. . Among them, silicone resin and silane-modified resin have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress. Epoxy resin and silicon dioxide resin have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.

This application does not specifically limit the type, shape, particle size, etc. of the conductive particles. For example, the conductive particles may include metal conductive particles. Specifically, the metal conductive particles may be silver (Ag) particles, copper (Gu) Any one or combination of particles, gold (Au) particles, aluminum (Al) particles, nickel (Ni) particles, etc.; the shape of the metal conductive particles can include spherical, spiny, flake, rod, linear, etc. Any of; the particle size of the metal conductive particles can be micron level, nano level, etc. Specifically, the particle size range of the metal conductive particles can include 5-20 μm, that is, the particle size of the metal conductive particles can be 5 μm, 8μm, 10μm, 13μm, 17μm or 20μm, etc.

It should be noted that the elastic modulus of the above-mentioned conductive particles is different. When the main body of the slurry is the same resin, when conductive particles with a smaller elastic modulus are selected and doped into the resin, the conductive slurry can be made under low pressure. Microscopic deformations occur, allowing the conductive foam to increase its contact area with structures in electronic devices.

Table 1 below shows the elastic modulus, Poisson's ratio, pressure and pressure corresponding to silver particles, copper particles, gold particles, aluminum particles, nickel particles, iron particles, and platinum particles of the same size.

Table I

particle Modulus of elasticity (GPa) Poisson's ratio Ag 83 0.37 Cu 130 0.34 Au 78 0.44 Al 70 0.35 Ni 207 0.31 Fe 211 0.29 Pt 168 0.38

As can be seen from Table 1, the elastic modulus of silver, gold, and aluminum are small. When doped in resin to form a slurry layer, silver, gold, and aluminum themselves are good conductors and are soft, so they can be used very well. Compression or stretching. Moreover, the silver particles, gold particles, and aluminum particles in the conductive slurry layer can be spread out after compression, thereby achieving a larger contact area between the conductive slurry layer and the structure in the electronic device.

In addition, the required conductive particles can also be selected based on other conditions:

As an example, conductive particles can be selected according to the pressure. For example, when the pressure is high, nickel particles can be selected, and the properties of nickel particles are more stable than silver particles. For example, when the pressure is moderate, copper particles can be selected. The cost is lower than that of silver particles.

As another example, the conductive particles can be selected according to the current of the conductive path in the conductive foam. For example, when the current is low or in a low current area, copper particles can be selected to reduce costs. For example, when the current is higher or in a high current area, the conductive particles can be selected. When selecting the area, you can choose low-PIM particles such as silver particles and gold particles to ensure the performance of the conductive foam.

This application does not specifically limit the doping concentration of the conductive particles in the above-mentioned conductive slurry in the slurry body. For example, the range of the mass fraction of the conductive particles in the slurry body can include 75-85%, specifically The mass fraction of the conductive particles in the main body of the slurry can be 75%, 78%, 80%, 81%, 83% or 85%, etc. Among them, the higher the mass fraction of conductive particles in the slurry body, the smaller the resistivity and the worse the elongation at break. Therefore, the mass fraction of conductive particles in the slurry body can be set to be higher to meet the compression of the conductive slurry layer. or stretch.

As an example, the conductive paste is conductive silver paste, the conductive silver paste includes resin and silver particles, and the silver particles are doped in the resin. Among them, the mass fraction of silver particles can be 80% and the mass fraction of resin can be 20%. The resin can be compressed or stretched; the density of silver particles can be 10 and the density of resin can be 1; when the mass fraction is converted into volume fraction Finally, the ratio of the volume fraction of silver particles to the volume fraction of resin can be 2:5. After the conductive silver paste is cured, the volume can shrink by about 50%, which effectively reduces the PIM between silver particles and can even be ignored, and, It can also make the ratio of the volume fraction of silver particles in the conductive silver paste layer to the volume fraction of the resin be 1:1.25. When in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, due to the silver The particles themselves are good conductors and soft, and will deform after strong activation at low pressure, further increasing the contact area; the tensile adhesion value range of the conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the conductive silver paste. The focus can be 8Mpa or 9Mpa and so on.

It should be noted that the silver particles can be micron-scale spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-scale silver wires, silver rods, etc., depending on the actual application.

When the thickness of the conductive slurry layer in the direction perpendicular to the foam matrix is in the range of 10-13 μm, the resistivity of the conductive slurry layer can reach 200 mΩ. Then, if the resistivity of the conductive slurry layer is desired to be lower, the thickness of the conductive slurry layer along the direction perpendicular to the foam matrix can be set to be smaller. This application does not specifically limit the thickness of the conductive slurry layer in the direction perpendicular to the foam matrix. For example, the thickness of the conductive slurry layer in the direction perpendicular to the foam matrix can range from 5 to 10 μm, specifically: , the thickness of the conductive slurry layer along the direction perpendicular to the foam matrix can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

This application does not specifically limit the manufacturing process of the above-mentioned conductive slurry layer. For example, when the conductive layer only includes a conductive slurry layer, the conductive slurry can be formed on the surface of the foam substrate by spraying, printing, etc., and then The conductive paste layer is formed by curing the conductive paste by baking/heating. Alternatively, when the conductive layer includes a conductive paste layer and a first base material layer, spraying or printing can be used on the surface of the first base material layer. Form a conductive slurry by other methods, and then bake/heat the conductive slurry to form a conductive slurry layer; or, when the conductive layer includes a conductive slurry layer and a first base material layer, the first base material layer can be first The base material is soaked in the conductive slurry, and then the first base material layer, the conductive slurry and the foam matrix are combined.

As an example, when the main body of the conductive paste is silicone resin or silane-modified resin, the silicone resin and silane-modified resin can be sprayed first, and then the conductive paste is baked/heated and cured. ; Alternatively, the first base material can be soaked in silicone resin or silane modified resin, and then the conductive slurry can be baked/heated and solidified. Of course, other production processes can also be used, and there are no specific limitations here.

As another example, when the main body of the conductive paste is epoxy resin or silica resin, the epoxy resin or silica resin can be printed first, and then the conductive paste is baked/heated. Curing treatment; alternatively, the first substrate can be soaked in epoxy resin or silicon dioxide resin, and then the conductive slurry can be baked/heated and cured. Of course, other production processes can also be used, and there are no specific limitations here.

It should be noted that the slurry main body can also be selected according to the material of the foam matrix. For example, a base material similar to the foam matrix can be selected as the slurry main body. For example, silicone rubber conductive foam can use silica. The resin of the base material can improve the bonding between the foam matrix and the conductive slurry.

For example, both FIG. 8 and FIG. 9 illustrate the conductive mechanism by taking the conductive layer including the first conductive slurry layer 21 and the first conductive slurry in the first conductive slurry layer 21 being the first polymer conductive slurry as an example. Among them, FIG. 8 shows a schematic diagram of the first polymer conductive slurry before film formation; FIG. 9 shows a schematic diagram of the first polymer conductive slurry after film formation.

As shown in FIG. 8 , before the first polymer conductive slurry is formed into a film, that is, when it is not cured, since the first conductive particles 212 are not in direct contact, the first conductive slurry layer does not have conductivity at this time, and will not Create a conductive path. As shown in Figure 9, during the curing process, as the solvent continues to evaporate, the distance between the first conductive particles 212 becomes smaller and smaller until they are in direct contact with each other to form a conductive path D1. This is the seepage of the first conductive slurry. theory. FIG. 9 illustrates an example in which the first conductive paste layer generates two conductive paths D1.

It should be noted that the mass fraction of the first conductive particles in the first conductive slurry should be such that the conductive mechanism of the first conductive slurry is at least based on the percolation theory, which at this time includes: the conductive mechanism of the first conductive slurry only It is the seepage theory; or, the conductive mechanism of the first conductive slurry is mainly based on the seepage theory, and can also be supplemented by the tunnel effect theory or the field emission theory. When the mass fraction range of the first conductive particles in the first conductive slurry includes 75-85%, the conductive mechanism of the first conductive slurry can be at least based on the percolation theory.

This application does not specifically limit the source of the above-mentioned external pressure. For example, it can be the external pressure directly applied to the conductive foam; or it can also be the external external pressure applied to other structures in the electronic device, and the structure is then applied The pressure effect on the conductive foam; or, it can also be the pressure effect exerted on the conductive foam generated by other structures in the electronic device itself.

Below, two conductive foams of the present application are randomly selected, namely conductive foam 1 and conductive foam 2, so that the first surface of the conductive foam 1 is electrically connected to the radium carved surface in the electronic device, and the second surface is electrically connected to the electronic device. The copper foil in the device is electrically connected, the first surface of the conductive foam 2 is electrically connected to the laser engraved surface in the electronic device, and the second surface is electrically connected to the copper foil in the electronic device, and then the conductive foam 1 and The PIM value and the worst knock value of conductive foam 2 are shown in Table 2 below.

Table II

The following provides a related art conductive foam 3. The conductive foam 3 has a gold-plated layer covering the surface of the foam base, so that the first surface of the conductive foam 3 is electrically connected to the radium carved surface in the electronic device to form a first contact surface. , and the second surface is electrically connected to the copper foil in the electronic device, and then the PIM value of the conductive foam 3, the worst value of knocking on the workbench and the worst value of knocking on the first contact surface are obtained, as shown in Table 3 below.

Table 3

It can be seen from Table 2 and Table 3 that as the external force increases with the conductive foam 1 and 2 of this application, the worst values of knocking everywhere are very stable, and the PIM value does not change much. , the effect is better. When the external force of the conductive foam 3 in the related art is small, the worst value of the first contact surface is unstable; and as the external force increases, the PIM value tends to be stable. However, if the pressure is too high, it may cause problems at the contact interface on the non-pressure-resistant side of the multiple contact interfaces between the conductive foam and the structure of the electronic device, such as screen film marks, battery cover film marks, etc. Therefore, Don't be too stressed.

It should be noted that in actual application, the conductive foam may also include a second adhesive layer, a release layer and other structures. This application does not specifically limit the type, position, etc. of the second adhesive layer. For example, the second adhesive layer may include any one of conductive glue, insulating glue, etc., specifically, the second adhesive layer It can be any one of comprehensive conductive glue, local insulating glue, etc.; the second adhesive layer can be provided on any surface of the foam matrix.

This application does not specifically limit the type, position, etc. of the release layer. For example, the release layer may include release paper; the release layer may be disposed on the side of the second adhesive layer away from the conductive layer to Second adhesive layer for protection. When using conductive foam, the release layer can be removed to electrically connect the conductive layer to structures in the electronic device through the second adhesive layer.

Only the content related to the invention point is introduced here. The rest of the structure can be obtained by referring to related technologies and will not be explained in detail here.

The conductive foam provided in the embodiments of the present application is provided with a conductive slurry layer covering at least the first surface of the foam matrix. On the one hand, the conductive slurry in the conductive slurry layer has certain ductility and good conductivity. properties, large resistivity (10 ^-5 -10 ^-4 Ω×cm), and the conductive slurry is liquid before film formation, and the volume will shrink during the curing process, so that the conductive foam shows good conductivity At the same time, it can also deform under pressure. Combined with the elasticity of the foam matrix, it can make the working height of the conductive foam in the first direction lower. For example, the working height of the conductive foam in the first direction can be adjusted to a certain value. The range includes 0.1-0.15mm, specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.; on the other hand, the sintering of the conductive slurry Forming into layers, the volume is reduced to ensure the contact force between multiple conductive particles, thereby making the PIM inside the conductive slurry very small; on the other hand, when the conductive slurry solidifies into a conductive slurry layer, the conductive particles in the conductive slurry Spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger, for example, the contact area can reach more than 43.46%.

Therefore, the present application provides a conductive foam with lower working height in the first direction, smaller PIM, and lower stress. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

The case where the conductive layer is the first conductive paste layer 21 will be described in detail below with reference to FIGS. 3 and 4 .

In FIGS. 3 and 4 , the conductive layer is a first conductive slurry layer 21 , and a plurality of first conductive particles 212 in the first conductive slurry layer 21 are doped in the first slurry body 211 . The conductive particles 212 are not connected before curing, but are connected after curing, so that multiple current paths are generated in the first conductive slurry layer 21 formed after curing, thereby conducting electricity, and after curing, the first conductive particles 212 reduce in volume to ensure phase. The contact between adjacent particles effectively reduces the PIM inside the first conductive slurry; at the same time, after curing, the first conductive particles 212 spread out, which can increase the contact between the first conductive slurry layer 21 and the structure in the electronic device. area.

This application does not specifically limit the conductive paste in the first conductive paste layer. For example, the conductive paste may include polymer conductive paste, sintered conductive paste, etc. The following embodiments of the present application are all described by taking the conductive slurry in the first conductive slurry layer as a polymer conductive slurry.

This application does not specifically limit the first slurry body. For example, the first slurry body may include a first resin. Specifically, the first resin may be epoxy resin, silicon dioxide resin, etc. Among them, epoxy resin and silicon dioxide resin have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation. .

This application does not specifically limit the type, shape, size, etc. of the first conductive particles. For example, the first conductive particles may include first metal conductive particles. Specifically, the first metal conductive particles may be silver particles, Any one or more combinations of copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the first metal conductive particles may include any one of spherical, spiny, flake, rod, linear, etc.; The size of the first metal conductive particles may be micron level, nano level, etc. Specifically, the particle size range of the first metal conductive particles may include 5-20 μm, that is, the particle size of the first metal conductive particles may be 5 μm or 8 μm. , 10μm, 13μm, 17μm or 20μm, etc.

It should be noted that the elastic modulus of the above-mentioned first conductive particles is different. When the main body of the first slurry is the same first resin, when the first conductive particles with a smaller elastic modulus are selected and doped in the first resin, , can cause the first conductive slurry to undergo slight deformation under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

This application does not specifically limit the doping concentration of the first conductive particles in the first conductive slurry in the first slurry body. For example, the mass fraction of the first conductive particles in the first slurry body is Value range can include 75-85%,

Specifically, the mass fraction of the first conductive particles in the first slurry body may be 75%, 78%, 80%, 81%, 83% or 85%, etc.

As an example, the first conductive paste is a first conductive silver paste, the first conductive silver paste includes a first resin and first silver particles, and the first silver particles are doped in the first resin. Wherein, the mass fraction of the first silver particles can be 80%, the mass fraction of the first resin can be 20%, and the first resin can be compressed or stretched; the density of the first silver particles can be 10, and the density of the first resin can be is 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin can be 2:5. After the first conductive silver paste is cured, the volume can shrink by about 50%, effectively The PIM between the first silver particles is reduced to negligible, and the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin in the first conductive silver paste layer can be 1:1.25. , when in contact with structures in electronic equipment, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after strong activation at low pressure, further increasing the contact area; the first conductive The value range of the tensile adhesion force of the silver paste may include 8-9Mpa. Specifically, the tensile adhesion force of the first conductive silver paste may be 8Mpa or 9Mpa, etc.

It should be noted that the silver particles can be micron-scale spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-scale silver wires, silver rods, etc., depending on the actual application.

This application does not specifically limit the thickness of the above-mentioned first conductive slurry layer in the direction perpendicular to the foam matrix. For example, the thickness range of the first conductive slurry layer in the direction perpendicular to the foam matrix may include 5- 10 μm, specifically, the thickness of the first conductive slurry layer in the direction perpendicular to the foam matrix may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

This application does not specifically limit the manufacturing process of the above-mentioned first conductive slurry layer. For example, the first conductive slurry can be formed on the surface of the foam substrate by printing or other methods, and then the first conductive slurry can be baked. The first conductive paste layer is formed by curing methods such as baking/heating.

The conductive foam provided in the embodiment of the present application is provided with a first conductive slurry layer covering at least the first surface of the foam matrix. On the one hand, the first conductive slurry in the first conductive slurry layer has a viscosity Small degree, easy leveling, large volume change rate after curing, easy curing, large internal stress, good heat dissipation and other properties, and the first conductive paste is liquid before film formation, and the volume will shrink during the curing process , so that the conductive foam shows good conductivity and can also deform under pressure. Combined with the elasticity of the foam matrix, the conductive foam can have a lower working height in the first direction; on the other hand, the second A conductive slurry is sintered into a layer, and the volume is reduced to ensure the contact force between the plurality of first conductive particles, thereby making the PIM inside the first conductive slurry very small; on the other hand, the first conductive slurry is solidified into the first conductive slurry. When forming the conductive slurry layer, the conductive particles in the first conductive slurry are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

Therefore, the present application provides a conductive foam with lower working height in the first direction, smaller PIM, and lower stress. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

The case where the conductive layer is the second conductive paste layer 22 will be described in detail below with reference to FIGS. 5 and 6 .

In FIGS. 5 to 6 and 19 , the conductive layer is the second conductive slurry layer 22 , and a plurality of second conductive particles 222 in the second conductive slurry layer 22 are doped in the second slurry body 221 . The second conductive particles 222 are not connected before curing, but are connected after curing, so that multiple current paths are generated in the second conductive slurry layer 22 formed after curing, thereby conducting electricity, and the second conductive particles 222 shrink in size after curing. To ensure the contact between adjacent particles, so that the PIM inside the second conductive slurry is effectively reduced; at the same time, after curing, the second conductive particles 222 are spread out, which can increase the contact between the second conductive slurry layer 22 and the electronic device. The contact area of the structure.

This application does not specifically limit the conductive paste in the second conductive paste layer. For example, the conductive paste may include polymer conductive paste, sintered conductive paste, etc. The following embodiments of the present application are all described by taking the conductive slurry in the second conductive slurry layer as a polymer conductive slurry.

This application does not specifically limit the second slurry body. For example, the second slurry body may include a second resin. Specifically, the second resin may be any one of silicone resin, silane modified resin, etc. Among them, silicone resin and silane-modified resin have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress.

This application does not specifically limit the type, shape, size, etc. of the second conductive particles. For example, the second conductive particles may include second metal conductive particles. Specifically, the second metal conductive particles may be silver particles, Any one or more combinations of copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the second metal conductive particles may include any one of spherical, spiny, flake, rod, linear, etc.; The size of the second metal conductive particles may be micron level, nano level, etc. Specifically, the particle size range of the second metal conductive particles may include 5-20 μm, that is, the particle size of the second metal conductive particles may be 5 μm or 8 μm. , 10μm, 13μm, 17μm or 20μm, etc.

It should be noted that the elastic modulus of the above-mentioned second conductive particles is different. When the main body of the second slurry is the same second resin, when the second conductive particles with a smaller elastic modulus are selected and doped in the second resin, , can cause the second conductive slurry to undergo slight deformation under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

This application does not specifically limit the doping concentration of the second conductive particles in the second conductive slurry in the second slurry body. For example, the mass fraction of the second conductive particles in the second slurry body is Value range can include 75-85%,

Specifically, the mass fraction of the second conductive particles in the second slurry body may be 75%, 78%, 80%, 81%, 83% or 85%, and so on.

As an example, the second conductive paste is a second conductive silver paste, the second conductive silver paste includes a second resin and second silver particles, and the second silver particles are doped in the second resin. Wherein, the mass fraction of the second silver particles can be 80%, the mass fraction of the second resin can be 20%, and the second resin can be compressed or stretched; the density of the second silver particles can be 10, and the density of the second resin can be is 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the second silver particles to the volume fraction of the second resin can be 2:5. After the second conductive silver paste is cured, the volume can shrink by about 50%, effectively The PIM between the second silver particles is reduced to negligible, and the ratio of the volume fraction of the second silver particles in the second conductive silver paste layer to the volume fraction of the second resin can be 1:1.25. , when in contact with structures in electronic equipment, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after strong activation at low pressure, further increasing the contact area; second conductivity The tensile adhesion force of the silver paste may range from 8 to 9 Mpa. Specifically, the tensile adhesion force of the second conductive silver paste may be 8 Mpa or 9 Mpa, etc.

It should be noted that the silver particles can be micron-scale spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-scale silver wires, silver rods, etc., depending on the actual application.

This application does not specifically limit the thickness of the second conductive slurry layer in the direction perpendicular to the foam matrix. For example, the thickness of the second conductive slurry layer in the direction perpendicular to the foam matrix can range from 5 to 10 μm, specifically, the thickness of the second conductive slurry layer in the direction perpendicular to the foam matrix may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

This application does not specifically limit the manufacturing process of the above-mentioned second conductive slurry layer. For example, the second conductive slurry can be formed on the surface of the foam substrate by spraying or other methods, and then the second conductive slurry can be baked. The second conductive paste layer is formed by curing methods such as baking/heating.

The conductive foam provided in the embodiment of the present application is provided with a second conductive slurry layer covering at least the first surface of the foam matrix. On the one hand, the second conductive slurry in the second conductive slurry layer has good elasticity. , greater viscosity, greater viscosity, lower volume shrinkage after curing, high temperature resistance, and no internal stress, and the second conductive slurry is liquid before film formation, and the volume will shrink during the curing process, thus making While the conductive foam exhibits good conductivity, it can also deform under pressure. Combined with the elasticity of the foam matrix, the conductive foam can work at a lower height in the first direction; on the other hand, the second conductive slurry The material is sintered into layers, and the volume is reduced to ensure the contact force between the plurality of second conductive particles, so that the PIM inside the second conductive slurry is very small; on the other hand, the second conductive slurry solidifies into the second conductive slurry. When the layer is formed, the conductive particles in the second conductive slurry are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

Therefore, the present application provides a conductive foam with lower working height in the first direction, smaller PIM, and lower stress. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

Optionally, as an implementable manner, with reference to Figures 9 to 11 and Figures 13 to 18, the conductive layer further includes a first base material layer 6, and the first base material layer 6 is used to react under external pressure. Deformation occurs below; the orthographic projection of the conductive slurry layer on the foam matrix 1 and the orthographic projection of the first base material layer 6 on the foam matrix at least partially coincide.

This application does not specifically limit the type of the first base material layer. For example, the first base material layer may include a polyimide (PI) layer, non-woven fabric, etc.

It should be noted that the first base material layer should be able to be compressed or stretched very well. The surface roughness of the first base material layer should be moderate, there should be no scratches on the surface or only very few scratches, and it should be suitable for conductive paste. Spraying, printing, etc.

This application does not specifically limit the thickness of the first base material layer in the direction perpendicular to the foam matrix. For example, the thickness of the first base material layer in the direction perpendicular to the foam matrix can range from 1 to 2 μm. Specifically, the thickness of the first base material layer along the direction perpendicular to the foam matrix may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm, or 2 μm, etc.

It should be understood that the orthographic projection of the above-mentioned conductive slurry layer on the foam matrix and the orthographic projection of the first base material layer on the foam matrix at least partially coincide with each other means: the orthographic projection of the conductive slurry layer on the foam matrix coincides with the orthographic projection of the first base material layer on the foam matrix. The orthographic projection of the first base material layer on the foam base partially overlaps; or, the orthographic projection of the conductive slurry layer on the foam base completely overlaps with the orthographic projection of the first base material layer on the foam base, which will not be detailed here. limited.

In the case where the orthographic projection of the conductive slurry layer on the foam base partially overlaps with the orthographic projection of the first base material layer on the foam base, the orthographic projection of the conductive slurry layer on the foam base may be located at the first The orthographic projection of the base material layer on the foam matrix is within; alternatively, the orthographic projection of the first base material layer on the foam matrix is within the orthographic projection of the conductive slurry layer on the foam matrix.

The structure of the conductive slurry layer is not specifically limited here. For example, the conductive slurry layer can be a single layer. For example, the conductive slurry layer can be a first conductive slurry layer/a second conductive slurry layer; or The conductive slurry layer may be multiple layers. For example, the conductive slurry layer may include a first conductive slurry layer and a second conductive slurry layer.

This application does not specifically limit the thickness of the single-layer conductive slurry layer in the direction perpendicular to the foam matrix. For example, the thickness of the single-layer conductive slurry layer in the direction perpendicular to the foam matrix can range from 5 to 10 μm. , specifically, the thickness of a single conductive slurry layer along the direction perpendicular to the foam matrix can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

This application does not specifically limit the relationship between the conductive slurry layer and the first base material layer. For example, the conductive slurry layer and the first base material layer may be independent film layers. As an example, the conductive slurry layer can be disposed on either side of the first base material layer; as another example, the conductive slurry layer can at least wrap the surface of the first base material layer close to the foam matrix, and wrap the third base material layer. A base material layer is located away from the surface of the foam base.

Or, for example, the conductive paste layer and the first substrate layer are not independent film layers. As an example, in addition to wrapping at least the surface of the first base material layer close to the foam base and wrapping the surface of the first base material layer far away from the foam base, the conductive slurry layer can also penetrate into the first base. inside the material layer. As shown in Figure 13, when the first base material layer is a non-woven fabric, since the non-woven fabric has no warp and weft lines, but short textile fibers or filaments are oriented or randomly arranged to form a fiber mesh structure, then the non-woven fabric is soaked In the conductive slurry, the conductive slurry can wrap at least two surfaces of the non-woven fabric and penetrate into the pores of the non-woven fabric to form a conductive layer.

The conductive foam provided in the embodiment of the present application is provided with a first base material layer and a conductive slurry layer. On the one hand, the first base material layer is elastic and can be compressed or stretched well; on the other hand, the conductive slurry layer It has certain ductility, good conductivity, large resistivity and other properties, and the volume of the conductive slurry will shrink during the curing process, so that the conductive foam can not only show good conductivity, but also be able to generate electricity under pressure. Deformation, combined with the elasticity of the foam matrix, can make the working height of the conductive foam lower in the first direction; at the same time, the conductive slurry is sintered into layers and the volume is reduced, which can make the PIM inside the conductive slurry very small; and, conductive When the slurry is cured into a conductive slurry layer and spread, the contact area between the conductive foam and the structure in the electronic device can be larger.

Therefore, the present application provides a conductive foam with lower working height in the first direction, smaller PIM, and lower stress. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

Optionally, as an implementable manner, as shown in FIGS. 9 to 11 , the conductive slurry layer is a first conductive slurry layer 21 , and the first conductive slurry layer 21 is disposed away from the first base material layer 6 One side of the foam base 1; the conductive layer also includes a first adhesive layer, the first adhesive layer is provided between the first base material layer 6 and the foam base 1, and the first adhesive layer is used to bond the first The base material layer 6 and the foam matrix 1 are deformed under the action of external pressure.

This application does not specifically limit the type of the first adhesive layer. For example, the first adhesive layer may be a glue layer, a conductive paste layer, etc.

As shown in Figures 9 and 10, when the first adhesive layer is the glue layer 5, the material of the glue layer 5 can be thermosetting glue.

As shown in FIG. 11 , when the first adhesive layer is a conductive slurry layer, the conductive slurry layer may be a second conductive slurry layer 22 .

This application does not specifically limit the thickness of the first adhesive layer in the direction perpendicular to the foam matrix. For example, the thickness of the first adhesive layer in the direction perpendicular to the foam matrix can range from 1 to 2 μm. Specifically, For example, the thickness of the first adhesive layer along the direction perpendicular to the foam matrix may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

It should be noted that when the first adhesive layer is a second conductive slurry layer, in the direction perpendicular to the foam matrix, in this application, for the second conductive slurry layer, the first base material layer and the first conductive slurry The thickness range of the conductive layer composed of layers is not specifically limited. For example, the thickness range may include 10-20 μm, specifically, the second conductive slurry layer, the first base material layer and the first conductive slurry. The thickness of the conductive layer composed of the material layer can be 10 μm, 13 μm, 15 μm, 16 μm, 18 μm or 20 μm, etc.

It should be noted that when the conductive layer covers multiple surfaces of the foam matrix, for any of the conductive foams in Figures 9 to 11, the thickness of the conductive layers covering different surfaces of the foam matrix can be partially the same. ; Alternatively, the thicknesses of the conductive layers covering different surfaces of the foam base may be all the same; or, the thicknesses of the conductive layers covering different surfaces of the foam base may be different, and there is no specific limitation here.

In the conductive foam provided by the embodiments of the present application, the first conductive slurry layer and the foam matrix can be well bonded through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, And the thickness of the first adhesive layer in the direction perpendicular to the foam base is smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam base is smaller, so that the working height of the conductive foam in the first direction is higher. Low; moreover, the first adhesive layer will not affect the PIM and other properties of the first conductive slurry in the first conductive slurry layer, so that a low working height, small PIM, and low stress in the first direction can be obtained of conductive foam. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

Optionally, as an implementable manner, as shown in FIGS. 13 to 18 , the conductive slurry layer is a first conductive slurry layer 21 , and the first conductive slurry layer 21 at least wraps the first base material layer 6 close to The surface on one side of the foam base 1 and the surface of the wrapping first base material layer 6 away from the foam base 1; the conductive layer also includes a first adhesive layer, and the first adhesive layer is provided on the first conductive slurry layer 21 and the foam matrix 1, the first adhesive layer is used to bond the first conductive slurry layer 21 and the foam matrix 1, and deforms under the action of external pressure.

It should be understood that the above-mentioned first conductive slurry layer at least wraps the surface of the first base material layer close to the foam base and wraps the surface of the first base material layer away from the foam base means: the first conductive slurry layer It is possible to wrap only the surface of the first base material layer close to the foam base and the surface of the first base material layer away from the foam base; or, the first conductive slurry layer can wrap only the first base material layer close to the foam. In addition to the surface on one side of the cotton matrix and the surface wrapping the first base material layer away from the foam matrix, other surfaces of the first base material layer may also be included; or, in addition to wrapping the first base material, the first conductive slurry layer In addition to the surface of the side of the layer close to the foam base and the surface of the side wrapping the first base layer away from the foam base, it can also penetrate into the interior of the first base layer, which is not specifically limited here.

As an example, when the first base material layer is a PI layer, the first conductive slurry layer can wrap the surface of the PI layer close to the foam base and wrap the surface of the first base material layer away from the foam base.

As another example, when the first substrate layer is a PI layer, the first conductive paste layer may wrap all surfaces of the PI layer.

As another example, when the first base material layer is a non-woven fabric, the first conductive slurry layer can wrap the surface of the non-woven fabric close to the foam base and wrap the first base material layer away from the foam base. s surface.

As another example, when the first base material layer is a non-woven fabric, the first conductive slurry layer can wrap all surfaces of the non-woven fabric.

As another example, when the first base material layer is a non-woven fabric, the first conductive slurry layer can wrap all surfaces of the non-woven fabric and penetrate into the pores inside the non-woven fabric. At this time, since the interior of the non-woven fabric is filled with the first conductive slurry, the non-woven fabric is less likely to tear when compressed or stretched.

It should be noted that the orthographic projection of the above-mentioned first base material layer on the foam matrix and the orthographic projection of the first conductive slurry layer on the foam matrix may partially overlap; alternatively, the first base material layer may be on the foam matrix. The orthographic projection of and the orthographic projection of the first conductive slurry layer on the foam substrate can all overlap, and there is no specific limitation here.

This application does not specifically limit the type of the first adhesive layer. For example, the first adhesive layer may be a glue layer, a conductive paste layer, etc.

As shown in Figures 13 and 14, Figures 17 and 18, when the first adhesive layer is the glue layer 5, the material of the glue layer 5 can be thermosetting glue.

As shown in FIGS. 15 and 16 , when the first adhesive layer is a conductive slurry layer, the conductive slurry layer may be the second conductive slurry layer 22 .

This application does not specifically limit the thickness of the first adhesive layer in the direction perpendicular to the foam matrix. For example, the thickness of the first adhesive layer in the direction perpendicular to the foam matrix can range from 1 to 2 μm. Specifically, For example, the thickness of the first adhesive layer along the direction perpendicular to the foam matrix may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

It should be noted that when the first adhesive layer is a second conductive slurry layer, in the direction perpendicular to the foam matrix, in this application, for the second conductive slurry layer, the first base material layer and the first conductive slurry The thickness range of the conductive layer composed of layers is not specifically limited. For example, the thickness range may include 10-20 μm, specifically, the second conductive slurry layer, the first base material layer and the first conductive slurry. The thickness of the conductive layer composed of the material layer can be 10 μm, 13 μm, 15 μm, 16 μm, 18 μm or 20 μm, etc.

As an example, in Figures 13 and 14, the first conductive slurry layer 21 wraps all the surfaces of the first base material layer 6 and forms a conductive layer with the adhesive layer 5. This conductive layer is disposed on part of the foam matrix 1. One surface 11 , part of the second surface 12 and all of the third surface 13 .

As another example, as shown in FIG. 15 , the first conductive slurry layer 21 wraps all surfaces of the first base material layer 6 and forms a conductive layer with the second conductive slurry layer 22 . The conductive layer is disposed on the foam matrix. The entire first surface 11, part of the second surface 12 and the entire third surface 13 of 1.

As another example, as shown in FIG. 16 , the first conductive slurry layer 21 wraps all surfaces of the first base material layer 6 and is disposed on all the first surface 11 , part of the second surface 12 and all of the foam base 1 . The third surface 13, and at the same time, the second conductive slurry layer 22 is provided on all the first surface 11 and part of the second surface 12 of the foam base 1 to form a conductive layer.

It should be noted that, first, the conductive slurry layer may also include a first conductive slurry layer and a second conductive slurry layer, wherein the first conductive slurry layer at least wraps the side of the first base material layer close to the foam matrix The second conductive slurry layer at least wraps the surface of the first conductive slurry layer close to the foam base, and wraps the first conductive slurry layer. The surface on the side away from the foam matrix is used to bond the first conductive slurry layer and the foam matrix.

As an example, the first conductive slurry layer wraps the surface of the first base material layer close to the foam base and the surface of the first base material layer away from the foam base, and the second conductive slurry layer wraps the first The surface of the conductive slurry layer close to the foam matrix and the surface surrounding the first conductive slurry layer away from the foam matrix.

As another example, the first conductive slurry layer wraps the surface of the first base material layer close to the foam base and the surface of the first base material layer away from the foam base, and the second conductive slurry layer wraps the second conductive slurry layer. A layer of conductive paste on all surfaces.

As another example, the first conductive slurry layer wraps all surfaces of the first base material layer, the second conductive slurry layer wraps the surface of the first conductive slurry layer close to the foam matrix, and wraps the first conductive slurry The surface of the layer away from the foam base.

As yet another example, the first conductive slurry layer wraps all surfaces of the first base material layer, and the second conductive slurry layer wraps all surfaces of the first conductive slurry layer, which is not specifically limited here.

Second, the conductive slurry layer can also be a second conductive slurry layer, wherein the second conductive slurry layer at least wraps the surface of the first base material layer close to the foam base and wraps the first base material layer away from the foam. The surface of one side of the cotton base, and the second conductive slurry layer is used to bond with the foam base.

As an example, the second conductive slurry layer wraps the surface of the first base material layer close to the foam base and wraps the surface of the first base material layer far away from the foam base.

As another example, the second conductive paste layer covers all surfaces of the first substrate layer, which is not specifically limited here.

Third, when the conductive layer covers multiple surfaces of the foam base, for any of the conductive foams in Figures 13 to 18, the thickness of the conductive layers covering different surfaces of the foam base can be partially the same; or , the thickness of the conductive layers covering different surfaces of the foam matrix can be all the same; or, the thickness of the conductive layers covering different surfaces of the foam matrix can be different, and there is no specific limitation here.

The conductive foam provided in the embodiment of the present application uses the first conductive slurry layer to at least wrap the surface of the first base material layer close to the foam base, and wrap the surface of the first base material layer away from the foam base, and The first conductive slurry layer and the foam matrix can be well bonded through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the first adhesive layer is perpendicular to the foam. The thickness in the direction of the cotton matrix is smaller, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix can be smaller. In this way, the working height of the conductive foam in the first direction can be lowered; moreover, the first adhesive layer does not It will affect the PIM and other properties of the first conductive slurry in the first conductive slurry layer, so that a conductive foam with a low working height in the first direction, small PIM and low stress can be obtained. When the conductive foam is used in electronic equipment, it can reduce the thickness of the electronic equipment and at the same time make the PIM between the contact interface between the conductive foam and the structure in the electronic equipment smaller; in addition, the conductive foam can It realizes the electrical connection of structures in electronic equipment and reduces or eliminates radiation stray interference, etc., effectively improving the performance of electronic equipment.

Optionally, as an implementable manner, as shown in Figures 17 and 18, the first surface 11 of the foam base 1 is at least divided into a first area Q1 and a second area Q2. direction, the height of the portion of the conductive layer located in the first region Q1 is smaller than the height of the portion of the conductive layer located in the second region Q2.

It should be understood that the above-mentioned first surface of the foam base is divided into at least a first area and a second area means: the first surface of the foam base can be divided into only a first area and a second area; or, the third area of the foam base can be divided into at least a first area and a second area. In addition to being divided into a first area and a second area, a surface can also be divided into other areas, such as a third area, a fourth area, etc., which are not specifically limited here.

This application does not specifically limit the position, area relationship, etc. of the above-mentioned first region and the second region. For example, the first region and the second region can be located at any position, wherein the area of the first region can be larger than that of the second region. The area of the two regions; or, the area of the first region may be smaller than the area of the second region; or, the area of the first region may be equal to the area of the second region.

The following describes in detail how to realize that the height of the part of the conductive layer located in the first region is smaller than the height of the part of the conductive layer located in the second region.

First, the structure of the portion of the conductive layer located in the first region is the same as the structure of the portion located in the second region, but the heights are different.

It should be understood that when the conductive layer is a single layer, for example, when the conductive layer is a conductive slurry layer, for example, when the conductive layer is a first conductive slurry layer, in the direction perpendicular to the foam matrix , the height of the part of the first conductive slurry layer located in the first region is smaller than the height of the part of the first conductive slurry layer located in the second region; for another example, when the conductive layer is a second conductive slurry layer, the height is perpendicular to the foam. In the direction of the substrate, the height of the portion of the second conductive slurry layer located in the first region is smaller than the height of the portion of the second conductive slurry layer located in the second region.

It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, the height of at least one layer of the conductive layer in the first region may be different from that in the second region.

For example, in the case where the conductive layer includes a first adhesive layer, a first base material layer and a first conductive slurry layer, in the direction perpendicular to the foam matrix, the first adhesive layer, the first base material layer may be The height of at least one layer of the material layer and the first conductive paste layer in the first region is different from that in the second region. Specifically, along the direction perpendicular to the foam matrix, the height of the first adhesive layer in the first region and the height of the second region may be different, and the first base material layer and the first conductive slurry layer are in the same height. The height of the part in the first region and the part in the second region are the same; alternatively, the height of the part of the first base material layer in the first region and the part in the second region are different, and the first adhesive layer and the third The height of the portion of a conductive paste layer in the first region and the portion in the second region are the same; or, the height of the portion of the first conductive paste layer in the first region and the height of the portion in the second region are different, and The heights of the portions of the first adhesive layer and the first base material layer in the first region and the portions in the second region are the same; or, the heights of the portions of the first adhesive layer and the first base material layer in the first region are the same as those in the second region. The heights of the portions in the second area are different, and the heights of the first conductive slurry layer in the first area and the portions in the second area are the same; alternatively, the first adhesive layer and the first conductive slurry layer can be The heights of the parts in the first region and the parts in the second region are different, and the heights of the parts of the first base material layer in the first region and the parts in the second region are the same; alternatively, the first base material layer and The height of the part of the first conductive paste layer in the first region and the part in the second region are different, and the height of the part of the first adhesive layer in the first region and the part in the second region are the same; or, it can be The heights of portions of the first adhesive layer, the first base material layer and the first conductive paste layer in the first region and in the second region are all different.

Of course, the conductive layer can also include other film layers, so there can be many other arrangement methods, which are not specifically limited here.

As an example, in FIG. 17 , the parts of the conductive layer located in the first region Q1 and the second region Q2 both include the glue layer 5 , the first base material layer 6 and the first conductive paste layer 21 . As shown in Figure 17, along the direction perpendicular to the foam matrix 1, the height of the glue layer 5 and the first base material layer 6 in the first area Q1 is the same as the height in the second area Q2, and the first conductive slurry layer The height of 21 in the first area Q1 is smaller than the height in the second area Q2.

The second method may be that the structure of the part of the conductive layer located in the first region is different from the structure of the part of the conductive layer located in the second region, and the heights are different.

It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, the same layer structure in the conductive layer may have different heights in the first region and in the second region.

For example, when the conductive layer in the first region includes a first adhesive layer, a first base material layer, and a first conductive paste layer, and the conductive layer in the second region includes a first adhesive layer, a first base layer, In the case of the material layer, the first conductive slurry layer and the second base material layer, in the direction perpendicular to the foam matrix, it can be the first adhesive layer, the first base material layer and the first conductive slurry layer. At least a portion of one layer in the first area has a different height than a portion in the second area. Specifically, along the direction perpendicular to the foam matrix, the height of the first adhesive layer in the first region and the height of the second region may be different, and the first base material layer and the first conductive slurry layer are in the same height. The height of the part in the first region and the part in the second region are the same; alternatively, the height of the part of the first base material layer in the first region and the part in the second region are different, and the first adhesive layer and the third The height of the portion of a conductive paste layer in the first region and the portion in the second region are the same; or, the height of the portion of the first conductive paste layer in the first region and the height of the portion in the second region are different, and The heights of the portions of the first adhesive layer and the first base material layer in the first region and the portions in the second region are the same; or, the heights of the portions of the first adhesive layer and the first base material layer in the first region are the same as those in the second region. The heights of the portions in the second area are different, and the heights of the first conductive slurry layer in the first area and the portions in the second area are the same; alternatively, the first adhesive layer and the first conductive slurry layer can be The heights of the parts in the first region and the parts in the second region are different, and the heights of the parts of the first base material layer in the first region and the parts in the second region are the same; alternatively, the first base material layer and The height of the part of the first conductive paste layer in the first region and the part in the second region are different, and the height of the part of the first adhesive layer in the first region and the part in the second region are the same; or, it can be The heights of portions of the first adhesive layer, the first base material layer and the first conductive paste layer in the first region and in the second region are all different.

Of course, the conductive layer can also include other film layers, so there can be many other arrangement methods, which are not specifically limited here.

It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, the same layer structure in the conductive layer may have the same height in the first region and in the second region.

For example, when the conductive layer in the first region includes a first adhesive layer, a first base material layer, and a first conductive paste layer, and the conductive layer in the second region includes a first adhesive layer, a first base layer, In the case of the material layer, the first conductive slurry layer and the second base material layer, in the direction perpendicular to the foam matrix, the first adhesive layer, the first base material layer and the first conductive slurry layer may be in the third The parts in one area have the same height as the parts in the second area.

Of course, the conductive layer can also include other film layers, so there can be many other arrangement methods, which are not specifically limited here.

As an example, in Figure 18, the part of the conductive layer located in the first region Q1 includes the glue layer 5, the first base material layer 6 and the first conductive paste layer 21, and the part of the conductive layer located in the second region Q2 includes the glue layer 5. The first base material layer 6, the first conductive paste layer 21 and the second base material layer 9. As shown in Figure 18, along the direction perpendicular to the foam matrix 1, the heights of the adhesive layer 5, the first base material layer 6, and the first conductive slurry layer 21 located in the first area Q1 and the second area Q2 are the same. Therefore, the second base material layer 9 makes the height of the portion of the conductive layer located in the first region Q1 smaller than the height of the portion of the conductive layer located in the second region Q2.

This application does not specifically limit the type of the above-mentioned second base material layer. For example, the above-mentioned second base material layer may include a polyimide layer, non-woven fabric, etc.

It should be noted that the second base material layer should be able to be compressed or stretched well, the surface roughness of the second base material layer should be moderate, and there should be no or very few scratches on the surface.

This application does not specifically limit the thickness of the above-mentioned second base material layer in the direction perpendicular to the foam matrix. For example, the thickness of the second base material layer in the direction perpendicular to the foam matrix can range from 1 to 2 μm. Specifically, the thickness of the second base material layer along the direction perpendicular to the foam matrix may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm, or 2 μm, etc.

It should be noted that, first, the above-mentioned second base material layer can also be replaced with any other structure, for example, the second base material layer and at least wrap the surface of the second base material layer close to the foam matrix, and wrap the second base material layer. The first conductive slurry layer on the surface of the second base material layer away from the foam base is not specifically limited here.

Second, along the direction perpendicular to the foam matrix, if the height of the conductive slurry layer in the first area is smaller than the height of the conductive slurry layer in the second area, the height of the conductive layer in the first area is smaller than the conductive layer. At the height of the second area, since the conductive paste layer can only be sprayed/printed to a thinner height, it is suitable for achieving a smaller step difference between the height of the conductive layer in the first area and the height of the conductive layer in the second area. In the case of The height difference in the second area may be 28 μm, 29 μm, 30 μm, 31 μm or 32 μm, etc.

To achieve a larger step difference between the height of the conductive layer in the first region and the height of the conductive layer in the second region, you can set the height of any layer of the conductive layer in the first region to be different from the height in the second region; or , it can be done by arranging other film layer structures in the second area, which is not specifically limited here.

The conductive foam provided in the embodiments of the present application can be used in electronic equipment by setting the height of the conductive layer in the first region to be different from the height of the conductive layer in the second region in the direction perpendicular to the foam matrix. Conductive foam can be electrically connected to at least two structures with different heights, enriching the application of conductive foam in electronic equipment.

Optionally, as an implementable manner, as shown in Figures 3 to 6, Figures 9 to 11, and Figures 12 to 19, the shape of the foam base 1 is a polyhedron, and the polyhedron at least includes connected first Surface 11, second surface 12 and third surface 13; the conductive layer at least covers the first surface 11, second surface 12 and third surface 13.

It should be understood that among all the surfaces of the above-mentioned polyhedron, at least one surface is used to electrically connect with the structure in the electronic device through the conductive layer.

For example, the first surface of the polyhedron may be used for electrical connection with the first structure in the electronic device through the conductive layer, while the other surfaces are not used for electrical connection with the structure in the electronic device through the conductive layer; or it may be polyhedral. The first surface is used for electrical connection with the first structure in the electronic device through the conductive layer, and the second surface is used for electrical connection with the second structure in the electronic device through the conductive layer, and the other surfaces are not used for electronic connection through the conductive layer. Of course, the structural electrical connection in the device can also be done in other ways, which are not specifically limited here.

This application does not specifically limit the above-mentioned polyhedron. For example, the polyhedron may include regular polyhedron or irregular polyhedron. When the shape of the foam matrix is a regular polyhedron, the regular polyhedron may include a cube, a hexahedron, an octahedron, etc.

It should be understood that the above-mentioned polyhedron at least includes connected first surface, second surface and third surface means: the polyhedron may only include connected first surface, second surface and third surface; or, the polyhedron may include only connected first surface, second surface and third surface. The surface, second surface and third surface may also include fourth surface, fifth surface, sixth surface, etc., which are not specifically limited here.

It should be understood that the above-mentioned conductive layer covering at least the first surface, the second surface and the third surface means: the conductive layer may only cover the first surface, the second surface and the third surface; or, the conductive layer may not only cover the first surface, but also the second surface and the third surface. In addition to the surface, the second surface and the third surface, it can also cover the fourth surface, the fifth surface, the sixth surface, etc., which are not specifically limited here.

The following is a specific example of the case where the conductive layer covers the foam matrix, taking the shape of the foam matrix as a hexahedron:

As an example, in Figures 3 to 6 and Figures 9 to 11, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface Surface 14 (right surface), fifth surface (not labeled in the figure, front surface) and sixth surface (not labeled in the figure, rear surface). As shown in Figures 3 to 6 and Figures 9 to 11, the conductive layer 2 covers all the first surface 11 (upper surface), all the second surface 12 (lower surface), and all the third surface 13 (left surface) and the entire fourth surface 14 (right surface).

As another example, in FIGS. 13 to 18 , the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), and a fourth surface 14 (right surface). , the fifth surface (not marked in the figure, front surface) and the sixth surface (not marked in the figure, rear surface). As shown in FIGS. 13 to 18 , the conductive layer covers at least part of the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface).

As yet another example, in Figure 19, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface surface (not labeled in the figure, front surface) and the sixth surface (not labeled in the figure, rear surface). As shown in FIG. 19 , the conductive layer covers all of the first surface 11 (upper surface), part of the second surface 12 (lower surface), all of the third surface 13 (left surface) and all of the fourth surface 14 (right surface).

It should be noted that when the shape of the foam matrix is a hexahedron, the positions of the above-mentioned first surface, second surface, third surface, fourth surface, fifth surface and sixth surface are not specifically limited. Examples Sexually, as shown in Figures 3 to 6, Figures 9 to 11, and Figures 13 to 19, the first surface 11 is the upper surface, the second surface 12 is the lower surface, the third surface 13 is the left surface, The fourth surface 14 is the right surface, the fifth surface is the front surface, and the sixth surface is the rear surface; or, the first surface 14 can be the upper surface, the second surface is the left surface, the third surface is the right surface, and the fourth surface is the lower surface, the fifth surface is the front surface, and the sixth surface is the rear surface. Of course, it can also be other situations, which are subject to actual application.

In the conductive foam provided by the embodiments of the present application, the foam matrix at least includes a connected first surface, a second surface, and a third surface, and the conductive layer at least covers the first surface, the second surface, and the third surface of the foam matrix, In this way, in actual application, it can ensure that the conductive layer in the conductive foam is conductive when the conductive foam is electrically connected to the structure in the electronic device, and can provide a variety of low working heights in the first direction, PIM Small, low-stress conductive foam enriches the application of conductive foam in electronic equipment.

Optionally, as an implementable manner, as shown in Figures 13 to 18, the polyhedron includes a first surface 11, a second surface 12 and a third surface 13. The first surface 11 and the second surface 12 are arranged opposite to each other. And the first surface 11 is connected to the second surface 12 through the third surface 13; the conductive layer covers at least part of the first surface 11, at least part of the second surface 12 and all of the third surface 13 of the polyhedron.

It should be understood that the above-mentioned conductive layer covering at least the first surface, at least part of the second surface and all of the third surface of the polyhedron means: the conductive layer can cover part of the first surface, part of the second surface and all of the third surface of the polyhedron; Alternatively, the conductive layer may cover part of the first surface, all of the second surface, and all of the third surface of the polyhedron; or, the conductive layer may cover all of the first surface, part of the second surface, and all of the third surface of the polyhedron; or , the conductive layer can cover all the first surface, all the second surface and all the third surface of the polyhedron, which is not specifically limited here.

As an example, as shown in Figure 13, the conductive layer composed of the first conductive slurry layer 21, the first base material layer 6 and the adhesive layer 5 covers part of the first surface 11 (upper surface) and part of the second surface of the hexahedron. 12 (lower surface) and the entire third surface 13 (left surface), thereby forming a "C"-like conductive layer.

It should be noted that in Figure 13, the conductive foam 05 also includes a second adhesive layer 7. The second adhesive layer 7 can be disposed on at least part of the second surface 12 of the foam base 1 and is connected with the adhesive layer 5 and The first conductive paste layers 21 are all connected.

Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and is spaced apart from the first adhesive layer and the first conductive slurry layer, which is not specifically limited here. The second adhesive layer can bond the conductive foam to the structure in the electronic device. The type of the second adhesive layer is not specifically limited here. For example, the second adhesive layer can include a back glue. The back glue can include any of conductive glue, insulating glue, etc.

As another example, as shown in FIG. 14 , the conductive layer composed of the first conductive slurry layer 21 , the first base material layer 6 and the adhesive layer 5 covers part of the first surface 11 (upper surface) and part of the second surface of the hexahedron. The surface 12 (lower surface) and the entire third surface 13 (left surface) can form a "C"-like conductive layer.

It should be noted that in FIG. 14 , the conductive foam 05 may also include a second adhesive layer 7 and a different-color polyethylene terephthalate (PET) layer 8 .

As shown in FIG. 14 , the second adhesive layer 7 can be disposed on at least part of the second surface 12 of the foam base 11 and connected to the glue layer 5 and the first conductive slurry layer 21 . Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and is spaced apart from the first adhesive layer and the first conductive slurry layer, which is not specifically limited here.

As shown in FIG. 14 , the different-color PET layer 8 is provided on part of the first surface 11 (upper surface) of the foam base 1 and is connected to the glue layer 5 and the first conductive slurry layer 21 . Of course, the different-color PET layer can also be provided on at least part of the first surface of the foam matrix and spaced apart from the first adhesive layer and the first conductive slurry layer, which is not specifically limited here.

It should be noted that the above-mentioned different-colored PET layer can have a color. In this way, on the one hand, it can be clearly marked that the side of the conductive foam with the different-colored PET layer is electrically connected to the structure in the electronic device, which is more conducive to preventing fools; on the other hand, On the one hand, if there is a step difference between the structure in the electronic device and the conductive foam, the step gap can be filled with a different-color PET layer.

As another example, as shown in FIG. 15 , the conductive layer composed of the first conductive slurry layer 21 , the first base material layer 6 and the second conductive slurry layer 22 covers all the first surface 11 (upper surface) of the hexahedron. , part of the second surface 12 (lower surface) and the entire third surface 13 (left surface), thereby forming a similar “C”-shaped conductive layer.

It should be noted that, first, in Figure 15, the conductive foam 05 may also include a second adhesive layer 7. The second adhesive layer 7 is provided on at least part of the second surface 12 of the foam base 1 and is connected to the second adhesive layer 7. The two conductive paste layers 22 and the first conductive paste layer 21 are both connected. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and is spaced apart from both the second conductive slurry layer and the first conductive slurry layer, which is not specifically limited here.

Secondly, the conductive layer composed of the first conductive slurry layer, the first base material layer and the second conductive slurry layer can also cover only part of the first surface of the foam base. At this time, the first surface of the foam base is not The part provided with the conductive layer may not be provided with any structure, or may be provided with a structure such as a different-color PET layer, which is not specifically limited here.

As yet another example, as shown in FIG. 16 , the first conductive paste layer 21 and the first base material layer 6 cover all the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire hexahedron. The third surface 13 (left surface) and the second conductive slurry layer 22 only cover the entire first surface 11 (upper surface) and part of the second surface 12 (lower surface) of the hexahedron, thereby forming a "C"-like conductive layer.

It should be noted that, first, in Figure 16, the conductive foam 05 also includes a second adhesive layer 7. The second adhesive layer 7 is provided on at least part of the second surface 12 of the foam base 1 and is connected with the second adhesive layer 7. The conductive paste layer 22 and the first conductive paste layer 21 are both connected. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and is spaced apart from both the second conductive slurry layer and the first conductive slurry layer, which is not specifically limited here.

Secondly, the conductive layer composed of the first conductive slurry layer, the first base material layer and the second conductive slurry layer can also cover only part of the first surface of the foam base. At this time, the first surface of the foam base is not The part provided with the conductive layer may not be provided with any structure, or may be provided with a structure such as a different-color PET layer, which is not specifically limited here.

As another example, as shown in Figure 17, the conductive layer composed of the first conductive slurry layer 21, the first base material layer 6 and the adhesive layer 5 covers all the first surface 11 (upper surface) of the hexahedron and part of the second surface. surface 12 (lower surface) and the entire third surface 13 (left surface), thus forming a similar “C”-shaped conductive layer; at the same time, along the direction perpendicular to the foam matrix 1, the first conductive slurry layer 21 is on the first The height of the region Q1 is smaller than the height of the first conductive paste layer 21 in the second region Q2.

It should be noted that in Figure 17, the conductive foam 05 also includes a second adhesive layer 7. The second adhesive layer 7 is provided on at least part of the second surface 12 of the foam base 1 and is connected with the adhesive layer 5 and the second adhesive layer 7. A conductive paste layer 21 is connected. Of course, the second adhesive layer can also be provided on at least part of the second surface of the foam matrix and spaced apart from the first adhesive layer and the first conductive slurry layer, which is not specifically limited here.

As another example, as shown in Figure 18, the conductive layer composed of the first conductive slurry layer 21, the first base material layer 6 and the adhesive layer 5 covers all the first surface 11 (upper surface) of the hexahedron and part of the second surface. The surface 12 (lower surface) and the entire third surface 13 (left surface), and the second base material layer 9 is located on part of the first surface 11 (upper surface) of the hexahedron, thereby forming a "C"-like conductive layer; at the same time, Along the direction perpendicular to the foam matrix 1, the heights of the first conductive slurry layer 21, the first base material layer 6 and the first adhesive layer 5 in the first area Q1 are equal to the heights of the first conductive slurry layer 21, the first base material layer 21 and the first adhesive layer 5. The material layer 6 and the first adhesive layer 5 are at the height of the second area Q2.

It should be noted that in Figure 18, the conductive foam 05 also includes a second adhesive layer 7. The second adhesive layer 7 is provided on at least part of the second surface 12 of the foam base 1 and is connected with the adhesive layer 5 and the second adhesive layer 7. A conductive paste layer 21 is connected. Of course, the second adhesive layer can also be provided on at least part of the second surface of the foam matrix and spaced apart from the first adhesive layer and the first conductive slurry layer, which is not specifically limited here.

It should be understood that the first surface, the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface of the hexahedron can also be located at other positions of the hexahedron. For example, the first surface can also be the upper surface, the third surface The second surface is the left surface, the third surface is the right surface, the fourth surface is the lower surface, the fifth surface is the front surface and the sixth surface is the back surface. At this time, when the conductive layer covers at least part of the first surface of the hexahedron, at least When part of the second surface and all of the third surface are used, the conductive layer forms an inverted "U"-like conductive layer.

For another example, the first surface may be the lower surface, the second surface may be the left surface, the third surface may be the right surface, the fourth surface may be the upper surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, When the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the hexahedron, the conductive layer forms a "U"-like conductive layer.

For another example, the first surface may be the upper surface, the second surface may be the lower surface, the third surface may be the right surface, the fourth surface may be the left surface, the fifth surface may be the front surface, and the sixth surface may be the back surface. In this case, When the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the hexahedron, the conductive layer forms a similar type conductive layer.

Of course, corresponding to the positions of other first surfaces, second surfaces, third surfaces, fourth surfaces, fifth surfaces, and sixth surfaces, the conductive layer can also form other structures, which are not specifically limited here.

The conductive foam provided by the embodiments of the present application has, on the one hand, a first surface and a second surface of the foam matrix opposite to each other, and the first surface is connected to the second surface through a third surface, and a conductive layer is provided to cover the polyhedron. At least part of the first surface, all of the third surface and at least part of the second surface can form a "C"-like conductive layer; on the other hand, when the conductive foam is used in electronic equipment, the conductive foam can ensure the Directionality, so as to identify and prevent fools, can also make the thickness of electronic equipment thinner, and make the PIM between the contact interface between conductive foam and the structure in the electronic equipment smaller; in addition, it can be achieved through conductive foam The directional electrical connection of structures in electronic equipment and the reduction or elimination of radiation spurious interference effectively improve the performance of electronic equipment.

Optionally, as an implementable manner, as shown in Figures 3 to 6, Figures 9 to 11, and Figure 19, the polyhedron includes a first surface 11, a second surface 12, a third surface 13, and a fourth surface. 14. The first surface 11 and the second surface 12 are arranged opposite each other, and the third surface 13 and the fourth surface 14 are arranged opposite each other. The first surface 11 is connected to the second surface 12 through the third surface 13 and the fourth surface 14 respectively, and is electrically conductive. The layer covers all of the first surface 11 , at least part of the second surface 12 , all of the third surface 13 and all of the fourth surface 14 .

It should be understood that the above conductive layer covering all the first surface, all the third surface, all the fourth surface and at least part of the second surface means: the conductive layer covers all the first surface, all the third surface, all the fourth surface and Part of the second surface; or, the conductive layer covers all of the first surface, all of the third surface, all of the fourth surface and all of the second surface, which is not specifically limited here.

As an example, as shown in FIGS. 3 to 6 and 9 to 11 , the conductive layer 2 covers all the first surface 11 (upper surface), all the second surface 12 (lower surface), and all the third surface of the hexahedron. 13 (left surface) and the entire fourth surface 14 (right surface).

As another example, as shown in FIG. 19 , the conductive layer covers all of the first surface 11 (upper surface), part of the second surface 12 (lower surface), all of the third surface 13 (left surface), and all of the hexahedron. Four surfaces 14 (right surface), thus forming a class type conductive layer.

It should be noted that, first, in Figure 19, the conductive foam 05 also includes a second adhesive layer 7. The second adhesive layer 7 is provided on at least part of the second surface 12 of the foam base 1 and is connected with the second adhesive layer 7. The conductive paste layers 22 are spaced apart. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and connected to the second conductive slurry layer, which is not specifically limited here.

Second, the conductive layer in the embodiment of the present application is not limited to the second conductive layer, and can also be any other structure. For example, the conductive layer can be the first adhesive layer, the first base material layer and the first conductive paste. Layers, etc., the specific arrangement method may refer to the above embodiment, and the arrangement of the second adhesive layer may also refer to the above and second conductive slurry layer, which will not be described again here.

It should be understood that the first surface, the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface of the hexahedron can also be located at other positions of the hexahedron. For example, the first surface can also be the lower surface and the third surface. The second surface is the left surface, the third surface is the upper surface, the fourth surface is the right surface, the fifth surface is the front surface and the sixth surface is the back surface. At this time, when the conductive layer covers the hexahedron and covers the entire first surface, When at least part of the second surface, all of the third surface, and all of the fourth surface is used, the conductive layer forms a similar “D” type conductive layer.

For another example, the first surface may be the left surface, the second surface may be the upper surface, the third surface may be the right surface, the fourth surface may be the lower surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, When the conductive layer covers all the first surface, at least part of the second surface, all the third surface and all the fourth surface of the hexahedron, the conductive layer forms a similar type conductive layer.

For another example, the first surface may be the upper surface, the second surface may be the right surface, the third surface may be the lower surface, the fourth surface may be the left surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, When the conductive layer covers all the first surface, at least part of the second surface, all the third surface and all the fourth surface of the hexahedron, the conductive layer forms a similar type conductive layer.

Of course, corresponding to the positions of other first surfaces, second surfaces, third surfaces, fourth surfaces, fifth surfaces, and sixth surfaces, the conductive layer can also form other structures, which are not specifically limited here.

On the one hand, the first surface and the second surface of the foam matrix are arranged opposite each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is provided to cover at least part of the first surface and all the third surface of the polyhedron. and at least part of the second surface, thus forming the class type of conductive layer; on the other hand, when this conductive foam is used in electronic equipment, it can ensure the directionality of the conductive foam, thereby identifying and preventing fools, while also thinning the thickness of the electronic equipment and making it conductive. The PIM between the contact interface between the foam and the structure in the electronic device is small; in addition, the conductive foam can be used to achieve directional electrical connection of the structure in the electronic device, and reduce or eliminate radiation stray interference, etc., effectively improving the Performance of electronic equipment.

The above only introduces the content related to the invention point. The rest of the structure can be obtained by referring to related technologies and will not be explained in detail here.

An embodiment of the present application also provides an electronic device, which includes the above-mentioned conductive foam.

Since the electronic device provided by the embodiment of the present application includes conductive foam with a lower working height, smaller PIM, and lower stress in the first direction, the thickness of the electronic device can be effectively reduced. At the same time, the electronic device The PIM between the structure and the contact interface of the conductive foam can be smaller; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

The following uses the shape of conductive foam as a hexahedron to specifically describe the various applications of conductive foam in electronic equipment.

Optionally, as shown in Figures 20 and 21, the first structure in the electronic device at least includes a camera component, and the camera component is used to maintain electrical connection with the conductive foam when rotating.

This application does not specifically limit the above-mentioned camera components. For example, the camera components may include cameras, etc.

When the camera component is a camera, the camera may include a front camera and a rear camera. Among them, the front camera can be set on the side of the display module away from the middle frame; the rear camera can be set on the side of the back shell away from the middle frame, depending on the actual application.

It should be understood that the above-mentioned first structure in the electronic device at least includes a camera component means: the first structure in the electronic device may only include a camera component; or, in addition to the camera component, the first structure in the electronic device may also include other components. The structure is not specifically limited here.

22 and 23 respectively show a schematic structural diagram of the electrical connection between the front camera 501 and the shielding cover 502 in the related art.

As shown in Figure 22, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503, and the shielding cover 502 is electrically connected to the PCB 504, resulting in a long ground (GND) path back to the PCB 504, which cannot effectively improve the electronic equipment. issues such as electromagnetic shielding.

As shown in Figure 23, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503 and the bracket steel sheet 505. This may cause the substrate 507 of the front camera 501 to have no space to place the screws 506 to ensure that the bracket steel sheet 505 and The distance between the substrates 507.

At this time, if a single-sided conductive adhesive is used to ensure the distance between the bracket steel piece 505 and the base plate 507, there may be a problem of inaccessibility; if a double-sided conductive adhesive is used to ensure the distance between the bracket steel piece 505 and the base plate 507, remove the bracket steel piece 505 may damage the front camera 501 at the same time. Moreover, if the bracket steel sheet 505 is an insert-molded bracket steel sheet, although there are screws 506 near the bracket steel sheet 505, the insert-molded bracket steel sheet may cause glue to overflow from the edge of the sealant. An insulating layer is formed between the glues, which may lead to problems such as insufficient or impossible contact.

In order to solve the above problems, it is possible to consider using conductive foam to electrically connect camera components such as cameras to shielding covers and other structures.

However, the conductive foam in the related art often cannot be placed near the camera due to problems such as high working height.

Therefore, the conductive foam provided by the embodiments of the present application has a lower working height in the first direction and smaller stress and PIM, which can well realize the electrical connection between the camera and other structures, and can improve the electromagnetic interference in electronic equipment. Shielding and other issues.

Figure 20 shows a schematic diagram of the conductive foam 05 according to the embodiment of the present application being used to electrically connect the front camera 501 and the shielding cover 502. FIG. 22 shows a schematic diagram of the conductive foam 05 according to the embodiment of the present application being used to electrically connect the rear camera 508 and the shielding cover 502 .

As shown in FIG. 20 , the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive foam 05 , and the shielding cover 502 and the PCB 504 are fixedly connected through screws 506 .

As shown in Figure 21, the middle frame 102 and the substrate 509 of the rear camera 508 are electrically connected through conductive foam 05, the shielding cover 502 and the bracket steel sheet 505 are electrically connected through the conductive foam 05, and the substrate 509 of the rear camera 508 is also connected to PCB504 is fixedly connected through screws 506.

The electronic device provided by the embodiment of the present application, on the one hand, electrically connects the camera component such as the camera to the conductive foam. Since the conductive foam has a low working height in the first direction, it can be placed between the camera and other structures; When the camera rotates in any direction, because the conductive foam can be compressed or stretched very well, the camera can always maintain an electrical connection with the conductive foam, ensuring the performance of the electronic device; on the other hand, because the conductive foam It is an independent structure and can be separated. For example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic equipment, causing the entire electronic equipment to be scrapped. On the other hand, the conductive foam can effectively absorb the tolerances that exist in the electrical connection with the structure of the electronic equipment. , thereby avoiding poor contact; on the other hand, conductive foam can make the ground (GND) path shorter; at the same time, if problems such as glue overflow occur, conductive foam can also be improved through strain. As a result, the performance of the electronic device according to the embodiment of the present application is greatly improved.

Optionally, in the electronic device of Figure 24, as shown in Figure 24, the first surface 11 of the foam base 1 is electrically connected to the display screen 111 through the conductive layer, and the second surface 12 of the foam base 1 is electrically connected to the display screen 111 through the conductive layer. The middle frame 102 is connected.

As a result, the first surface and the second surface in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can conduct conduction along the second direction and the third direction respectively, wherein the second direction and The third direction is vertical.

The electronic device provided in the embodiment of the present application is electrically connected to the display screen and the middle frame through conductive foam, which can effectively reduce the stress between the contact interface between the conductive foam and the antenna, and the stress between the conductive foam and the middle frame. The stress between the contact interfaces effectively improves the performance of electronic devices.

Optionally, in the electronic device of Figure 25, as shown in Figure 25, the first surface 11 of the foam base 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam base 1 is electrically connected to the reed 108 through the conductive layer. Electrically connected to PCB504.

Thus, the two surfaces in the foam matrix are electrically connected to the structure in the electronic device, thereby enabling the conductive foam to conduct conduction along the second direction and the third direction respectively, wherein the second direction can be set to be perpendicular to the third direction. .

It should be noted that PCB504 in Figure 25 can be replaced with a display screen, battery cover, decorative parts and other structures.

The middle frame 102 in Figure 25 may be a metal middle frame, and the metal middle frame is surrounded by an anti-oxidation layer 110.

As shown in FIG. 25 , the surface of the middle frame 102 in contact with the reed 108 can be laser-engraved to form a laser-engraved surface 109 .

The electronic device provided by the embodiment of the present application, on the one hand, realizes the electrical connection between the reed and the PCB through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the PIM between the conductive foam and the reed. The PIM between the PCB contact interfaces effectively improves the performance of electronic devices; on the other hand, when one side of the conductive foam is a display screen, the conductive foam will not rebound and cause interface damage, for example, screen film printing etc., further improving the performance of electronic equipment.

Optionally, in the electronic device of Figure 26, as shown in Figure 26, the first surface 11 of the foam base 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam base 1 is electrically connected to the reed 108 through the conductive layer. PCB504 electrical connection.

Thereby, two surfaces in the foam matrix are electrically connected to structures in the electronic device, thereby enabling the conductive foam to conduct conduction along the second direction and the third direction respectively.

It should be noted that, as shown in FIG. 26 , the electronic device may also include an antenna 105, a middle frame 102 and a plastic 107. The antenna 105 and the middle frame 102 are carried on one side of the plastic 107.

The surface of the side of the antenna 105 close to the reed 108 can be laser-engraved to form a laser-engraved surface 109 .

The antenna 105 may be surrounded by an anti-oxidation layer 110 .

The electronic device provided by the embodiment of the present application realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the contact between the conductive foam and the PCB. PIM between interfaces effectively improves the performance of electronic devices.

Optionally, in the electronic device of Figure 27, as shown in Figure 27, the first surface 11 and the second surface 12 of the foam base 1 are electrically connected to the antenna 105 through the conductive layer, and the first surface 11 of the foam base 1 It is also electrically connected to the middle frame 102 through the conductive layer, and one surface of the foam base is connected to the insulating material layer 106 .

As a result, the first surface and the second surface of the foam matrix are electrically connected to multiple structures in the electronic device respectively, thereby enabling the conductive foam to conduct conduction in multiple directions.

It should be noted that, as shown in FIG. 27 , the electronic device may also include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

The surface of the foam base connected to the insulating material layer may be provided with a first sub-conductive layer, or may not be provided with a first sub-conductive layer, which is not specifically limited here.

The electronic device provided by the embodiment of the present application realizes the electrical connection between the antenna and the middle frame through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, and the contact between the conductive foam and the middle frame. PIM between interfaces effectively improves the performance of electronic devices.

Optionally, in the electronic device of Figure 28, as shown in Figure 28, the first surface 11 and the third surface 13 of the foam base 1 are electrically connected to the antenna 105 through the conductive layer, and the first surface of the foam base 1 11 and the fourth surface 14 are electrically connected to the middle frame 102 through the conductive layer, and the second surface 12 of the foam base 1 is electrically connected to the PCB 504 through the conductive layer.

Thereby, the first surface, the second surface, the third surface and the fourth surface of the foam base are electrically connected to multiple structures in the electronic device respectively, thereby enabling the conductive foam to conduct in multiple directions.

It should be noted that, as shown in FIG. 28 , the electronic device may also include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

The electronic device provided by the embodiment of the present application realizes the electrical connection of the antenna, the middle frame, and the PCB through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, and the interference between the conductive foam and the middle frame. The PIM between the contact interface and the PIM between the contact interface between the conductive foam and the PCB effectively improves the performance of electronic equipment.

Optionally, in the electronic device of Figure 29, as shown in Figure 29, the first surface 11 of the foam base 1 is electrically connected to the antenna 105 and the middle frame 102 respectively through the conductive layer, and one surface of the foam base 1 is also connected to A layer of insulating material 106 is connected.

As a result, only the first surface of the foam matrix is electrically connected to the structure in the electronic device, thereby enabling the conductive foam to conduct conduction in the second direction.

The heights of the antenna 105 and the middle frame 102 in the electronic device shown in FIG. 29 are different in the direction perpendicular to the foam base.

As shown in FIG. 29 , the electronic device may also include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

The surface of the foam base connected to the insulating material layer may be provided with a first sub-conductive layer, or may not be provided with a first sub-conductive layer, which is not specifically limited here.

The electronic device provided by the embodiment of the present application, on the one hand, realizes the electrical connection between the antenna and the middle frame through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, and the PIM between the conductive foam and the middle frame. The PIM between the contact interface of the frame effectively improves the performance of the electronic device; on the other hand, due to the different heights of the antenna and the middle frame in the direction perpendicular to the foam base, a conductive foam can be integrated with the electronic device The electrical connection of structures of different heights enriches the application of conductive foam.

The embodiment of the present application provides a method for making conductive foam.

As shown in Figure 30, the production method includes:

S1. Provide foam matrix.

S2. Form a conductive layer on at least the first surface of the foam matrix.

Wherein, the first surface is used to be electrically connected to the first structure in the electronic device through a conductive layer. The conductive layer at least includes a conductive slurry layer, and the conductive slurry layer is used to deform under external pressure.

This application does not specifically limit the manufacturing process of the above-mentioned conductive layer. As an example, when the conductive layer only includes a conductive slurry layer, the conductive layer can be formed on the surface of the foam substrate by spraying, printing, spray plating, vacuum plating, etc. slurry, and then bake/heat and solidify the conductive slurry to form a conductive slurry layer.

As another example, when the conductive layer includes a conductive paste layer and a first base material layer, the conductive paste can be formed on at least one surface of the first base material layer by spraying, printing, etc., and then the conductive paste can be Bake/heat and solidify to form a first substrate layer and a conductive paste layer.

As another example, when the conductive layer includes a conductive slurry layer and a first base material layer, the first base material can be first soaked in the conductive slurry, and then the conductive slurry is baked/heated and solidified to form The first substrate layer and the conductive paste layer.

The manufacturing method of conductive foam provided in the embodiments of this application, on the one hand, forms conductive slurry through spraying, printing, sputtering, vacuum plating, dipping, etc., and bakes/heats to solidify to form a conductive slurry layer, which is simple and easy to implement ; On the other hand, the conductive slurry in the conductive slurry layer has certain ductility, good conductivity, large resistivity (10 ^-5 -10 ^-4 Ω×cm) and other properties, and the conductive slurry is It is in liquid state before film formation, and the volume will shrink during the curing process, so that the conductive foam shows good conductivity and can also deform under pressure. Combined with the elasticity of the foam matrix, the conductive foam can be made first The working height is lower in the direction; on the other hand, the conductive slurry is sintered into layers, and the volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive slurry is very small; on the other hand, the conductive slurry When cured into a conductive slurry layer, the conductive particles in the conductive slurry spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

The following is a detailed description of the manufacturing methods of conductive foam with various structures in this application.

As an example, the manufacturing method of the conductive foam shown in Figures 3 and 4 includes:

S11. Print the first conductive paste on all the first surface 11, all the second surface 12, all the third surface 13 and all the fourth surface 14 of the foam substrate 1.

S12. Bake and solidify to form the first conductive paste layer 21.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, prints the first conductive slurry and bakes/heats it to solidify it to form the first conductive slurry layer, which is simple and easy to implement; on the other hand, it can form a Conductive foam with low working height, small PIM and low stress in the first direction.

As an example, the manufacturing method of conductive foam shown in Figures 5 and 6 includes:

S21. Spray the second conductive slurry on all the first surface 11, all the second surface 12, all the third surface 13 and all the fourth surface 14 of the foam substrate 1.

S22. Bake and solidify to form the second conductive paste layer 22.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, sprays a second conductive slurry and bakes/heats it to solidify to form a second conductive slurry layer, which is simple and easy to implement; on the other hand, it can form a Conductive foam with low working height, small PIM and low stress in the first direction.

As an example, the manufacturing method of the conductive foam shown in Figures 9 and 10 includes:

S31. Form the glue layer 5 on all the first surface 11, all the second surface 12, all the third surface 13 and all the fourth surface 14 of the foam base 1.

S32. Form the first base material layer 6 on the surface of the glue layer 5 close to the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14.

S33. Print the first conductive paste on the surface of the first base material layer 6 close to the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14.

S34. Bake and solidify to form the first conductive slurry layer 21.

It should be noted that the glue layer may not be formed on all the first surfaces, all the second surfaces, all the third surfaces and all the fourth surfaces of the foam matrix, but directly on all the first surfaces, all the third surfaces of the foam matrix. The second surface, all the third surface and all the fourth surface form a first base material layer; and then the first conductive paste is printed on the surface of the first base material layer close to the first surface, the second surface, the third surface and the fourth surface. ; Bake and solidify to form the first conductive slurry layer.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, prints the first conductive slurry and bakes/heats it to solidify it to form the first conductive slurry layer, which is simple and easy to implement; on the other hand, it can form a Conductive foam with low working height, small PIM and low stress in the first direction.

As an example, the manufacturing method of conductive foam shown in Figure 11 includes:

S41. Spray the second conductive slurry on all the first surface 11, all the second surface 12, all the third surface 13 and all the fourth surface 14 of the foam substrate 1.

S42. Form the first base material layer 6 on the surface of the second conductive paste.

S43. Print the first conductive paste on the surface of the first base material layer 6.

S44. Bake and solidify to form the second conductive slurry layer 22 and the first conductive slurry layer 21.

The method for making conductive foam provided in the embodiment of the present application includes, on the one hand, spraying a second conductive slurry, printing the first conductive slurry, and baking/heating to solidify the first conductive slurry layer and the second conductive slurry layer. , simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height in the first direction, small PIM, and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 13 includes:

S51. Form a glue layer 5 on part of the first surface 11, part of the second surface 12 and all of the third surface 13 of the foam base 1.

S52. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S53. Form a first intermediate layer on the surface of the glue layer 5 close to the first surface 11, the second surface 12 and the third surface 13.

S54. Bake and solidify to form the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S55. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

Among them, the second adhesive layer 7 is connected to the glue layer 5 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above-mentioned steps S51 and step S52. For example, step S51 can be performed first and then step S52; or step S52 can be performed first and then step S51; or steps can be performed simultaneously. S51 and step S52.

It should be noted that the production method may also include:

S051. Soak the first base material layer in the second conductive slurry to form a second intermediate layer with the second conductive slurry covering all surfaces of the first base material layer.

S052. Form a second intermediate layer on part of the first surface, part of the second surface and all of the third surface of the foam base.

S053. Bake and solidify to form a second conductive slurry layer covering all surfaces of the first base material layer.

S054. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is connected to the second conductive paste layer.

The manufacturing method of conductive foam provided by the embodiment of the present application: on the one hand, the first base material layer is immersed in conductive slurry, and baked/heated to solidify to form a conductive slurry layer that wraps all surfaces of the first base material layer; It is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height in the first direction, small PIM, and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 14 includes:

S61. Form a glue layer 5 on part of the first surface 11, part of the second surface 12 and all of the third surface 13 of the foam base 1.

S62. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S63. Form a first intermediate layer on the surface of the glue layer 5 close to the first surface 11, the second surface 12 and the third surface 13.

S64. Bake and solidify to form the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S65. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

Among them, the second adhesive layer 7 is connected to the glue layer 5 and the first conductive slurry layer 21 .

S66. Form a different-color PET layer 8 on part of the first surface 11 of the foam base 1.

Among them, the different-color PET layer 8 is connected to the glue layer 5 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above-mentioned steps S61 and step S62. For example, step S61 can be performed first and then step S62; or step S62 can be performed first and then step S61; or steps can be performed simultaneously. S61 and step S62.

It should be noted that the production method may also include:

S061. Soak the first base material layer in the second conductive slurry to form a second intermediate layer with the second conductive slurry covering all surfaces of the first base material layer.

S062. Form a second intermediate layer on part of the first surface, part of the second surface and all of the third surface of the foam base.

S063. Bake and solidify to form a second conductive slurry layer covering all surfaces of the first base material layer.

S064. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is connected to the second conductive paste layer.

S065. Form a different-color PET layer on part of the first surface of the foam matrix.

Wherein, the different-color PET layer is connected to the second conductive slurry layer.

The manufacturing method of conductive foam provided by the embodiment of the present application: on the one hand, the first base material layer is immersed in conductive slurry, and baked/heated to solidify to form a conductive slurry layer that wraps all surfaces of the first base material layer; It is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height in the first direction, small PIM, and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 15 includes:

S71. Spray the second conductive slurry on all the first surface 11, part of the second surface 12 and all the third surface 13 of the foam substrate 1.

S72. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S73. Form a first intermediate layer on the surface of the second conductive paste close to the first surface 11, the second surface 12 and the third surface 13.

S74. Bake and solidify to form the second conductive slurry layer 22 and the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S75. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

The second adhesive layer 7 is connected to both the second conductive slurry layer 22 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above-mentioned steps S71 and step S72. For example, step S71 can be performed first and then step S72; or step S72 can be performed first and then step S71; or steps can be performed simultaneously. S71 and step S72.

It should be noted that the production method may also include:

S071. Soak the first base material layer in the second conductive slurry to form a second intermediate layer with the second conductive slurry covering all surfaces of the first base material layer.

S072. Form a second intermediate layer on the entire first surface, part of the second surface, and all of the third surface of the foam matrix.

S073. Bake and solidify to form a second conductive slurry layer covering all surfaces of the first base material layer.

S074. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is connected to the second conductive paste layer.

The manufacturing method of conductive foam provided by the embodiment of the present application: on the one hand, the first base material layer is immersed in conductive slurry, and baked/heated to solidify to form a conductive slurry layer that wraps all surfaces of the first base material layer; It is simple and easy to implement; on the other hand, it can form a conductive foam with a lower working height in the first direction, small PIM, and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 16 includes:

S81. Spray the second conductive slurry on the entire first surface 11 and part of the second surface 12 of the foam substrate 1 .

S82. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S83. Form a first intermediate layer on the surface of the second conductive paste close to the first surface 11 and the second surface 12 and the third surface 13 of the foam matrix.

S84. Bake and solidify to form the second conductive slurry layer 22 and the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S85. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

The second adhesive layer 7 is connected to both the second conductive slurry layer 22 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above steps S81 and step S82. For example, step S81 can be performed first and then step S82; or step S82 can be performed first and then step S81; or steps can be performed simultaneously. S81 and step S82.

The method for making conductive foam provided in the embodiment of the present application includes, on the one hand, coating a second conductive slurry, immersing the first base material layer in the first conductive slurry, and baking/heating to solidify it to form a second conductive slurry. The slurry layer and the first conductive slurry layer that wraps all surfaces of the first base material layer are simple and easy to implement; on the other hand, it can form a conductive structure with a low working height in the first direction, small PIM, and low stress. Foam.

As an example, the manufacturing method of conductive foam shown in Figure 17 includes:

S91. Form a glue layer 5 on all the first surface 11, part of the second surface 12 and all the third surface 13 of the foam base 1.

S92. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S93. Form a first intermediate layer on the surface of the glue layer 5 close to the first surface 11, the second surface 12 and the third surface 13.

S94. Bake and solidify to form the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S95. Print the first conductive paste on the first conductive paste layer 21 in the second region Q2.

S96. Bake and solidify to form the first conductive slurry layer 21.

S97. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

Among them, the second adhesive layer 7 is connected to the glue layer 5 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above-mentioned steps S91 and step S92. For example, step S91 can be performed first and then step S92; or step S92 can be performed first and then step S91; or steps can be performed simultaneously. S91 and step S92.

It should be noted that the production method may also include:

S091. Soak the first base material layer in the second conductive slurry to form a second intermediate layer with the second conductive slurry covering all surfaces of the first base material layer.

S092. Form a second intermediate layer on the entire first surface, part of the second surface, and all of the third surface of the foam matrix.

S093. Bake and solidify to form a second conductive slurry layer covering all surfaces of the first base material layer.

S094. Spray the second conductive slurry on the second conductive slurry layer in the second area.

S095. Bake and solidify to form a second conductive slurry layer.

S096. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is connected to the second conductive paste layer.

Of course, when the first base material layer and the conductive paste layer are independent structures, when forming the conductive paste layer, conductive materials can be printed/sprayed on the first area in the direction perpendicular to the foam matrix. The height of the paste is less than the height of the conductive paste printed/sprayed on the second area.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, forms an additional conductive slurry layer in the second region than in the first region, so that the structure of the conductive layer in the first region is the same as that in the second region. While the structures of the parts are the same, along the direction perpendicular to the foam matrix, the height of the part of the conductive layer in the first area is smaller than the height of the part of the conductive layer in the second area; on the other hand, a kind of structure in the first direction can be formed. Conductive foam with lower upward working height, small PIM, and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 18 includes:

S101. Form a glue layer 5 on all the first surface 11, part of the second surface 12 and all the third surface 13 of the foam base 1.

S102. Soak the first base material layer 6 in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer 6.

S103. Form a first intermediate layer on the surface of the glue layer 5 close to the first surface 11, the second surface 12 and the third surface 13.

S104. Bake and solidify to form the first conductive slurry layer 21 covering all surfaces of the first base material layer 6.

S105. Form the second base material layer 9 on the first conductive paste layer 21 in the second region Q2.

S106. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

Among them, the second adhesive layer 7 is connected to the glue layer 5 and the first conductive slurry layer 21 .

This application does not specifically limit the order of the above-mentioned steps S101 and step S102. For example, step S101 can be performed first and then step S102; or step S102 can be performed first and then step S101; or steps can be performed simultaneously. S101 and step S102.

It should be noted that the production method may also include:

S0101. Soak the first base material layer in the second conductive slurry to form a second intermediate layer with the second conductive slurry covering all surfaces of the first base material layer.

S0102. Form a second intermediate layer on the entire first surface, part of the second surface, and all of the third surface of the foam matrix.

S0103. Bake and solidify to form a second conductive slurry layer covering all surfaces of the first base material layer.

S0104. Form a second base material layer on the second conductive paste layer in the second region.

S0105. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is connected to the second conductive paste layer.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, additionally forms a second base material layer in the second region, so that the structure of the conductive layer in the first region is different from the structure of the part in the second region. , and along the direction perpendicular to the foam matrix, the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area; on the other hand, a working height in the first direction can be formed. Conductive foam with low PIM and low stress.

As an example, the manufacturing method of conductive foam shown in Figure 19 includes:

S111. Spray the second conductive slurry on all the first surface 11, part of the second surface 12, all the third surface 13 and all the fourth surface 14 of the foam substrate 1.

S112. Bake and solidify to form the second conductive paste layer 22.

S113. Form the second adhesive layer 7 on part of the second surface 12 of the foam base 1.

Wherein, the second adhesive layer 7 is spaced apart from the second conductive paste layer 22 .

It should be noted that the production method may also include:

S0111. Form a glue layer on all the first surface, part of the second surface, all the third surface and all the fourth surface of the foam matrix.

S0112. Soak the first base material layer in the first conductive slurry to form a first intermediate layer with the first conductive slurry covering all surfaces of the first base material layer.

S0113. Form a first intermediate layer on the surface of the glue layer close to the first surface, the second surface, the third surface and the fourth surface.

S0114. Bake and solidify to form a first conductive slurry layer covering all surfaces of the first base material layer.

S0115. Form a second adhesive layer on part of the second surface of the foam base.

Wherein, the second adhesive layer is spaced apart from the glue layer and the first conductive slurry layer.

This application does not specifically limit the order of the above-mentioned steps S0111 and step S0112. For example, step S0111 can be performed first and then step S0112; or step S0112 can be performed first and then step S0111; or steps can be performed simultaneously. S0111 and step S0112.

Of course, the conductive layer with other structures can also be made by a method, which will not be described again here.

The manufacturing method of conductive foam provided by the embodiment of the present application, on the one hand, forms a similar conductive foam on the foam matrix. type conductive layer; on the other hand, it can form a conductive foam with a lower working height in the first direction, small PIM, and low stress.

In application, a first foam matrix with a larger volume is generally selected, and a conductive layer, an adhesive layer, etc. are formed, and then punched into multiple conductive foams with a smaller volume, and compounded with a release layer, ready for use. During use, the release layer is peeled off, and the conductive foam is electrically connected to at least one structure in the electronic device.

Here are a variety of specific production methods:

As an example, as shown in Figure 31, the production method includes:

S011. Clean the surface of the first foam base.

S012. Select the first conductive silver paste.

After step S012, selecting the first conductive silver paste, and before step S013, spraying the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam matrix, the production method also Can include: S019, add diluent. At this time, the selected first conductive silver paste can be diluted to obtain the required first conductive silver paste.

S013. Spray the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam base.

S014, baking and curing.

S015, detect resistivity and height.

If the detected resistivity and height meet the requirements, proceed to subsequent steps; if the detected resistivity and height do not meet the requirements, discard the material. At this time, the resistivity of the conductive foam needs to meet 10 ^-5 -10 ^-4 Ω×cm. Specifically, the resistivity of the conductive foam can be 10 ^-5 Ω×cm, 10 ^-4 Ω×cm, etc.; conductive foam The working height in the first direction needs to be 0.1-0.15mm. Specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.

S016, cover the entire surface with conductive adhesive.

S017, punching.

S018, laminating release paper.

It should be noted that, first, the order of the above steps S011, S012 and S019 is not specifically limited. For example, step S011 can be performed first, and then steps S012 and S019 can be performed; or, step S012 can be performed first. and step S019, and then perform step S011; or, step S011, step S012, and step S019 can be performed simultaneously.

Second, after cleaning the surface of the first foam base in step S011, and before spraying the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam base in step S013 , the production method may also include: S020, first foam matrix mold forming.

This application does not specifically limit the mold forming process of the first foam base body. For example, the first foam base body can be made by extrusion molding. Specifically, the mechanically foamed first foam matrix is selected for cleaning, the cleaned first foam matrix is placed at the discharge port of the mold, and the first foam matrix is squeezed to force the foamed foam matrix to produce Directional plastic deformation, extrusion from the die hole in a specific shape, for example, the hexahedral first foam matrix 10 shown in Figure 33. The reason why mechanical foaming is used is because the conductive foam will not undergo major dimensional changes after the conductive paste is sprayed/printed and cured.

Of course, you can also directly mold the first foam matrix into the foam matrix and then make the conductive layer without punching.

As another example, as shown in Figure 32, the fabrication method includes:

S021. Clean the surface of the first foam base.

S022. Select the first conductive silver paste.

S023. Place the first conductive silver paste in the groove of the steel plate.

After step S022, selecting the first conductive silver paste, and before step S023, placing the first conductive silver paste in the groove of the steel plate, the production method may further include: S031, adding a diluent. At this time, the selected first conductive silver paste can be diluted to obtain the required first conductive silver paste.

S024. The pad printing head dips in the first conductive silver paste and forms the first conductive silver paste.

S025. The pad printing head pad prints the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam base.

The pad printing head of the present application can print the first conductive silver paste multiple times on the first surface, the second surface, the third surface and the fourth surface of the first foam base at the same time, and dry it to the surface, and then solidify after repeated multiple times; or , the pad printing head can print the first conductive silver paste on the surface of a first foam substrate multiple times in sequence, and dry it to the surface, and then solidify after repeated multiple times. There is no specific limit here.

S026, baking and curing.

S027, detect resistivity and height.

If the detected resistivity and height meet the requirements, proceed to subsequent steps; if the detected resistivity and height do not meet the requirements, discard the material. At this time, the resistivity of the conductive foam needs to meet 10 ^-5 -10 ^-4 Ω×cm. Specifically, the resistivity of the conductive foam can be 10 ^-5 Ω×cm, 10 ^-4 Ω×cm, etc.; conductive foam The working height in the first direction needs to be 0.1-0.15mm. Specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.

S028, cover the entire surface with conductive adhesive.

S029, punching.

S030, laminated release paper.

It should be noted that the order of the above-mentioned steps S021 to step S032 and step S022 to step S024 is not specifically limited. For example, steps S021 to step S032 can be performed first, and then steps S022 to step S024 can be performed; alternatively, steps can be performed first Perform step S022 to step S024, and then perform step S021 to step S032; or, perform step S021 to step S032, and step S022 to step S024 at the same time.

In step S021, after cleaning the surface of the first foam base, and in step S025, the pad print head prints the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam base. Previously, the production method could also include: S032, first foam matrix mold forming.

This application does not specifically limit the mold forming process of the first foam base body. For example, the first foam base body can be made by extrusion molding. Specifically, the mechanically foamed first foam matrix is selected for cleaning, the cleaned first foam matrix is placed at the discharge port of the mold, and the first foam matrix is squeezed to force the foamed foam matrix to produce Directional plastic deformation, extrusion from the die hole in a specific shape, for example, the hexahedral first foam matrix 10 shown in Figure 33. The reason why mechanical foaming is used is because the conductive foam will not undergo major dimensional changes after the conductive paste is sprayed/printed and cured.

Of course, you can also directly mold the first foam matrix into the foam matrix and then make the conductive layer without punching.

Figure 33 is a process flow chart of Figure 32 combined with the conductive foam structure. As shown in (a) of Figure 33 , a first foam base 10 is provided; as shown in (b) of Figure 33 , a first conductive layer is printed on the first surface and the second surface of the first foam base 10 Silver paste; as shown in (c) in Figure 33, the first conductive silver paste is pad printed on the third surface and the fourth surface of the first foam base 10, and solidified to form the first conductive paste layer 21; Figure 33 As shown in (d), multiple conductive foams are obtained by punching. At this time, each conductive foam includes a foam base 1, and the first surface, the second surface, the third surface and the third surface of the foam base 1. The first conductive paste layer 21 is formed on the fourth surface, and the first conductive paste in the first conductive paste layer 21 is conductive.

For the structural description of the conductive foam in the embodiments of the present application, reference can be made to the above embodiments and will not be described again here.

Only the content related to the invention point is introduced here. The rest of the production methods can be obtained by referring to relevant technologies and will not be explained in detail here.

It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, but is not intended to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes based on the above examples given. For example, some steps in various embodiments of the above detection methods may be unnecessary, or some new steps may be added. wait. Or a combination of any two or more of the above embodiments. Such modified, changed or combined solutions also fall within the scope of the embodiments of the present application.

It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The similarities or similarities that are not mentioned can be referred to each other. For the sake of brevity, they will not be described again here.

It should also be understood that the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its functions and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application.

It should also be understood that in the embodiments of the present application, "preset" and "predefined" can be realized by pre-saving corresponding codes, tables or other methods that can be used to indicate relevant information in the device (for example, including electronic devices). , this application does not limit its specific implementation.

It should also be understood that the division of modes, situations, categories and embodiments in the embodiments of this application is only for the convenience of description and should not constitute a special limitation. The features in various modes, categories, situations and embodiments are not contradictory unless cases can be combined.

It should also be understood that in the various embodiments of the present application, if there are no special instructions or logical conflicts, the terms and/or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments New embodiments can be formed based on their internal logical relationships.

Finally, it should be noted that the above are only specific implementation modes of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be covered by this application. within the scope of protection applied for. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (19)

1. A conductive foam, characterized in that is applied to electronic equipment, the conductive foam includes:

a foam substrate;

the conductive layer is used for coating at least a first surface of the foam substrate, and the first surface is used for being electrically connected with a first structure in the electronic equipment through the conductive layer; the conductive layer at least comprises a conductive slurry layer, and the conductive slurry layer is used for deforming under the action of external pressure.

2. The conductive foam of claim 1, wherein the conductive paste layer comprises a paste body and a plurality of connected conductive particles, the conductive particles being doped in the paste body.

3. The conductive foam of claim 1 or 2, wherein the conductive layer further comprises a first substrate layer for deforming under the external pressure;

The orthographic projection of the conductive paste layer on the foam substrate is at least partially overlapped with the orthographic projection of the first substrate layer on the foam substrate.

4. The conductive foam of claim 3, wherein the conductive paste layer is a first conductive paste layer disposed on a side of the first substrate layer remote from the foam substrate;

the conductive layer further comprises a first bonding layer, the first bonding layer is arranged between the first substrate layer and the foam substrate, and the first bonding layer is used for bonding the first substrate layer and the foam substrate and deforming under the action of external pressure.

5. The conductive foam of claim 3, wherein the conductive paste layer is a first conductive paste layer, the first conductive paste layer wrapping at least a surface of the first substrate layer on a side closer to the foam substrate and a surface of the first substrate layer on a side farther from the foam substrate;

the conductive layer further comprises a first bonding layer, the first bonding layer is arranged between the first conductive slurry layer and the foam substrate, and the first bonding layer is used for bonding the first conductive slurry layer and the foam substrate and deforming under the action of external pressure.

6. The conductive foam of claim 4 or 5, wherein the first adhesive layer is a second conductive paste layer or glue layer.

7. The electrically conductive foam of any one of claims 1 to 6, wherein the first surface of the foam substrate is divided into at least a first region and a second region, and a height of a portion of the conductive layer located in the first region is smaller than a height of a portion of the conductive layer located in the second region in a direction perpendicular to the foam substrate.

8. The conductive foam of claim 7, wherein a portion of the conductive layer in the first region has the same structure as a portion of the conductive layer in the second region;

and along the direction perpendicular to the foam substrate, the height of the part of at least one layer of the conductive layers, which is positioned in the first area, is smaller than that of the part of the conductive layers, which is positioned in the second area.

9. The conductive foam of claim 7, wherein the conductive layer further comprises a second substrate layer disposed in the second region on a side of the conductive paste layer remote from the foam substrate.

10. The electrically conductive foam according to any one of claims 1 to 9, wherein said foam substrate is in the shape of a polyhedron comprising at least said first, second and third surfaces connected;

the conductive layer coats at least the first surface, the second surface, and the third surface.

11. The conductive foam of claim 10, wherein when the polyhedron comprises the first surface, the second surface, and the third surface, the first surface is disposed opposite the second surface and the first surface is connected to the second surface by the third surface; the conductive layer encapsulates at least a portion of the first surface, at least a portion of the second surface, and all of the third surface of the polyhedron.

12. The conductive foam of claim 10, wherein when the polyhedron comprises the first surface, the second surface, the third surface and the fourth surface, the first surface is disposed opposite the second surface and the third surface is disposed opposite the fourth surface, the first surface is connected to the second surface by the third surface and the fourth surface, respectively, and the conductive layer covers all of the first surface, at least part of the second surface, all of the third surface and all of the fourth surface.

13. The conductive foam of any one of claims 10 to 12, wherein said second surface of said polyhedron is for electrical connection with a second structure in said electronic device through said conductive layer.

14. The conductive foam according to any one of claims 1 to 13, wherein the first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal center, a circuit board, a reed, a shield cover, a battery cover, a decorative piece.

15. The conductive foam of claim 13, wherein the second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal center, a circuit board, a reed, a shielding cover, a battery cover, and a decorative piece.

16. An electronic device comprising the conductive foam of any one of claims 1 to 15.

17. The electronic device of claim 16, wherein the first structure in the electronic device is a display screen and the second structure in the electronic device is a metal bezel.

18. The electronic device of claim 16, wherein the first structure comprises at least a camera assembly for maintaining electrical connection with the conductive foam when rotated.

19. The manufacturing method of the conductive foam is characterized by comprising the following steps of:

forming a conductive layer on at least a first surface of the foam substrate; the first surface is used for being electrically connected with a first structure in the electronic equipment through the conductive layer, the conductive layer at least comprises a conductive paste layer, and the conductive paste layer is used for being deformed under the action of external pressure.