CN115101449A - Device for cleaning surface of wafer - Google Patents
Device for cleaning surface of wafer Download PDFInfo
- Publication number
- CN115101449A CN115101449A CN202210790596.4A CN202210790596A CN115101449A CN 115101449 A CN115101449 A CN 115101449A CN 202210790596 A CN202210790596 A CN 202210790596A CN 115101449 A CN115101449 A CN 115101449A
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- CN
- China
- Prior art keywords
- cleaning
- wafer
- lifting plate
- nozzles
- spraying
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a device for cleaning the surface of a wafer, which comprises a device shell, wherein the bottom of the device shell is a base; the base is provided with a rotating mechanism which is used for placing the wafer and driving the wafer to rotate; the top of the device shell is provided with a cleaning mechanism, and the cleaning mechanism comprises a lifting plate, a power mechanism for driving the lifting plate to move up and down above the wafer and a plurality of spraying pipelines; the section of the lifting plate is circular; the lifting plate is provided with a plurality of nozzles, the nozzles face the base and are used for spraying cleaning media to the surface of the wafer; the plurality of spray heads are annularly distributed along the center of the lifting plate in a plurality of circles; each spraying pipeline is connected with at least one spray head and is used for conveying different cleaning media. The device can rapidly switch cleaning media, save the operation time and improve the cleaning efficiency; and the recovery subassembly that sets up has certain temperature, and the cleaning solution that sputters can follow the quick landing of recovery subassembly inner wall, prevents to splash back, can improve the yield of wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor cleaning, in particular to a device for cleaning the surface of a wafer.
Background
Wafers are carriers used in the production of integrated circuits, and in general terms wafers are referred to more than as single crystal silicon wafers. The monocrystalline silicon wafer is prepared by drawing and refining common silica sand, dissolving, purifying and distilling the common silica sand to prepare a monocrystalline silicon rod, and the monocrystalline silicon rod becomes a wafer after polishing and slicing.
In the wafer processing process, the processes such as etching and polishing generate contaminants on the surface of the wafer, and the wafer needs to be cleaned in order to ensure the surface cleanness of the wafer and eliminate the contaminants generated on the surface of the wafer in each process. Therefore, it is an urgent need to solve the above-mentioned problems by those skilled in the art to design a wafer cleaning apparatus that is efficient, fast and high in yield.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a device for cleaning the surface of a wafer.
In order to realize the purpose, the invention adopts the technical scheme that:
an apparatus for cleaning a wafer surface is provided, comprising an apparatus housing,
the bottom of the device shell is a base;
the base is provided with a rotating mechanism, and the rotating mechanism is used for placing a wafer and driving the wafer to rotate;
the top of the device shell is provided with a cleaning mechanism, and the cleaning mechanism comprises a lifting plate, a power mechanism for driving the lifting plate to move up and down above the wafer and a plurality of spraying pipelines; the cross section of the lifting plate is circular;
the lifting plate is provided with a plurality of nozzles, and the nozzles face the base and are used for spraying cleaning media to the surface of the wafer; the plurality of spray heads are annularly distributed along the center of the lifting plate in a plurality of circles;
each spraying pipeline is connected with at least one spray head and is used for conveying different cleaning media.
Furthermore, the plurality of spray heads are divided into a plurality of groups of spray head groups, and the number of the spray pipelines is the same as that of the groups of the spray head groups and corresponds to the spray head groups one by one.
Furthermore, at least two of the annularly distributed nozzles belong to the same group of nozzles.
Further, the extension line of each spray head is aligned with the central point of the platform of the rotating mechanism.
Furthermore, each spraying pipeline is respectively connected with different cleaning medium conveying mechanisms.
Further, the cleaning medium comprises a cleaning gas or a cleaning spray.
Furthermore, a recovery assembly is arranged in the device shell and comprises a baffle and a heating element, and the baffle is arranged in a mode of surrounding the rotating mechanism.
Further, the heating element is mounted in-line within the baffle to heat the baffle.
By adopting the technical scheme, compared with the prior art, the invention has the following technical effects:
the device can rapidly switch the cleaning medium, save the operation time and improve the cleaning efficiency; and the recovery subassembly that sets up has certain temperature, and the cleaning solution that sputters can follow the quick landing of recovery subassembly inner wall, prevents to splash back, can effectively improve the yield of wafer.
Drawings
FIG. 1 is a schematic view of the apparatus of the present invention;
wherein the reference numbers are:
the device comprises a shell 1, a base 2, a rotating mechanism 3, a wafer 4, a lifting plate 5, a power mechanism 6, a spray head 7, a platform 8 and a baffle 9.
Detailed Description
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, the present embodiment provides an apparatus for cleaning a wafer surface, which includes an apparatus housing 1, a base 2 disposed at a bottom of the apparatus housing 1; the base 2 is provided with a rotating mechanism 3, and the rotating mechanism 3 is used for placing a wafer 4 and driving the wafer 4 to rotate; the top of the device shell 1 is provided with a cleaning mechanism, and the cleaning mechanism comprises a lifting plate 5, a power mechanism 6 for driving the lifting plate 5 to move up and down above the wafer 4 and a plurality of spraying pipelines; the cross section of the lifting plate 5 is circular;
a plurality of nozzles 7 are arranged on the lifting plate 5, and the nozzles 7 face the base 2 and are used for spraying cleaning media to the surface of the wafer 4; the plurality of spray heads 7 are annularly distributed along the center of the lifting plate 5 in a plurality of circles; each spray line is connected to at least one spray head 7, and the spray lines are used for conveying different cleaning media so as to rapidly switch the types of the cleaning media sprayed onto the surface of the wafer 4.
In the invention, each spraying pipeline is respectively connected with different cleaning medium conveying mechanisms, different types of cleaning media can be rapidly switched by controlling the opening or closing of the cleaning medium conveying mechanisms, and the cleaning media are selectively sprayed towards the surface of the wafer 4 through the spray head 7, so that the operation time is saved, and the cleaning efficiency is improved.
In this embodiment, the plurality of nozzles 7 are divided into a plurality of groups of nozzles, and the number of the spraying pipes is the same as the number of the groups of the nozzles, and the spraying pipes correspond to the groups of the nozzles one by one; at least two of the annularly distributed nozzles 7 belong to the same nozzle group; the extension line of each spray head 7 is aligned with the center point of the platform 8 of the rotating mechanism 3. The design can ensure that the spray head 7 can better and more uniformly spray the cleaning medium on the surface of the wafer 4, and prevent the generation of spraying dead angles.
In practical application, each spraying pipeline fixedly conveys a medium so as to avoid mutual reaction among the media and influence on the cleaning effect; and the material of the spraying pipeline and the type and model of the cleaning medium conveying mechanism can be designed according to the physical and chemical properties of the cleaning medium.
In this embodiment, the cleaning medium includes a cleaning gas or a cleaning spray, and may be high-temperature dry air, which is sprayed to the surface of the wafer 4 through the nozzle 7 to dry the wafer 4.
The device of the embodiment further comprises a recovery assembly, the recovery assembly is integrally arranged in the device shell 1 and comprises a cylindrical baffle 9 and a heating element, and the heating element is arranged in the cylindrical baffle 9 in an embedded mode so as to heat the cylindrical baffle 9.
The baffle 9 of tube-shape sets up with the mode that surrounds rotary mechanism 3, and the baffle 9 of tube-shape is divided into the straight section of lower part and the throat section on upper portion, and straight section bottom and base 2 fixed connection, base 2 is kept away from to the throat section, and the one end of throat section is followed upwards direction diameter and is dwindled gradually. The height of the cylindrical shutter 9 is not lower than the level of the surface of the wafer 4.
In other embodiments, the shape of the baffle 9 is not limited to the cylindrical shape, and may be other shapes, and is not limited herein.
In this embodiment, the heating element is embedded in the baffle 9 to heat the baffle 9, so that the temperature of the baffle 9 is 50-60 ℃, and at this time, the liquid cleaning medium is kept in a liquid state and is not easy to solidify, and therefore, the liquid cleaning medium is not easy to attach to the inner wall of the baffle 9, the sputtered cleaning liquid can quickly slide along the inner wall of the baffle 9, the back-sputtering is prevented, and the yield of wafers can be effectively improved.
The heating element may be a heat resistor or a heat plate, or may be other heating forms, and is not limited herein.
The device of this embodiment still includes the waste liquid discharge channel who sets up in base 2 inside, and above-mentioned waste liquid discharge channel is two, communicates baffle 9 respectively and encloses synthetic space to and baffle 9 and device casing 1 inner wall enclose synthetic space.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. An apparatus for cleaning the surface of a wafer, which comprises an apparatus shell and is characterized in that,
the bottom of the device shell is a base;
the base is provided with a rotating mechanism, and the rotating mechanism is used for placing a wafer and driving the wafer to rotate;
the top of the device shell is provided with a cleaning mechanism, and the cleaning mechanism comprises a lifting plate, a power mechanism for driving the lifting plate to move up and down above the wafer and a plurality of spraying pipelines; the section of the lifting plate is circular;
the lifting plate is provided with a plurality of nozzles, and the nozzles face the base and are used for spraying cleaning media to the surface of the wafer; the plurality of spray heads are annularly distributed along the center of the lifting plate in a plurality of circles;
each spraying pipeline is connected with at least one spray head and is used for conveying different cleaning media.
2. The apparatus of claim 1, wherein the plurality of nozzles are divided into a plurality of groups of nozzles, and the number of the spraying pipes is the same as the number of the groups of the nozzles, and corresponds to one another.
3. The apparatus of claim 2, wherein at least two of the nozzles in each ring belong to the same group of nozzles.
4. The apparatus of claim 1, wherein an extension of each of the spray heads is aligned with a center point of a platform of the rotary mechanism.
5. The apparatus of claim 1, wherein each of the spray lines is connected to a different cleaning medium delivery mechanism.
6. The apparatus of claim 1, wherein the cleaning medium comprises a cleaning gas or a cleaning spray.
7. The device of claim 1, further comprising a recovery assembly disposed within the device housing, the recovery assembly comprising a baffle and a heating element, the baffle disposed in a manner surrounding the rotation mechanism.
8. The apparatus of claim 7 wherein said heating element is mounted in-line within said baffle for heating said baffle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210790596.4A CN115101449A (en) | 2022-07-06 | 2022-07-06 | Device for cleaning surface of wafer |
| TW112109830A TWI846386B (en) | 2022-07-06 | 2023-03-16 | Cleaning device for wafer surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210790596.4A CN115101449A (en) | 2022-07-06 | 2022-07-06 | Device for cleaning surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115101449A true CN115101449A (en) | 2022-09-23 |
Family
ID=83297513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210790596.4A Pending CN115101449A (en) | 2022-07-06 | 2022-07-06 | Device for cleaning surface of wafer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115101449A (en) |
| TW (1) | TWI846386B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6077437B2 (en) * | 2013-05-31 | 2017-02-08 | 東京エレクトロン株式会社 | Substrate processing apparatus and nozzle cleaning method |
| JP5941023B2 (en) * | 2013-08-21 | 2016-06-29 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, and computer-readable recording medium |
| CN112750734B (en) * | 2020-12-30 | 2023-03-14 | 上海至纯洁净系统科技股份有限公司 | Single wafer carrier cleaning and drying device |
| CN113035742B (en) * | 2021-02-10 | 2022-03-11 | 江苏亚电科技有限公司 | Wafer cleaning and recycling device for semiconductor manufacturing |
-
2022
- 2022-07-06 CN CN202210790596.4A patent/CN115101449A/en active Pending
-
2023
- 2023-03-16 TW TW112109830A patent/TWI846386B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202403927A (en) | 2024-01-16 |
| TWI846386B (en) | 2024-06-21 |
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