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CN116349011A - 具有电功率模块和dc链路电容器的电气系统以及用于制造这种电气系统的方法 - Google Patents

具有电功率模块和dc链路电容器的电气系统以及用于制造这种电气系统的方法 Download PDF

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Publication number
CN116349011A
CN116349011A CN202180068253.0A CN202180068253A CN116349011A CN 116349011 A CN116349011 A CN 116349011A CN 202180068253 A CN202180068253 A CN 202180068253A CN 116349011 A CN116349011 A CN 116349011A
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CN
China
Prior art keywords
electrical
substrate
power module
capacitor
electrical conductors
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Pending
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CN202180068253.0A
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English (en)
Inventor
T·基斯特
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Valeo eAutomotive Germany GmbH
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Valeo eAutomotive Germany GmbH
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Publication of CN116349011A publication Critical patent/CN116349011A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
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    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
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    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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  • Inverter Devices (AREA)

Abstract

一种电气系统，包括功率模块(107)和DC链路电容器(110)。功率模块(107)包括第一基板(204)和面对所述第一基板(204)的第二基板(206)。第一和第二基板(204，206)在它们之间限定功率模块(107)的内部空间(208)。电源模块(107)包括由第一基板(204)或第二基板(206)支撑并在电源模块(107)的内部空间(208)中延伸的开关(210)，以及在电源模块(107)的内部空间(208)中延伸并连接开关(210)的内部电导体。内部电导体包括用于接收DC电压(E)的两个内部DC电导体。DC链路电容器(110)包括两个电容器电导体(224，226)，所述电容器电导体彼此面对并且至少部分地延伸到功率模块(107)的内部空间(208)之外，并且分别连接到内部DC电导体以稳定DC电压(E)。该电气系统包括包覆成型件(232)，包覆成型件至少部分地封装基板(204，206)、开关(210)、内部电导体和电容器电导体(224，226)。

Description

具有电功率模块和DC链路电容器的电气系统以及用于制造这 种电气系统的方法
技术领域
本发明涉及一种具有电功率模块和DC链路电容器的电气系统。本发明还涉及制造这种电气系统的方法。本发明尤其可以应用于汽车工业。
背景技术
功率模块可以包括彼此面对的两个基板，并且在它们之间限定功率模块的内部空间。至少一个基板支撑电气部件(例如开关电气部件)，以及用于连接电气部件的电导体，所有这些都在内部空间中延伸。
特别地，这种电功率模块可以经由两个引线框架端子连接到DC电压源。
为了稳定由DC电压源提供的DC电压，可以使用DC链路电容器。DC链路电容器通常包括由电介质隔开的两个电容器电导体(通常为面对的金属板或表面的形式)。
由于电功率模块和DC链路电容器之间的距离，在电功率模块和DC链路电容器之间可能存在寄生电感。这种寄生电感会导致开关事件期间的电压过冲。这种电压过冲不仅限制了开关速度，而且增加了开关损耗。当电功率模块用于牵引逆变器时，这导致牵引逆变器的效率和充分利用例如SIC基功率半导体的性能的可能性的限制因素。
公开的欧洲专利申请No.2717460A1公开了一种包括控制装置、三个单相功率模块和DC链路电容器的逆变器。逆变器包括要连接到DC电压源的DC端子。DC链路电容器连接到DC端子，以平滑DC电压源提供的DC电压。每个功率模块包括两个串联连接的半导体开关，并由控制装置控制，使得功率模块将DC电压转换成三相AC电压以驱动电机。
公开的US-美国专利申请No.2008/0192437A1公开了一种包括功率半导体元件和电容器的模块，它们的电极彼此连接。功率半导体元件形成在具有第一和第二主表面的半导体衬底上。该功率半导体模块包括连接到第一主表面的、主电流流过的电极、连接到第二主表面的、主电流流过的电极、以及密封半导体衬底、电容器和电极的树脂部分。电容器的电极和半导体元件的电极通过焊料彼此接合，使得通过树脂部分暴露的表面布置在一个连续的表面上，冷却器可以附接在该表面上。
发明内容
本发明的一个目的是提供一种改进的电气系统，其具有电功率模块和DC链路电容器，特别是具有减少的寄生电感。
本发明的目的通过一种电气系统来解决，该电气系统包括：
电气系统包括：
功率模块，包括：
-第一基板，
-第二基板，与所述第一基板相对，第一基板和第二基板之间限定功率模块的内部空间，
-串联连接的两个开关，形成开关臂，由第一或第二基板支撑并在功率模块的内部空间中延伸，以及
-内部电导体，在功率模块的内部空间中延伸并连接开关臂，内部电导体包括用于接收DC电压的两个内部DC电导体；
DC链路电容器，并联连接到开关臂，并且包括两个电容器电导体，两个电容器电导体彼此面对并且至少部分地延伸到功率模块的内部空间之外，并且分别连接到内部DC电导体，用于稳定DC电压；以及
包覆成型件，包覆成型件至少部分地、优选地完全地封装基板、开关、内部电导体、DC链路电容器及其电容器电导体。
因此，本发明的电气系统包括可以是半导体开关的两个开关和通过包覆成型封装的DC链路电容器。因此，本发明的电气系统基本上是集成了DC链路电容器的功率模块。
开关串联连接，形成开关臂。开关臂配置为将DC电压转换成AC电压，这对于传统的功率模块是已知的，例如，从引言中提到的公开的欧洲专利申请No.2717460A1中是已知的。
由于本发明，DC链路电容器与电功率模块集成在一起。这种直接集成使得在电功率模块和DC链路电容器之间具有相对较短的距离成为可能，这使得增加模块的效率和功率成为可能。特别地，本发明使得保持相对高的电容成为可能，同时获得电压过冲的显著降低以及开关损耗的降低。
这种直接集成还可以降低牵引逆变器的制造成本，并在硬件层面降低整个系统的开发成本。所得到的设备形成一个单一单元的事实也有利于操作。
可选地，电容器电导体的两个相应部分在功率模块的内部空间中延伸，并且例如通过焊接分别结合到内部DC电导体。
还可选地，每个基板包括具有朝向另一基板的内表面的非导电芯层，内部导电层施加在芯层的该内表面上，并且至少一个基板的内部导电层形成至少一个内部DC电导体。
还可选地，基板之一的内部导电层形成两个内部DC电导体。
还可选地，一个基板的内部导电层形成一个内部DC电导体，另一个基板的内部导电层形成另一个内部DC电导体。
还可选地，对于每个基板，外部导电层被施加在芯层的外表面上，与芯层的内表面相对，并且电气系统还包括用于冷却每个外部导电层的冷却系统。
还可选地，电容器电导体是两个导电膜。
还可选地，膜被卷在一起。
该目的还通过根据前述权利要求中任一项的用于制造电气系统的方法来解决，该方法包括以下步骤：
将DC链路电容器的两个电容器电导体连接到功率模块的内部DC电导体；然后
至少部分地包覆成型基板、开关、内部电导体和DC链路电容器及其电容器电导体。
可选地，该方法还包括：获得DC链路电容器；
分离电容器电导体的两个相应部分；并且
将电容器电导体连接到内部DC电导体包括将分离的部分插入到功率模块的内部空间中并且将分离的部分连接到DC电导体。
附图说明
借助于下面的描述，将更好地理解本发明，下面的描述仅作为示例给出并参考附图，其中：
图1是示出根据本发明的电气系统的元件的示意图；
图2是根据本发明的图1的电气系统的组合的电功率模块和DC链路电容器的横截面图；
图3是示出用于制造图2的组合的电功率模块和DC链路电容器的方法的示例的步骤的框图。
具体实施方式
参考图1，现在将描述根据本发明的电气系统100。该电气系统100例如旨在集成到汽车(未示出)中。
电气系统100包括DC电压源102，例如电池，其被配置为提供DC电压E。DC电压源102包括正极端子和负极端子，在正极端子和负极端子之间提供DC电压E。
电气系统100还包括旋转电机104，旋转电机104包括定子相。在所描述的示例中，旋转电机104是交流发电机-起动器类型，连接到汽车的热机。旋转电机104可以在发动机模式和交流模式下操作，在发动机模式下旋转电机104帮助热机，在交流模式下旋转电机104将热机产生的机械能的一部分转换成电能以重新加载DC电压源102。
电气系统100还包括电压转换器106，该电压转换器一方面连接到DC电压源端子，另一方面连接到旋转电机104。
电压转换器106包括分别与定子相相关联的开关臂(switch legs)。每个开关臂包括连接到DC电压源102的正极端子的上开关和连接到DC电压源102的负极端子的下开关。上开关和下开关在连接到相关定子相的中间点处彼此连接。
每个开关臂旨在被控制以在两种配置之间切换。在称为上配置的第一种配置中，上开关闭合，下开关断开，从而将DC电压E施加到相关联的定子相。在称为下配置的第二种配置中，上开关断开，下开关闭合，从而将零电压施加到相关联的定子相。
电压转换器106包括分别实现开关臂的电功率模块107。
电气系统100还包括模块控制装置108，以便在这两种配置之间转换每个臂。在所描述的示例中，电压转换器106被控制为逆变器，以便当旋转电机104必须在发动机模式下运行时向旋转电机104提供电能。然而，当旋转电机104必须以交流发电机模式运行时，电压转换器106被控制为整流器，以便向DC电压源102提供电能(例如对其充电)。
开关是包括例如晶体管的半导体开关。开关例如是金属氧化物半导体场效应晶体管(MOSFET)或绝缘栅双极晶体管(IGBT)。
电气系统100还包括连接在DC电压源102的两个端子之间的DC链路电容器110，用于稳定DC电压E。
在下面的描述中，不同的元件在空间上以包括垂直方向V、纵向方向L和横向方向T的任意正交标记来识别。
参考图2，将以更详细的方式描述结合图1的功率模块107和DC链路电容器110中的一个的电气设备的示例。
电功率模块107包括彼此面对的两个基板204、206。这些基板204、206根据由L和T方向限定的平面延伸。沿着V方向的下基板204被称为“第一基板”，沿着V方向的上基板206被称为“第二基板”。
基板204、206在它们之间限定功率模块107的内部空间208。
电功率模块107’还包括由基板204、206中的至少一个支撑并在内部空间208中延伸的两个开关210。在所描述的示例中，每个开关210是封装开关臂的半导体开关之一的芯片。此外，在该示例中，内部开关210由第一基板204或第二基板206支撑。
每个基板204、206有利地是电基板，即，除了机械支撑之外，配置为提供用于连接开关210的电连接器。通常，电基板包括例如板或金属刀片或印刷电路板，印刷电路板包括用于将开关210电连接在它们之间和/或与外部电路电连接的电子轨道。
在所描述的示例中，每个基板204、206包括非导电芯层204A、206A，其内表面212、214朝向另一基板204、206。
在该示例中，根据V方向，每个芯层204A、206A具有上侧和下侧。第一基板204的芯层204A的上侧对应于其内表面212，而第二基板206的芯层206A的下侧对应于其内表面214。
内部导电层204B施加在第一基板204的芯层204A的内表面212上。类似地，内部导电层206B也施加在第二基板206的芯层206A的内表面214上。
这些内部导电层204B、206B被配置为形成在内部空间208中延伸的电导体，根据所需的电路连接开关210，用于实现所描述示例中的开关臂。具体地，这些电导体包括两个DC电导体，用于接收DC电压，在所描述的示例中为DC电压E。
具体地，每个内部电气部件210的下表面可以电和/或机械地结合到基板204、206中的一个。在所描述的示例中，该下表面例如通过焊接结合到形成在内部导电层204中的至少一个电导体。
可选地，芯层204A、206A的外表面216、218(即分别为芯层204A的下侧和芯层206A的上侧)可以涂覆有外部导电层204C、206C。这些外部导电层204C、206C是导热的，以便将热量从电功率模块107中散发出去。电功率模块107还可以包括冷却系统(未示出)，用于冷却每个外部导电层204C、206C，以便形成双面冷却模块。
例如，每个基板204、206可以是直接结合铜基板(DCB基板)，包括在一个或两个面上涂覆有铜的陶瓷芯204A、206A。替代地，基板204、206可以由金属板(即铝板)组成，金属板覆盖有电介质层，电介质层覆盖有铜层。在这种情况下，金属板对应于外部导电层，电介质层对应于芯层，铜层对应于内部导电层。
间隔件220可以布置在两个基板204、206之间的内部空间208中，以便在它们之间保持预定的距离。例如，每个间隔件220从由一个基板支撑的电气部件延伸到另一个基板。在所描述的示例中，每个间隔件220从一个开关210延伸到第二基板206。以这种方式，每个间隔件220可以用于将热量传递到第二基板206以改善散热，并且可以用于将内部电气部件210的上表面电连接到形成在第二基板206的内部导电层206B中的电导体。
电功率模块107还包括至少一个外部电导体222，该外部电导体222从电功率模块107的内部空间208延伸到内部空间208的外部，用于将内部电导体和/或开关210直接连接到外部电气部件，例如图1所示的电压转换器106的其他电气部件。
每个外部电导体222有利地包括刚性引线框架，例如基本上是平面的。这些引线框架例如是金属的。如果需要，它们以直线方式延伸和/或以弯曲和/或平面变化的方式成形。
在所描述的示例中，外部电导体222具有旨在连接到旋转电机104的相的第一端(在左侧)和连接到第一基板204的内部电导体的第二端(在右侧)。
DC链路电容器110包括至少两个电容器电导体224、226，它们彼此面对并被电介质228隔开。在所描述的示例中，电容器电导体224、226分别包括卷在一起的两个叠加的金属化膜。
每个膜224、226的一小部分224’、226’(例如小于10％)在电功率模块107的内部空间208中延伸，而其余部分延伸到内部空间208之外。这些部分224’、226’彼此分离(电介质228可以在这些部分224’、226’之间移除)并分别结合到内部DC电导体，例如通过焊接直接结合到内部DC电导体。因为大多数电容器电导体延伸到内部空间208之外，所以它们可以很大，使得DC链路电容器可以实现高电容，例如大于50pF，例如在50pF和100pF之间。
除了在这些小部分224’、226’上，两个电容器电导体224、226优选地总是在它们之间保持短的且基本上恒定的距离，例如由于电介质228在它们之间延伸。
在所描述的示例中，一个内部DC电导体位于第一基板204上，而另一个内部DC电导体位于第二基板206上。在这种情况下，两个部分224’、226’在V方向上分开，以分别结合到两个基板204、206。
在未示出的另一个可能的实施例中，膜224、226的部分224’、226’可以沿T方向分裂，并结合到相同的基板(第一或第二)，同时彼此间隔开，以避免接触。
DC链路电容器110还可以包括两个外部DC电导体230，用于将DC链路电容器110连接到外部部件(不同于电功率模块107)。外部DC电导体具有分别连接(即结合)到膜224、226的一端和用于接收例如DC电压的另一端，例如所描述的示例中的DC电压E。优选地，每个外部DC电导体230包括刚性引线框架，例如基本上是平面的。这些引线框架例如是金属的。如果需要，它们以直线方式延伸和/或以弯曲和/或平面变化的方式成形。
组合的电功率模块和DC链路电容器还包括包覆成型件232，包覆成型件232是电绝缘的、刚性的，并且至少部分地封装基板204、206、开关210、内部电导体和电容器电导体。优选地，包覆成型件232完全涂覆开关210。包覆成型件232包括例如环氧树脂。包覆成型件232例如通过传递模塑或通过压缩模塑制成。例如，开关210浸没在包覆成型件232中以实现封装，即涂覆成型。优选地，外部电导体222的至少一部分(例如在内部空间208中延伸的部分)也被封装。优选地，外部导电层204C、206C不被封装以便冷却，至少它们的外表面是如此。优选地，包覆成型件232完全填充内部空间208。包覆成型件232由附图上具有点的区域示出。
从前面的描述中可以清楚地看出，DC链路电容器110与模块107集成在一起，而不是像现有技术中那样是附件部件。因此，模块107及其集成的DC链路电容器110形成单个单元。优选地，封装使得在不损坏封装元件的情况下不可能拆卸。将DC链路电容器110直接集成到电功率模块107中导致DC链路电容器和电功率模块107之间的距离减小，从而获得非常低的寄生电感，同时保持非常大的电容的可能性，这导致电压过冲的显著降低以及开关损耗的降低。
参照图3，现在将描述用于制造组合的电功率模块和DC链路电容器的方法300的示例。
在步骤302，获得电功率模块107和DC链路电容器110，没有包覆成型232。
在步骤304，电容器电导体的各部分彼此分离。
在步骤306，将分离的部分插入到电功率模块107的内部空间208中。
在步骤308，将分离的部分插入到电功率模块107的内部空间208中。
在步骤310，插入部分分别结合到内部DC电导体，例如直接结合，例如焊接。因此，两个电容器电导体连接到内部DC电导体，并且非常紧密地延伸到内部DC电导体，使得寄生电感低。
在步骤312，基板204、206、开关210、内部电导体和电容器电导体224、226通过至少部分包覆成型以形成包覆成型件232而被封装。
封装可以在单个步骤中进行，以形成单个包覆成型件：基板204、206(优选除了外部导电层)、开关210、内部电导体、电容器电导体224、226和部分外部电导体222、230同时被封装。
替代地，封装可以分两步进行：在第一步中封装电功率模块107的基板204、206(优选地，除了外部导电层)、开关210、内部电导体和部分外部电导体222，然后在第二步中封装DC链路电容器110的电容器电导体224、226和部分外部电导体230。
应注意，本发明不限于上述实施例。
根据以上公开的教导，对本领域技术人员来说确实可以对上述实施例进行各种修改。在本发明的先前详细描述中，所使用的术语不应被解释为将本发明限制于本描述中呈现的实施例，而是应被解释为包括本领域技术人员通过将他们的一般知识应用于以上公开的教导的实施而能够达到的所有等同物。

Claims (10)

1.一种电气系统，包括：
功率模块(107)，所述功率模块(107)包括：
-第一基板(204)，
-第二基板(206)，与所述第一基板(204)相对，所述第一和第二基板(204，206)在它们之间限定所述功率模块(107)的内部空间(208)，
-串联连接的两个开关(210)，形成开关臂并由第一基板(204)或第二基板(206)支撑，并且在所述功率模块(107)的内部空间(208)中延伸，以及
-内部电导体，在所述功率模块(107)的所述内部空间(208)中延伸并连接所述开关臂，所述内部电导体包括用于接收DC电压(E)的两个内部DC电导体；
DC链路电容器(110)，并联连接到所述开关臂，并且包括两个电容器电导体(224，226)，所述两个电容器电导体彼此面对并且至少部分地延伸到所述功率模块(107)的内部空间(208)之外，并且分别连接到所述内部DC电导体以稳定所述DC电压(E)；以及
包覆成型件(232)，至少部分地封装所述基板(204，206)、所述开关(210)、所述内部电导体、所述DC链路电容器(110)及其电容器电导体(224、226)。
2.根据权利要求1所述的电气系统，其中，所述电容器电导体(224、226)的两个相应部分(224’、226’)在所述功率模块(107)的内部空间(208)中延伸，并且例如通过焊接分别结合到所述内部DC电导体。
3.根据权利要求1至2中任一项所述的电气系统，其中，每个基板(204，206)包括非导电芯层(204A，206A)，其内表面(212，214)朝向另一基板(204，206)取向，内部导电层(204B，206B)施加在所述芯层(204A，206A)的该内表面(212，214)上，并且其中，至少一个基板(204，206)的内部导电层形成至少一个内部DC电导体。
4.根据权利要求3所述的电气系统，其中，所述基板(204，206)之一的所述内部导电层形成两个内部DC电导体。
5.根据权利要求3所述的电气系统，其中，所述基板之一(204，206)的内部导电层形成所述内部DC电导体之一，所述基板(204，206)中的另一个的内部导电层形成所述内部DC电导体中的另一个。
6.根据权利要求3至5中任一项所述的电气系统，其中，对于每个基板(204、206)，外部导电层(204C、206C)被施加在所述芯层(204A、206A)的外表面(216、218)上，与所述芯层(204A、206A)的内表面(212、214)相对，并且还包括用于冷却每个外部导电层(204C、206C)的冷却系统。
7.根据权利要求1至6中任一项所述的电气系统，其中，所述电容器电导体是两个导电膜(224、226)。
8.根据权利要求7所述的电气系统，其中，所述膜(224、226)卷起在一起。
9.一种用于制造根据前述权利要求中任一项所述的电气系统的方法，包括以下步骤：
将DC链路电容器的两个电容器电导体连接到功率模块(107)的内部DC电导体；然后
至少部分地包覆成型基板(204、206)、开关(210)、内部电导体和DC链路电容器(110)及其电容器电导体。
10.根据权利要求9所述的方法，还包括：
获得所述DC链路电容器；
分离所述电容器电导体的两个相应部分；并且
其中，将所述电容器电导体连接到所述内部DC电导体包括：将分离的部分插入到所述功率模块(107)的内部空间中并且将所述分离的部分连接到所述DC电导体。
CN202180068253.0A 2020-10-05 2021-09-10 具有电功率模块和dc链路电容器的电气系统以及用于制造这种电气系统的方法 Pending CN116349011A (zh)

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