Detailed Description
In order to make the features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.
Fig. 1 is a diagram illustrating an exemplary system architecture of a method for assembling components according to an embodiment of the present disclosure.
As shown in fig. 1, the system architecture may include at least one component mounting apparatus 110, a first component 120, and a second component 130, where the component mounting apparatus 110 or a processor in the component mounting apparatus 110 may be considered as an execution subject of the embodiments of the present application, and the component mounting apparatus may be hardware or software. When the component mounting apparatus 110 is hardware, it may be various electronic devices having a display screen. When the component mounting apparatus 110 is software, it may be installed in the electronic device. Which may be implemented as a plurality of software or software modules (e.g., for providing distributed services) or as a single software or software module, and is not particularly limited herein.
The first member 120 and the second member 130 may be members of any product, for example, the first member 120 and the second member 130 may be a display screen assembly, a middle frame, a rear cover, or the like in an electronic product.
It should be understood that the component assembly device, the number of components in fig. 1 is merely illustrative, and any number of component assembly devices and components may be used, as desired for implementation. For the purpose of description, the following describes in detail the component assembling method by taking the component assembling apparatus 110 as an example that the first component and the second component can be assembled based on the component assembling method, and the processor in the component assembling apparatus 110 is an execution subject, where the number of components in the embodiment of the present application may not only include two components of the first component and the second component, but also may assemble a plurality of components of two or more based on the component assembling method in practical use.
Referring to fig. 2, fig. 2 is a system interaction diagram of a component assembly method according to an embodiment of the present application, and a system interaction process in the component assembly method will be described with reference to fig. 1 and fig. 2.
S201, a processor in the component assembling device respectively acquires a first three-dimensional structure diagram of a first component and a second three-dimensional structure diagram of a second component.
Wherein, respectively obtain the first three-dimensional structure chart of first part and the second three-dimensional structure chart of second part, include: controlling a three-dimensional scanner and a multi-foot displacement platform to scan a first assembly surface corresponding to a second component in a first component, and taking a first three-dimensional original point cloud obtained by scanning as a first three-dimensional structure diagram of the first component; and controlling the three-dimensional scanner and the multi-foot displacement table to scan a second assembly surface corresponding to the first component in the second component, and taking a second three-dimensional original point cloud obtained by scanning as a second three-dimensional structure diagram of the second component.
Further, after the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component are respectively obtained, the method further includes: carrying out noise reduction and filtering processing on the first three-dimensional structure chart and the second three-dimensional structure chart; and converting the processed first three-dimensional structure diagram into a first three-dimensional model of the first part, and converting the processed second three-dimensional structure diagram into a second three-dimensional model of the second part.
S202, a processor in the component assembly device performs virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram.
Wherein, based on the first three-dimensional structure chart and the second three-dimensional structure chart, the virtual assembly between the first component and the second component is carried out, which comprises the following steps: acquiring a corresponding preset assembly position between the first component and the second component, and moving the first three-dimensional model and/or the second three-dimensional model based on the preset assembly position to perform virtual assembly; acquiring first positions of a plurality of first preset punctuations in a first three-dimensional model and acquiring second positions of a plurality of second preset punctuations in a second three-dimensional model; and moving the first three-dimensional model and/or the second three-dimensional model until the position difference between the first position and the second position meets the preset difference requirement.
S203, the processor in the component assembling device obtains assembling parameters when virtual assembling is carried out, and the motion mechanism is controlled to carry out actual assembling between the first component and the second component based on the assembling parameters.
Wherein, the assembly parameter when obtaining to carry out virtual assembly, based on assembly parameter control motion mechanism carries out the actual assembly between first part and the second part, includes: acquiring position change data when the first three-dimensional model and/or the second three-dimensional model move, and taking the position change data as an assembly parameter when the first component and the second component are virtually assembled; generating a motion path and a motion coordinate of the motion mechanism according to the assembly parameters; and controlling the motion mechanism to carry out actual assembly between the first component and the second component based on the motion path and the motion coordinate.
Further, based on the motion path and the motion coordinates, controlling the motion mechanism to perform actual assembly between the first component and the second component includes: controlling the motion mechanism to move the first component and/or the second component based on the motion path and the motion coordinate; controlling a three-dimensional scanner to scan the postures of the moved first component and/or second component and obtaining posture data; if the attitude data meet the preset attitude requirement, controlling a laminating device to laminate the first component and the second component; and if the attitude data does not meet the preset attitude requirement, controlling the movement mechanism to move the first component and/or the second component based on the movement path and the movement coordinate until the attitude data meets the preset attitude requirement, and controlling the laminating device to laminate the first component and the second component.
Optionally, after controlling the attaching device to attach the first member to the second member, the method further includes: controlling a pressure maintaining device to perform pre-pressure maintaining operation with preset duration on the attached first component and the attached second component; controlling a scanning device to perform slit scanning on the first component and the second component after the pre-pressure maintaining operation is performed, and obtaining a scanning result; and controlling the picking device to select the attached first component and the attached second component of which the scanning results do not meet the preset scanning requirements.
In the embodiment of the application, a first three-dimensional structure diagram of a first component and a second three-dimensional structure diagram of a second component are respectively obtained; then, based on the first three-dimensional structure diagram and the second three-dimensional structure diagram, carrying out virtual assembly between the first component and the second component; and finally, acquiring assembly parameters during virtual assembly, and controlling the movement mechanism to carry out actual assembly between the first component and the second component based on the assembly parameters. Because the virtual assembly can be carried out based on the three-dimensional structure diagrams of the first component and the second component, and the assembly data of the virtual assembly is obtained, the actual assembly between the first component and the second component is carried out based on the assembly data, the three-dimensional adjustment between the assembly of the components can be realized, and the assembly precision between the components is greatly improved.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a method for assembling a component according to another embodiment of the present application.
As shown in fig. 3, the assembly method of the components includes:
s301, respectively acquiring a first three-dimensional structure diagram of the first component and a second three-dimensional structure diagram of the second component.
For the purpose of description, the following describes in detail the assembling method of the components by taking as an example that the component assembling apparatus can assemble the first component and the second component based on the assembling method of the components, and a processor in the component assembling apparatus is an execution subject, where the number of the components in the embodiment of the present application may not only include two components of the first component and the second component, but also may assemble a plurality of components of two or more based on the assembling method of the components in practical use.
In the correlation technique, can set up the plane camera through the assembly line top of part, shoot the plane image of each part through the plane camera, acquire each part plane position through the plane image, proofread with predetermineeing the position according to the plane position of each part at last to the realization carries out the adjustment on the plane to each part, the assembly of each part of being convenient for. However, in the above-described conventional technique, since only the planar adjustment of each component is possible, the assembly gap or the assembly pitch between the non-planar components cannot be controlled, resulting in low assembly accuracy of the components.
In order to solve the above problems, in the embodiments of the present application, high-precision assembly of components is mainly achieved based on a three-dimensional structure of the components, so that the processor may first obtain a three-dimensional structure diagram of a first component and obtain a three-dimensional structure diagram of a second component, and in order to distinguish the three-dimensional structure diagram of the first component from the three-dimensional structure diagram of the second component, the three-dimensional structure diagram of the first component may be written as a first three-dimensional structure diagram of the first component, and the three-dimensional structure diagram of the second component may be written as a second three-dimensional structure diagram of the second component.
The method for acquiring the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component may be a plurality of methods, for example, a high-precision three-dimensional scanner may be controlled to cooperate with a high-precision multi-axis motion module to realize three-dimensional scanning of the first component and the second component, wherein the high-precision multi-axis motion module may realize multi-angle motion of the first component and the second component, the high-precision three-dimensional scanner may capture data of structures of the first component and the second component in real time, the data may be converted to be used as the three-dimensional structure diagrams of the first component and the second component, and the processor acquires the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component from the high-precision three-dimensional scanner.
S302, performing virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram.
After the first three-dimensional structure diagram and the second three-dimensional structure diagram are obtained, in order to achieve more accurate assembly of the first component and the second component in actual assembly, virtual assembly of the first component and the second component can be firstly carried out, namely the assembly process of the first component and the second component is simulated through virtual assembly, and data of the virtual assembly process is obtained.
Optionally, there may be multiple manners of performing virtual assembly of the first component and the second component, where one possible manner is to obtain a virtual model of the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram obtained by the processor, where the virtual model also represents various structural details in the first component and the second component, and then perform simulated assembly on the virtual model of the first component and the second component.
And S303, acquiring assembly parameters during virtual assembly, and controlling the movement mechanism to perform actual assembly between the first component and the second component based on the assembly parameters.
Because the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component are used during the virtual assembly, the assembly process of the first component and the second component is reduced to a greater extent during the virtual assembly, and after the virtual assembly of the first component and the second component is completed, the position relationship between the first component and the second component theoretically meets the preset requirement, then the assembly parameters during the virtual assembly can be obtained, the assembly parameters can include the position movement data of the first component and the second component during the virtual assembly, and finally the movement mechanism can be controlled to move the first component and/or the second component based on the assembly parameters, so that the first component and the second component can also meet the preset requirement after the assembly is completed. Because the assembly process of the first component and the second component is simulated through virtual assembly, the data of the virtual assembly process is obtained, so that the data support during the virtual assembly is provided, the actual assembly of the first component and the second component can be conveniently carried out subsequently according to the data, and the assembly accuracy and efficiency of the first component and the second component can be improved.
In the embodiment of the application, a first three-dimensional structure diagram of a first component and a second three-dimensional structure diagram of a second component are respectively obtained; then, based on the first three-dimensional structure diagram and the second three-dimensional structure diagram, carrying out virtual assembly between the first component and the second component; and finally, acquiring assembly parameters during virtual assembly, and controlling the movement mechanism to carry out actual assembly between the first component and the second component based on the assembly parameters. Because the virtual assembly can be carried out based on the three-dimensional structure diagrams of the first component and the second component, and the assembly data of the virtual assembly is obtained, the actual assembly between the first component and the second component is carried out based on the assembly data, the three-dimensional adjustment between the assembly of the components can be realized, and the assembly precision between the components is greatly improved.
Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a component assembling method according to another embodiment of the present disclosure.
As shown in fig. 4, the method of assembling the components includes:
s401, controlling a three-dimensional scanner and a multi-foot displacement table to scan a first assembly surface corresponding to a second component in a first component, and taking a first three-dimensional original point cloud obtained through scanning as a first three-dimensional structure diagram of the first component.
Optionally, the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component are respectively obtained, and the virtual assembly between the first component and the second component is performed based on the first three-dimensional structure diagram and the second three-dimensional structure diagram, which can be completed before the first component and the second component are actually assembled in batches. The step of the processor controlling the three-dimensional scanner and the multi-foot displacement stage to scan a first assembly surface corresponding to a second component in the first component and using a first three-dimensional original point cloud obtained by scanning as a first three-dimensional structure diagram of the first component may be specifically.
The three-dimensional scanner can be a linear array laser scanner or an area array laser scanner, and can perform three-dimensional reconstruction based on high-resolution 3D vision, so that a vision system can be formed based on the three-dimensional scanner, and an imaging sensor in the three-dimensional scanner is fixedly arranged above or below a part to be scanned; the components are borne by a multi-foot displacement table of the high-precision linear module, and the components perform actions such as spatial linear rotation and surrounding in the visual field range of the visual system, so that the visual system can successfully grab the three-dimensional characteristics of key parts of the components and form three-dimensional point cloud.
The resolution of the vision system formed by the three-dimensional scanner needs to be within 0.005mm, and the precision splicing precision is achieved, wherein, because the scanned points of the parts in different directions hardly present accurate ductility in the same visual field, a high-precision calibration jig needs to be customized to correct the correlation between the two different scanning directions, and the bridging processing is carried out. Furthermore, each part has the characteristics of nearly vertical angle and concavity, the scanning angle needs to realize the rotation in the vertical direction of the space, when all the areas needing to be scanned in the part exceed a single scanning frame, the movement or the rotation of the plane on each coordinate axis of the three-dimensional coordinate system is needed, the above characteristics determine that the part is borne by the multi-foot displacement table of the high-precision linear module, the multi-foot displacement table needs to strictly control the repeated positioning precision and repeatedly perform spiral interpolation, and the precision requirement of the part scanning can be realized.
Optionally, when the vision system formed by the three-dimensional scanner and the bearing system formed by the multi-foot displacement table scan the first component, there may be three scanning modes, where the first scanning mode is that the vision system is stationary, and the bearing system drives the first component to move, so as to scan the first component; the second scanning mode is that the vision system moves, and the bearing system fixes the first component not to move so as to scan the first component; the third scanning mode is that the vision system moves, the bearing system drives the first component to move, the first component is scanned together, and in practical application, a proper scanning mode can be selected according to the shape and the specification of the first component.
Further, when the first component is scanned by the three-dimensional scanner and the multi-foot displacement table, in order to improve scanning efficiency, the whole structure of the first component may not be scanned, wherein a feasible manner is that, because not all structures are coupled or contacted when the first component and the second component are assembled, only the three-dimensional scanner and the multi-foot displacement table may be controlled to scan a first assembly surface corresponding to the second component in the first component, wherein the first assembly surface is an assembly surface that needs to be coupled or contacted when the first component and the second component are assembled, so that structural data required when the first component and the second component are assembled can be obtained, scanning data amount when the first component is scanned can be greatly reduced, and scanning efficiency of the first component is improved.
After the three-dimensional scanner and the multi-foot displacement table are controlled to scan the first assembly surface corresponding to the second component in the first component, the processor can obtain a first three-dimensional original point cloud obtained by scanning from the three-dimensional scanner, wherein the three-dimensional original point cloud comprises a point data set of the appearance surface of the first assembly surface in the first component, and then the first three-dimensional original point cloud is used as a first three-dimensional structure diagram of the first component.
S402, controlling the three-dimensional scanner and the multi-foot displacement table to scan a second assembly surface corresponding to the first component in the second component, and taking a second three-dimensional original point cloud obtained through scanning as a second three-dimensional structure diagram of the second component.
The process of obtaining the second three-dimensional structure diagram of the second component is similar to the process of obtaining the first three-dimensional structure diagram of the first component, and may also be obtained by using the same or similar three-dimensional scanner and multi-leg displacement table, so the manner of obtaining the second three-dimensional structure diagram of the second component may refer to the manner of obtaining the first three-dimensional structure diagram of the first component in the above steps, which is not described herein again.
And S403, performing noise reduction and filtering processing on the first three-dimensional structure diagram and the second three-dimensional structure diagram.
Optionally, the first three-dimensional structure diagram and the second three-dimensional structure diagram obtained in the above steps are both original point clouds, which include more point cloud data formed by surface particles, edge breakage, or dust reflection of the component, so that tools for noise reduction (e.g., gaussian noise reduction), filtering (e.g., laplace filtering), and the like can be repeatedly used for processing many times, interferences such as microscopic surface particles, edge breakage, dust reflection, and the like on the component are eliminated, and then the surface is subjected to smoothing processing, so as to improve the accuracy of subsequent virtual assembly based on the first three-dimensional structure diagram and the second three-dimensional structure diagram.
S404, converting the processed first three-dimensional structure diagram into a first three-dimensional model of the first component, and converting the processed second three-dimensional structure diagram into a second three-dimensional model of the second component.
After the first three-dimensional structure diagram and the second three-dimensional structure diagram are processed, the processed first three-dimensional structure diagram can be converted into a first three-dimensional model of the first component and the processed second three-dimensional structure diagram can be converted into a second three-dimensional model of the second component for facilitating the virtual assembly of the first component and the second component.
S405, acquiring a corresponding preset assembly position between the first component and the second component, and moving the first three-dimensional model and/or the second three-dimensional model based on the preset assembly position to perform virtual assembly.
When the first component and the second component are designed or shipped from a factory, both have fixed structures and parameters, for example, a certain protruding structure of the first component corresponds to a certain recessed structure of the second component, and for another example, the first component may have a first long side and a first wide side, and the second component may have a second long side and a second wide side. Based on the preset assembly position, the first three-dimensional model can be controlled to move, or the second three-dimensional model can be controlled to move, or the first three-dimensional model and the second three-dimensional model can be controlled to move simultaneously, so that the first three-dimensional model and the second three-dimensional model move to the preset assembly position, and the primary assembly of the first three-dimensional model and the second three-dimensional model is completed.
S406, obtaining first positions of a plurality of first preset punctuations in the first three-dimensional model, and obtaining second positions of a plurality of second preset punctuations in the second three-dimensional model.
After the first three-dimensional model and the second three-dimensional model are initially assembled, the position between the first three-dimensional model and the second three-dimensional model may not meet the preset assembly requirement, and in order to determine whether the position of the first three-dimensional model and the position of the second three-dimensional model meet the preset assembly requirement, a first position of a plurality of first preset marking points in the first three-dimensional model and a second position of a plurality of second preset marking points in the second three-dimensional model may be obtained, wherein the first preset marking points are typical assembly points representing a first component structure, the second preset marking points are typical assembly points representing a second component structure, the plurality of first preset marking points and the plurality of second preset marking points correspond to each other one by one, and the number of the plurality of first preset marking points and the plurality of second preset marking points may be set according to the shapes of the first component and the second component.
S407, moving the first three-dimensional model and/or the second three-dimensional model until the position difference between the first position and the second position meets the preset difference requirement.
After the first positions of the first preset marking points and the second positions of the second preset marking points are obtained, the difference between each first position and each corresponding second position can be calculated, if at least one difference between one first position and one second position does not meet the preset difference requirement, the assembly between the first three-dimensional model and the second three-dimensional model does not meet the preset assembly precision or requirement, at the moment, the first three-dimensional model and/or the second three-dimensional model can be continuously moved until the position difference between the first position and the second position meets the preset difference requirement, the assembly between the first three-dimensional model and the second three-dimensional model meets the preset assembly precision or requirement, and the virtual assembly between the first part and the second part is finished.
S408, acquiring position change data when the first three-dimensional model and/or the second three-dimensional model move, and taking the position change data as assembly parameters when the first component and the second component are virtually assembled.
When the first three-dimensional model and the second three-dimensional model are virtually assembled, the first three-dimensional model and/or the second three-dimensional model are/is moved, in order to obtain assembly parameters during virtual assembly, position change data during movement of the first three-dimensional model and/or the second three-dimensional model can be obtained, and the position change data is used as assembly parameters during virtual assembly between the first component and the second component.
And S409, generating a motion path and motion coordinates of the motion mechanism according to the assembly parameters.
The position change of the first three-dimensional model and/or the second three-dimensional model when moving corresponds to the position change of the first part and/or the second part, and the first part and the second part are driven by the motion mechanism to move in the actual assembly process, so the motion path and the motion coordinates of the motion mechanism can be generated according to the position change data of the first three-dimensional model and/or the second three-dimensional model when moving. The motion path of the motion mechanism is a moving path of the motion mechanism connecting the driving ends of the first part and the second part, and the motion coordinate of the motion mechanism is a specific coordinate of the driving end of the motion mechanism connecting the first part and the second part when moving along the moving path.
And S4010, controlling a motion mechanism to actually assemble the first component and the second component based on the motion path and the motion coordinate.
Because the movement path and the movement coordinates reflect the change of the movement position of the first three-dimensional model and/or the second three-dimensional model during virtual assembly, the movement mechanism can be controlled to carry out actual assembly between the first component and the second component based on the movement path and the movement coordinates, so as to realize the same effect as the virtual assembly between the first three-dimensional model and the second three-dimensional model, namely, the actual assembly between the first component and the second component meets the preset assembly precision or requirement, namely, the actual assembly between the first component and the second component is completed.
Optionally, the controlling the motion mechanism to perform the actual assembly between the first component and the second component based on the motion path and the motion coordinate may specifically include: first, the motion mechanism is controlled to move the first component and/or the second component based on the motion path and the motion coordinates, and the step is similar to the step of performing virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram. And then controlling a three-dimensional scanner to scan the posture of the moved first component and/or second component, and obtaining posture data, wherein the posture data comprises assembly data between the first component and the second component, if the posture data meets the preset posture requirement and represents that the initial assembly between the first component and the second component meets the requirement, controlling an attaching device to attach the first component and the second component, and in some application scenes, attaching the first component and the second component is required for ensuring the assembly stability between the first component and the second component after the first component and the second component are assembled. And if the attitude data does not meet the preset attitude requirement, controlling the movement mechanism to move the first component and/or the second component based on the movement path and the movement coordinate until the attitude data meets the preset attitude requirement, and controlling the laminating device to laminate the first component and the second component.
Further, in some application scenarios, for example, if the first component is a display screen assembly, the second component is a middle frame, or the first component is a battery rear cover, and the second component is a middle frame, after the first component and the second component are attached, a pre-pressure maintaining operation needs to be performed on the first component and the second component, so that certain positions of the first component and the second component are located on a preset plane, and then the attaching device is controlled to attach the first component and the second component, further comprising: controlling a pressure maintaining device to perform a preset duration of pressure maintaining operation on the attached first component and the attached second component, and controlling a scanning device to perform gap scanning on the first component and the second component subjected to the pressure maintaining operation, and obtaining a scanning result; and controlling the picking device to select the attached first component and the attached second component of which the scanning results do not meet the preset scanning requirements.
Optionally, when the scanning device is controlled to perform gap scanning on the first component and the second component after the pressure pre-maintaining operation, for some gaps which are not easy to scan, the position of the wider position of the gap can be scanned first, and according to the gap data of the wider position, whether the position of the narrower position of the gap meets the preset scanning requirement or not is further judged, so that the scanning efficiency can be improved.
In the embodiment of the application, a first three-dimensional structure diagram of a first component and a second three-dimensional structure diagram of a second component are respectively obtained; then, based on the first three-dimensional structure diagram and the second three-dimensional structure diagram, carrying out virtual assembly between the first component and the second component; and finally, acquiring assembly parameters during virtual assembly, and controlling the movement mechanism to carry out actual assembly between the first component and the second component based on the assembly parameters. Because the virtual assembly can be carried out based on the three-dimensional structure diagrams of the first component and the second component, and the assembly data of the virtual assembly is obtained, the actual assembly between the first component and the second component is carried out based on the assembly data, the three-dimensional adjustment between the assembly of the components can be realized, and the assembly precision between the components is greatly improved.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a component mounting apparatus according to another embodiment of the present disclosure.
As shown in fig. 5, the component mounting apparatus 500 includes:
the three-dimensional structure obtaining module 510 is configured to obtain a first three-dimensional structure diagram of the first component and a second three-dimensional structure diagram of the second component, respectively.
A virtual assembly module 520, configured to perform virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram.
And an actual assembly module 530, configured to obtain assembly parameters when performing the virtual assembly, and control the motion mechanism to perform actual assembly between the first component and the second component based on the assembly parameters.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a component mounting apparatus according to another embodiment of the present application.
As shown in fig. 6, the component mounting apparatus 600 includes:
the first point cloud obtaining module 610 is configured to control the three-dimensional scanner and the multi-foot displacement table to scan a first assembly surface corresponding to a second component in the first component, and use a first three-dimensional original point cloud obtained through scanning as a first three-dimensional structure diagram of the first component.
And a second point cloud obtaining module 620, configured to control the three-dimensional scanner and the multi-foot displacement table to scan a second assembly surface corresponding to the first component in the second component, and use a second three-dimensional original point cloud obtained through scanning as a second three-dimensional structure diagram of the second component.
And a denoising and filtering module 630, configured to denoise and filter the first three-dimensional structure diagram and the second three-dimensional structure diagram.
And a model conversion module 640, configured to convert the processed first three-dimensional structure diagram into a first three-dimensional model of the first component, and convert the processed second three-dimensional structure diagram into a second three-dimensional model of the second component.
And a primary assembling module 650, configured to obtain a corresponding preset assembling position between the first component and the second component, and move the first three-dimensional model and/or the second three-dimensional model based on the preset assembling position to perform virtual assembling.
The position data obtaining module 660 is configured to obtain first positions of a plurality of first preset punctuations in the first three-dimensional model, and obtain second positions of a plurality of second preset punctuations in the second three-dimensional model.
And the assembly adjusting module 670 is configured to move the first three-dimensional model and/or the second three-dimensional model until a position difference between the first position and the second position meets a preset difference requirement.
The assembly parameter obtaining module 680 is configured to obtain position change data when the first three-dimensional model and/or the second three-dimensional model move, and use the position change data as an assembly parameter when performing virtual assembly between the first component and the second component.
And a path and coordinate generating module 690 for generating a motion path and motion coordinates of the motion mechanism according to the assembly parameters.
And an actual assembling module 6100 for controlling the motion mechanism to perform actual assembling between the first component and the second component based on the motion path and the motion coordinates.
Wherein, based on the motion path and the motion coordinate, the motion mechanism is controlled to actually assemble the first component and the second component, and the method comprises the following steps: controlling the motion mechanism to move the first component and/or the second component based on the motion path and the motion coordinate; controlling a three-dimensional scanner to scan the postures of the moved first component and/or second component and obtaining posture data; if the attitude data meet the preset attitude requirement, controlling a laminating device to laminate the first component and the second component; and if the attitude data does not meet the preset attitude requirement, controlling the movement mechanism to move the first component and/or the second component based on the movement path and the movement coordinate until the attitude data meets the preset attitude requirement, and controlling the laminating device to laminate the first component and the second component.
Further, after controlling the attaching device to attach the first member to the second member, the attaching device further includes: controlling a pressure maintaining device to perform pre-pressure maintaining operation with preset duration on the attached first component and the attached second component; controlling a scanning device to perform slit scanning on the first component and the second component after the pre-pressure maintaining operation is performed, and obtaining a scanning result; and controlling the picking device to select the attached first component and the attached second component of which the scanning results do not meet the preset scanning requirements.
In an embodiment of the present application, an assembling apparatus of a component includes: the three-dimensional structure acquisition module is used for respectively acquiring a first three-dimensional structure diagram of the first component and a second three-dimensional structure diagram of the second component; the virtual assembly module is used for carrying out virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram; and the actual assembly module is used for acquiring assembly parameters during virtual assembly and controlling the movement mechanism to carry out actual assembly between the first component and the second component based on the assembly parameters. Because the virtual assembly can be carried out based on the three-dimensional structure diagrams of the first component and the second component, and the assembly data of the virtual assembly is obtained, the actual assembly between the first component and the second component is carried out based on the assembly data, the three-dimensional adjustment between the assembly of the components can be realized, and the assembly precision between the components is greatly improved.
Embodiments of the present application also provide a computer storage medium storing a plurality of instructions adapted to be loaded by a processor and to perform the steps of the method of assembling components as in the above embodiments.
Further, please refer to fig. 7, where fig. 7 is a schematic structural diagram of a terminal according to another embodiment of the present application. As shown in fig. 7, the terminal 700 may include: at least one central processor 701, at least one network interface 704, a user interface 703, a memory 705, at least one communication bus 702. Wherein a communication bus 702 is used to enable connective communication between these components.
The user interface 703 may include a screen (Display) and a Camera (Camera), and the optional user interface 703 may also include a standard wired interface and a wireless interface.
The network interface 704 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface), among others.
The central processor 701 may include one or more processing cores. The central processor 701 connects various parts within the entire terminal 700 using various interfaces and lines, and performs various functions of the terminal 700 and processes data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 705, and calling data stored in the memory 705. Optionally, the central Processing unit 701 may be implemented in at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The CPU 701 may integrate one or a combination of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a modem, and the like. Wherein, the CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing the content required to be displayed by the screen; the modem is used to handle wireless communications. It is understood that the modem may not be integrated into the cpu 701, and may be implemented by a single chip.
The Memory 705 may include a Random Access Memory (RAM) or a Read-Only Memory (Read-Only Memory). Optionally, the memory 705 includes a non-transitory computer-readable medium. The memory 705 may be used to store instructions, programs, code sets, or instruction sets. The memory 705 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the various method embodiments described above, and the like; the storage data area may store data and the like referred to in the above respective method embodiments. The memory 705 may optionally be at least one memory device located remotely from the central processor 701. As shown in fig. 7, the memory 705, which is a kind of computer storage medium, may include therein an operating system, a network communication module, a user interface module, and an assembly program of components.
In the terminal 700 shown in fig. 7, the user interface 703 is mainly used to provide an input interface for a user to obtain data input by the user; the central processing unit 701 may be configured to call the assembly program of the components stored in the memory 705, and specifically perform the following operations:
respectively acquiring a first three-dimensional structure diagram of a first component and a second three-dimensional structure diagram of a second component;
performing virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram;
and acquiring assembly parameters during virtual assembly, and controlling the movement mechanism to perform actual assembly between the first component and the second component based on the assembly parameters.
When the central processing unit 701 respectively acquires the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component, the following steps are specifically performed: controlling a three-dimensional scanner and a multi-foot displacement platform to scan a first assembly surface corresponding to a second component in a first component, and taking a first three-dimensional original point cloud obtained by scanning as a first three-dimensional structure diagram of the first component; and controlling the three-dimensional scanner and the multi-foot displacement table to scan a second assembly surface corresponding to the first component in the second component, and taking a second three-dimensional original point cloud obtained by scanning as a second three-dimensional structure diagram of the second component.
After the central processing unit 701 respectively obtains the first three-dimensional structure diagram of the first component and the second three-dimensional structure diagram of the second component, the following steps are also specifically executed: carrying out noise reduction and filtering processing on the first three-dimensional structure chart and the second three-dimensional structure chart; and converting the processed first three-dimensional structure diagram into a first three-dimensional model of the first part, and converting the processed second three-dimensional structure diagram into a second three-dimensional model of the second part.
When executing virtual assembly between the first component and the second component based on the first three-dimensional structure diagram and the second three-dimensional structure diagram, the central processor 701 specifically executes the following steps: acquiring a corresponding preset assembly position between the first component and the second component, and moving the first three-dimensional model and/or the second three-dimensional model based on the preset assembly position to perform virtual assembly; acquiring first positions of a plurality of first preset punctuations in a first three-dimensional model and acquiring second positions of a plurality of second preset punctuations in a second three-dimensional model; and moving the first three-dimensional model and/or the second three-dimensional model until the position difference between the first position and the second position meets the preset difference requirement.
When the central processing unit 701 performs the steps of obtaining the assembly parameters for performing the virtual assembly and controlling the movement mechanism to perform the actual assembly between the first component and the second component based on the assembly parameters, the following steps are specifically performed: acquiring position change data when the first three-dimensional model and/or the second three-dimensional model move, and taking the position change data as an assembly parameter when the first component and the second component are virtually assembled; generating a motion path and a motion coordinate of the motion mechanism according to the assembly parameters; and controlling the motion mechanism to carry out actual assembly between the first component and the second component based on the motion path and the motion coordinate.
When the central processor 701 controls the motion mechanism to actually assemble the first component and the second component based on the motion path and the motion coordinate, the following steps are specifically performed: controlling the motion mechanism to move the first component and/or the second component based on the motion path and the motion coordinate; controlling a three-dimensional scanner to scan the postures of the moved first component and/or second component and obtaining posture data; if the attitude data meet the preset attitude requirement, controlling a laminating device to laminate the first component and the second component; and if the attitude data does not meet the preset attitude requirement, controlling the movement mechanism to move the first component and/or the second component based on the movement path and the movement coordinate until the attitude data meets the preset attitude requirement, and controlling the laminating device to laminate the first component and the second component.
After the central processing unit 701 executes the control of the attaching device to attach the first component to the second component, the following steps are further specifically executed: controlling a pressure maintaining device to perform pre-pressure maintaining operation with preset duration on the attached first component and the attached second component; controlling a scanning device to perform slit scanning on the first component and the second component after the pre-pressure maintaining operation is performed, and obtaining a scanning result; and controlling the picking device to select the attached first component and the attached second component of which the scanning results do not meet the preset scanning requirements.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of modules is merely a division of logical functions, and an actual implementation may have another division, for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
Modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present application may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a separate product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In view of the above description of the method, apparatus, storage medium and terminal for assembling components provided in the present application, those skilled in the art will recognize that changes may be made in the embodiments and applications of the method, apparatus, storage medium and terminal according to the teachings of the present application.