CN115734988A - Thermoplastic resin composition and molded article formed therefrom - Google Patents
Thermoplastic resin composition and molded article formed therefrom Download PDFInfo
- Publication number
- CN115734988A CN115734988A CN202180045621.XA CN202180045621A CN115734988A CN 115734988 A CN115734988 A CN 115734988A CN 202180045621 A CN202180045621 A CN 202180045621A CN 115734988 A CN115734988 A CN 115734988A
- Authority
- CN
- China
- Prior art keywords
- thermoplastic resin
- resin composition
- weight
- parts
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 80
- 239000011342 resin composition Substances 0.000 title claims abstract description 79
- -1 phosphite ester compound Chemical class 0.000 claims abstract description 61
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 43
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 42
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 28
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 26
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 19
- 239000000178 monomer Substances 0.000 claims description 18
- 229920002379 silicone rubber Polymers 0.000 claims description 16
- 239000004945 silicone rubber Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 11
- 239000003085 diluting agent Substances 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004711 α-olefin Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- 238000010998 test method Methods 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 125000004434 sulfur atom Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 41
- 229920001296 polysiloxane Polymers 0.000 abstract description 17
- 229920001971 elastomer Polymers 0.000 abstract description 9
- 239000005060 rubber Substances 0.000 abstract description 9
- 230000006866 deterioration Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000010422 painting Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- VSIKJPJINIDELZ-UHFFFAOYSA-N 2,2,4,4,6,6,8,8-octakis-phenyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound O1[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si](C=2C=CC=CC=2)(C=2C=CC=CC=2)O[Si]1(C=1C=CC=CC=1)C1=CC=CC=C1 VSIKJPJINIDELZ-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- IRVZFACCNZRHSJ-UHFFFAOYSA-N 2,4,6,8-tetramethyl-2,4,6,8-tetraphenyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound O1[Si](C)(C=2C=CC=CC=2)O[Si](C)(C=2C=CC=CC=2)O[Si](C)(C=2C=CC=CC=2)O[Si]1(C)C1=CC=CC=C1 IRVZFACCNZRHSJ-UHFFFAOYSA-N 0.000 description 1
- HNDVYGDZLSXOAX-UHFFFAOYSA-N 2,6-dichloro-4-propylphenol Chemical compound CCCC1=CC(Cl)=C(O)C(Cl)=C1 HNDVYGDZLSXOAX-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- WRLVTKZXVVEUPL-UHFFFAOYSA-N 2-chloro-4-propylphenol Chemical compound CCCC1=CC=C(O)C(Cl)=C1 WRLVTKZXVVEUPL-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- NIRYBKWMEWFDPM-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-methylbutyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CCC1=CC=C(O)C=C1 NIRYBKWMEWFDPM-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- IUMSDRXLFWAGNT-UHFFFAOYSA-N Dodecamethylcyclohexasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 IUMSDRXLFWAGNT-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical class CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- QROGIFZRVHSFLM-QHHAFSJGSA-N [(e)-prop-1-enyl]benzene Chemical compound C\C=C\C1=CC=CC=C1 QROGIFZRVHSFLM-QHHAFSJGSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229920000402 bisphenol A polycarbonate polymer Polymers 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- HAURRGANAANPSQ-UHFFFAOYSA-N cis-2,4,6-Trimethyl-2,4,6-triphenylcyclotrisiloxane Chemical compound O1[Si](C)(C=2C=CC=CC=2)O[Si](C)(C=2C=CC=CC=2)O[Si]1(C)C1=CC=CC=C1 HAURRGANAANPSQ-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical class C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/375—Thiols containing six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The thermoplastic resin composition of the present invention is characterized by comprising: about 100 parts by weight of a polycarbonate resin; about 0.1 to about 2 parts by weight of a phosphite ester compound represented by chemical formula 1; about 0.1 to 1.2 parts by weight of a hindered phenol compound represented by chemical formula 2; and about 1.5 to about 9 parts by weight of a silicone-based rubber modified vinyl graft copolymer. The thermoplastic resin composition has excellent (high temperature) chemical resistance, impact resistance, hardness, and a balance of these properties, and the like.
Description
Technical Field
The present invention relates to thermoplastic resin compositions and articles produced therefrom. More particularly, the present invention relates to a thermoplastic resin composition exhibiting good characteristics in terms of (high temperature) chemical resistance, impact resistance, rigidity, and a balance therebetween, and a molded article formed therefrom.
Background
For the low price and stability of the mobile phone, a thermoplastic resin is applied to the battery and the rear cover. In particular, since a rear cover (battery cover) of a mobile phone requires film formability and high gloss appearance characteristics, a polycarbonate product which is not reinforced with an inorganic material and has high impact resistance is generally applied thereto.
Polycarbonate resins, which are commonly used as materials for mobile phones, are transparently coated to realize various colors and prevent daily scratches, or are painted after injection to secure the appearance. In this case, after dilution in various organic solvents, the coating solution and paint are applied to the surface of the resin product and dried thereon. However, the organic solvent used as a diluent in this process permeates into the polycarbonate, thereby causing deterioration of mechanical properties including impact resistance, rigidity, and the like, and the solvent remaining during drying after painting promotes decomposition of the polycarbonate resin.
Therefore, there is a need for a thermoplastic resin composition having good characteristics in terms of chemical resistance, impact resistance, rigidity, and a balance therebetween.
Background art of the present invention is disclosed in korean patent laid-open publication No. 10-2010-0076643 and the like.
Disclosure of Invention
[ problem ] to provide a method for producing a semiconductor device
It is an object of the present invention to provide a thermoplastic resin composition exhibiting good characteristics in terms of (high temperature) chemical resistance, impact resistance, rigidity and a balance therebetween.
It is another object of the present invention to provide a molded article formed of the thermoplastic resin composition.
The above and other aspects of the present invention can be achieved by the present invention described below.
[ technical solution ] A
1. One aspect of the present invention relates to a thermoplastic resin composition. The thermoplastic resin composition comprises: about 100 parts by weight of a polycarbonate resin; about 0.1 to about 2 parts by weight of a phosphite compound represented by formula 1; about 0.1 parts by weight to about 1.2 parts by weight of a hindered phenol compound represented by formula 2; and about 1.5 to about 9 parts by weight of a silicone rubber modified vinyl graft copolymer,
[ formula 1]
Wherein R is 1 、R 2 、R 3 、R 4 、R 5 、R 6 、R 7 And R 8 Each independently is a hydrogen atom or C 1 To C 10 An alkyl group, and a is a sulfur atom or an oxygen atom; and is provided with
[ formula 2]
Wherein R is 9 Is straight chain or branched C 8 To C 22 An alkyl group, and n is 0 or 1.
2. In embodiment 1, R 1 、R 2 、R 3 And R 4 At least one of which may comprise a branch C 4 To C 10 An alkyl group, and R 5 、R 6 、R 7 And R 8 May include a branch C 4 To C 10 An alkyl group.
3. In embodiment 1 or 2, the phosphite compound may include a compound represented by formula 1 a.
[ formula 1a ]
4. In embodiments 1 to 3, the silicone rubber-modified vinyl graft copolymer may be prepared by graft-polymerizing an alkyl (meth) acrylate monomer to a silicone rubber polymer.
5. In embodiments 1 to 4, the phosphite compound and hindered phenol compound may be present in a weight ratio of about 1.
6. In embodiments 1 to 5, the thermoplastic resin composition may further include a maleic anhydride-modified olefin copolymer.
7. In embodiments 1 to 6, the thermoplastic resin composition may include about 0.1 parts by weight to about 2 parts by weight of the maleic anhydride-modified olefin copolymer with respect to about 100 parts by weight of the polycarbonate resin.
8. In embodiments 1 to 7, the maleic anhydride-modified olefin copolymer may include a maleic anhydride-modified alkene- α -olefin copolymer prepared by polymerization of an alkene- α -olefin copolymer with maleic anhydride.
9. In embodiments 1 to 8, the maleic anhydride-modified olefin copolymer may include at least one of a maleic anhydride-modified ethylene-butene copolymer and a maleic anhydride-modified ethylene-octene copolymer.
10. In embodiments 1 through 9, the thermoplastic resin composition may have a fracture height of about 70cm to about 100cm at which the sample fractures upon falling a weight of 1kg on the sample, according to the dupont drop test method, wherein the sample is prepared by: a1 mm thick sample of the thermoplastic resin composition was immersed in the diluent solution for 2.5 minutes, dried at 80 ℃ for 20 minutes, and left at room temperature for 24 hours.
11. In embodiments 1 to 9, the polycarbonate resin of the thermoplastic resin composition may have a weight average molecular weight difference of about 500 or less, calculated according to equation 1:
[ equation 1]
Weight average molecular weight difference = Mw1-Mw2
Wherein Mw1 is a weight average molecular weight of the polycarbonate resin measured by GPC on a sample after immersing a 1mm thick sample in a diluent solution for 2.5min and drying at 80 ℃ for 20 min; and Mw2 is the weight average molecular weight of the polycarbonate resin measured on the sample by GPC after the sample is left at 100 ℃ for 24 hours.
12. In embodiments 1 to 11, the thermoplastic resin composition may have a notched Izod impact strength of about 70kgf cm/cm or more, as measured on a 1/8 "thick sample according to ASTM D256.
13. In embodiments 1 through 12, the thermoplastic resin composition may have about 20,000kgf/cm as measured at 2.8mm/min on a 1/4 "thick sample according to ASTM D790 2 Or a greater flexural modulus.
14. Another aspect of the invention relates to a molded article. A molded article is formed from the thermoplastic resin composition according to any one of embodiments 1 to 13.
[ PROBLEMS ] the present invention
The present invention provides a thermoplastic resin composition having good characteristics in terms of (high temperature) chemical resistance, impact resistance, rigidity, and a balance therebetween, and a molded article formed therefrom.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
The thermoplastic resin composition according to the present invention comprises: (A) a polycarbonate resin; (B) a phosphite compound; (C) a hindered phenol compound; and (D) a silicone rubber-modified vinyl graft copolymer.
As used herein to represent a particular numerical range, the expression "a through b" means ". Gtoreq.a, and ≦ b".
(A) Polycarbonate resin
The polycarbonate resin according to an embodiment of the present invention may be selected from any polycarbonate resins used in typical thermoplastic resin compositions. For example, the polycarbonate resin may be an aromatic polycarbonate resin prepared by reacting diphenols (aromatic diol compounds) with precursors such as phosgene, a haloformate or a carbonate diester.
In some embodiments, the diphenols may include, for example, 4' -biphenol, 2-bis (4-hydroxyphenyl) propane, 2, 4-bis (4-hydroxyphenyl) -2-methylbutane, 1-bis (4-hydroxyphenyl) cyclohexane, 2-bis (3-chloro-4-hydroxyphenyl) propane, and 2, 2-bis- (3, 5-dichloro-4-hydroxyphenyl) propane, but are not limited thereto. For example, the diphenol may be 2, 2-bis (4-hydroxyphenyl) propane, 2-bis (3, 5-dichloro-4-hydroxyphenyl) propane or 1, 1-bis (4-hydroxyphenyl) cyclohexane, in particular 2, 2-bis (4-hydroxyphenyl) propane, which is also known as bisphenol A.
In some embodiments, the polycarbonate resin may be a branched polycarbonate resin. For example, the polycarbonate resin may be a polycarbonate resin prepared by adding a trivalent or higher polyfunctional compound (specifically, a trivalent or higher phenol group-containing compound) in an amount of about 0.05mol% to about 2mol% based on the total amount of diphenols used in the polymerization.
In some embodiments, the polycarbonate resin may be a homopolycarbonate resin, a copolycarbonate resin, or a blend thereof. In addition, the polycarbonate resin may be partially or completely replaced by an aromatic polyester-carbonate resin obtained by polymerization in the presence of an ester precursor (e.g., a bifunctional carboxylic acid).
In some embodiments, the polycarbonate resin can have a weight average molecular weight (Mw) of about 10,000g/mol to about 50,000g/mol (e.g., about 15,000g/mol to about 40,000g/mol) as measured by Gel Permeation Chromatography (GPC). Within this range, the thermoplastic resin composition may have good flowability (processability).
(B) Phosphite ester compound
According to the present invention, the phosphite compound may be used together with a specific hindered phenol compound and a silicone rubber-modified vinyl graft copolymer, etc. to improve (high temperature) chemical resistance, impact resistance, rigidity, and a balance therebetween, etc. of the thermoplastic resin composition without using an inorganic filler, and the phosphite compound may be a phosphite compound represented by formula 1.
[ formula 1]
Wherein R is 1 、R 2 、R 3 、R 4 、R 5 、R 6 、R 7 And R 8 Each independently is a hydrogen atom or C 1 To C 10 An alkyl group, and A is a sulfur atom or an oxygen atom.
In some embodiments, R 1 、R 2 、R 3 And R 4 At least one of which may comprise a branch C 4 To C 10 An alkyl group, and R 5 、R 6 、R 7 And R 8 At least one of which may comprise a branch C 4 To C 10 An alkyl group.
In some embodiments, the phosphite compound may include a compound represented by formula 1 a.
[ formula 1a ]
In some embodiments, the phosphite compound may be present in an amount of about 0.1 parts by weight to about 2 parts by weight, for example, about 0.2 parts by weight to about 1 part by weight, relative to about 100 parts by weight of the polycarbonate resin. If the content of the phosphite compound is less than about 0.1 parts by weight with respect to about 100 parts by weight of the polycarbonate resin, the thermoplastic resin composition may suffer from deterioration in chemical resistance (high temperature) and the like, and if the content of the phosphite compound exceeds about 2 parts by weight, the thermoplastic resin composition may suffer from deterioration in chemical resistance, impact resistance and the like.
(C) Hindered phenol compound
According to the present invention, the hindered phenol compound may be used together with a phosphite compound and a silicone rubber-modified vinyl graft copolymer, etc. to improve (high temperature) chemical resistance, impact resistance, rigidity, and balance therebetween, etc. of the thermoplastic resin composition without using an inorganic filler, and the hindered phenol compound may be a hindered phenol compound represented by formula 2.
[ formula 2]
Wherein R is 9 Is straight chain or branched C 8 To C 22 An alkyl group, and n is 0 or 1.
In some embodiments, the hindered phenol compound may include C 8 To C 22 Alkyl-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate in which n is 0.
In some embodiments, the hindered phenol compound may be contained in an amount of about 0.1 parts by weight to about 1.2 parts by weight, for example, about 0.1 parts by weight to about 1 part by weight, relative to about 100 parts by weight of the polycarbonate resin. If the content of the hindered phenol compound is less than about 0.1 parts by weight with respect to about 100 parts by weight of the polycarbonate resin, the thermoplastic resin composition may suffer from deterioration in (high temperature) chemical resistance and the like, and if the content of the hindered phenol compound exceeds about 1.2 parts by weight, the thermoplastic resin composition may suffer from deterioration in chemical resistance, impact resistance, rigidity and the like.
In some embodiments, the phosphite compound (B) and hindered phenol compound (C) may be present in a weight ratio (B: C) of about 1. Within this range, the thermoplastic resin composition may exhibit good (high temperature) chemical resistance and the like.
(D) Silicone rubber modified vinyl graft copolymers
According to the present invention, the silicone rubber-modified vinyl graft copolymer may be used together with a phosphite compound and a hindered phenol compound, etc. to improve (high temperature) chemical resistance, impact resistance, rigidity, and balance therebetween, etc. of a thermoplastic resin composition without using an inorganic filler, and the silicone rubber-modified vinyl graft copolymer may be prepared by graft-polymerizing a vinyl monomer ((meth) acrylic acid alkyl ester monomer, etc.) to a silicone rubber polymer. The polymerization may be carried out by any typical polymerization method such as emulsion polymerization, suspension polymerization and the like. In addition, the silicone rubber-modified vinyl graft copolymer may have a core (rubber polymer) -shell (polymer of the monomer mixture) structure.
In some embodiments, the polysiloxane rubber polymer can be prepared by polymerization of rubber monomers (including siloxane monomers, such as cyclosiloxanes and the like). Examples of the cyclic siloxane may include hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, trimethyltriphenylcyclotrisiloxane, tetramethyltetraphenylcyclotetrasiloxane, octaphenylcyclotetrasiloxane, and the like. Here, a curing agent such as trimethoxymethylsilane, triethoxyphenylsilane, tetramethoxysilane, tetraethoxysilane or the like may be used. For example, the silicone rubber polymer may be a polydimethylsiloxane rubber polymer.
In some embodiments, the silicone rubber polymer (rubber particles) can have an average particle diameter (D50) of from about 30nm to about 200nm (e.g., from about 50nm to about 100 nm), and the silicone rubber modified vinyl graft copolymer can have an average particle diameter (D50) of from about 100nm to about 300nm (e.g., from about 150nm to about 250 nm), as measured using a particle size analyzer. Within this range, the thermoplastic resin composition may have good characteristics in terms of (low temperature) impact resistance, appearance, and the like. Here, the average particle size can be measured by a drying method well known in the art using a Mastersizer 2000E series analyzer (Malvern).
In some embodiments, the vinyl monomer may be selected from alkyl (meth) acrylate monomers, aromatic vinyl monomers, and combinations thereof.
In some embodiments, the alkyl (meth) acrylate monomer may be graft polymerized to the rubber polymer, and may include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, epoxy resin-containing alkyl (meth) acrylate monomers such as glycidyl (meth) acrylate, and the like. These may be used alone or as a mixture thereof.
In some embodiments, the aromatic vinyl monomer may be graft polymerized to the rubber polymer, and may include, for example, styrene, α -methylstyrene, β -methylstyrene, p-tert-butylstyrene, ethylstyrene, vinylxylene, monochlorostyrene, dichlorostyrene, dibromostyrene, vinylnaphthalene, and the like. These may be used alone or as a mixture thereof.
In some embodiments, the silicone rubber modified vinyl graft copolymer can be a graft copolymer prepared by graft polymerizing an alkyl (meth) acrylate monomer (e.g., butyl acrylate and/or methyl methacrylate) to a silicone rubber polymer.
In some embodiments, the silicone rubber polymer can be present in an amount of about 20wt% to about 85wt%, for example, about 40wt% to about 85wt%, and the vinyl monomer can be present in an amount of about 15wt% to about 80wt%, for example, about 15wt% to about 60wt%, based on 100wt% of the silicone rubber modified vinyl graft copolymer. Within this range, the thermoplastic resin composition may exhibit good chemical resistance and the like.
In some embodiments, the polysiloxane rubber-modified vinyl graft copolymer may be present in an amount of about 1.5 parts by weight to about 9 parts by weight, for example, about 2 parts by weight to about 8 parts by weight, relative to about 100 parts by weight of the polycarbonate resin. If the content of the polysiloxane rubber-modified vinyl graft copolymer is less than about 1.5 parts by weight with respect to about 100 parts by weight of the polycarbonate resin, the thermoplastic resin composition may suffer from deterioration in chemical resistance, impact resistance, rigidity, and the like, and if the content of the polysiloxane rubber-modified vinyl graft copolymer exceeds about 9 parts by weight, the thermoplastic resin composition may suffer from deterioration in chemical resistance, impact resistance, rigidity, and the like.
In some embodiments, the phosphite compound (B) and the silicone rubber-modified vinyl graft copolymer (D) may be present in a weight ratio (B: D) of from about 1 to about 1. Within this range, the thermoplastic resin composition may exhibit good characteristics in terms of chemical resistance, impact resistance, rigidity, and the like.
According to some embodiments, the thermoplastic resin composition may further include a maleic anhydride-modified olefin copolymer to achieve further improvement in (high temperature) chemical resistance and the like.
In some embodiments, the maleic anhydride-modified olefin copolymer may be a reactive olefin copolymer prepared by polymerization of an olefin copolymer with maleic anhydride as a reactive functional group. For example, the maleic anhydride-modified olefin copolymer can be prepared by polymerization of an olefin copolymer (which is prepared by copolymerization of at least two alkene monomers) with maleic anhydride. The alkene monomer may be C 2 To C 10 Alkenes and may be selected from, for example, ethylene, propylene, isopropene, butene, isobutene, octene, and combinations thereof.
In some embodiments, the maleic anhydride-modified olefin copolymer may comprise a maleic anhydride-modified alkene-alpha-olefin copolymer prepared by polymerization of an alkene-alpha-olefin copolymer with maleic anhydride.
In some embodiments, the maleic anhydride-modified olefin copolymer may include maleic anhydride-modified ethylene-butene copolymers, maleic anhydride-modified ethylene-octene copolymers, and combinations thereof.
In some embodiments, the maleic anhydride-modified olefin copolymer can have a melt flow index of from about 0.5g/10min to about 20g/10min (e.g., from about 1g/10min to about 10g/10 min), measured at 190 ℃ and 2.16kg according to ASTM D1238.
In some embodiments, the maleic anhydride-modified olefin copolymer may be contained in an amount of about 0.1 parts by weight to about 2 parts by weight, for example, about 0.2 parts by weight to about 1.5 parts by weight, relative to about 100 parts by weight of the polycarbonate resin. Within this range, the thermoplastic resin composition may exhibit good characteristics in terms of chemical resistance, high-temperature chemical resistance, and the like.
The thermoplastic resin composition according to one embodiment of the present invention may further include additives used in typical thermoplastic resin compositions. The additives may include, but are not limited to, flame retardants, anti-impregnation agents, lubricants, nucleating agents, stabilizers, mold release agents, pigments, dyes, and mixtures thereof. The content of the additive may be about 0.001 parts by weight to about 40 parts by weight, for example, about 0.1 parts by weight to about 10 parts by weight, relative to about 100 parts by weight of the polycarbonate resin.
According to one embodiment, the thermoplastic resin composition may be prepared in pellet form by mixing the above-described components, followed by melt extrusion at about 200 ℃ to about 280 ℃ (e.g., about 220 ℃ to about 260 ℃) using a typical twin screw extruder.
In some embodiments, the thermoplastic resin composition may have a height at break of about 70cm to about 100cm (e.g., about 72cm to about 98 cm) at which a sample breaks when a 1kg weight is dropped onto the sample, according to the dupont drop test method, wherein the sample is prepared by immersing a 1mm thick sample of the thermoplastic resin composition in a diluent solution for 2.5 minutes, drying the sample at 80 ℃ for 20 minutes, and standing the sample at room temperature for 24 hours.
In some embodiments, the polycarbonate resin of the thermoplastic resin composition may have a weight average molecular weight difference of about 500 or less (e.g., about 400 or less) calculated according to equation 1.
[ equation 1]
Weight average molecular weight difference = Mw1-Mw2
Wherein Mw1 is a weight average molecular weight of the polycarbonate resin measured by GPC on a 1mm thick sample after the sample is immersed in a diluent solution for 2.5min and dried at 80 ℃ for 20 min; and Mw2 is the weight average molecular weight of the polycarbonate resin measured on the sample by GPC after the sample is left at 100 ℃ for 24 hours.
In some embodiments, the thermoplastic resin composition can have a notched Izod impact strength of about 70 kgf-cm/cm or greater (e.g., from about 75 kgf-cm/cm to about 90 kgf-cm/cm) as measured on a 1/8 "thick sample according to ASTM D256.
In some embodiments, the thermoplastic resin composition may have a thickness of about 20,000kgf/cm as measured at 2.8mm/min on a 1/4 "thick sample according to ASTM D790 2 Or greater (e.g., about 20,000kgf/cm) 2 To about 30,000gf/cm 2 ) The flexural modulus of (a).
The molded article according to the present invention is formed from the above-stated thermoplastic resin composition. The thermoplastic resin composition may be prepared in the form of pellets. The prepared pellets can be produced into various molded articles (products) by various molding methods such as injection molding, extrusion molding, vacuum molding and casting. These molding methods are well known to those skilled in the art. The molded article has good characteristics in terms of (high temperature) chemical resistance, impact resistance, rigidity, and balance therebetween, and the like, and thus can be advantageously used for interior/exterior materials of electric/electronic products, interior/exterior materials of vehicles, exterior materials of buildings, and the like. In particular, the molded article can be used for interior/exterior materials including mobile phones, notebook computers, and the like, which require a painting process such as clear coating and the like.
[ modes for the invention ]
Next, the present invention will be described in more detail with reference to some examples. It should be understood that these examples are provided for illustration only, and are not to be construed as limiting the invention in any way.
Examples
The details of the components used in examples and comparative examples are as follows.
(A) Polycarbonate resin
A bisphenol A polycarbonate resin having a weight average molecular weight (Mw) of 22,000g/mol was used.
(B) Phosphite ester compound
(B1) The phosphite compound represented by formula 1a is used.
[ formula 1a ]
(B2) Triphenyl phosphite compounds are used.
(B3) Tris (2, 4-di-t-butylphenyl) phosphite compounds are used.
(B4) A tris (4-methoxyphenyl) phosphite compound was used.
(C) Hindered phenol compound
(C1) Octadecyl-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate was used.
(C2) 3, 9-bis [1, 1-dimethyl-2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy ] ethyl ] -2,4,8, 10-tetraoxaspiro [5.5] undecane, which has a different structure from the phenol compound of the present invention, was used (manufacturer: smitomo Co., ltd., product name: sumilizer GA-80).
(D) Rubber modified vinyl graft copolymers
(D1) A silicone rubber-modified vinyl graft copolymer prepared by graft polymerizing an acrylic monomer (BA/MMA) to a silicone rubber Polymer (PDMS) (manufacturer: mitsubishi Chemical Co., ltd., product name: metablen S-2100) was used.
(D2) g-ABS prepared by graft polymerizing 55wt% of styrene and acrylonitrile (weight ratio: 75/25) to 45wt% of butadiene rubber particles having a Z-average of 310nm was used.
(E) Maleic anhydride-modified ethylene-butene copolymer (manufacturer: mitsui Chemicals co., ltd., product name: TAFMER MH-7020) was used.
Examples 1 to 8 and comparative examples 1 to 11
The above components were mixed in the amounts listed in tables 1 to 3, and extrusion was performed at 250 ℃, thereby preparing pellets. Here, a twin-screw extruder (L/D =36,
) The extrusion was performed, and the prepared pellets were dried at 100 ℃ for 4 hours or more, and dried in an injection molding machine (injection temperature: injection molding was performed at 300 ℃ to prepare a sample. The prepared samples were evaluated for the following characteristics by the following methods, and the results are shown in tables 1 to 3.
Property measurement
(1) Chemical resistance (impact resistance after painting): an injection-molded 1mm thick sample was immersed in the diluent solution for 2.5 minutes, dried at 80 ℃ for 20 minutes, and left at room temperature for 24 hours, followed by measuring a breaking height (unit: cm) at which the sample breaks when a weight of 1kg is dropped on the sample according to the dupont drop test method.
(2) High temperature chemical resistance: the difference in weight average molecular weight of the polycarbonate resin (decrease in weight average molecular weight at high temperature after painting) was calculated according to equation 1.
[ equation 1]
Weight average molecular weight difference = Mw1-Mw2
Wherein Mw1 is a weight average molecular weight of the polycarbonate resin measured by GPC on a 1mm thick sample after dipping the sample in a diluent solution for 2.5min and drying at 80 ℃ for 20 min; and Mw2 is the weight average molecular weight of the polycarbonate resin measured on the sample by GPC after the sample is left at 100 ℃ for 24 hours.
(3) Notched Izod impact resistance (unit: kgf cm/cm): notched Izod impact strength was measured according to ASTM D256 on 1/8' thick specimens.
(4) Flexural modulus (FM, unit: kgf/cm) 2 ): flexural modulus was measured at 2.8mm/min on a 1/4 "thick sample according to ASTM D790.
TABLE 1
TABLE 2
TABLE 3
From the results, it can be seen that the thermoplastic resin composition according to the present invention has good characteristics in terms of chemical resistance (impact resistance after painting), high temperature chemical resistance (thermal stability under high temperature conditions after painting), impact resistance, rigidity, and a balance therebetween.
In contrast, it can be seen that the thermoplastic resin composition of comparative example 1 prepared using an insufficient amount of the phosphite compound of the present invention suffers from deterioration in chemical resistance, high temperature chemical resistance, and the like; the thermoplastic resin composition of comparative example 2 prepared using an excessive amount of the phosphite compound suffered from deterioration in chemical resistance, impact resistance, and the like; and the thermoplastic resin compositions of comparative examples 3, 4 and 5 prepared using the phosphite compound (B2), (B3) or (B4) in place of the phosphite compound suffered from deterioration in chemical resistance, high-temperature chemical resistance and the like. It can be seen that the thermoplastic resin composition of comparative example 6 prepared using an insufficient amount of the hindered phenol compound of the present invention suffered from deterioration in chemical resistance, high temperature chemical resistance, and the like; the thermoplastic resin composition of comparative example 7 prepared using an excessive amount of hindered phenol compound suffered from deterioration in chemical resistance, impact resistance, rigidity and the like; and the thermoplastic resin composition of comparative example 8 prepared using a hindered phenol compound (C2) in place of the hindered phenol compound suffered from deterioration in chemical resistance and high temperature chemical resistance. It can be seen that the thermoplastic resin composition of comparative example 9 prepared using an insufficient amount of the silicone rubber-modified vinyl graft copolymer of the present invention suffered from deterioration in chemical resistance and the like; the thermoplastic resin composition of comparative example 10 prepared using an excess amount of the silicone rubber-modified vinyl graft copolymer suffered from deterioration in chemical resistance, impact resistance, rigidity, and the like; and the thermoplastic resin composition of comparative example 11, which was prepared using g-ABS (D2) in place of the silicone rubber-modified vinyl graft copolymer, suffered from deterioration in chemical resistance, high-temperature chemical resistance, rigidity, and the like.
Although a few exemplary embodiments have been described herein, those skilled in the art will appreciate that these embodiments are given by way of illustration only, and that various modifications, changes, and alterations can be made without departing from the spirit and scope of the invention. Therefore, the embodiments should not be construed as limiting the scope of the invention, but as illustrating the invention. The scope of the invention should be construed according to the appended claims to cover all modifications or changes derived from the appended claims and equivalents thereof.
Claims (15)
1. A thermoplastic resin composition comprising:
about 100 parts by weight of a polycarbonate resin;
about 0.1 to about 2 parts by weight of a phosphite compound represented by formula 1;
about 0.1 parts by weight to about 1.2 parts by weight of a hindered phenol compound represented by formula 2; and
from about 1.5 parts by weight to about 9 parts by weight of a silicone rubber modified vinyl graft copolymer,
[ formula 1]
Wherein R is 1 、R 2 、R 3 、R 4 、R 5 、R 6 、R 7 And R 8 Each independently is a hydrogen atom or C 1 To C 10 An alkyl group, and a is a sulfur atom or an oxygen atom; and is provided with
[ formula 2]
Wherein R is 9 Is a linear or branched C8 to C22 alkyl group and n is 0 or 1.
2. The thermoplastic resin composition of claim 1, wherein R 1 、R 2 、R 3 And R 4 At least one of which comprises a branch C 4 To C 10 An alkyl group, and R 5 、R 6 、R 7 And R 8 At least one of which comprises a branch C 4 To C 10 An alkyl group.
3. The thermoplastic resin composition of claim 1, wherein the phosphite ester compound comprises a compound represented by formula 1 a:
[ formula 1a ]
4. The thermoplastic resin composition of claim 1, wherein said silicone rubber modified vinyl graft copolymer is prepared by graft polymerizing an alkyl (meth) acrylate monomer to a silicone rubber polymer.
5. The thermoplastic resin composition of claim 1, wherein said phosphite compound and said hindered phenol compound are present in a weight ratio of about 1.
6. The thermoplastic resin composition of claim 1, further comprising: maleic anhydride modified olefin copolymers.
7. The thermoplastic resin composition of claim 6, wherein said thermoplastic resin composition comprises about 0.1 to about 2 parts by weight of said maleic anhydride-modified olefin copolymer, relative to about 100 parts by weight of said polycarbonate resin.
8. The thermoplastic resin composition of claim 6, wherein said maleic anhydride-modified olefin copolymer comprises a maleic anhydride-modified alkene-alpha-olefin copolymer prepared by polymerizing an alkene-alpha-olefin copolymer with maleic anhydride.
9. The thermoplastic resin composition of claim 6, wherein said maleic anhydride-modified olefin copolymer comprises at least one of a maleic anhydride-modified ethylene-butene copolymer and a maleic anhydride-modified ethylene-octene copolymer.
10. The thermoplastic resin composition of claim 1, wherein said thermoplastic resin composition has a fracture height of about 70cm to about 100cm according to the dupont drop test method, said sample fracturing when falling a weight of 1kg below said fracture height on the sample, wherein said sample is prepared by: a 1mm thick sample of the thermoplastic resin composition was immersed in the diluent solution for 2.5 minutes, dried at 80 ℃ for 20 minutes, and left at room temperature for 24 hours.
11. The thermoplastic resin composition of claim 1, wherein said polycarbonate resin of said thermoplastic resin composition has a weight average molecular weight difference of about 500 or less, as calculated according to equation 1:
weight average molecular weight difference = Mw1-Mw2
Wherein Mw1 is a weight average molecular weight of the polycarbonate resin measured by GPC on a sample after the sample having a thickness of 1mm is immersed in a diluent solution for 2.5min and dried at 80 ℃ for 20min, and Mw2 is a weight average molecular weight of the polycarbonate resin measured by GPC on the sample after the sample is left at 100 ℃ for 24 hours.
12. The thermoplastic resin composition of claim 1, wherein said thermoplastic resin composition has a notched izod impact strength of about 70 kgf-cm/cm or greater as measured on a 1/8 "thick sample according to ASTM D256.
13. The thermoplastic resin composition of claim 1, wherein said thermoplastic resin composition has about 20,000kgf/cm measured at 2.8mm/min on a 1/4 "thick sample according to ASTM D790 2 Or greater flexural modulus.
14. A molded article formed from the thermoplastic resin composition of any one of claims 1 to 13.
15. A mobile phone case, comprising:
about 100 parts by weight of a polycarbonate resin;
about 0.1 to about 2 parts by weight of a phosphite compound represented by formula 1;
about 0.1 to about 1.2 parts by weight of a hindered phenol compound represented by formula 2; and
from about 1.5 parts by weight to about 9 parts by weight of a silicone rubber modified vinyl graft copolymer,
wherein the mobile phone case has:
a fracture height of about 70cm to about 100cm at which a sample fractures when a 1kg weight is dropped on the sample according to the DuPont drop test method, wherein the sample is prepared by: immersing a 1mm thick sample of the thermoplastic resin composition in a diluent solution for 2.5 minutes, drying the sample at 80 ℃ for 20 minutes, and leaving the sample at room temperature for 24 hours;
a notched Izod impact strength of about 70kgf cm/cm or greater, as measured on a 1/8 "thick sample according to ASTM D256; and
about 20,000kgf/cm 2 Or greater, as measured by ASTM D790 at 2.8mm/min on 1/4 "thick samples,
[ formula 1]
Wherein R is 1 、R 2 、R 3 、R 4 、R 5 、R 6 、R 7 And R 8 Each independently is a hydrogen atom or C 1 To C 10 An alkyl group, and A is a sulfur atom or an oxygen atom,
[ formula 2]
Wherein R is 9 Is a straight chain or branched chain C 8 To C 22 An alkyl group, and n is 0 or 1.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200078273A KR102543266B1 (en) | 2020-06-26 | 2020-06-26 | Thermoplastic resin composition and article produced therefrom |
| KR10-2020-0078273 | 2020-06-26 | ||
| PCT/KR2021/004325 WO2021261718A1 (en) | 2020-06-26 | 2021-04-07 | Thermoplastic resin composition and molded article formed therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115734988A true CN115734988A (en) | 2023-03-03 |
| CN115734988B CN115734988B (en) | 2024-05-10 |
Family
ID=79281479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180045621.XA Active CN115734988B (en) | 2020-06-26 | 2021-04-07 | Thermoplastic resin composition and molded article formed therefrom |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102543266B1 (en) |
| CN (1) | CN115734988B (en) |
| WO (1) | WO2021261718A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11263904A (en) * | 1998-03-18 | 1999-09-28 | Mitsui Chem Inc | Polyalkylene carbonate resin composition |
| US20030149144A1 (en) * | 2001-12-10 | 2003-08-07 | Mengshi Lu | Stabilized resin compositions |
| US20120129989A1 (en) * | 2009-07-31 | 2012-05-24 | Cheil Industries Inc. | Thermoplastic Resin Composition and Molded Product Using the Same |
| US20180112035A1 (en) * | 2015-05-28 | 2018-04-26 | Sabic Global Technologies B.V. | Polymer blends comprising polycarbonate and polymethyl methacrylate |
| WO2019197270A1 (en) * | 2018-04-09 | 2019-10-17 | Covestro Deutschland Ag | Glass fiber reinforced thermoplastic compositions with good mechanical properties |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101709142B (en) * | 2009-11-13 | 2011-06-01 | 北京化工大学 | A high-toughness halogen-free flame-retardant polycarbonate recycled material compound and its preparation method |
| KR102240969B1 (en) * | 2018-12-27 | 2021-04-15 | 롯데첨단소재(주) | Thermoplastic resin composition and article produced therefrom |
-
2020
- 2020-06-26 KR KR1020200078273A patent/KR102543266B1/en active Active
-
2021
- 2021-04-07 CN CN202180045621.XA patent/CN115734988B/en active Active
- 2021-04-07 WO PCT/KR2021/004325 patent/WO2021261718A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11263904A (en) * | 1998-03-18 | 1999-09-28 | Mitsui Chem Inc | Polyalkylene carbonate resin composition |
| US20030149144A1 (en) * | 2001-12-10 | 2003-08-07 | Mengshi Lu | Stabilized resin compositions |
| US20120129989A1 (en) * | 2009-07-31 | 2012-05-24 | Cheil Industries Inc. | Thermoplastic Resin Composition and Molded Product Using the Same |
| US20180112035A1 (en) * | 2015-05-28 | 2018-04-26 | Sabic Global Technologies B.V. | Polymer blends comprising polycarbonate and polymethyl methacrylate |
| WO2019197270A1 (en) * | 2018-04-09 | 2019-10-17 | Covestro Deutschland Ag | Glass fiber reinforced thermoplastic compositions with good mechanical properties |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220000524A (en) | 2022-01-04 |
| CN115734988B (en) | 2024-05-10 |
| WO2021261718A1 (en) | 2021-12-30 |
| KR102543266B1 (en) | 2023-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102532842B (en) | The mechanograph of poly carbonate resin composition and use said composition | |
| CN101210107B (en) | Polycarbonate resin composition and plastic article | |
| EP2341104B1 (en) | Polycarbonate resin composition with excellent scratch resistance and impact strength | |
| KR100810684B1 (en) | Polymer alloy composition | |
| TWI400323B (en) | An organic resin flame retardant additive, a flame retardant resin composition, and a molded article | |
| KR100961118B1 (en) | Glass fiber reinforced polycarbonate resin composition excellent in fluidity and impact resistance and its manufacturing method | |
| KR20090126804A (en) | Polylactic acid resin composition | |
| CN101208388B (en) | Polycarbonate resin composition having good chemical resistance and flowability | |
| CN109988405B (en) | Thermoplastic resin composition and molded article produced therefrom | |
| EP2025714B1 (en) | Glass fiber reinforced polycarbonate resin composition having excellent impact strength and flowability and method for preparing the same | |
| US8314168B2 (en) | Polycarbonate resin compositions | |
| EP3674367B1 (en) | Thermoplastic resin composition and article produced therefrom | |
| JP7500566B2 (en) | Polycarbonate resin composition | |
| CN110776728B (en) | Thermoplastic resin composition and molded article formed therefrom | |
| CN107001786B (en) | Polymeric materials | |
| CN115734988B (en) | Thermoplastic resin composition and molded article formed therefrom | |
| KR100899172B1 (en) | Thermoplastic resin composition | |
| CN113260674B (en) | Thermoplastic resin composition and molded article formed therefrom | |
| CN114479404A (en) | Thermoplastic resin composition and molded article produced therefrom | |
| KR102251561B1 (en) | Thermoplastic resin composition having excellent impact resistance and fluidity and improved dimensional stability and heat aging property and molded article produced using the same | |
| KR20070071446A (en) | Polycarbonate resin composition excellent in chemical resistance | |
| JP2000302958A (en) | Polycarbonate resin composition | |
| CN114106544B (en) | Thermoplastic resin composition and molded article produced therefrom | |
| CN118871530A (en) | Thermoplastic resin composition and molded article made therefrom | |
| KR100439788B1 (en) | Polycarbonate Resin Composition with High Environmental Stress Crack Resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |